Loudspeaker structure of in-ear earphone

Abstract

The utility model provides an in-ear earphone loudspeaker structure comprising a loudspeaker, and the loudspeaker comprises an upper support and a lower support which are produced through a CNC technology process. An upper magnet frame and a lower magnet frame are arranged in the upper support and the lower support, a vibrating diaphragm assembly is arranged between the upper magnet frame and the lower magnet frame, and silica gel sealing rings used for connecting the upper magnet frame and the lower magnet frame are arranged on the upper portion and the lower portion of the vibrating diaphragm assembly respectively. The upper magnet basin frame and the lower magnet basin frame are provided with a plurality of magnets; the vibrating diaphragm assembly comprises a double-sided circuit plane vibrating diaphragm and fiber supports, wherein welding point leads of the double-sided circuit plane vibrating diaphragm are designed in a straight welding mode, and the fiber supports are arranged on the upper side and the lower side of the double-sided circuit plane vibrating diaphragm respectively. The silica gel sealing ring structure is adopted to replace glue, so that the assembly of the loudspeaker is more standardized and simplified and does not depend on the glue, the problem of glue overflow is avoided, and the production efficiency and the product consistency are improved. And by adopting the design of the straight welding lead, the electrical performance and the consistency are improved, and faults caused by poor contact are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of earphone speakers, and more particularly to an in-ear earphone speaker structure. Background Art

[0002] Currently, the common structures of in-ear headphone speakers have the following characteristics:

[0003] 1. The bracket is composed of two molded plastic positioning posts corresponding to the two positioning holes of the diaphragm. The overall structural design and assembly are centered on the positioning posts, welded and glued together, and sealed with layers of glue to complete the package. Pure copper spring contact is used between the diaphragm circuit and the pads.

[0004] 2. The bracket consists of two positioning screws corresponding to the two positioning holes of the diaphragm, and is sealed layer by layer with glue. The overall structural design and assembly are centered on the positioning column and tightened with nuts to complete the package. Pure copper spring contact is used between the diaphragm circuit and the pad.

[0005] The above structure has defects:

[0006] 1. The overall speaker assembly relies on glue, which is not environmentally friendly and has poor consistency.

[0007] 2. The disadvantage of spring-type contacts is that weather factors can easily cause copper contacts to oxidize, increase impedance or cause poor contact. Transportation, daily drops, etc. can cause silence.

[0008] In addition, existing technologies in the same industry have the following problems: insufficient speaker performance, high defective rate, and many after-sales problems due to reasons such as structural design precision, supply chain, and raw materials. Utility Model Content

[0009] In view of this, the present invention provides an in-ear earphone speaker structure.

[0010] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0011] An in-ear headphone speaker structure includes a speaker, the speaker including an upper bracket and a lower bracket produced by a CNC process; an upper magnet basin frame and a lower magnet basin frame are provided in the upper bracket and the lower bracket, a diaphragm assembly is provided between the upper magnet basin frame and the lower magnet basin frame, and the diaphragm assembly is respectively provided with silicone sealing rings for connecting the upper magnet basin frame and the lower magnet basin frame on the upper and lower sides; the upper magnet basin frame and the lower magnet basin frame are provided with multiple magnets; the diaphragm assembly includes a double-sided circuit planar diaphragm with a direct welding design for welding point leads and fiber brackets respectively provided on the upper and lower sides of the double-sided circuit planar diaphragm.

[0012] In the preferred technical solution, the thickness of the silicone sealing ring is 0.2 mm.

[0013] In a preferred technical solution, the upper magnet basin frame and the lower magnet basin frame are provided with a plurality of magnet slots, and the plurality of magnets are respectively fixed on the upper magnet basin frame or the lower magnet basin frame through the magnet slots.

[0014] In a preferred technical solution, a plurality of welding points are provided between the upper bracket and the lower bracket, and the upper bracket and the lower bracket are positioned at multiple points through the plurality of welding points and are fixed by welding using a low-voltage welding technique.

[0015] In the preferred technical solution, all components of the speaker are produced using tooling, and the upper bracket and the lower bracket are made of 304 stainless steel.

[0016] In a preferred technical solution, the double-sided circuit planar diaphragm is horizontally arranged in the upper bracket and the lower bracket, and the maximum area of ​​the double-sided circuit planar diaphragm is equal to the internal horizontal area of ​​the upper bracket and the lower bracket combined.

[0017] It can be seen from the above technical solutions that, compared with the prior art, the present invention has the following beneficial technical effects:

[0018] Standardized assembly reduces glue usage: Using a silicone sealing ring structure instead of glue makes speaker assembly more standardized and simplified, and does not rely on glue, avoiding glue overflow problems and improving production efficiency and product consistency.

[0019] Improved performance and reliability: By adopting a straight solder lead design, the contact resistance is reduced, the electrical performance and consistency are improved, and failures due to poor contact are reduced.

[0020] Environmental protection and sustainability: It reduces the use of glue, improves the environmental friendliness of the product, and conforms to the trend of sustainable development.

[0021] Enhanced speaker performance: By increasing the effective vibration area of ​​the planar diaphragm, the speaker's sound field width and detail performance are improved, and the sound quality is improved.

[0022] Reduce defective rate and after-sales problems: Due to the use of high-precision CNC stainless steel brackets and low-voltage spot welding technology, the overall assembly is more precise, which reduces product defective rate and reduces after-sales problems.

[0023] Through a series of innovative designs, the present invention optimizes the structure of the in-ear headphone speaker, improves the performance, reliability and environmental friendliness of the speaker, solves many defects in the existing technology, and has significant market competitive advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0025] Figure 1 This is a schematic diagram of the exploded structure of the present invention.

[0026] Figure 2 It is a schematic diagram of the cross-sectional structure of the present utility model.

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the utility model.

[0028] Figure numbers: 100, speaker; 110, upper bracket; 120, lower bracket; 130, upper magnet basin bracket; 140, lower magnet basin bracket; 160, silicone sealing ring; 131, magnet; 151, double-sided line planar diaphragm; 152, fiber bracket; 132, magnet slot; 101, welding point. DETAILED DESCRIPTION

[0029] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0030] In the description of this application, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting this application. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0032] An in-ear headphone speaker structure, see Figure 1-3 , including a speaker 100, the speaker 100 includes an upper bracket 110 and a lower bracket 120 produced by a CNC process, the upper bracket 110 and the lower bracket 120 are circular basin-shaped structures that match each other, the outer diameter of the upper bracket 110 is slightly smaller than the lower bracket 120, and the inner side of the lower bracket 120 is provided with a support groove that matches the upper bracket 110, and the upper bracket 110 can be embedded in the lower bracket 120 and fixed through the support groove. The combined upper bracket 110 and lower bracket 120 form a cylindrical box-shaped structure, and the components in the speaker 100 are all arranged inside the upper and lower brackets 110 and the lower bracket 120. An upper magnet basin frame 130 and a lower magnet basin frame 140 are provided in the upper bracket 110 and the lower bracket 120, and a diaphragm assembly is provided between the upper magnet bracket 130 and the lower magnet basin frame 140. The diaphragm assembly is respectively provided with silicone sealing rings 160 for connecting the upper magnet basin frame 130 and the lower magnet basin frame 140; the upper magnet basin frame 130 and the lower magnet basin frame 140 are provided with multiple magnets 131, and the diaphragm assembly includes a double-sided line planar diaphragm 151 with a direct welding design of welding point leads and a fiber bracket 152 provided on the upper and lower sides of the double-sided line planar diaphragm 151, the fiber bracket 152 is used to support and connect the double-sided line planar diaphragm 151 to ensure its stability during operation; the diaphragm assembly and the upper magnet basin frame 131 and the lower magnet basin frame 140 provided with multiple magnets 131 are connected and cooperated to realize planar magnetic drive, and the interaction between the double-sided line planar diaphragm 151 and the magnetic field makes the speaker sound. The double-sided planar diaphragm's 151 solder point leads utilize a direct soldering design, eliminating the copper spring contact point process and the brick pads on the PCB. This reduces electrical defects, lowers impedance, and improves electrical performance. Compared to traditional spring contacts or other electrical connection methods, the direct soldering design provides a more stable electrical connection. Spring contacts are prone to poor contact or oxidation, resulting in sound quality loss, but solder points prevent this problem, ensuring stable signal transmission. The soldering lead design strengthens the diaphragm's electrical connection, reducing the increased resistance and impedance changes caused by poor contact, thereby avoiding sound distortion. During mass production, the soldering technology is highly controllable, delivering consistent electrical performance and minimizing variability caused by poor manual assembly. Because the solder points are more robust, they can withstand more vibration and mechanical stress, reducing wear and tear or poor contact during long-term use, thereby extending the speaker's lifespan.

[0033] Furthermore, the silicone seal is 0.2mm thick, offering high elasticity and durability, effectively preventing air leaks and improving acoustic performance. Compared to traditional speaker structures, this eliminates the need for glue-bonding and sealing. This reduces excess glue that can increase diaphragm weight, improves acoustic performance, and eliminates damage to the diaphragm caused by excess glue.

[0034] Furthermore, the upper and lower magnet frames 130 and 140 are equipped with four magnet slots 132, each of which is equipped with a magnet 131. The number of magnets 131 is not limited to this embodiment. Arranged above and below the double-sided planar diaphragm 151, the upper and lower magnet frames 130 and 140 create a strong, uniform magnetic field. The four magnets are arranged in a ring shape, with smaller magnets on the inner side and larger magnets on the outer side. The design of the ring-shaped magnets 131 enables them to create a uniform magnetic field for the diaphragm. The multiple ring magnets within the upper and lower magnet frames 130 and 140 generate a magnetic field parallel to the two surfaces of the diaphragm. This magnetic field is parallel in direction and influences the diaphragm's movement through the diaphragm's conductive loop. The arrangement of multiple ring magnets generally ensures a uniform magnetic force on the diaphragm during movement, thus avoiding distortion or instability caused by localized magnetic field unevenness. When the speaker receives current, the current flows through the conductive loop of the leads soldered to the diaphragm and interacts with the magnetic field. The current flowing in the magnetic field through the conductive loop on the diaphragm generates a force perpendicular to the magnetic field, which pushes the diaphragm up and down to vibrate, thus producing sound.

[0035] Furthermore, four welding points 101 are provided between upper bracket 110 and lower bracket 120. Welding points 101 are located on the upper side of speaker 100. Welding at these points secures the top of upper bracket 110 to the top of lower bracket 120. These four welding points 101 achieve four-point positioning of upper bracket 110 and lower bracket 120, and are secured using low-voltage welding technology. This results in better welding and a more aesthetically pleasing overall speaker 100. Each component of speaker 100 is manufactured using tooling, with upper bracket 110 and lower bracket 120 constructed of 304 stainless steel. This ensures the precision and reliability of each component, facilitating assembly during production. This results in more standardized assembly of speaker 100 and reduces the use of glue, significantly reducing defect rates, after-sales maintenance, and product returns. The double-sided planar diaphragm 151 is horizontally arranged in the upper bracket 110 and the lower bracket 120. The maximum area of ​​the double-sided planar diaphragm 151 is equal to the internal horizontal area of ​​the combination of the upper bracket 110 and the lower bracket 120. This structural design maximizes the planar diaphragm area of ​​the speaker 100, thereby increasing the effective vibration area of ​​the speaker 100, making the sound field wider and more detailed.

[0036] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An in-ear headphone speaker structure, comprising a speaker (100), characterized in that: The loudspeaker (100) comprises an upper bracket (110) and a lower bracket (120) produced by a CNC process; an upper magnet basin (130) and a lower magnet basin (140) are provided in the upper bracket (110) and the lower bracket (120); a diaphragm assembly is provided between the upper magnet basin (130) and the lower magnet basin (140); a silicone sealing ring (160) for connecting the upper magnet basin (130) and the lower magnet basin (140) is provided on the upper and lower sides of the diaphragm assembly; the upper magnet basin (130) and the lower magnet basin (140) are provided with a plurality of magnets (131); the diaphragm assembly comprises a double-sided line planar diaphragm (151) with a direct welding design for welding point leads and a fiber bracket (152) respectively provided on the upper and lower sides of the double-sided line planar diaphragm (151).

2. The in-ear headphone speaker structure according to claim 1, characterized in that: The thickness of the silicone sealing ring is 0.2 mm.

3. The in-ear headphone speaker structure according to claim 1, characterized in that: The upper magnet basin frame (130) and the lower magnet basin frame (140) are provided with a plurality of magnet slots (132), and the plurality of magnets (131) are fixed on the upper magnet basin frame (130) or the lower magnet basin frame (140) respectively through the magnet slots (132).

4. The in-ear headphone speaker structure according to claim 1, characterized in that: A plurality of welding points (101) are provided between the upper bracket (110) and the lower bracket (120). The upper bracket (110) and the lower bracket (120) are positioned at multiple points via the plurality of welding points (101) and are fixed by welding using a low-voltage welding technique.

5. The in-ear headphone speaker structure according to claim 1, characterized in that: All components of the loudspeaker (100) are produced using tooling, and the upper bracket (110) and the lower bracket (120) are made of 304 stainless steel.

6. The in-ear headphone speaker structure according to claim 1, characterized in that: The double-sided circuit planar diaphragm (151) is horizontally arranged inside the upper bracket (110) and the lower bracket (120), and the maximum area of ​​the double-sided circuit planar diaphragm (151) is equal to the internal horizontal area of ​​the upper bracket (110) and the lower bracket (120) after combination.

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