Furnace passing carrier suitable for circuit board

Abstract

The utility model relates to a furnace-passing carrier suitable for a circuit board, which comprises a substrate and a limiting frame arranged on a bottom plate, the middle of the top surface of the substrate protrudes outwards, the bottom surface of the substrate sinks inwards towards the top surface, the substrate is provided with a first placing position and a second placing position which are used for accommodating a PCB (Printed Circuit Board), the first placing position and the second placing position are arranged at an interval, and the limiting frame is arranged on the substrate. A hot air flow guide hole is formed beside the first containing position, two first limiting frames are arranged on the first containing position, two second limiting frames are arranged on the second containing position, mounting column grooves are formed in the positions, making contact with the first limiting frames and the second limiting frames, of the top face of the base plate, and magnetic columns are arranged in the middles of the mounting column grooves. According to the utility model, as a structural improvement, the structure is simple, the design is reasonable, the magnet adsorption type limiting blocks are designed, the disassembly is simple, the PCB is positioned at the PCB placing position, and the position deviation of the PCB is avoided.

Description

Technical Field

[0001] The utility model relates to the field of PCB board carriers, in particular to a furnace carrier suitable for circuit boards. Background Art

[0002] SMT is the abbreviation of Surface Mount Technology, which is an electronic connection technology that uses professional automatic assembly equipment such as solder paste printers, placement machines, and reflow soldering to directly attach and solder surface assembly components (including resistors, capacitors, inductors, etc.) to the surface of the circuit board. It compresses the volume of traditional electronic components to only a few tens of the original size, achieving high density, high reliability, miniaturization, low cost and automated production of electronic product assembly. Due to the high production cost of electronic PCBA, in order to save costs, it is usually designed into a board-free edge structure during the production process. However, when the PCB board with no board edge structure is subjected to SMT placement through the furnace, the positioning of the PCB board is difficult. In order to solve this problem, a placement furnace carrier is usually used to carry the PCB board for placement through the furnace. The PCB board is placed on the placement position provided on the carrier, and then a corner or side of the placement position is attached with a positioning pin and tape.

[0003] Regarding the fixation of the pallet plate, a general design provides a retaining plate on the top surface of the base plate. For example, the publication number is CN219322689 U, and its technical solution is shown in "an assembly groove that cooperates with the limiting component is provided on the base plate, and the limiting component includes a limiting slide, a limiting cover plate and an elastic member. The limiting slide slides and cooperates with the assembly groove. The elastic member is provided between the assembly groove and the limiting slide and forces the limiting slide to move toward the pallet plate. The limiting cover plate is provided on the limiting slide to prevent the limiting slide from detaching from the assembly groove. Preferably, the limiting slide includes a sliding plate and a retaining plate, the sliding plate is provided with a limiting hole that cooperates with the elastic member, and the assembly groove is provided with an opening that cooperates with the retaining plate." Its fixing form is in the form of a snap buckle. In view of this, the applicant designed a completely different structure and specially applied for this invention. Utility Model Content

[0004] In order to solve the above-mentioned problems in the prior art, the present invention provides a furnace carrier suitable for circuit boards to improve the above-mentioned deficiencies.

[0005] The utility model relates to a furnace carrier suitable for circuit boards, comprising a base plate and a limiting frame arranged on the base plate, the top surface of the base plate is convex in the middle, and the bottom surface is concave inwardly toward the top surface, a first placement location and a second placement location for accommodating PCB boards are provided on the base plate, the first placement location and the second placement location are spaced apart, a hot air guide hole is provided next to the first placement location, two first limiting frames are provided on the first placement location, and two second limiting frames are provided on the second placement location, mounting column grooves are provided at positions where the top surface of the base plate contacts the first limiting frame and the second limiting frame, and magnetic columns are provided in the middle of the mounting column grooves.

[0006] Furthermore, a first limiting groove is provided on the bottom surface of the first limiting frame, and mounting feet are formed on both sides of the first limiting frame through the first limiting groove.

[0007] Furthermore, the bottom surfaces of the mounting feet are all provided with connection grooves, the bottom surfaces of the connection grooves are all provided with iron sheets, the side of the iron sheet away from the opening surface of the connection grooves has a convex surface, and the connection grooves are fixed to the magnetic columns by adsorption.

[0008] Furthermore, a second limiting groove is provided on the bottom surface of the second limiting frame, and mounting feet are formed on both sides of the first limiting frame through the second limiting groove.

[0009] Furthermore, the bottom surfaces of the mounting feet are all provided with connection grooves, the bottom surfaces of the connection grooves are all provided with iron sheets, the side of the iron sheet away from the opening surface of the connection grooves has a convex surface, and the connection grooves are fixed to the magnetic columns by adsorption.

[0010] Furthermore, a reinforcement ring is hidden inside the mounting foot.

[0011] Furthermore, the substrate is synthetic stone, copper or aluminum.

[0012] Furthermore, a temperature-sensitive layer is provided on the top surfaces of the second limiting frame and the first limiting frame.

[0013] The utility model is a structural improvement with a simple structure and reasonable design. The design of the magnetic adsorption type limit block is simple to disassemble and the PCB board placement position is used to position the PCB circuit board to avoid positional deviation of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of the utility model.

[0015] Figure 2 Schematic diagram of the first limiting frame structure.

[0016] Figure 3 Schematic diagram of the second limiting frame structure.

[0017] Illustration: 1 base plate, 2 first placement position, 21 first avoidance hole, 3 second placement position, 31 second avoidance hole, 4 hot air guide hole, 5 mounting column slot, 6 magnetic column, 7 first limiting frame, 71 first limiting groove, 8 second limiting frame, 81 second limiting groove, 9 connecting groove, 10 iron sheet, 11 reinforcement ring, 12 mounting foot, 13 temperature sensing layer. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] like Figure 1-3 As shown, the utility model relates to a furnace carrier suitable for circuit boards, including a base plate and a limiting frame arranged on the bottom plate, the top surface of the base plate is convex in the middle, and the bottom surface is concave inwardly toward the top surface, and a first placement place 2 and a second placement place 3 for accommodating the PCB board are provided on the base plate, the first placement place and the second placement place are spaced apart, a first avoidance hole 21 is designed on the first placement place, and a second avoidance hole 31 is provided on the second placement place, a hot air guide hole 4 is provided next to the first placement place, and the avoidance hole 11 can effectively prevent the parts on the circuit board from being crushed, and the hot air guide hole 4 facilitates the up and down circulation of hot air, making the welding of parts more firm. Two first limiting frames 7 are provided on the first placement place, and two second limiting frames 8 are provided on the second placement place, and the positions where the top surface of the base plate contacts the first limiting frame and the second limiting frame are both provided with mounting column grooves 5, and magnetic columns 6 are provided in the middle of the mounting column grooves. The magnetic columns are cylindrical and are spaced apart from the inside of the mounting column grooves.

[0020] As a technical improvement, a first limiting groove 71 is provided on the bottom surface of the first limiting frame, and mounting feet 12 are formed on both sides of the first limiting frame through the first limiting groove.

[0021] As a technical improvement, a connecting groove is provided on the bottom surface of the mounting foot, and an iron sheet 10 is provided on the bottom surface of the connecting groove. The iron sheet has a convex surface on the side away from the opening surface of the connecting groove. The connecting groove is adsorbed and fixed to the magnetic column, and the convex surface design of the iron sheet is conducive to fixing in the connecting groove.

[0022] As a technical improvement, a second limiting groove 81 is provided on the bottom surface of the second limiting frame 8, and mounting feet are formed on both sides of the first limiting frame through the second limiting groove.

[0023] As a technical improvement, the bottom surface of the mounting foot is provided with a connection groove, the bottom surface of the connection groove is provided with an iron sheet, the iron sheet has a convex surface on the side away from the opening surface of the connection groove, and the connection groove is adsorbed and fixed to the magnetic column.

[0024] As a technical improvement, a reinforcement ring 11 is hidden inside the mounting foot.

[0025] As a technical improvement, the substrate is made of heat-insulating and heat-resistant material such as synthetic stone, copper or aluminum.

[0026] As a technical improvement, the second limiting frame and the first limiting frame are both provided with a temperature-sensitive layer 13 on their top surfaces, and components made of temperature-sensitive color-changing powder are added inside.

Claims

1. A furnace carrier suitable for circuit boards, characterized by: It includes a base plate and a limiting frame arranged on the bottom plate, the middle of the top surface of the base plate is convex, and the bottom surface is concave inwardly toward the top surface, a first placement location and a second placement location for accommodating a PCB board are arranged on the base plate, the first placement location and the second placement location are arranged at intervals, a hot air guide hole is arranged next to the first placement location, two first limiting frames are arranged on the first placement location, and two second limiting frames are arranged on the second placement location, mounting column grooves are arranged at positions where the top surface of the base plate contacts the first limiting frame and the second limiting frame, and magnetic columns are arranged in the middle of the mounting column grooves.

2. The furnace carrier for circuit boards according to claim 1, characterized in that: A first limiting groove is provided on the bottom surface of the first limiting frame, and mounting feet are formed on both sides of the first limiting frame through the first limiting groove.

3. The furnace carrier for circuit boards according to claim 2, characterized in that: The bottom surfaces of the mounting feet are all provided with connection grooves, the inner bottom surfaces of the connection grooves are all provided with iron sheets, the side of the iron sheet away from the opening surface of the connection grooves has a convex surface, and the connection grooves are fixed by adsorption to the magnetic columns.

4. The furnace carrier for circuit boards according to claim 1, characterized in that: A second limiting groove is provided on the bottom surface of the second limiting frame, and mounting feet are formed on both sides of the first limiting frame through the second limiting groove.

5. The furnace carrier for circuit boards according to claim 4, characterized in that: The bottom surfaces of the mounting feet are all provided with connection grooves, the inner bottom surfaces of the connection grooves are all provided with iron sheets, the side of the iron sheet away from the opening surface of the connection grooves has a convex surface, and the connection grooves are fixed by adsorption to the magnetic columns.

6. A furnace carrier for circuit boards according to claim 2 or 5, characterized in that: A reinforcement ring is hidden inside the mounting foot.

7. The furnace carrier for circuit boards according to claim 1, characterized in that: The substrate is synthetic stone, copper or aluminum.

8. The furnace carrier for circuit boards according to claim 1, characterized in that: The top surfaces of the second limiting frame and the first limiting frame are both provided with a temperature sensing layer.

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