Switch and communication system

Abstract

The utility model provides a switch and a communication system, and relates to the field of communication equipment manufacturing. The switch comprises a switch shell, a mainboard and a first power module, the switch shell comprises an air inlet face, the air inlet face comprises a first air inlet window and a second air inlet window, and a first air duct partition plate is fixed to the mainboard. The mainboard is fixedly installed in the switch shell, the internal space of the switch shell is divided into a first layer and a second layer, and the first layer corresponds to the first surface of the mainboard. The first air duct partition plate is fixed to the first face and divides the space of the first layer into a first air inlet area and a second air inlet area. The first air inlet window corresponds to the first air inlet area, and the second air inlet window corresponds to the second air inlet area. The first power supply module is arranged in the second air inlet area of the first layer, is opposite to the second air inlet window, and is electrically connected with the mainboard through a connecting piece in a pluggable manner. According to the utility model, internal air channel crosstalk of the switch can be prevented, and overtemperature of the power supply module and the main chip can be avoided.

Description

Technical Field

[0001] The utility model relates to the field of communication equipment manufacturing, and in particular to a switch and a communication system. Background Art

[0002] As market demand for network switching capacity increases, the demand for switch performance is also increasing, and correspondingly, switch power consumption is also gradually increasing. Traditional heat dissipation methods such as heat sinks are no longer able to meet the heat dissipation requirements of existing switch systems. Air cooling is an essential heat dissipation method in current switch systems.

[0003] Existing air-cooled heat dissipation switches are generally configured with fans and power supplies sharing the same air duct. However, in the case of high power consumption, the shared air duct will cause air duct crosstalk, which in turn causes the power supply and main chip to overheat. Utility Model Content

[0004] The purpose of the present invention is to provide a switch and a communication system that can at least partially solve the above technical problems.

[0005] In a first aspect, the present invention provides a switch, comprising a switch housing, a mainboard, and a first power module, wherein the switch housing comprises an air inlet surface, the air inlet surface comprises a first air inlet window and a second air inlet window, and a first air duct baffle is fixed to the mainboard;

[0006] The mainboard is installed and fixed in the switch housing, dividing the internal space of the switch housing into a first layer and a second layer, wherein the first layer corresponds to the first surface of the mainboard;

[0007] The first air duct partition is fixed to the first surface, dividing the space of the first layer into a first air inlet area and a second air inlet area;

[0008] The first air inlet window corresponds to the first air inlet area, and the second air inlet window corresponds to the second air inlet area;

[0009] The first power module is arranged in the second air inlet area of ​​the first layer, opposite to the second air inlet window, and the first power module is pluggably electrically connected to the mainboard through a connector.

[0010] Optionally, the switch further includes a second power supply module and a second air duct baffle;

[0011] The second air duct baffle is fixed to the second surface of the main board, corresponding to the first air duct baffle, and divides the space of the second layer into a third air inlet area and a fourth air inlet area; wherein the second surface is the surface of the main board corresponding to the second layer, and the first surface is opposite to the second surface;

[0012] The second power supply module is arranged in the third air inlet area of ​​the second layer, opposite to the second air inlet window, and the second power supply module is pluggably electrically connected to the mainboard through a connector.

[0013] Optionally, the switch further includes a panel connector, and the air inlet surface further includes a third air inlet window;

[0014] The third air inlet window is arranged opposite to the first air inlet window and corresponds to the first air inlet area;

[0015] The panel connector is arranged on the air inlet surface and is located between the first air inlet window, the second air inlet window and the third air inlet window.

[0016] Optionally, the switch further includes a main chip heat sink, a third air duct baffle, and a fourth air duct baffle, and the switch housing further includes a first cover plate;

[0017] The main chip radiator is fixed on the mainboard and is located in the second air inlet area of ​​the first layer;

[0018] The first cover plate is away from the second surface and is arranged opposite to the first surface;

[0019] The third air duct baffle and the fourth air duct baffle are fixed to the first cover plate and are arranged at a first preset angle and a second preset angle with the first cover plate respectively;

[0020] The third air duct baffle and the fourth air duct baffle are located in the first air inlet area and are arranged opposite to the main chip radiator so that the wind entering from the first air inlet window is directed to the main chip radiator through the third air duct baffle and the fourth air duct baffle.

[0021] Optionally, the switch further includes a fifth air duct partition;

[0022] The fifth air duct baffle is fixed to the first surface of the mainboard, one side of the fifth air duct baffle is closely attached to the main chip heat sink, and the other side is closely attached to the edge of the first air inlet area;

[0023] The side of the main chip heat sink away from the fifth air duct baffle is arranged in close contact with the first air duct baffle.

[0024] Optionally, the switch further includes a sixth air duct partition;

[0025] The sixth air duct partition is fixed on a side of the first air inlet window close to the first air inlet area;

[0026] The sixth air duct partition is arranged at a third preset angle with respect to the first air inlet window.

[0027] Optionally, the switch housing further includes an air outlet surface, the air outlet surface including a first preset number of first air outlets and a second preset number of second air outlets, each of the first air outlets is correspondingly provided with a fan module, and the first power supply module and the second power supply module are provided in the second air outlets;

[0028] The first air outlet corresponds to the first air inlet window and the third air inlet window, and is used to discharge heat from the first air inlet area and the fourth air inlet area from the inside of the switch;

[0029] The second air outlet corresponds to the second air inlet window and is used to discharge heat from the second air inlet area and the third air inlet area from the inside of the switch.

[0030] Optionally, the switch further includes a fan power supply board;

[0031] The fan power supply board is arranged between the main board and the first air outlet, and is located on the same plane as the main board;

[0032] Each of the fan modules is electrically connected to the fan power supply board in a pluggable manner.

[0033] Optionally, the switch further includes a CPU and a CPU radiator;

[0034] The CPU is installed on the first surface near the fan power supply board;

[0035] The CPU radiator is fixed on a side of the CPU away from the mainboard.

[0036] In a second aspect, the present invention provides a communication system, which includes the switch described in any one of the above items.

[0037] The beneficial effects of the switch and communication system provided by the utility model are:

[0038] By installing a first air duct partition, the first layer isolated from the motherboard is divided into a first air inlet area and a second air inlet area. The first power module is placed in the second air inlet area. This allows the power supply to use its own air duct, eliminating air duct crosstalk with the first air inlet area and effectively preventing overheating of the power supply and main chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0040] Figure 1 A schematic diagram of an existing switch provided by an embodiment of the present utility model;

[0041] Figure 2 A schematic diagram of the structure of a switch provided in an embodiment of the present utility model;

[0042] Figure 3 A schematic diagram of a second air duct baffle and a panel connector provided in an embodiment of the present utility model;

[0043] Figure 4 A schematic diagram showing the positions of the first cover plate and the main chip heat sink provided in an embodiment of the present utility model;

[0044] Figure 5 A schematic diagram of the position of the fifth air duct baffle provided in an embodiment of the present utility model;

[0045] Figure 6 A schematic diagram of the position of the sixth air duct partition provided in an embodiment of the present utility model;

[0046] Figure 7 A schematic diagram of an air outlet surface provided in an embodiment of the present utility model;

[0047] Figure 8 A schematic diagram of a fan power supply board and a CPU provided in an embodiment of the present utility model;

[0048] Figure 9 A schematic diagram of plugging and unplugging the fan module and the power module provided in an embodiment of the utility model.

[0049] Icons: 01-Switch; 10-Switch housing; 101-Air inlet surface; 1011-First air inlet window; 1012-Second air inlet window; 1013-Third air inlet window; 102-First cover plate; 103-Air outlet surface; 1031-First air outlet; 1032-Second air outlet; 11-Motherboard; 111-First surface; 112-Second surface; 12-First power module; 13-Second power module; 14-Panel connector; 15-Main chip heat sink; 16-Fan module; 17-Fan power board; 18-CPU; 19-CPU heat sink; 21-First air duct partition; 22-Second air duct partition; 23-Third air duct partition; 24-Fourth air duct partition; 25-Fifth air duct partition; 26-Sixth air duct partition. DETAILED DESCRIPTION

[0050] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0051] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0052] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0053] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the utility model product is usually placed when in use, or are the orientation or position relationship commonly understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0054] Furthermore, the terms “first,” “second,” “third,” etc., are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0055] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0056] A switch generally includes a mainboard, fan module, power module, and CPU module. The specific module locations are designed according to system requirements.

[0057] Typically, a plug-in power supply is placed at the rear of the chassis, where it uses its own fan for self-cooling, while the system cools down via the fan at the rear of the chassis. Currently, the fans of common low-power air-cooled switches are fixed to the inner wall of the switch with screws. If the fan malfunctions during operation and needs to be replaced, it is necessary to disconnect the power supply and open the top cover for maintenance. This significantly impacts scenarios where the switch must be used continuously without power interruption. In such cases, the fan, like the plug-in power supply, must support quick hot-swap replacement in the event of damage.

[0058] In the layout design of high-power switch equipment, the air ducts of the power module and the plug-in fan module need to be completely isolated, mainly for the following reasons: 1. When the equipment is designed for exhaust ventilation, the temperature at the air inlet of the power module is often higher than the temperature at the equipment air inlet. This is mainly due to the heat sinks of the optical module and the main chip causing a certain temperature rise in the air, which may exceed the maximum operating temperature of the power module. 2. For the thermal design of high-power switch equipment, the fans are generally high-static pressure fans. If the air duct is not isolated from the power module, the back pressure of the fan of the power module will be very high, and the efficiency of the plug-in power fan will be greatly reduced, thereby affecting the heat dissipation of the plug-in power module. In severe cases, there may be air duct backflow and air duct turbulence, which greatly affects the heat dissipation of the system.

[0059] like Figure 1 The figure below shows the structure of a conventional switch chassis equipped with pluggable fans and power supplies. This is typically used for relatively low-power switches. When the fan is mounted on the back, the pluggable fan and power supply share a common air duct (optionally with both exhaust and blower functions). The fan's static pressure is relatively balanced with that of the power module's built-in fan, resulting in relatively uniform heat dissipation within the system, meeting the cooling requirements of most environments.

[0060] However, this structure can only meet the heat dissipation needs of low-power devices. When the power consumption reaches a certain level, plugging and unplugging the power module and the fan sharing the system air duct will cause air duct disorder, power module overheating, abnormal back pressure of the power module's own fan, and overheating of the system main chip.

[0061] Based on the above situation, the embodiments of this specification provide a switch 01 and a communication system that can effectively alleviate the above technical problems.

[0062] In the embodiments provided herein, when switch 01 is designed for exhaust ventilation, the air inlet surface 101, air inlet window, air outlet surface 103, air outlet, and the like described below can be employed. If switch 01 is designed for blown ventilation, the principles are similar and do not affect the technical effects of the present invention. The following description will only describe the principles of the present invention using the exhaust ventilation design.

[0063] See also Figure 2 This embodiment provides a switch 01, which includes a switch housing 10, a mainboard 11 and a first power module 12. The switch housing 10 includes an air inlet surface 101, and the air inlet surface 101 includes a first air inlet window 1011 and a second air inlet window 1012. A first air duct partition 21 is fixed on the mainboard 11.

[0064] The mainboard 11 is installed and fixed in the switch housing 10 , dividing the internal space of the switch housing 10 into a first layer and a second layer, wherein the first layer corresponds to the first surface 111 of the mainboard 11 .

[0065] The first air duct partition plate 21 is fixed on the first surface 111 , dividing the space of the first layer into a first air inlet area and a second air inlet area.

[0066] The first air inlet window 1011 corresponds to the first air inlet area, and the second air inlet window 1012 corresponds to the second air inlet area.

[0067] The first power module 12 is disposed in the second air inlet area of ​​the first layer, opposite to the second air inlet window 1012 . The first power module 12 is pluggably electrically connected to the mainboard 11 via a connector.

[0068] exist Figure 2 In the figure, the motherboard 11 is positioned in the middle of the switch housing 10, dividing the space inside the switch housing 10 into two upper and lower parts: the first layer and the second layer. A first air duct partition 21 further divides the first layer of the switch housing 10's internal space, corresponding to the first surface 111 of the motherboard 11, into a first air intake area and a second air intake area. A first air intake window 1011 is positioned on the air intake surface 101 at a position corresponding to the first air intake area, and a second air intake window 1012 is positioned at a position corresponding to the second air intake area. A first power supply module 12 is positioned in the second air intake area, opposite the second air intake window 1012.

[0069] When the cooling system of switch 01 starts working, the air entering through the first air inlet window 1011 will only pass through the first air inlet area, and the air entering through the second air inlet window 1012 will only pass through the second air inlet area and reach the first power module 12, thereby taking away the heat generated by the first power module 12 and avoiding the problem of air duct crosstalk.

[0070] Optionally, the switch 01 further includes a second power supply module 13 and a second air duct baffle 22 .

[0071] The second air duct partition 22 is fixed on the second surface 112 of the main board 11, corresponding to the first air duct partition 21, dividing the space of the second layer into a third air inlet area and a fourth air inlet area; wherein, the second surface 112 is the surface of the main board 11 corresponding to the second layer, and the first surface 111 is opposite to the second surface 112.

[0072] The second power supply module 13 is disposed in the third air inlet area of ​​the second layer, opposite to the second air inlet window 1012 . The second power supply module 13 is pluggably electrically connected to the mainboard 11 via a connector.

[0073] like Figure 3 The figure shows a schematic diagram with the second surface 112 of the mainboard 11 facing upward. A second air duct partition 22 is provided on the second surface 112 of the mainboard 11 corresponding to the first air duct partition 21, and a second power module 13 is provided corresponding to the first power module 12. The second air duct partition 22 separates the space of the second layer corresponding to the second surface 112 into a third air inlet area and a fourth air inlet area. This also ensures that the air entering the third air inlet area through the second air inlet window 1012 does not cross-interfere with the air entering the fourth air inlet area, thereby ensuring the operating stability of the second power module 13.

[0074] Optionally, the switch 01 further includes a panel connector 14, and the air inlet surface 101 further includes a third air inlet window 1013. The third air inlet window 1013 is arranged opposite to the first air inlet window 1011 and corresponds to the first air inlet area.

[0075] The panel connector 14 is disposed on the air inlet surface 101 and is located between the first air inlet window 1011 , the second air inlet window 1012 and the third air inlet window 1013 .

[0076] Still Figure 3 For example, the panel connector 14 of the switch 01 can be located on the air inlet surface 101, between the first air inlet window 1011, the second air inlet window 1012, and the third air inlet window 1013. This effectively utilizes the space resources of the air inlet surface 101. The third air inlet window 1013 corresponds to the fourth air inlet area, so that the air in the fourth air inlet area can be completely supplied by the third air inlet window 1013, thus preventing the air from other air inlets from entering the fourth air inlet area and causing interference.

[0077] Optionally, the switch 01 further includes a main chip heat sink 15 , a third air duct partition 23 , and a fourth air duct partition 24 , and the switch housing 10 further includes a first cover plate 102 .

[0078] The main chip heat sink 15 is fixed on the main board 11 and is located in the second air inlet area of ​​the first layer. The first cover plate 102 is away from the second surface 112 and is arranged opposite to the first surface 111.

[0079] The third air duct baffle 23 and the fourth air duct baffle 24 are fixed on the first cover plate 102 and are disposed at a first preset angle and a second preset angle with the first cover plate 102 , respectively.

[0080] The third air duct baffle 23 and the fourth air duct baffle 24 are located in the first air inlet area and are arranged opposite to the main chip radiator 15 so that the wind entering from the first air inlet window 1011 is directed to the main chip radiator 15 through the third air duct baffle 23 and the fourth air duct baffle 24.

[0081] like Figure 4 As shown, the first cover plate 102 can be the upper cover plate of the switch housing 10 covering the first layer. The third air duct partition plate 23 and the fourth air duct partition plate 24 are installed and fixed on the first cover plate 102, which can better guide the air volume entering from the first air inlet window 1011 to the main chip radiator 15, thereby achieving better heat dissipation effect.

[0082] Optionally, the switch 01 further includes a fifth air duct baffle 25. The fifth air duct baffle 25 is fixed to the first surface 111 of the mainboard 11, with one side of the fifth air duct baffle 25 being closely attached to the main chip heat sink 15 and the other side being closely attached to the edge of the first air inlet area.

[0083] A side of the main chip heat sink 15 away from the fifth air duct partition 25 is closely attached to the first air duct partition 21 .

[0084] like Figure 5 As shown, since the main chip radiator 15 is close to the fifth air duct partition 25 on the left and the first air duct partition 21 on the right, when the wind enters the first air inlet area from the first air inlet window 1011, it can only pass through the position where the main chip is located, and then reach the air outlet position at the rear end of the switch 01, further improving the heat dissipation effect of the main chip radiator 15.

[0085] Optionally, the switch 01 further includes a sixth air duct baffle 26. The sixth air duct baffle 26 is fixed to a surface of the first air inlet window 1011 close to the first air inlet area. The sixth air duct baffle 26 is arranged at a third preset angle to the first air inlet window 1011.

[0086] See also Figure 6 A sixth air duct partition 26 is installed on the side of the first air inlet window 1011 close to the first air inlet area. When the wind enters the first air inlet area from the first air inlet window 1011, the port optical module corresponding to the panel connector 14 will be cooled first due to the action of the sixth air duct partition 26, and then the main chip radiator 15 will continue to be cooled.

[0087] It should be noted that the above-mentioned first preset angle, second preset angle and third preset angle can be the same angle or different angles. During actual settings, users can make specific settings according to their needs, and the present utility model does not make specific limitations on this.

[0088] Optionally, the switch housing 10 also includes an air outlet surface 103, which includes a first preset number of first air outlets 1031 and a second preset number of second air outlets 1032, and each first air outlet 1031 is correspondingly provided with a fan module 16, and the first power supply module 12 and the second power supply module 13 are arranged in the second air outlet 1032.

[0089] The first air outlet 1031 corresponds to the first air inlet window 1011 and the third air inlet window 1013 , and is used to discharge heat from the first air inlet area and the fourth air inlet area from the inside of the switch 01 .

[0090] The second air outlet 1032 corresponds to the second air inlet window 1012 and is used to discharge heat from the second air inlet area and the third air inlet area from the inside of the switch 01.

[0091] by Figure 7 For example, corresponding to the air inlet surface 101, the air outlet surface 103 of the switch 01 can be provided with a plurality of first air outlets 1031, and each first air outlet 1031 is provided with a Figure 9 The pluggable fan module 16 is shown. Similarly, the first power module 12 and the second power module 13 can be provided with a second air outlet 1032. When the switch 01 is in operation, cold air enters the switch 01 through the air inlet 101, dissipates heat from the main chip heat sink 15, the first power module 12, and the second power module 13, and is then exhausted from the switch 01 by the fan module 16 and the fans built into the first and second power modules 12, 13. Because the fan module 16, the first power module 12, and the second power module 13 are all pluggable, they can be replaced more conveniently and quickly.

[0092] In practical applications, the number of the first air outlets 1031 , the number of the fan modules 16 , and the number of the first power modules 12 and the second power modules 13 can be set according to needs, and the present invention does not impose any specific restrictions on this.

[0093] Optionally, the switch 01 further includes a fan power supply board 17. The fan power supply board 17 is disposed between the mainboard 11 and the first air outlet 1031 and is located on the same plane as the mainboard 11. Each fan module 16 is electrically connected to the fan power supply board 17 in a pluggable manner.

[0094] See Figure 8The fan power supply board 17 is arranged between the mainboard 11 and the first air outlet 1031, providing conditions for plugging and unplugging the fan module 16, and arranging it on the same plane with the mainboard 11 reasonably utilizes the internal space of the mainboard 11.

[0095] Optionally, the switch 01 further includes a CPU 18 and a CPU radiator 19. The CPU 18 is mounted on the first surface 111 near the fan power supply board 17. The CPU radiator 19 is fixed to a side of the CPU 18 away from the motherboard 11.

[0096] Still Figure 8 For example, the CPU radiator 19 is arranged close to the fan module 16. When the fan is running, it can quickly take away the heat on the CPU radiator 19 and dissipate the heat for the CPU 18 well.

[0097] Based on the same inventive concept, the present invention provides a communication system, which includes any one of the above switches 01.

[0098] Regarding the above-mentioned communication system, the specific functions and structures of each part thereof have been described in detail in the embodiment of the switch 01 provided in this specification, and will not be elaborated here.

[0099] By adopting the above solution in the embodiment of the present utility model, it is possible to:

[0100] 1. By installing a first air duct partition, the first layer isolated from the motherboard is divided into a first air intake area and a second air intake area. The first power module is placed in the second air intake area. This allows the power supply to use its own air duct, eliminating air duct crosstalk with the first air intake area and effectively preventing overheating of the power supply and main chip.

[0101] 2. The first power module, the second power module and each fan module are all configured to be pluggable, so that the fan module or the power module can be replaced more conveniently.

[0102] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A switch, characterized in that: The switch (01) comprises a switch housing (10), a mainboard (11) and a first power module (12); the switch housing (10) comprises an air inlet surface (101); the air inlet surface (101) comprises a first air inlet window (1011) and a second air inlet window (1012); a first air duct partition (21) is fixed on the mainboard (11); The mainboard (11) is installed and fixed in the switch housing (10), dividing the internal space of the switch housing (10) into a first layer and a second layer, wherein the first layer corresponds to the first surface (111) of the mainboard (11); The first air duct partition (21) is fixed on the first surface (111), dividing the space of the first layer into a first air inlet area and a second air inlet area; The first air inlet window (1011) corresponds to the first air inlet area, and the second air inlet window (1012) corresponds to the second air inlet area; The first power module (12) is arranged in the second air inlet area of ​​the first layer, opposite to the second air inlet window (1012), and the first power module (12) is pluggably electrically connected to the mainboard (11) via a connector.

2. The switch according to claim 1, wherein: The switch (01) further includes a second power supply module (13) and a second air duct partition (22); The second air duct partition plate (22) is fixed on the second surface (112) of the main board (11), corresponding to the first air duct partition plate (21), and divides the space of the second layer into a third air inlet area and a fourth air inlet area; wherein the second surface (112) is a surface of the main board (11) corresponding to the second layer, and the first surface (111) and the second surface (112) are opposite; The second power supply module (13) is arranged in the third air inlet area of ​​the second layer, opposite to the second air inlet window (1012), and the second power supply module (13) is pluggably electrically connected to the mainboard (11) via a connector.

3. The switch according to claim 2, wherein: The switch (01) further includes a panel connector (14), and the air inlet surface (101) further includes a third air inlet window (1013); The third air inlet window (1013) is arranged opposite to the first air inlet window (1011) and corresponds to the first air inlet area; The panel connector (14) is arranged on the air inlet surface (101), and is located between the first air inlet window (1011), the second air inlet window (1012), and the third air inlet window (1013).

4. The switch according to claim 2, wherein: The switch (01) further includes a main chip heat sink (15), a third air duct partition (23), and a fourth air duct partition (24); the switch housing (10) further includes a first cover plate (102); The main chip radiator (15) is fixed on the main board (11) and is located in the second air inlet area of ​​the first layer; The first cover plate (102) is away from the second surface (112) and is arranged opposite to the first surface (111); The third air duct partition plate (23) and the fourth air duct partition plate (24) are fixed on the first cover plate (102), and are arranged at a first preset angle and a second preset angle with the first cover plate (102), respectively; The third air duct baffle (23) and the fourth air duct baffle (24) are located in the first air inlet area and are arranged opposite to the main chip radiator (15), so that the air entering from the first air inlet window (1011) is guided to the main chip radiator (15) through the third air duct baffle (23) and the fourth air duct baffle (24).

5. The switch according to claim 4, wherein: The switch (01) further includes a fifth air duct partition (25); The fifth air duct baffle (25) is fixed on the first surface (111) of the main board (11), one side of the fifth air duct baffle (25) is closely attached to the main chip heat sink (15), and the other side is closely attached to the edge of the first air inlet area; The side of the main chip heat sink (15) away from the fifth air duct partition (25) is arranged in close contact with the first air duct partition (21).

6. The switch according to claim 1, wherein: The switch (01) further includes a sixth air duct partition (26); The sixth air duct partition (26) is fixed on a side of the first air inlet window (1011) close to the first air inlet area; The sixth air duct partition (26) and the first air inlet window (1011) are arranged at a third preset angle.

7. The switch according to claim 3, wherein: The switch housing (10) further comprises an air outlet surface (103), the air outlet surface (103) comprising a first preset number of first air outlets (1031) and a second preset number of second air outlets (1032), a fan module (16) being correspondingly arranged in each of the first air outlets (1031), and the first power supply module (12) and the second power supply module (13) being arranged in the second air outlets (1032); The first air outlet (1031) corresponds to the first air inlet window (1011) and the third air inlet window (1013), and is used to discharge heat from the first air inlet area and the fourth air inlet area from the inside of the switch (01); The second air outlet (1032) corresponds to the second air inlet window (1012) and is used to discharge heat from the second air inlet area and the third air inlet area from the inside of the switch (01).

8. The switch according to claim 7, wherein: The switch (01) further includes a fan power supply board (17); The fan power supply board (17) is arranged between the main board (11) and the first air outlet (1031), and is located on the same plane as the main board (11); Each of the fan modules (16) is electrically connected to the fan power supply board (17) in a pluggable manner.

9. The switch according to claim 8, wherein: The switch (01) further includes a CPU (18) and a CPU radiator (19); The CPU (18) is installed on the first surface (111) at a position close to the fan power supply board (17); The CPU radiator (19) is fixed on a side of the CPU (18) away from the mainboard (11).

10. A communication system, characterized in that: The communication system comprises the switch (01) according to any one of claims 1 to 9.

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