Loudspeaker module and electronic equipment

Abstract

The embodiment of the utility model provides a loudspeaker module and electronic equipment, the loudspeaker module comprises a shell, a loudspeaker single body and a separator, the shell is provided with a containing cavity, the separator is of a net structure and divides the containing cavity into a first cavity and a second cavity, the loudspeaker single body is arranged in the first cavity, and the second cavity is used for being filled with sound absorption particles. According to the loudspeaker module provided by the embodiment of the invention, the isolation between the first cavity and the second cavity is realized through the isolation piece, the assembly space of the isolation piece does not need to be reserved between the side wall of the loudspeaker monomer and the shell, and the dispensing space between the isolation piece and the side wall of the loudspeaker monomer is saved; the occupation of the internal space of the loudspeaker module is further reduced, the overall size of the loudspeaker module is reduced, and the layout difficulty in the electronic equipment is also reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a speaker module and electronic equipment. Background Art

[0002] In order to improve the acoustic performance of the speaker module, sound-absorbing particles can be filled in the shell of the speaker module. At the same time, an isolation piece is required to separate the sound-absorbing particles from the speaker unit to prevent the sound-absorbing particles from entering the interior of the speaker unit and affecting the working performance of the unit.

[0003] In the prior art, the isolation member in the speaker module surrounds the speaker unit, isolating it from its multiple outer walls. Furthermore, glue is required between the isolation member and the speaker unit to ensure a secure connection and seal. This structure is complex, requiring more space and glue to secure the speaker unit. It also increases the overall size of the speaker module and hinders its placement within the overall device. Utility Model Content

[0004] The present application aims to provide a speaker module and an electronic device to solve the problem of the speaker module occupying space.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, the present application discloses a speaker module, comprising: a housing, a speaker unit, and an isolation member, wherein:

[0007] The shell has a accommodating cavity, the isolating member is a mesh structure, the isolating member divides the accommodating cavity into a first cavity and a second cavity, the speaker unit is arranged in the first cavity, and the second cavity is used to fill sound-absorbing particles.

[0008] In a second aspect, the present application also discloses an electronic device, comprising the above-mentioned speaker module.

[0009] In the embodiment of the present application, the isolation member is a mesh structure with a simple structure. By setting the isolation member, isolation between the first cavity and the second cavity can be achieved, preventing sound-absorbing particles from entering the speaker unit set in the first cavity without the need for connection to the side wall of the speaker unit. In this way, there is no need to reserve assembly space for the isolation member between the side wall of the speaker unit and the shell, and the glue spotting space between the isolation member and the side wall of the speaker unit is saved, further reducing the occupation of the internal space of the speaker module, reducing the overall size of the speaker module, and reducing the difficulty of layout inside the electronic device.

[0010] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0012] Figure 1 is an exploded schematic diagram of a speaker module in an embodiment of the present application;

[0013] Figure 2 Schematic diagram of the internal structure of the speaker module in the embodiment of the present application;

[0014] Figure 3 is a cross-sectional view of a speaker module in an embodiment of the present application;

[0015] Figure 4 It is a partially enlarged schematic diagram of the isolation element in the embodiment of the present application.

[0016] Figure numerals: 10 - shell, 11 - accommodating cavity, 111 - first cavity, 112 - second cavity, 12 - first shell, 13 - second shell, 20 - isolation member, 21 - connecting portion, 22 - assembly gap, 23 - supporting area, 201 - first side, 202 - second side, 30 - speaker unit, 40 - supporting member, 50 - buffer member, 60 - circuit board, X - first direction. DETAILED DESCRIPTION

[0017] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0018] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0019] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0021] As electronic devices upgrade at an ever-increasing pace, the stacking and integration levels within them are also increasing, making the internal layout space of the entire device increasingly crowded. Furthermore, the improvement in the shooting performance of electronic devices has led to an increasing occupation of the internal layout space by the camera module, posing a severe challenge to the layout of components within the limited space.

[0022] In electronic devices, speaker modules can be used to convert electrical signals into sound signals to achieve functions such as calls, media playback, message notifications, and voice interaction. Among them, in order to improve the acoustic performance of the speaker module, sound-absorbing particles can also be filled in the shell of the speaker module. At the same time, it is necessary to set an isolation member to separate the sound-absorbing particles from the speaker unit to prevent the sound-absorbing particles from entering the interior of the speaker unit and affecting the working performance of the unit. However, as mentioned above, the shrinking of the internal layout space of electronic equipment has also put forward new requirements for the volume of the speaker module. In common speaker modules, the isolation member used to isolate the sound-absorbing particles from the speaker unit is a three-dimensional isolation net, which is usually covered on the outside of the speaker unit. A certain distance needs to be set between the shell and the speaker unit to accommodate the side wall of the isolation net. Furthermore, in order to ensure the isolation effect of this three-dimensional isolation net on the speaker unit, it is also necessary to set a sealant between the outer wall of the speaker unit and the inner wall of the isolation net. The above factors all occupy the space between the shell and the speaker unit, resulting in a larger shell size, which is not conducive to the miniaturization of the speaker module.

[0023] Based on the above reasons, an embodiment of the present application provides a speaker module. Compared with the speaker module in the prior art, the speaker module provided by the embodiment of the present application is smaller in size, easier to layout, and more adaptable to the current increasingly tight layout space trend.

[0024] Reference Figures 1 to 3 , which shows a schematic structural diagram of a speaker module disclosed in an embodiment of the present application. As shown in the figure, the speaker module provided by the present application may specifically include: a housing 10, a speaker unit 30, and an isolator 20. The housing 10 has a receiving cavity 11. The isolator 20 is a planar mesh structure. The isolator 20 is connected to the side wall of the housing 10 and divides the receiving cavity 11 into a first cavity 111 and a second cavity 112. The speaker unit 30 is disposed in the first cavity 111, and the second cavity 112 is used to fill sound-absorbing particles.

[0025] Specifically, if Figure 1 As shown, the shell 10 includes a first shell 12 and a second shell 13 arranged along a first direction X, and the first shell 12 is connected to the second shell 13 to enclose a accommodating cavity 11, wherein the accommodating cavity 11 can be arranged in the first shell 12, and the accommodating cavity 11 has an opening to facilitate the assembly of the internal structure, the second shell 13 can be used as a cover to block the opening of the accommodating cavity 11, and the isolation member 20 can be connected to the side wall of the first shell 12. It should be noted that in the embodiment of the present application, the shell 10 has a top wall and a bottom wall arranged relative to each other along the first direction X, and four side walls arranged around it. In actual applications, the shell 10 serves as the outer shell of the speaker module and the external protective structure of the speaker unit 30, and has the functions of protection and sound insulation. Specifically, the shell 10 can prevent the vibration of the speaker from interfering with the sound generated by the surrounding environment, while protecting the internal structure from the influence of the external environment. The speaker module also includes a circuit board 60. The speaker unit 30 is electrically connected to the circuit board 60 to receive electrical signals and convert the received electrical signals into sound signals. The speaker unit 30 can also amplify the sound signals so that the user can hear the sound clearly and realize various audio playback functions of the electronic device.

[0026] In the speaker module of the embodiment of the present application, the second cavity 112 is further provided with sound-absorbing particles to virtually expand the space of the second cavity 112 in the module, thereby improving the acoustic performance of the speaker module. The isolation member 20 generally includes an isolation net, which is provided with a plurality of mesh holes distributed at intervals. Preferably, the apertures of the mesh holes are equal, so as to facilitate matching with the size of the sound-absorbing particles. Figure 4 , is a partial schematic diagram of the isolation member 20 in the embodiment of the present application, as shown Figure 4As shown, the mesh of the isolation net is circular. In practical applications, the mesh can also be other shapes, such as rectangular, triangular, or diamond-shaped. This application does not specifically limit the mesh shape. The isolation net is used to isolate the sound-absorbing particles from the speaker unit 30. It should be noted that the mesh of the isolation net needs to be compatible with the sound-absorbing particles. That is, the mesh size of the isolation net should be smaller than the particle size of the sound-absorbing particles to prevent the sound-absorbing particles from falling through the mesh into the first cavity 111 and then into the speaker unit 30, affecting its performance.

[0027] In the embodiment of the present application, the isolator 20 is a planar mesh structure with a simple structure and processing technology. The size of the isolator 20 can be determined according to the size of the shell 10 and by reserving an assembly gap 22. The isolator 20 required by the embodiment of the present application can be obtained by cutting, which saves processing costs. The isolator 20 can achieve isolation between the first cavity 111 and the second cavity 112 by directly connecting to the side wall of the shell 10, preventing sound-absorbing particles from entering the speaker unit 30 arranged in the first cavity 111, without the need to connect to the side wall of the speaker unit 30. In this way, there is no need to reserve assembly space for the isolator 20 between the side wall of the speaker unit 30 and the shell 10, and the glue dispensing space between the isolator 20 and the side wall of the speaker unit 30 is saved, further reducing the occupation of the internal space of the speaker module, reducing the overall size of the speaker module, and reducing the difficulty of layout inside the electronic device.

[0028] like Figure 2 、 Figure 3 As shown, the speaker module also includes a connecting portion 21, and there is an assembly gap 22 between the isolation member 20 and the side wall of the shell 10. The connecting portion 21 at least partially fills the assembly gap 22 and connects the isolation member 20 to the side wall of the shell 10 to achieve the connection between the isolation member 20 and the shell 10, and complete isolation between the first cavity 111 and the second cavity 112.

[0029] In actual application, the speaker unit 30 can be assembled into the first shell 12 first, and then the isolator 20 can be placed on the speaker unit 30. The speaker unit 30 can play a certain supporting role on the isolator 20, so as to facilitate the connection operation between the isolator 20 and the first shell 12. An assembly gap 22 is formed around the isolator 20 and the side wall of the shell 10. Among them, the setting of the assembly gap 22 needs to take into account the connection reliability of the connecting part 21, the difficulty of the connection operation and the assembly tolerance of the isolator 20. For example, when the connection reliability of the connecting part 21 is low, the assembly gap 22 can be appropriately increased to increase the volume of the connecting part 21 and thus improve the connection strength. When the difficulty of the connection operation is high, the assembly gap 22 can be appropriately reduced to facilitate the connection operation. In addition, the manufacturing tolerance between the isolator 20 and the shell 10 must also be considered to prevent the isolator 20 from being unable to be assembled to the target position due to manufacturing tolerance.

[0030] In an optional embodiment of the present application, the spacer 20 and the housing 10 are connected by bonding. This is suitable for situations where at least one of the spacer 20 and the housing 10 is non-metallic, making welding impossible. In practice, glue can be dispensed along the assembly gap 22. Once the glue solidifies, it forms a connection 21. This connection 21 not only connects the spacer 20 and the housing 10 but also acts as a sealant to isolate the first cavity 111 from the second cavity 112.

[0031] In another optional embodiment of the present application, the isolator 20 is connected to the shell 10 by welding. For example, the isolator 20 can be a metal woven mesh or a metal etched mesh, and the shell 10 is a metal shell 10, and the two can be connected by welding. It should be noted that in order to ensure complete isolation between the first cavity 111 and the second cavity 112, the edges of the isolator 20 need to be welded to the shell 10 to prevent the sound-absorbing particles in the second cavity 112 from falling into the first cavity 111 and then falling into the speaker unit 30.

[0032] In addition, the connection between the isolation member 20 and the housing 10 may be achieved by combining bonding and welding, which is not specifically limited in this application.

[0033] Optionally, the width of the assembly gap 22 is 0.05 mm-0.2 mm, so as to improve the isolation effect and reliability of the isolation member 20 between the first cavity 111 and the second cavity 112 while satisfying the connection strength between the isolation member 20 and the shell 10 .

[0034] The present application controls the width of the assembly gap 22 to be between 0.05 mm and 0.2 mm. This not only facilitates the bonding or welding operation between the isolator 20 and the housing 10, thereby improving assembly efficiency, but also ensures the reliability of the connection between the isolator 20 and the housing 10. In addition, in actual applications, since the second cavity 112 is filled with sound-absorbing particles, the sound-absorbing particles may adhere to any position in the second cavity 112. When the sound-absorbing particles fall into the assembly gap 22, if the connection portion 21 does not completely fill the assembly gap 22, the sound-absorbing particles may fall into the first cavity 111. Furthermore, the sound-absorbing particles may fall into the speaker unit 30, ultimately adversely affecting the acoustic performance of the speaker module. Therefore, by controlling the width of the assembly gap 22, the probability of sound-absorbing particles falling into the first cavity 111 through the incompletely filled assembly gap 22 can also be reduced.

[0035] like Figure 3As shown, the speaker module also includes a support member 40, which is arranged in the second cavity 112, and the support member 40 is respectively connected to the shell 10 and the isolation member 20 on both sides along the first direction X to provide support for the speaker unit 30, prevent the speaker unit 30 from moving, and ensure the reliability of the speaker unit 30.

[0036] As mentioned above, during the assembly of the speaker module, it is necessary to first place the speaker unit 30 into the first shell 12, and then place the isolating member 20 on top of the speaker unit 30, so as to facilitate bonding or welding operations on the isolating member 20. It can be understood that through the above assembly method, the isolating member 20 is actually in contact with the top of the speaker unit 30. Since the isolating member 20 provided in the embodiment of the present application is a planar mesh structure, its structural thickness is relatively small, and its rigidity will be affected to a certain extent. When the speaker module is subjected to external force, the speaker unit 30 may move in the first cavity 111, thereby squeezing the isolating member 20. When the isolating member 20 is not rigid enough, the isolating member 20 will be deformed under the squeezing of the speaker unit 30, which will cause the speaker unit 30 to be displaced, thereby affecting the acoustic performance of the speaker unit 30. Therefore, by setting a support member 40 in the second cavity 112 and setting the support member 40 to be connected between the shell 10 and the isolation member 20, a certain supporting force can be provided to the isolation member 20. Indirectly, the supporting force is transmitted to the speaker unit 30 in contact with the isolation member 20, thereby preventing the speaker unit 30 from shaking and affecting its performance.

[0037] Optionally, the support member 40 is a spring sheet, which is connected to the isolation member 20 and protrudes toward the shell 10 along the first direction X to be connected to the shell 10. When the spring sheet is connected to the isolation member 20 and the shell 10, the spring sheet itself is bent and can be used to accommodate sound-absorbing particles.

[0038] Specifically, if Figure 3 The illustrated spring sheet can be bent in its middle portion along its length to form a bent section, ultimately resulting in a shape in which the bent section protrudes toward the housing 10 along the first direction X. Because the support member 40 is formed by the bent spring sheet, in actual applications, the spring sheet occupies very little space in the second cavity 112, and sound-absorbing particles can be filled between the bent section and the isolation member 20. This spring sheet structure not only provides support for the speaker unit 30, but also minimizes the impact on the volume of the sound-absorbing particles used to create the second cavity 112 space in the virtual expansion module, thereby ensuring an improved acoustic performance of the speaker module.

[0039] Optionally, the isolation member 20 is provided with a support area 23 , and the support area 23 is used to set the support member 40 , wherein the support area 23 is set in the central area of ​​the isolation member 20 , thereby ensuring the supporting effect of the isolation member 20 and the speaker unit 30 .

[0040] like Figure 2 As shown, the blank area on the isolation member 20 is the area shown as the support area 23, wherein, when the support member 40 is a spring, the two ends of the spring can be connected to the two blank areas as shown in the figure, and the middle part of the spring is bent toward the shell 10 and connected to the shell 10. It can be understood that since the support area 23 is set in the central area of ​​the isolation member 20, the support member 40 set on the support area 23 can provide a more uniform support force to each position of the isolation member 20, reducing the structural deformation caused by vibration or external force, thereby improving the overall stability and durability of the speaker module. In addition, this layout is also conducive to the uniform distribution of sound-absorbing particles in the second cavity 112, further ensuring the sound absorption effect.

[0041] It should be noted that Figure 2 The blank area in the middle is merely a schematic representation of the support area 23 and does not mean that the area is not provided with mesh. Without specifying whether the support area 23 is provided with mesh, the manufacturing and cutting process of the separator 20 does not need to consider the setting of the support area 23, ensuring the processing convenience of the separator 20.

[0042] Furthermore, if Figure 3 As shown, the speaker module further includes a buffer member 50 , which is connected between the housing 10 and the support member 40 , wherein the buffer member 50 may be an elastic member or a flexible member to enhance the structural stability and shock resistance of the speaker module.

[0043] Specifically, support member 40 and isolator 20 both have a certain degree of rigidity, while buffer member 50 has less rigidity and greater elasticity. When housing 10 is impacted by external forces, buffer member 50 deforms to effectively absorb and disperse external vibration and impact forces, preventing these external forces from directly acting on support member 40 and isolator 20, thereby protecting speaker unit 30 from damage. In practical applications, buffer member 50 can be foam with cushioning properties, or other components capable of achieving a cushioning effect, which is not specifically limited in this application.

[0044] Optionally, the isolation member 20 includes at least one of an etched mesh and a woven mesh, which can be selected according to actual needs and is not specifically limited in this application.

[0045] For example, the isolator 20 can be a woven metal mesh or an etched steel mesh. In practical applications, a pre-made woven metal mesh or etched steel mesh with suitable mesh size can be selected and cut to the desired size to obtain an isolator 20 suitable for use in a speaker module. When the isolator 20 is made of metal and the housing 10 is also made of metal, the isolator 20 can be welded to the housing 10.

[0046] In addition, the spacer 20 can also be made of a polymer material, such as polyester film (PET), by punching holes in a film. It should be noted that when the spacer 20 is made of a non-metallic material, the rigidity of the material must be considered to ensure its ability to support the sound-absorbing particles.

[0047] Optionally, the isolation member 20 includes a first side 201 and a second side 202 disposed opposite to each other along the first direction X. The first side 201 is disposed close to the speaker unit 30 and is connected to the speaker unit 30 .

[0048] It should be noted that, according to the assembly process of the speaker module, the speaker unit 30 needs to be placed in the shell 10 first, and then the isolator 20 needs to be placed on top of the speaker unit 30, and then the isolator 20 needs to be welded or bonded. During this process, the isolator 20 may be subjected to unexpected displacement by external force, resulting in a change in the assembly gap 22 between the side wall of the shell 10. By connecting the first side 201 of the isolator 20 to the speaker unit 30, a preliminary positioning operation is actually performed on the isolator 20, which facilitates keeping the isolator 20 in a preset position. In actual application, after placing the isolator 20 on top of the speaker unit 30, the assembly gap 22 between the isolator 20 and the shell 10 can be adjusted so that the assembly gap 22 between the isolator 20 and the multiple side walls is evenly distributed, and then the isolator 20 is fixed to the speaker unit 30 by dispensing or spot welding. In this way, when performing the connection operation between the isolator 20 and the shell 10, the displacement of the isolator 20 can be avoided, which causes a change in the assembly gap 22, thereby improving the assembly quality.

[0049] In summary, the speaker module provided by the embodiments of the present application has at least the following advantages:

[0050] In the embodiment of the present application, the isolation member is a planar mesh structure with a simple structure. The isolation member can achieve isolation between the first cavity and the second cavity by directly connecting to the side wall of the shell, thereby preventing sound-absorbing particles from entering the speaker unit arranged in the first cavity, without the need to connect to the side wall of the speaker unit. In this way, there is no need to reserve assembly space for the isolation member between the side wall of the speaker unit and the shell, and the glue spotting space between the isolation member and the side wall of the speaker unit is saved, further reducing the occupation of the internal space of the speaker module, reducing the overall size of the speaker module, and reducing the difficulty of layout inside the electronic device.

[0051] The present application also discloses an electronic device including the speaker module described above. The electronic device may include, but is not limited to, at least one of a mobile phone, a tablet computer, and a wearable device. The embodiments of the present application do not limit the specific type of the electronic device.

[0052] For example, the electronic device can be a smart phone. When the electronic device is a smart phone, a main board and a sub-board are usually provided inside the device. The speaker module can be an upper speaker or a lower speaker. When the speaker module is used as an upper speaker, it can be connected to the main board of the electronic device. When the speaker module is used as a lower speaker, it can be connected to the sub-board of the electronic device. This application does not make any specific limitations on this.

[0053] In specific applications, when the speaker module is used as an upper speaker, its position is usually closer to the camera module of the electronic device. Since the camera module is usually equipped with a coil motor for driving the movement of the lens assembly, the magnetic parts in the motor and the magnetic circuit components in the speaker may cause magnetic interference. At this time, the shell of the speaker module can be made of a material with magnetic isolation properties, such as 430 stainless steel.

[0054] It should be noted that the structure of the speaker module in the electronic device provided in the embodiment of the present application is the same as the structure of the speaker module described in any of the above embodiments, and its beneficial effects are also similar, which will not be repeated here.

[0055] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0056] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A speaker module, characterized in that: include: A housing (10), a speaker unit (30) and an isolation member (20), wherein: The housing (10) has a housing cavity (11); the isolating member (20) is a mesh structure; the isolating member (20) divides the housing cavity (11) into a first cavity (111) and a second cavity (112); the speaker unit (30) is arranged in the first cavity (111); and the second cavity (112) is used to be filled with sound-absorbing particles.

2. The speaker module according to claim 1, wherein: The speaker module further includes a connecting portion (21), an assembly gap (22) is provided between the isolating member (20) and the side wall of the shell (10), and the connecting portion (21) at least partially fills the assembly gap (22) and connects the isolating member (20) to the side wall of the shell (10).

3. The speaker module according to claim 2, wherein: The width of the assembly gap (22) is 0.05 mm to 0.2 mm.

4. The speaker module according to claim 1, wherein: The speaker module further includes a support member (40), the support member (40) being arranged in the second cavity (112), and the support member (40) being respectively connected to the shell (10) and the isolation member (20) on both sides along the first direction (X).

5. The speaker module according to claim 4, characterized in that: The supporting member (40) is a spring sheet, which is connected to the isolating member (20) and protrudes toward the housing (10) along the first direction (X) to be connected to the housing (10).

6. The speaker module according to claim 4, wherein: The isolating member (20) is provided with a support area (23), and the support area (23) is used to set the support member (40), wherein the support area (23) is set in the central area of ​​the isolating member (20).

7. The speaker module according to claim 4, wherein: The speaker module further comprises a buffer member (50), wherein the buffer member (50) is connected between the housing (10) and the support member (40).

8. The speaker module according to claim 1, wherein: The spacer (20) comprises at least one of an etched mesh and a woven mesh.

9. The speaker module according to claim 1, wherein: The isolation member (20) comprises a first side (201) and a second side (202) arranged in opposite directions along a first direction (X), wherein the first side (201) is arranged close to the speaker unit (30), and the first side (201) is connected to the speaker unit (30).

10. An electronic device, characterized in that: Comprising the speaker module according to any one of claims 1 to 9.

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