Packaging structure and electronic equipment

Abstract

The utility model relates to a packaging structure and electronic equipment. The packaging structure comprises a substrate, a chip, a connecting wire harness and a packaging body, wherein the chip is arranged on the substrate; the chip is electrically connected with the substrate through the connecting wire harness; the packaging body is of a preformed structure and is provided with a containing groove, the packaging body is fixed to the substrate, the chip and the connecting wire harness are packaged in the containing groove, and the connecting wire harness does not make contact with the packaging body. The packaging structure provided by the utility model is good in reliability and low in manufacturing cost.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging, and more specifically, to a packaging structure and electronic equipment. Background Art

[0002] Molding structures are commonly used in semiconductor packaging to protect chips and connect gold wires. However, the molding process is susceptible to interference from factors such as temperature, pressure, and the environment, leading to risks such as product deformation and wire breakage due to stress, thus affecting the yield of packaged products. Utility Model Content

[0003] An object of the present utility model is to provide a packaging structure and an electronic device.

[0004] According to one aspect of the present invention, a packaging structure is provided, comprising:

[0005] substrate;

[0006] a chip, wherein the chip is disposed on the substrate;

[0007] a connecting harness, through which the chip is electrically connected to the substrate;

[0008] The package body is a pre-formed structure and is provided with a receiving groove. The package body is fixed on the substrate so that the chip and the connecting harness are encapsulated in the receiving groove, and the connecting harness does not contact the package body.

[0009] Optionally, a set distance is left between the connecting harness and the packaging body.

[0010] Optionally, the package body is made of metal, ceramic or plastic.

[0011] Optionally, the package body is fixedly connected to the substrate via an adhesive.

[0012] Optionally, the chip is a photosensitive chip, the package body is provided with a perspective window, and the photosensitive area of ​​the photosensitive chip is opposite to the perspective window.

[0013] Optionally, it further includes a transparent protective cover, which is arranged at the perspective window and fixed on the photosensitive chip.

[0014] Optionally, the edge areas of the package body located at the perspective window are all fixed on the photosensitive chip.

[0015] Optionally, the transparent protective cover and the edge area are fixedly connected to the photosensitive chip via adhesives respectively.

[0016] Optionally, a shape of a region of the accommodating groove close to the connecting harness is consistent with a shape of the connecting harness.

[0017] According to a second aspect of the present invention, an electronic device is provided, comprising: the packaging structure described in the first aspect.

[0018] One of the technical effects of the present invention is:

[0019] The utility model sets the package body as a preformed structure and provides it with a receiving groove for accommodating the chip and the connecting harness, and the connecting harness does not contact the package body. This can not only avoid the damage to the connecting harness caused by stress release of the traditional package body, but also expand the selection range of the package body, improve the reliability of the package structure, and reduce its manufacturing cost.

[0020] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0022] Figure 1 It is an exploded view of the packaging structure provided by the utility model.

[0023] Figure 2 It is a side sectional view of the packaging structure provided by the utility model.

[0024] Description of reference numerals:

[0025] 1. Substrate; 2. Photosensitive chip; 3. Package; 31. Perspective window; 4. Connecting wire harness; 5. Receiving groove; 6. Adhesive; 61. First adhesive layer; 62. Second adhesive layer; 63. Third adhesive layer; 7. Transparent protective cover. DETAILED DESCRIPTION

[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0027] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0028] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0029] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0030] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0031] In the existing technology, traditional packaging structures mostly use a molding structure to protect chips or gold wires. The molding structure is to place the packaged chip components in a mold, and then inject molten packaging material (such as epoxy resin or plastic). After the packaging material solidifies, a protective shell is formed. However, during this packaging process, the packaging structure is easily affected by the environment, and stress release may cause damage to the gold wire. In addition, the equipment cost of the molding structure is relatively high, resulting in high mold opening costs for the equipment.

[0032] like Figures 1 to 2 As shown, according to one aspect of the present invention, a packaging structure is provided, including: a substrate 1, a chip, a connecting harness 4, and a packaging body 3; the chip is arranged on the substrate 1; the chip is electrically connected to the substrate 1 through the connecting harness 4; the packaging body 3 is a pre-formed structure and is provided with a receiving groove 5, the packaging body 3 is fixed on the substrate 1, and the chip and the connecting harness 4 are encapsulated in the receiving groove 5, so that the connecting harness 4 and the packaging body 3 do not contact.

[0033] Specifically, in this embodiment, the package 3 provides basic protection for the chip and the connecting harness 4 by encapsulating them in the receiving groove 5. The package 3 is set as a pre-molded structure, so that it is not restricted by the molding process, material selection and other conditions compared to the existing package 3, especially the package 3 with a molding structure. The chip can be set on the substrate 1 by an adhesive, such as Figure 2 As shown, the chip is fixed on the substrate 1 by providing a second adhesive layer 62 between the chip and the substrate 1 .

[0034] For example, the package body 3 is made of metal material, and a receiving groove 5 is formed by internal punching, and then the package body 3 of the preformed structure of the metal material is fixed on the substrate 1 by welding or bonding, so as to form packaging protection for the chip and the connecting harness 4, thereby improving the yield of the product. Alternatively, the package body 3 is made of plastic and is integrally formed through an injection molding process, or the package body 3 is made of ceramic material and is integrally formed through a sintering process. The specific selection can be made according to actual needs, which greatly improves the flexibility of the packaging product manufacturing process.

[0035] In the above embodiment, the process for forming the package 3 is relatively simple, and a wide range of materials are available, which can significantly reduce manufacturing costs and the structural strength of the package 3. In addition, the appearance flatness and consistency of the package 3 can be controlled, reducing the difficulty of subsequent assembly of the package structure.

[0036] Furthermore, the shape of the receiving groove 5 of the package body 3 of the preformed structure is controllable and can be designed to match the shape and position of the chip and the connecting harness 4, which not only avoids damage to the connecting harness 4 due to stress release of the package body 3, but also reserves a certain gap between the connecting harness 4 and the package body 3 (i.e., the groove wall of the receiving groove 5) by designing the connecting harness 4 not to contact the package body 3. When the package structure is subjected to external force impact or collision, friction damage between the connecting harness 4 and the package body 3 can be avoided, further improving the connection reliability between the chip and the substrate 1.

[0037] In actual applications, the chip's connecting harness 4 will vary depending on its product model. The use of a pre-formed package 3 can achieve a matching design between the accommodating slot 5 and the chip model, so that the package 3 can, on the one hand, cover the chip and the connecting harness 4 as much as possible to provide better protection. On the other hand, it can prevent the package 3 from causing damage to the devices in the accommodating slot 5, especially the connecting harness 4, thereby further ensuring the functional reliability of the package structure during subsequent use.

[0038] In the above embodiment, the package body 3 does not contact the connecting harness 4, which means that there is a certain distance between the groove wall of the accommodating groove 5 and the connecting harness 4. The size of the distance can be designed according to the type of chip and the final use environment of the package structure. For example, a larger distance can be set in some products with greater impact potential, and a smaller distance can be set in some products with a safer use environment. The present utility model does not impose any restrictions on this.

[0039] In addition, a preformed structure refers to a semi-finished product with a certain shape and structure that is pre-formed through a certain process method before the chip is packaged. In the present utility model, the preformed structure significantly improves the molding rate and molding time of the packaged product during the subsequent packaging process, greatly reducing the packaging cost.

[0040] In this embodiment, the provided packaging structure can be manufactured using the following process flow: a chip of a specific type is placed on a substrate 1, and the chip and substrate 1 are electrically connected by soldering via a connecting harness 4. Furthermore, a specific process, such as punching or injection molding, is used to manufacture a package body 3, which is then formed with a receiving groove 5 of a specific shape. The shape of the receiving groove 5 is matched to the position and shape of the connecting harness 4 of the chip. The package body 3 is then fixed to the substrate 1 so that the chip and the connecting harness 4 are located at corresponding positions in the receiving groove 5. The entire packaging process is simple, easy to operate, and has low equipment costs. Furthermore, the packaged product is highly reliable, thereby improving the yield rate of the packaging structure.

[0041] Alternatively, as Figure 1 As shown, a set distance is left between the connecting harness 4 and the package body 3, for example, less than or equal to 50 μm.

[0042] Specifically, in this embodiment, the distance between the connecting harness 4 and the package body 3 is set to be less than or equal to 50 μm. This, on the one hand, maximizes the structural strength of the package body 3 and avoids the structural strength and protective capabilities of the package body 3 being reduced due to the excessively thin walls of the receiving groove 5. On the other hand, it also prevents the connecting harness 4 from having an excessive range of motion when subjected to external forces, which could lead to fracture at the connection. In addition, the fact that the connecting harness 4 does not contact the package body 3 means that the gap between the package body 3 and the connecting harness 4 must be greater than 0, allowing a certain amount of space for movement between the two to ensure that the package body 3 does not damage the connecting harness 4 when the package structure is subjected to external forces.

[0043] In actual applications, due to the irregular shape of the condensed wire harness, the distances between different positions of the connecting wire harness 4 and the package body 3 (i.e., the wall of the receiving groove 5) do not necessarily have to be the same, as long as they are within a certain range, such as 10 μm, 20 μm, 30 μm, 40 μm, etc., which is not limited by the present invention.

[0044] Optionally, the package body 3 is made of metal, ceramic or plastic.

[0045] Specifically, in practical applications, the preformed structure of package body 3 allows for a wide range of material options for the package structure provided by the present invention, allowing for tailored selection based on the intended use environment and function of the package structure. For example, in some environments, the structural strength of package body 3 can be enhanced by selecting a metal material, the insulation properties of package body 3 can be improved by using a plastic material, or the thermal conductivity and corrosion resistance of the package structure can be improved by using a ceramic material.

[0046] Alternatively, as Figures 1 to 2 As shown, the package body 3 is fixedly connected to the substrate 1 via an adhesive 6 .

[0047] Specifically, in practical applications, the package body 3 can be fixed on the substrate 1 by means of an adhesive 6, such as Figure 2 As shown, by setting a third adhesive layer 63 between the package body 3 and the substrate 1, the package body 3 can be fixedly connected to the substrate 1, which reduces the difficulty of assembling the package body 3 and improves the sealing performance of the receiving groove 5. The type of adhesive 6 can be selected according to actual needs.

[0048] Alternatively, as Figures 1 to 2 As shown, the chip is a photosensitive chip 2 , the package body 3 is provided with a perspective window 31 , and the photosensitive area of ​​the photosensitive chip 2 is opposite to the perspective window 31 .

[0049] Specifically, the photosensitive chip 2 comes in various types depending on its function. It typically consists of multiple photosensitive elements that convert light signals into electrical signals. These elements are core components of products such as digital cameras, photoelectric sensors, and image sensors. When light strikes the photosensitive chip 2, photons hitting atoms on the surface of the photosensitive elements excite electrons, causing them to escape, generating an electron flow, or electrical signal. These electrical signals can then be processed to form an image or used for other photoelectric measurement purposes.

[0050] Based on the above-mentioned working principle of the photosensitive chip 2, the utility model sets a perspective window 31 on the package body 3, and makes the photosensitive area of ​​the photosensitive chip 2 face the perspective window 31, so as to avoid the package body 3 from blocking the light. In this embodiment, based on the pre-molded structure of the package body 3, compared with the traditional package body 3, especially the package body 3 with a Molding structure, the processing technology of the perspective window 31 is simpler and the processing accuracy is more precise, which further improves the reliability of the package structure. Among them, the edge area of ​​the perspective window 31 on the package body 3 can be fixed on the photosensitive chip 2. For example, the edge of the perspective window 31 can be connected and fixed to the non-photosensitive area of ​​the chip by means of adhesive 6, etc., which ensures the sealing of the receiving groove 5 on the one hand, and the structural strength and assembly stability of the package of the package body 3 on the other hand.

[0051] Alternatively, as Figures 1 to 2 As shown, it also includes a transparent protective cover 7, which is arranged at the perspective window 31 and fixed on the photosensitive chip 2.

[0052] Specifically, in actual applications, the photosensitive area of ​​the photosensitive chip 2 is also susceptible to damage from the external environment. The present invention provides a transparent protective cover 7 at the perspective window 31 to protect the chip, especially the photosensitive area, without affecting the photosensitivity of the photosensitive chip 2. The shape and size of the transparent protective cover 7 can match the perspective window 31 to protect the chip as much as possible. The edge area of ​​the transparent protective cover 7 can be connected to the edge of the perspective window 31, that is, connected to the package 3, or it can be connected to the chip surface via an adhesive 6 or the like, and the present invention does not impose any restrictions on this.

[0053] Alternatively, as Figures 1 to 2 As shown, the transparent protective cover 7 and the edge area are fixedly connected to the photosensitive chip 2 via adhesive 6 respectively.

[0054] For example, in one embodiment, the transparent protective cover 7 can be made of transparent plastic, and a first adhesive layer 61 is provided between the edge of the transparent protective cover 7 and the corresponding position of the chip to ensure a fixed connection between the transparent protective cover 7 and the chip. The transparent protective cover 7 can also be made of transparent materials such as glass.

[0055] Alternatively, as Figure 1 As shown, the shape of the area of ​​the accommodating groove 5 close to the connecting harness 4 is consistent with the shape of the connecting harness 4 .

[0056] Specifically, in this embodiment, the area of ​​the accommodating groove 5 close to the connecting harness 4 is set to a structure consistent with its shape, which can make the package body 3 as close to the connecting harness 4 as possible, improve its structural strength, and will not cause damage to the connecting harness 4 by the package body 3, thereby improving the reliability of the structure.

[0057] According to a second aspect of the present invention, an electronic device is provided, comprising: the packaging structure of the first aspect, referring to Figure 1 and Figure 2 .

[0058] Specifically, in practical applications, the packaging structure can be applied to electronic devices such as mobile phones, computers, and cameras. The packaging structure manufactured using the first aspect of the present invention can ensure the reliability of functions based on the packaging structure in the electronic device and reduce the manufacturing cost of the electronic device.

[0059] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0060] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art will appreciate that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A packaging structure, characterized in that: include: substrate; a chip, wherein the chip is disposed on the substrate; a connecting harness, through which the chip is electrically connected to the substrate; The package body is a pre-formed structure and is provided with a receiving groove. The package body is fixed on the substrate so that the chip and the connecting harness are encapsulated in the receiving groove, and the connecting harness does not contact the package body.

2. The packaging structure according to claim 1, wherein: A set distance is left between the connecting harness and the packaging body.

3. The packaging structure according to claim 1, wherein: The packaging body is made of metal, ceramic or plastic.

4. The packaging structure according to claim 1, wherein: The packaging body is fixedly connected to the substrate through an adhesive.

5. The packaging structure according to claim 1, wherein: The chip is a photosensitive chip, the package body is provided with a perspective window, and the photosensitive area of ​​the photosensitive chip is opposite to the perspective window.

6. The packaging structure according to claim 5, wherein: It also includes a transparent protective cover, which is arranged at the perspective window and fixed on the photosensitive chip.

7. The packaging structure according to claim 6, wherein: The edge areas of the package body located at the perspective window are all fixed on the photosensitive chip.

8. The packaging structure according to claim 7, wherein: The transparent protective cover and the edge area are fixedly connected to the photosensitive chip via adhesives respectively.

9. The packaging structure according to claim 1, wherein: The shape of the area of ​​the accommodating groove close to the connecting harness is consistent with the shape of the connecting harness.

10. An electronic device, characterized in that: include: The packaging structure according to any one of claims 1 to 9.

Images