Laser processing equipment with visual camera device

Abstract

The utility model discloses laser processing equipment with a visual camera device. The laser processing equipment comprises a working table, the laser device is arranged on the working table, and a processing focal plane is formed on the laser device; the visual camera device is connected with the laser device, an alignment focal plane and a detection focal plane are formed on the visual camera device, and the alignment focal plane, the detection focal plane and the processing focal plane move simultaneously and all coincide with the working table top. According to the utility model, the z-axis moving part is adjusted to adjust the distance of the laser device relative to the working table and adjust the distance of the processing focal plane relative to the working table; the angles of the alignment focal plane and the detection focal plane relative to the processing focal plane are adjusted by adjusting the mounting base, so that the alignment focal plane, the detection focal plane and the processing focal plane coincide with the working table at the same time, and when the visual alignment camera detects the position of the laser device relative to the PCB substrate, laser beams process the PCB substrate with the maximum gathering effect; the visual detection camera detects the machining process of the laser device in real time.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, in particular to laser processing equipment with a visual camera device. Background Art

[0002] Laser processing equipment is a precision industrial tool widely used in materials processing applications such as cutting and marking. Its main components include the laser that generates the laser beam, the optical system that controls the direction and focus of the laser beam, the galvanometer system that controls the laser beam's scanning path, the machine tool that supports the workpiece and laser head for precise three-dimensional movement, and the numerical control system that controls the machine's motion and the laser's output power. The optical system includes the field lens, which maintains consistent focus of the laser beam throughout the entire scanning range. This ensures that the laser beam's focal point at different angles lies on the same plane, which is crucial for applications like laser marking.

[0003] The inventors of this application discovered that when applying laser processing equipment to the drilling process of PCB substrates, before laser drilling, it is necessary to first use the Z-axis to adjust the focal plane of the visual alignment system so that it falls on the PCB substrate to align its positioning point, and then determine the position of the laser head relative to the PCB substrate. After determining the position, the Z-axis is adjusted. After the laser processing focal plane falls on the PCB substrate, the laser beam drills the hole therein. During this process, the laser head needs to be adjusted twice in the Z-axis direction, which is time-consuming and labor-intensive. Affected by the dimensional error of the equipment, the position of the laser head relative to the PCB substrate will change slightly during the adjustment of the laser processing focal plane, resulting in a large dimensional deviation of the laser drilling, thereby reducing the processing quality of the PCB substrate. Utility Model Content

[0004] In order to solve the problem that the laser head needs to adjust the position and focus multiple times during the processing of PCB substrates, which affects the drilling accuracy, this utility model provides a laser processing equipment with a visual camera device. The specific technical solution is as follows:

[0005] A laser processing device with a visual camera device includes: a motion platform, the motion platform includes a horizontal work surface; a laser device arranged above the work surface, the laser device forming a processing focal plane; and a visual camera device connected to the laser device, the visual camera device forming an alignment focal plane and a detection focal plane, the alignment focal plane, the detection focal plane, and the processing focal plane moving simultaneously and all coinciding with the work surface.

[0006] Furthermore, it also includes at least two adjustment mounts, the vertical center axis of the adjustment mount is perpendicular to the alignment focal plane and the detection focal plane, the adjustment mount is capable of adjusting the vertical distance between the alignment focal plane and the detection focal plane, and the adjustment mount is capable of adjusting the vertical distance between the alignment focal plane and the detection focal plane relative to the work table.

[0007] Furthermore, a through hole is formed at the vertical center axis of the adjustment mount, and the inner surface diameter of the through hole can be adjusted. The inner surfaces of the through hole are respectively provided with a visual alignment lens and a visual detection lens. The ends of the visual alignment lens and the visual detection lens away from the work surface are respectively provided with a visual alignment camera and a visual detection camera. The sides of the visual alignment camera and the visual detection camera close to the work surface are respectively formed with an alignment focal plane and a detection focal plane. The axes of the visual alignment camera and the visual alignment lens both coincide with the vertical center axis of the adjustment mount, and the axes of the visual detection camera and the visual detection lens both coincide with the vertical center axis of the adjustment mount.

[0008] Furthermore, the motion platform also includes: a planar moving part, the top surface of which forms two work surfaces, and the work surfaces can move parallel to the horizontal plane; a z-axis moving part connected to the laser device, which can drive the laser device closer to or away from the work surface; and a z-axis air-floating support part connected to the laser device, the supporting force direction of the z-axis air-floating support part being parallel to the moving direction of the z-axis moving part.

[0009] Preferably, four laser devices are included, and the laser devices are evenly arranged directly above the work surface. The laser device also includes: a laser head, which forms a laser beam; a galvanometer whose reflective surface is on the optical path of the laser beam, and the reflective surface of the galvanometer can rotate at an angle; and a field lens arranged on the optical path of the laser beam, through which the laser beam forms a processing focal plane, and the processing focal plane is parallel to the work surface.

[0010] Preferably, the laser device further comprises a second screw connected to the laser head, wherein the rotation axis of the second screw is perpendicular to the work surface, and the second screw can adjust the angle of the galvanometer mirror relative to the field lens during rotation.

[0011] Preferably, the motion platform also includes: a mounting plate connected to the laser device, the mounting side of the mounting plate close to the laser device being perpendicular to the processing focal plane; and a first screw connected to the bottom of the mounting plate, which can adjust the angle of the field lens relative to the work table during rotation.

[0012] It can be seen from the above technical solution that the utility model has the following beneficial effects:

[0013] The utility model adjusts the distance of the laser device relative to the work surface by adjusting the z-axis moving part, and then adjusts the distance of the processing focal plane relative to the work surface, so that the processing focal plane coincides with the work surface; secondly, by setting an adjustment mounting seat, the distance of the visual alignment lens and the visual detection lens relative to the work surface is adjusted, and then the angles of the alignment focal plane and the detection focal plane relative to the processing focal plane are adjusted, so that the alignment focal plane, the detection focal plane and the processing focal plane can coincide with the work surface at the same time, so that when the visual alignment camera detects the position of the laser device relative to the PCB substrate, the laser beam can process the PCB substrate with the maximum focusing effect, and at the same time the visual detection camera can detect the processing process of the laser device in real time, thereby improving the processing effect of the laser device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of an embodiment of the utility model;

[0015] Figure 2 for Figure 1 partial cross-sectional view;

[0016] Figure 3 for Figure 1 partial cross-sectional view;

[0017] Figure 4 for Figure 1 Partial enlarged view;

[0018] Figure 5 for Figure 4 Partial enlarged image.

[0019] In the figure: 1. Motion platform; 2. Laser device; 3. Visual camera device; 11. Work table; 12. Plane moving part; 14. Z-axis air-floating support; 15. Z-axis moving part; 16. Mounting plate; 17. First screw; 21. Laser head; 22. Galvanometer; 23. Field mirror; 24. Second screw; 25. Processing focal plane; 31. Adjustment mounting base; 32. Coaxial light source; 33. Visual alignment camera; 34. Visual alignment lens; 35. Alignment focal plane; 36. Visual inspection camera; 37. Visual inspection lens; 38. Inspection focal plane; 39. Ring light source. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.

[0022] like Figure 1 As shown, the utility model includes: a motion platform 1, which includes a horizontal work surface 11; a laser device 2 arranged above the work surface 11, and the laser device 2 forms a processing focal plane 25; and a visual camera device 3 connected to the laser device 2, and the visual camera device 3 forms an alignment focal plane 35 and a detection focal plane 38, and the alignment focal plane 35, the detection focal plane 38, and the processing focal plane 25 move simultaneously and all coincide with the work surface 11.

[0023] Specifically, the work table 11 is used to place a PCB substrate that needs to be laser drilled. The laser device 2 arranged directly above the PCB substrate can emit a laser beam. The focal plane of the laser beam is the processing focal plane 25, which coincides with the top surface of the PCB substrate, so that the laser beam can process it with maximum energy; secondly, the alignment focal plane 35 can make the laser device 2 and the PCB substrate in the correct relative position, so that the laser beam can correctly process the holes that need to be processed on the PCB substrate successfully. The detection focal plane 38 can detect the process of the laser device 2 processing the PCB substrate in real time, and then detect the processing status of the holes on the PCB substrate in real time, so that the relative position of the PCB substrate and the laser device 2 can be adjusted in time to improve the accuracy and quality of the holes processed by the laser device 2.

[0024] The alignment focal plane 35, the detection focal plane 38 and the processing focal plane 25 work together to determine the quality of the hole processed by the laser device 2. The three can coincide with the work surface 11, so that when the laser device 2 adjusts its relative position with the PCB substrate, one of the three coincides with the work surface 11, and the other two can also coincide with the work surface 11, reducing the adjustment steps of the laser device 2, thereby reducing the cumulative error during the movement of the laser device 2 and improving the accuracy of its processed holes.

[0025] Further, the motion platform 1 further comprises: a planar moving part 12, a top surface of the planar moving part 12 forms two worktable surfaces 11, the worktable surfaces 11 can move parallel to the horizontal plane; a z-axis moving part 15 connected with the laser device 2, the z-axis moving part 15 can drive the laser device 2 to approach or move away from the worktable surfaces 11; and a z-axis air floating support 14 connected with the laser device 2, a support force direction of the z-axis air floating support 14 is parallel to a moving direction of the z-axis moving part 15.

[0026] Specifically, the two worktable surfaces 11 can move in the horizontal plane along the slide rails, and the moving range of each worktable surface 11 is only half of the moving range of the PCB substrate, which reduces the moving distance and moving time of the worktable surfaces 11 and improves the moving efficiency of the PCB substrate; secondly, the z-axis moving part 15 drives the laser device 2 to move up and down through the rotation of the screw rod, so that the machining focal surface 25 coincides with the worktable surfaces 11, and then the laser beam can process the holes of the PCB substrate with the maximum energy, thereby improving the processing quality; thirdly, the z-axis air floating support 14 assists the z-axis moving part 15 to move the laser device 2, which can provide a certain upward support force for the laser device 2, thereby reducing the force borne by the z-axis moving part 15, and when the machining focal surface 25 coincides with the worktable surfaces 11, the z-axis air floating support 14 can stabilize the position of the laser device 2 relative to the worktable surfaces 11, thereby improving the stability of the laser device 2 during processing.

[0027] As shown in Figure 2 , the motion platform 1 further comprises: a mounting plate 16 connected with the laser device 2, a mounting side of the mounting plate 16 close to the laser device 2 is perpendicular to the machining focal surface 25; and a first screw 17 connected with the bottom of the mounting plate 16, the first screw 17 can adjust the angle of the field lens 23 relative to the worktable surfaces 11 during rotation.

[0028] Specifically, the bottom of the mounting plate 16 is formed with a water platform step, so that the contact surface of the laser device 2 and the mounting plate 16 is L-shaped, and then the mounting plate 16 provides more support for the laser device 2, and at the same time, the other side of the mounting plate 16 is connected with the z-axis moving part 15 through the long waist hole, so that the mounting plate 16 can adjust the angle between the moving direction of the z-axis moving part 15 and the mounting plate 16, and then adjust the angle of the machining focal surface 25 relative to the worktable surfaces 11, so that the two can coincide; secondly, the first screw 17 is in contact with the bottom of the laser device 2 through the water platform step, so that when the first screw 17 rotates, the threaded end of the first screw 17 can further adjust the angle of the bottom of the laser device 2 relative to the worktable surfaces 11, and then ensure that the machining focal surface 25 coincides with the worktable surfaces 11, thereby ensuring the processing effect of the laser beam.

[0029] As shown in Figure 3As shown, there are at least four laser devices 2, and the laser device 2 also includes: a laser head 21, which forms a laser beam; a galvanometer 22 whose reflecting surface is on the optical path of the laser beam, and the reflecting surface of the galvanometer 22 can rotate at an angle; and a field lens 23 arranged on the optical path of the laser beam, and the laser beam forms a processing focal plane 25 through the field lens 23, and the processing focal plane 25 is parallel to the work table 11.

[0030] Specifically, four laser devices 2 are evenly arranged directly above the work surface 11, that is, two laser devices 2 correspond to one work surface 11, so that the two laser devices 2 complete the hole processing of a PCB substrate, thereby reducing the horizontal movement of a single laser device 2, thereby improving the processing efficiency and processing size of the laser device 2; secondly, the galvanometer 22 passes the reflected laser beam through the field lens 23 so that the laser beam forms a processing focal plane 25, and it is necessary to adjust the z-axis moving part 15 so that the processing focal plane 25 coincides with the work surface 11, so that the energy of the laser beam focused on the PCB substrate is the strongest, thereby improving the energy utilization rate of the laser device 2.

[0031] Furthermore, the laser device 2 further includes a second screw 24 connected to the laser head 21 . The rotation axis of the second screw 24 is perpendicular to the work surface 11 . The second screw 24 can adjust the angle of the galvanometer 22 relative to the field lens 23 during rotation.

[0032] Specifically, the second screw 24 is a fine-thread screw. When the first screw 17 adjusts the angle of the processing focal plane 25 relative to the work table 11, the second screw 24 can adjust the position of the laser head 21 at a smaller distance, so that the laser beam reflected by the galvanometer 22 changes when passing through the field lens 23, so that the processing focal plane 25 can be more perfectly overlapped with the work table 11, thereby improving the focusing effect of the laser beam.

[0033] like Figure 4 and Figure 5 As shown, the visual camera device 3 also includes at least two adjustment mounts 31, the vertical center axis of the adjustment mount 31 is perpendicular to the alignment focal plane 35 and the detection focal plane 38, the adjustment mount 31 is capable of adjusting the vertical distance between the alignment focal plane 35 and the detection focal plane 38, and the adjustment mount 31 is capable of adjusting the vertical distance between the alignment focal plane 35 and the detection focal plane 38 relative to the work table 11.

[0034] Specifically, the visual camera device 3 includes eight adjustment mounts 31, which are evenly formed with four alignment focal planes 35 and detection focal planes 38. The adjustment mounts 31 are fixedly connected to the laser device 2 by screws, so that the vertical center axis of the adjustment mount 31 is perpendicular to the bottom of the laser device 2, and then perpendicular to the processing focal plane 25, so that the alignment focal plane 35, the detection focal plane 38 and the processing focal plane 25 are parallel to each other and then overlap with each other.

[0035] Further, a through hole is formed at the vertical central axis of the adjusting mount 31, the inner side diameter of the through hole can be adjusted, the inner side of the through hole is respectively provided with a visual alignment lens 34 and a visual detection lens 37, the end of the visual alignment lens 34 and the visual detection lens 37 away from the workbench surface 11 is respectively provided with a visual alignment camera 33 and a visual detection camera 36, the side of the visual alignment camera 33 and the visual detection camera 36 close to the workbench surface 11 is respectively formed with an alignment focal plane 35 and a detection focal plane 38, the axis of the visual alignment camera 33 and the visual alignment lens 34 are all coincided with the vertical central axis of the adjusting mount 31, the axis of the visual detection camera 36 and the visual detection lens 37 are all coincided with the vertical central axis of the adjusting mount 31.

[0036] Specifically, the structure of the adjusting mount 31 is that a half ring is connected to another half ring through a screw, the distance between the two half rings is adjusted to adjust the inner side diameter of the through hole, and then the positions of the visual alignment lens 34 and the visual detection lens 37 relative to the adjusting mount 31 are adjusted, and then the height of the alignment focal plane 35 and the detection focal plane 38 relative to the machining focal plane 25 is adjusted, so that the visual alignment camera 33 and the visual detection camera 36 can simultaneously have the clearest field of view to the PCB substrate, and then the alignment focal plane 35 and the detection focal plane 38 can be coincided with the machining focal plane 25, so that the visual alignment camera 33, the visual detection camera 36 and the laser device 2 can be in the best position to process the PCB substrate.

[0037] Secondly, the visual alignment camera 33 determines the position of the laser beam relative to the PCB substrate through the visual alignment lens 34, thereby improving the position accuracy of the hole processed by the laser beam, and the visual detection camera 36 detects the process of processing the PCB substrate by the laser beam in real time through the visual detection lens 37, so that the operator can obtain the quality of the hole processed by the laser beam in time, and then adjust it to obtain higher quality of the shape and position accuracy of the hole, thereby improving the quality of the laser device 2 processing.

[0038] Further, the visual camera device 3 further comprises: a coaxial light source 32 arranged on the visual alignment lens 34 and the visual detection lens 37, the light beam of the coaxial light source 32 intersects and is perpendicular to the axis of the visual alignment lens 34 and the visual detection lens 37; and a ring light source 39 arranged at the bottom of the visual alignment lens 34 and the visual detection lens 37, the light beam of the ring light source 39 is parallel to the axis of the visual alignment lens 34 and the visual detection lens 37.

[0039] Specifically, the coaxial light source 32 and the annular light source 39 can provide a stable and uniform light source to the visual alignment camera 33 and the visual inspection camera 36, ​​thereby improving the imaging quality of both with respect to the PCB substrate, thereby improving the position of the laser beam relative to the PCB substrate and the quality of the laser beam processing image, making it easier for the operator to adjust it, thereby improving the quality of the holes processed by the laser device 2.

[0040] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

[0041] The technology, shape and structure that are not described in detail in this utility model are all well-known technologies.

Claims

1. A laser processing device with a visual camera device, characterized in that: include: A motion platform (1), the motion platform (1) comprising a horizontal work surface (11), a z-axis moving member (15) connected to the laser device (2), and the z-axis moving member (15) capable of driving the laser device (2) toward or away from the work surface (11); A laser device (2) is arranged above the work surface (11), and the laser device (2) forms a processing focal plane (25); and A visual camera device (3) connected to the laser device (2) comprises a visual alignment camera (33) and a visual detection camera (36), wherein the visual alignment camera (33) and the visual detection camera (36) are respectively formed with an alignment focal plane (35) and a detection focal plane (38) on one side close to the work table (11), and the visual camera device (3) further comprises at least two adjustment mounting seats (31), wherein the adjustment mounting seats (31) are capable of adjusting the vertical distance between the alignment focal plane (35) and the detection focal plane (38) relative to the work table (11), and the alignment focal plane (35), the detection focal plane (38), and the processing focal plane (25) move simultaneously and all coincide with the work table (11).

2. The laser processing equipment according to claim 1, characterized in that: The vertical center axis of the adjustment mounting seat (31) is perpendicular to the alignment focal plane (35) and the detection focal plane (38), and the adjustment mounting seat (31) is capable of adjusting the vertical distance between the alignment focal plane (35) and the detection focal plane (38).

3. The laser processing equipment according to claim 2, characterized in that: A through hole is formed at the vertical center axis of the adjustment mounting seat (31), and the inner side diameter of the through hole can be adjusted. The inner side surfaces of the through hole are respectively provided with a visual alignment lens (34) and a visual detection lens (37). The ends of the visual alignment lens (34) and the visual detection lens (37) away from the work table (11) are respectively provided with a visual alignment camera (33) and a visual detection camera (36). The axes of the visual alignment camera (33) and the visual alignment lens (34) are both coincident with the vertical center axis of the adjustment mounting seat (31), and the axes of the visual detection camera (36) and the visual detection lens (37) are both coincident with the vertical center axis of the adjustment mounting seat (31).

4. The laser processing equipment according to claim 1, characterized in that: The motion platform (1) further comprises: A planar moving member (12), the top surface of which forms two working tables (11), and the working tables (11) are capable of moving parallel to a horizontal plane; and A z-axis air-floating support member (14) connected to the laser device (2) has a supporting force direction parallel to a moving direction of the z-axis moving member (15).

5. The laser processing equipment according to claim 1, characterized in that: The invention comprises four laser devices (2), wherein the laser devices (2) are evenly arranged directly above the working table (11), and the laser devices (2) further comprise: A laser head (21) that forms a laser beam; a galvanometer (22) whose reflective surface is on the optical path of the laser beam, wherein the reflective surface of the galvanometer (22) can rotate at an angle; and A field lens (23) is arranged on the optical path of the laser beam. The laser beam passes through the field lens (23) to form a processing focal plane (25). The processing focal plane (25) is parallel to the working table (11).

6. The laser processing equipment according to claim 5, characterized in that: The laser device (2) further comprises a second screw (24) connected to the laser head (21), wherein the rotation axis of the second screw (24) is perpendicular to the work surface (11), and the second screw (24) can adjust the angle of the galvanometer (22) relative to the field lens (23) during rotation.

7. The laser processing equipment according to claim 1, characterized in that: The motion platform (1) further comprises: a mounting plate (16) connected to the laser device (2), wherein the mounting side of the mounting plate (16) close to the laser device (2) is perpendicular to the processing focal plane (25); and A first screw (17) connected to the bottom of the mounting plate (16) is capable of adjusting the angle of the field lens (23) relative to the work surface (11) during rotation.

8. The laser processing equipment according to claim 1, characterized in that: The visual camera device (3) further comprises: a coaxial light source (32) disposed on the visual alignment lens (34) and the visual detection lens (37), wherein a light beam of the coaxial light source (32) intersects and is perpendicular to the axes of the visual alignment lens (34) and the visual detection lens (37); An annular light source (39) is arranged at the bottom of the visual alignment lens (34) and the visual detection lens (37), and the light beam of the annular light source (39) is parallel to the axis of the visual alignment lens (34) and the visual detection lens (37).

Images