Sensor shift anti-shake camera structure
Through sensor shift anti-shake technology, the mobile photosensitive chip realizes the relative movement of the lens and the photosensitive chip, solving the problem of insufficient motor driving force caused by the increase in lens weight, realizing the integrated design of autofocus and anti-shake, reducing the height and number of parts of the camera module, and meeting the lightweight and thin requirements of smart devices.
Patent Information
- Application Number
- CN202422770248.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-11-14
AI Technical Summary
When existing camera modules implement autofocus and anti-shake functions, the increased weight of the lens leads to insufficient motor driving force, making it difficult to meet the requirements of lightweight and low power consumption. At the same time, the sensor anti-shake technology increases the overall thickness of the camera module.
The sensor shift anti-shake technology is used to achieve relative movement between the lens and the photosensitive chip by moving the photosensitive chip. Combined with the AF coil driver board and the sensor shift coil driver board, autofocus and anti-shake functions are realized, reducing the Z-axis height and volume of the camera module.
The integrated design of autofocus and anti-shake is realized, which reduces the height and number of parts of the camera module, improves assembly efficiency, and meets the lightweight and thin requirements of smart devices.
Smart Images

Figure CN223414933U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of camera modules, and in particular to a sensor shift anti-shake camera structure. Background Art
[0002] With the development trend of the intelligent interconnection of all things, camera modules have become an important component of smart devices. In recent years, consumers have increasingly demanded camera modules with features such as autofocus and anti-shake when using smart devices. Currently, voice coil motors are commonly used to drive lens movement to achieve camera focus and anti-shake. However, as the pixel count of photosensitive chips continues to increase, the height and size of camera modules are also gradually increasing, making it difficult to meet the requirements of the overall device structure. As image quality improves, the lens size is getting larger and larger, and the internal plastic lenses are gradually replaced by glass lenses. The rapid increase in lens weight makes it difficult for existing motors to provide sufficient driving force. In order to increase the driving force of the motor, the motor structure design needs to increase its volume accordingly, which also increases power consumption, which is inconsistent with the trend of thinner and lower power camera modules.
[0003] Translational sensor stabilization technology addresses these issues. It utilizes a moving photosensitive chip to create relative motion between the lens and the chip, counteracting image shake caused by vibration. Because it eliminates the need to move a heavy lens, it offers significant advantages in high-frequency stabilization and power consumption. Furthermore, the location of the translation sensor's driver below the camera module significantly reduces the camera's height.
[0004] In existing sensor anti-shake technology, a separate voice coil motor is often used to drive the lens to achieve Z-axis autofocus, and a translation chip is used to achieve mobile anti-shake in the X / Y directions. The independence of autofocus and anti-shake makes the camera module very high in the Z direction, resulting in a thicker overall device. Summary of the Invention
[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides a sensor shift anti-shake camera structure, which has a simple structure, realizes anti-shake and auto-focus, and has a simple structure and takes up little space.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A sensor shift anti-shake camera structure, characterized in that it includes a rigid circuit board, a flexible circuit board, a base frame, a chip circuit board, and a photosensitive chip, wherein the flexible circuit board is fixed on the rigid circuit board and electrically connected, the chip circuit board is electrically connected to the flexible circuit board, the photosensitive chip is fixed on the chip circuit board and electrically connected, the base frame is bonded to the rigid part of the flexible circuit board, a small bracket is provided above the photosensitive chip, the small bracket is bonded to the chip circuit board, a filter is provided on the small bracket, magnet grooves are provided on the four sides of the small bracket, magnets are provided in the magnet grooves, a large bracket is provided above the small bracket, a spring sheet is provided between the small bracket and the large bracket, an AF coil drive board is provided around the outer periphery of the large bracket, the AF coil drive board has first coils corresponding to the four sides of the large bracket, the first coils correspond one-to-one with the side surfaces of the magnets, a sensor shift coil drive board is provided on the top surface of the large bracket, and the sensor The shift coil driving board is provided with a second coil, and the second coil corresponds to the magnet one by one. A lens base is provided in the middle of the top of the large bracket, and a lens is provided on the lens base.
[0008] Furthermore, a placement groove is provided in the middle of the small bracket, and the filter is glued in the placement groove.
[0009] Furthermore, the lower surface of the small bracket has a first boss, and the boss contacts the upper surface of the base frame.
[0010] Furthermore, the upper surface of the small bracket has a second boss.
[0011] Furthermore, a Hall element is provided in the middle of at least one of the first coils.
[0012] Furthermore, a Hall element is provided between at least two adjacent second coils.
[0013] Furthermore, a sensor shift coil drive board placement groove is provided on the upper surface of the large bracket, an AF coil drive board placement groove is provided on the outer four sides, and a lens base bonding platform is provided in the middle.
[0014] Furthermore, the AF coil driving board and the sensor shift coil driving board are electrically connected to the rigid circuit board.
[0015] The beneficial effects of the present invention include: 1. It can achieve the effects of AF and anti-shake at the same time, improving the motion shooting effect of smart devices;
[0016] 2. The integrated design of AF and sensor shift greatly reduces the height of the camera module, while also reducing the number of camera module parts and process steps, thereby improving assembly efficiency;
[0017] 3. The compact design in X / Y direction greatly reduces the total volume of the camera module, meeting the demand for thin and light smart devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the explosion structure of the utility model;
[0019] Figure 2 It is a longitudinal sectional view of the utility model;
[0020] Figure 3 This is a schematic diagram of the large bracket and surrounding structures of the utility model;
[0021] Figure 4 This is a schematic diagram of the structure of the mover of the utility model;
[0022] Figure 5 It is a schematic diagram of the small bracket structure of the utility model. DETAILED DESCRIPTION
[0023] The present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.
[0024] A kind of Figure 1-5 The sensor shift anti-shake camera structure shown includes a rigid circuit board 1, a flexible circuit board 2, a base frame 3, a chip circuit board 4, a photosensitive chip 5, a small bracket 6, a filter 7, a magnet 8, a spring sheet 10, a large bracket 9, an AF coil driver board 11, a sensor shift coil driver board 13, a lens base 15, and a lens 16.
[0025] The flexible circuit board 2 is fixed on the rigid circuit board 1 and electrically connected to the corresponding pads. The non-pad area is glued to the rigid circuit board 1, and the flexible part of the flexible circuit board 2 can move in the X / Y / Z directions. The chip circuit board 4 is electrically connected to the flexible circuit board 2. The photosensitive chip 5 is fixed to the chip circuit board 4 and glued, and is electrically connected to the chip circuit board through gold wire welding. The chip circuit board is arranged with the auxiliary electronic components required for the photosensitive chip. The base frame 3 is glued to the hard part of the flexible circuit board 2. A small bracket 6 is provided above the photosensitive chip 5. The small bracket 6 is glued to the chip circuit board 4. The lower surface of the small bracket 6 is glued to the chip circuit board 4. A first boss 61 is provided to contact the upper surface of the base frame 3, thereby limiting the downward movement of the small bracket and preventing the small bracket from hitting the sensor shift coil and pulling the flexible circuit board.
[0026] A filter placement slot is provided in the center of small bracket 6, into which filter 7 is glued. A large bracket 9 is provided above small bracket 6, with a spring sheet 10 disposed between the small bracket 6 and the large bracket 9. The upper surface of the small bracket is welded or glued to the spring sheet. A second boss 62 is also provided on the upper surface to prevent collision and limit the mechanical travel during AF autofocus. The four corners of spring sheet 10 are welded or glued to the four inner corners of large bracket 9.
[0027] The four sides of the small bracket 6 are provided with magnet grooves, and magnets 8 are arranged in the magnet grooves. The outer periphery of the large bracket 9 is provided with an AF coil driving board 11, and the AF coil driving board 11 has first coils 12 corresponding to the four sides of the large bracket 9. The first coils 12 correspond to the sides of the magnet 8 one by one, and a Hall element is arranged in the middle of at least one first coil 12. The magnet group, small bracket, filter, photosensitive chip, chip circuit board and flexible circuit board together constitute the AF automatic focus mover. When the AF coil is energized, it can push the mover to move in the Z direction to achieve automatic focus. Figure 3 As shown in the figure, the Hall element is used to sense the change of the magnetic field and determine the position of the actuator, thereby realizing closed-loop control of AF autofocus and improving the accuracy of AF focusing.
[0028] The top surface of the main bracket 9 is equipped with a sensor shift coil driver board 13, which has a second coil 14 mounted on it. The second coil 14 corresponds one-to-one with the magnet 8. A lens base 15 is located in the center of the top of the main bracket 9, with a lens 16 mounted on it. The upper surface of the main bracket 9 is provided with a slot for the sensor shift coil driver board, and the outer four sides are provided with slots for the AF coil driver board. A bonding platform for the lens base is located in the center. The lens base is bonded to the main bracket with glue. The lens is centrally located and secured to the lens base by threaded locking or direct glue application.
[0029] The lens can be fixed to the lens base by locking and gluing, and then automatically calibrated and focused by the AA device so that the optical axis coincides with the center line of the photosensitive chip, thereby ensuring the consistency of the camera module and facilitating subsequent AF and anti-shake debugging.
[0030] The magnet group, small bracket, filter, photosensitive chip, chip circuit board and flexible circuit board together form the actuator of sensor shift anti-shake. The sensor shift coil is divided into two groups, X and Y. When powered on, the X-direction coil controls the actuator to move in the X direction, and the Y-direction coil controls the actuator to move in the Y direction, thereby realizing the sensor shift anti-shake function. There is a Hall element in the middle of each X / Y sensor shift coil, such as Figure 3As shown, the position of the actuator can be determined, thereby realizing closed-loop control of sensorshift anti-shake and improving the anti-shake effect of the camera module.
[0031] After the camera module is focused, if the picture becomes unclear due to shaking of the smart device itself or the holder, the shaking information can be obtained by the gyroscope set on the smart device. The mainboard of the smart device calculates the corresponding displacement compensation value required by the photosensitive chip based on the obtained information, and pushes the actuator to the corresponding displacement by controlling the current of the sensor shift coil. The Hall element feedback position ensures the correct displacement, thereby realizing the entire anti-shake process and enabling the camera module to take clear pictures.
[0032] The AF coil driver board 11 and the sensor shift coil driver board 13 are electrically connected to the rigid circuit board 1. The AF coil driver board and the sensor shift coil driver board are cleverly designed, with power pads positioned around the large bracket, in the direction of the FPC cable outlet from the camera module. These pads can be electrically connected to corresponding pads on the rigid circuit board, effectively utilizing the large bracket space while eliminating the additional space required for the power supply structure. This overcomes the bulkiness of existing designs, resulting in a clever design, easy assembly, and enhanced operability.
[0033] This new device achieves both AF and sensor shift stabilization by moving the photosensitive chip, eliminating the need for a separate VCM motor as in the prior art. This significantly reduces the Z-axis height and volume of the camera module, contributing to the slimming down of smart devices. Furthermore, the integrated AF and sensor shift stabilization system reduces the number of camera module parts, eliminates the need for manufacturing by location, facilitates material management and assembly, and facilitates performance debugging.
[0034] The above is a detailed introduction to the technical solutions provided by the embodiments of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the embodiments of the present invention. The description of the above embodiments is only applicable to help understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, according to the embodiments of the present invention, there may be changes in the specific implementation methods and application scopes. In summary, the contents of this specification should not be understood as limiting the present invention.
Claims
1. A sensor shift anti-shake camera structure, characterized by: The invention comprises a rigid circuit board (1), a flexible circuit board (2), a base frame (3), a chip circuit board (4), and a photosensitive chip (5); the flexible circuit board (2) is fixed on the rigid circuit board (1) and electrically connected; the chip circuit board (4) is electrically connected to the flexible circuit board (2); the photosensitive chip (5) is fixed on the chip circuit board (4) and electrically connected; the base frame (3) is bonded to the rigid part of the flexible circuit board (2); a small bracket (6) is provided above the photosensitive chip (5); the small bracket (6) is bonded to the chip circuit board (4); the small bracket (6) is provided with a filter (7), the outer four sides of the small bracket (6) are provided with magnet grooves, and magnets (8) are provided in the magnet grooves. A large bracket (9) is provided above the small bracket (6), and a spring sheet (10) is provided between the small bracket (6) and the large bracket (9). An AF coil driving plate (11) is provided around the outer periphery of the large bracket (9), and the AF coil driving plate (11) has first coils (12) corresponding to the four sides of the large bracket (9), and the first coils (12) correspond to the side surfaces of the magnets (8) one by one. A sensor shift coil driving plate (13) is provided on the top surface of the large bracket (9), and a second coil (14) is provided on the sensor shift coil driving plate (13), and the second coil (14) corresponds to the magnets (8) one by one. A lens base (15) is provided in the middle of the top of the large bracket (9), and a lens (16) is provided on the lens base (15).
2. The sensor shift anti-shake camera structure according to claim 1, characterized in that: A placement groove is provided in the middle of the small bracket (6), and the filter (7) is glued in the placement groove.
3. The sensor shift anti-shake camera structure according to claim 1, characterized in that: The lower surface of the small bracket (6) has a first boss (61), and the boss contacts the upper surface of the base frame (3).
4. The sensor shift anti-shake camera structure according to claim 3, characterized in that: The upper surface of the small bracket (6) has a second boss (62).
5. The sensor shift anti-shake camera structure according to claim 1, characterized in that: A Hall element is arranged in the middle of at least one of the first coils (12).
6. The sensor shift anti-shake camera structure according to claim 5, characterized in that: A Hall element is arranged between at least two adjacent second coils (14).
7. The sensor shift anti-shake camera structure according to claim 1, characterized in that: The upper surface of the large bracket (9) is provided with a sensor shift coil drive board placement groove, the outer four sides are provided with AF coil drive board placement grooves, and the middle is provided with a lens base bonding platform.
8. The sensor shift anti-shake camera structure according to claim 1, characterized in that: The AF coil drive board (11) and the sensor shift coil drive board (13) are electrically connected to the rigid circuit board (1).