BGA chip appearance defect detection device

Abstract

The utility model provides a BGA chip appearance defect detection device, which comprises a case and a support fixed at the top of the case through bolts, a material guide assembly is arranged at the top of the support, the material guide assembly comprises a barrier plate and two symmetrically arranged guide plates, the barrier plate is fixedly connected to the opposite sides of the two guide plates, and the guide plates are fixedly connected to the other sides of the two guide plates. The flow guide plates are fixed to the top of the support, the two flow guide plates are in a Y shape with the two ends open, and a conveying assembly used for conveying BGA chips, an image collecting assembly used for collecting BGA chip images and a waste collecting assembly used for collecting unqualified BGA chips are arranged in the support. According to the utility model, the two guide plates which are symmetrically arranged are arranged, and the two guide plates are in the Y shape with the two open ends, so that chips can be guided, the chips can be gathered inwards, an image acquisition area is reduced, and the difficulty of subsequent image processing is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a BGA chip appearance defect detection device. Background Art

[0002] The main purpose of BGA chip appearance defect detection is to discover various defects generated during the chip packaging, welding or manufacturing process, including but not limited to scratches, cracks, dirt, poor welding, voids, bubbles, etc. These defects may affect the performance, stability and service life of the chip.

[0003] After searching, the Chinese patent publication number CN215525580U discloses a chip appearance defect sampling inspection platform. Its conveying device has a large area. When placing the chips, the placement positions vary greatly, so a larger image acquisition area is required, which increases the difficulty of subsequent image processing.

[0004] Therefore, a BGA chip shape defect detection device is proposed. Utility Model Content

[0005] In view of this, the embodiments of the present invention hope to provide a BGA chip appearance defect detection device to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0006] The technical solution of the embodiment of the present utility model is implemented as follows: A BGA chip appearance defect detection device includes a chassis and a bracket fixed to the top of the chassis by bolts, a material guide assembly is provided on the top of the bracket, the material guide assembly includes a baffle plate and two symmetrically arranged guide plates, the baffle plate is fixedly connected to the opposite sides of the two guide plates, the guide plates are fixed to the top of the bracket, the two guide plates are Y-shaped with both ends open, and a conveying assembly for conveying BGA chips, an image acquisition assembly for capturing images of BGA chips, and a waste collection assembly for collecting unqualified BGA chips are provided in the bracket.

[0007] In some embodiments, the conveying assembly includes two symmetrically arranged conveying rollers, which are rotatably connected to the inner wall of the bracket through a rotating shaft. A horizontal plate is fixedly installed on the inner wall of the bracket. The horizontal plate and the outer walls of the two conveying rollers are driven by the same conveyor belt, and the two guide plates are in contact with the conveyor belt.

[0008] In some embodiments, one of the rotating shafts is fixedly connected to a motor via a coupling, and the motor is fixed to the outer wall of the bracket via bolts.

[0009] In some embodiments, a collection box 1 is detachably mounted on an outer wall of one side of the bracket.

[0010] In some embodiments, the image acquisition assembly includes a photoelectric gate and a fixing frame fixed to the top of the bracket, an electric push rod is fixed to the top of the fixing frame by bolts, and the output end of the electric push rod passes through the fixing frame and is fixedly connected to a shield.

[0011] In some embodiments, an image collector and a plurality of fill lights are fixedly connected to the lower surface of the top of the shield, a control box is installed in the chassis, and the photoelectric gate, motor and electric push rod are all electrically connected to the control box.

[0012] In some embodiments, the waste collection assembly includes a second collection box and a vertical plate. The second collection box is detachably mounted on the outer wall of one side of the bracket, and the vertical plate is fixed to the top of the other side of the bracket.

[0013] In some embodiments, an air pump is provided in the chassis, the air pump input end is connected to the atmosphere through connecting pipe 1, the air pump output end is fixedly connected to a nozzle through connecting pipe 2, the nozzle is fixed to the inner wall of the vertical plate, and the air pump is electrically connected to the control box.

[0014] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0015] 1. A BGA chip shape defect detection device is provided. By providing two symmetrically arranged guide plates, the two guide plates are in a Y-shape with open ends, thereby guiding the chips and achieving central aggregation of the chips, thereby reducing the image acquisition area and reducing the difficulty of subsequent image processing.

[0016] 2. A BGA chip appearance defect detection device, which sets a shield and a fill light, uses the shield to further reduce the image acquisition range, and uses the fill light to increase the clarity of image acquisition, thereby further reducing the difficulty of subsequent image processing.

[0017] 3. A BGA chip shape defect detection device is provided with a collection box 2 and a nozzle. The nozzle is used to blow unqualified chips into the collection box 2 for unified collection, reducing manual operation steps and improving the convenience of use of the device.

[0018] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 The overall structure of the utility model is shown in FIG. Figure 1 ;

[0021] Figure 2 The overall structure of the utility model is shown in FIG. Figure 2 ;

[0022] Figure 3 It is a cross-sectional view of the utility model;

[0023] Figure 4 This is a cross-sectional view of the local structure of the image acquisition component of the utility model;

[0024] Figure 5 This is a cross-sectional view of the waste collection component structure of the present utility model.

[0025] Reference numerals:

[0026] 1. Chassis; 2. Bracket; 3. Conveying assembly; 4. Waste collection assembly; 5. Material guide assembly; 6. Blocking plate; 7. Guide plate; 8. Photoelectric gate; 9. Fixing frame; 10. Control box; 11. Motor; 12. Rotating shaft; 13. Conveyor roller; 14. Conveyor belt; 15. Horizontal plate; 16. Collection box 1; 17. Electric push rod; 18. Shield; 19. Image collector; 20. Fill light; 21. Collection box 2; 22. Air pump; 23. Connecting pipe 1; 24. Connecting pipe 2; 25. Vertical plate; 26. Nozzle. DETAILED DESCRIPTION

[0027] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] Example 1:

[0031] like Figure 1-5 As shown, a BGA chip appearance defect detection device includes a chassis 1 and a bracket 2 fixed to the top of the chassis 1 by bolts.

[0032] A material guide assembly 5 is provided on the top of the bracket 2. The material guide assembly 5 includes a baffle plate 6 and two symmetrically arranged guide plates 7. The baffle plate 6 is fixedly connected to the opposite side of the two guide plates 7. The guide plates 7 are fixed to the top of the bracket 2. The two guide plates 7 are Y-shaped with both ends open. A conveying assembly 3 for conveying BGA chips, an image acquisition assembly for capturing images of BGA chips, and a waste collection assembly 4 for collecting unqualified BGA chips are provided in the bracket 2.

[0033] Multiple chips are spread between two guide plates 7 , and all chips are gathered in the middle under the guidance of the guide plates 7 for subsequent image acquisition.

[0034] By setting two symmetrically arranged guide plates 7, the two guide plates 7 are in a Y shape with both ends open, so as to guide the chips and achieve central aggregation of the chips, thereby reducing the image acquisition area and reducing the difficulty of subsequent image processing.

[0035] like Figure 2 、 3 As shown, the conveying assembly 3 includes two symmetrically arranged conveying rollers 13, which are rotatably connected to the inner wall of the bracket 2 through a rotating shaft 12. A transverse plate 15 is fixedly installed on the inner wall of the bracket 2. The transverse plate 15 and the outer walls of the two conveying rollers 13 are driven by the same conveyor belt 14, and the two guide plates 7 are in contact with the conveyor belt 14.

[0036] One of the rotating shafts 12 is fixedly connected to the motor 11 via a coupling, and the motor 11 is fixed to the outer wall of the bracket 2 via bolts.

[0037] A collecting box 16 is detachably mounted on the outer wall of one side of the bracket 2 .

[0038] The starting motor 11 drives one of the rotating shafts 12 and the conveying roller 13 to rotate, and the other rotating shaft 12 and the conveying roller 13 drive the conveyor belt 14 to rotate under the transmission cooperation, so as to realize the conveying of chips. Qualified chips will be conveyed to the collection box 16, and unqualified chips will be collected by the waste collection component 4.

[0039] like Figure 2-4 As shown, the image acquisition assembly includes a photoelectric gate 8 and a fixing frame 9 fixed to the top of the bracket 2. An electric push rod 17 is fixed to the top of the fixing frame 9 by bolts. The output end of the electric push rod 17 passes through the fixing frame 9 and is fixedly connected to a shield 18.

[0040] An image collector 19 and a plurality of fill lights 20 are fixedly connected to the lower surface of the top of the shield 18 . A control box 10 is installed in the chassis 1 . The photoelectric gate 8 , the motor 11 and the electric push rod 17 are all electrically connected to the control box 10 .

[0041] The photoelectric gate 8 detects that a chip has passed and transmits a signal to the control box 10. The control box 10 turns off the motor 11 and starts the electric push rod 17 to push the shield 18 down. The shield 18 is used to cover the chip. The fill light 20 assists in fill light. The image collector 19 performs image acquisition. After the acquisition is completed, the control box 10 starts the electric push rod 17 to drive the shield 18 to rise and starts the motor 11 again. The conveyor belt 14 continues to transport the chip forward, and this cycle repeats.

[0042] By providing the shield 18 and the fill light 20 , the shield 18 is used to further reduce the image acquisition range, and the fill light 20 is used to provide fill light to increase the clarity of image acquisition, thereby further reducing the difficulty of subsequent image processing.

[0043] Example 2:

[0044] A BGA chip shape defect detection device, this embodiment makes the following improvements on the basis of embodiment 1, such as Figure 2 、 5 As shown:

[0045] The waste collection assembly 4 includes a second collection box 21 and a vertical plate 25 . The second collection box 21 is detachably mounted on the outer wall of one side of the bracket 2 , and the vertical plate 25 is fixed to the top of the other side of the bracket 2 .

[0046] An air pump 22 is provided in the chassis 1. The input end of the air pump 22 is connected to the atmosphere through a connecting pipe 1 23. The output end of the air pump 22 is fixedly connected to a nozzle 26 through a connecting pipe 24. The nozzle 26 is fixed to the inner wall of the vertical plate 25. The air pump 22 is electrically connected to the control box 10.

[0047] When the unqualified chips reach the nozzle 26, the control box 10 starts the air pump 22 to send gas into the nozzle 26, and blows the unqualified chips into the collection box two 21 by the gas flow.

[0048] By arranging the collection box two 21 and the nozzle 26, the unqualified chips are blown into the collection box two 21 by the nozzle 26, so that the manual operation steps are reduced, and the use convenience of the device is improved.

[0049] Working principle: when the device is used, the motor 11 is started to drive one of the rotating shafts 12 and the conveying rollers 13 to rotate, and the other rotating shaft 12 and the conveying roller 13 are driven to rotate the conveying belt 14 under the transmission cooperation, then the chips are laid on the conveying belt 14, the conveying belt 14 is used to realize the conveying of the chips, the chips are guided to the middle under the guidance of the flow guide plate 7, and finally are conveyed out through the openings of the two flow guide plates 7, when the chips reach the photoelectric door 8, the photoelectric door 8 transmits a detection signal to the control box 10, the control box 10 closes the motor 11 and starts the electric push rod 17 to push the cover 18 to descend, the cover 18 is used to cover the chips, the light supplement lamp 20 is used for light supplement, the image collector 19 is used for image acquisition, after the acquisition is completed, the control box 10 starts the electric push rod 17 to drive the cover 18 to ascend and starts the motor 11 again, the conveying belt 14 is used to continue to convey the chips, and the above steps are repeated, when the unqualified chips reach the nozzle 26, the control box 10 starts the air pump 22 to send gas into the nozzle 26, and blows the unqualified chips into the collection box two 21 by the gas flow, the qualified chips are continuously conveyed by the conveying belt 14, and finally fall into the collection box one 16 for unified collection.

[0050] The above merely illustrates the specific implementation manner of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can easily think of various changes or replacements within the technical range disclosed by the present application, and these should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A BGA chip shape defect detection device, characterized by: The invention comprises a chassis (1) and a bracket (2) fixed to the top of the chassis (1) by bolts, wherein a material guide assembly (5) is provided on the top of the bracket (2), the material guide assembly (5) comprising a baffle (6) and two symmetrically arranged guide plates (7), the baffle (6) being fixedly connected to opposite sides of the two guide plates (7), the guide plates (7) being fixed to the top of the bracket (2), the two guide plates (7) being Y-shaped with both ends open, and a conveying assembly (3) for conveying BGA chips, an image acquisition assembly for acquiring images of the BGA chips, and a waste collection assembly (4) for collecting unqualified BGA chips being provided in the bracket (2).

2. The BGA chip shape defect detection device according to claim 1, characterized in that: The conveying assembly (3) comprises two symmetrically arranged conveying rollers (13), the conveying rollers (13) being rotatably connected to the inner wall of the bracket (2) via a rotating shaft (12), a transverse plate (15) being fixedly mounted on the inner wall of the bracket (2), the transverse plate (15) and the outer walls of the two conveying rollers (13) being driven and matched with a same conveyor belt (14), and the two guide plates (7) being in contact with the conveyor belt (14).

3. The BGA chip shape defect detection device according to claim 2, characterized in that: One of the rotating shafts (12) is fixedly connected to a motor (11) via a coupling, and the motor (11) is fixed to the outer wall of the bracket (2) via bolts.

4. The BGA chip shape defect detection device according to claim 3, characterized in that: A collecting box (16) is detachably mounted on the outer wall of one side of the bracket (2).

5. The BGA chip shape defect detection device according to claim 1, characterized in that: The image acquisition assembly comprises a photoelectric gate (8) and a fixing frame (9) fixed to the top of the bracket (2); an electric push rod (17) is fixed to the top of the fixing frame (9) by bolts; the output end of the electric push rod (17) passes through the fixing frame (9) and is fixedly connected to a shield (18).

6. The BGA chip shape defect detection device according to claim 5, characterized in that: An image collector (19) and a plurality of fill lights (20) are fixedly connected to the lower surface of the top of the shield (18); a control box (10) is installed in the chassis (1); and the photoelectric gate (8), the motor (11) and the electric push rod (17) are all electrically connected to the control box (10).

7. The BGA chip shape defect detection device according to claim 1, characterized in that: The waste collection assembly (4) comprises a second collection box (21) and a vertical plate (25). The second collection box (21) is detachably mounted on the outer wall of one side of the bracket (2), and the vertical plate (25) is fixed to the top of the other side of the bracket (2).

8. The BGA chip shape defect detection device according to claim 7, characterized in that: An air pump (22) is provided in the chassis (1). The input end of the air pump (22) is connected to the atmosphere via a first connecting pipe (23). The output end of the air pump (22) is fixedly connected to a nozzle (26) via a second connecting pipe (24). The nozzle (26) is fixed to the inner wall of the vertical plate (25). The air pump (22) is electrically connected to the control box (10).

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