3D circuit board shape correcting device

Abstract

The utility model is suitable for the technical field of circuit board processing, and provides a 3D circuit board shape correcting device which comprises a base plate, and an installation box is fixedly installed on the top of the base plate. The mounting plate can be rotationally adjusted, the mounting plate is arranged on the mounting box, and a plurality of placing seats are symmetrically and fixedly mounted on the mounting plate and used for placing 3D circuit boards to be shaped; the mounting frame is fixedly mounted at the top of the base plate, and a height-adjustable assembly plate is arranged on the mounting frame; and the connecting plate is arranged on the assembling plate, a shape correcting shell is fixedly installed at the bottom of the connecting plate and used for leveling the D circuit board placed in the containing base, and an electric heating plate is arranged in the shape correcting shell. According to the 3D circuit board shape correcting device provided by the scheme, the problem that the 3D circuit board is warped after being processed at present is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board processing, and in particular relates to a 3D circuit board shape correction device. Background Art

[0002] With the rapid development of electronic technology and the rise of intelligent manufacturing, 3D printing technology is increasingly being used in the electronics industry, showing great potential in particular in the manufacturing of printed circuit boards (PCBs). 3D printing technology, with its unique advantages, such as the ability to generate complex three-dimensional parts directly from computer design data without the need for traditional machining or molds, has greatly shortened the product design to production cycle, improved production efficiency, and reduced production costs.

[0003] However, during the 3D printing process, due to the rapid solidification of the material at high temperature and the accumulation of stress between printed layers, the PCB board often exhibits a certain degree of warping after cooling. Even if the warping is only around 2.4%, it may have a significant impact on the assembly of precision electronic components and the overall performance of the circuit board, thereby reducing the quality and reliability of the finished product. Therefore, how to correct the shape and leveling of 3D circuit boards has become an urgent problem that needs to be solved. Utility Model Content

[0004] The utility model provides a 3D circuit board shape correction device, aiming to solve the problem of warping of the current 3D circuit board after processing.

[0005] The present utility model is implemented as follows: a D circuit board correction device comprises: a base plate, a mounting box is fixedly mounted on the top of the base plate; a rotatable and adjustable mounting plate, the mounting plate is arranged on the mounting box, a plurality of placement seats are symmetrically fixedly mounted on the mounting plate for placing the 3D circuit board to be corrected; a mounting frame, the mounting frame is fixedly mounted on the top of the base plate, the mounting frame is provided with a height-adjustable assembly plate; a connecting plate, the connecting plate is arranged on the assembly plate, a correction shell is fixedly mounted on the bottom of the connecting plate for leveling the D circuit board placed in the placement seat, an electric heating plate is provided in the correction shell; a rotating mechanism for regulating the rotation of the mounting plate to switch the position of the placement seat, the rotating mechanism is arranged on the mounting box; an adjusting mechanism for regulating the lifting and lowering of the assembly plate, the adjusting mechanism is arranged on the mounting frame.

[0006] Preferably, the rotation mechanism adjustment mechanism includes: a rotating shaft rotatably mounted on the mounting box, the top end of the rotating shaft being fixedly connected to the bottom end of the mounting plate; a first motor fixed in the mounting box, which is a power source for driving the rotating shaft; and gears respectively fixedly mounted on the output shaft of the first motor and on the rotating shaft, the two gears being engaged with each other.

[0007] Preferably, the adjustment mechanism includes: a screw rotatably mounted on the mounting frame, the screw thread passing through the assembly plate; a guide rod fixed on the mounting frame, the guide rod passing through the assembly plate; a second motor fixed on the mounting frame, which is a power source for driving the screw; and bevel teeth respectively fixed on the output shaft of the second motor and on the screw, the two bevel teeth being engaged with each other.

[0008] Preferably, a support frame is symmetrically fixedly mounted on the installation box, a ball is embedded on the top of the support frame, and an annular groove is provided at the bottom of the installation plate, and the annular groove is adapted to fit the ball.

[0009] Preferably, a thermostat is provided on the assembly plate for regulating the temperature of the electric heating plate, and a plurality of foot pads are symmetrically fixedly mounted on the bottom of the base plate.

[0010] Preferably, the installation box is provided with an openable and closable inspection door, the inspection door is hinged to the installation box through a hinge, and the inspection door is provided with a door lock.

[0011] Preferably, a connecting frame is fixedly mounted on the assembly plate, a detachable connecting block is provided on the connecting frame, the bottom end of the connecting block is fixedly connected to the connecting plate, a bolt is provided on the connecting frame, and the bolt thread passes through the connecting block.

[0012] Compared with the related art, the D circuit board shape correction device provided by the present invention has the following beneficial effects:

[0013] A stable support structure is formed by the base plate, mounting box and mounting frame to ensure the stability of the entire correction process. The mounting plate and assembly plate realize automatic switching and precise leveling of the circuit board through precise rotation and lifting control, which significantly improves the leveling efficiency and accuracy; the first motor and the second motor serve as power sources, and through the engagement of gears and bevel teeth, realize the automatic control of the rotation mechanism and the adjustment mechanism, enhancing the flexibility and automation level of the device; the support frame and ball bearing combination reduces the friction during the rotation of the mounting plate, ensures smooth and stable rotation, and improves the stability of the leveling process; the screw and guide rod ensure the vertical movement of the assembly plate, so that the correction shell can apply appropriate pressure according to the thickness or warping degree of the circuit board, thereby improving the adaptability and leveling effect of the device; the electric heating plate provides a uniform heat source, softens the circuit board material, effectively solves the warping problem, and improves the flatness of the circuit board after leveling, thereby improving the overall quality and reliability of electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the main structure of a 3D circuit board shape correction device provided by the utility model;

[0015] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0016] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of part A shown in FIG;

[0017] Figure 4 It is a structural diagram of the support frame and the ball in the utility model.

[0018] Figure numerals: 1. base plate; 2. mounting box; 3. mounting plate; 4. placement seat; 5. mounting frame; 6. assembly plate; 7. connecting plate; 8. correction shell; 9. electric heating plate; 10. rotating shaft; 11. first motor; 12. gear; 13. screw; 14. guide rod; 15. second motor; 16. bevel gear; 17. support frame; 18. ball bearing. DETAILED DESCRIPTION

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0020] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] The present invention provides a 3D circuit board shape correction device. Figure 1-4As shown, the 3D circuit board correction device includes: a base plate 1, a mounting box 2 is fixedly installed on the top of the base plate 1; a rotatable and adjustable mounting plate 3, the mounting plate 3 is arranged on the mounting box 2, and a plurality of placement seats 4 are symmetrically fixedly installed on the mounting plate 3 for placing the 3D circuit board to be corrected; a mounting frame 5, the mounting frame 5 is fixedly installed on the top of the base plate 1, and a height-adjustable assembly plate 6 is provided on the mounting frame 5; a connecting plate 7, the connecting plate 7 is arranged on the assembly plate 6, and a correction shell 8 is fixedly installed on the bottom of the connecting plate 7 for leveling the 3D circuit board placed in the placement seat 4, and an electric heating plate 9 is provided in the correction shell 8; a rotating mechanism for regulating the rotation of the mounting plate 3 to switch the position of the placement seat 4, the rotating mechanism is arranged on the mounting box 2; an adjusting mechanism for regulating the lifting and lowering of the assembly plate 6, the adjusting mechanism is arranged on the mounting frame 5.

[0022] In this embodiment, the base plate 1 serves as the supporting foundation of the entire device to ensure structural stability; the mounting box 2 is fixed to the top plate of the base plate 1, and is used to install and support the rotatable mounting plate 3 to provide a stable platform; the mounting plate 3 is rotated by a rotating mechanism, so that multiple 3D circuit boards placed on the mounting plate 3 can enter the leveling area of ​​the correction shell 8 in sequence, thereby improving processing efficiency; the placement seat 4 is symmetrically fixed on the mounting plate 3, and is used to accurately place the 3D circuit board to be corrected, ensuring the stability of the circuit board during heating and leveling; the mounting frame 5 is fixed to the top of the base plate 1, supporting the assembly plate 6, and providing a vertical moving platform; the assembly plate 6 is raised and lowered by an adjustment mechanism, The shape-correcting shell 8 can accurately apply pressure to the 3D circuit board in the placement seat 4 to achieve leveling; the connecting plate 7 connects the assembly plate 6 and the shape-correcting shell 8 to ensure that the shape-correcting shell 8 moves with the rise and fall of the assembly plate 6; an electric heating plate 9 is provided inside the shape-correcting shell 8, which softens the circuit board by heating and then applies pressure to level it, effectively solving the warping problem; the electric heating plate 9 provides a uniform heat source, softens the circuit board material, reduces its rigidity, and facilitates leveling; the rotating mechanism regulates the rotation of the mounting plate 3 to achieve the switching of the placement seat 4, so as to continuously level the warped circuit board; the adjusting mechanism regulates the rise and fall of the assembly plate 6, so as to adjust the height of the shape-correcting shell 8 to align the circuit board on the placement seat 4. Through the synergistic effect of the above components, the utility model can efficiently and accurately level the 3D circuit board, significantly improve the flatness of the circuit board, and thus improve the quality and reliability of electronic products.

[0023] In a further preferred embodiment of the present invention, the rotation mechanism adjustment mechanism includes: a rotating shaft 10 rotatably mounted on the mounting box 2, the top of the rotating shaft 10 is fixedly connected to the bottom of the mounting plate 3; a first motor 11 fixed in the mounting box 2, which is a power source for driving the rotating shaft 10; and gears 12 respectively fixedly mounted on the output shaft of the first motor 11 and on the rotating shaft 10, and the two gears 12 are engaged with each other.

[0024] In this embodiment, the rotating shaft 10 is rotatably mounted on the mounting box 2, and its top end is fixedly connected to the bottom of the mounting plate 3, bearing the rotational movement of the mounting plate 3, ensuring that the 3D circuit board on the placement seat 4 can accurately switch positions; the first motor 11 is fixed inside the mounting box 2, serving as a power source for driving the rotating shaft 10 to rotate, ensuring smooth rotation of the mounting plate 3; the gears 12 are respectively fixedly mounted on the output shaft of the first motor 11 and the rotating shaft 10, and through the engagement between the gears, the rotational power of the motor is efficiently transmitted to the rotating shaft 10, thereby realizing precise control of the mounting plate 3; the coordinated work of these components ensures the efficient operation of the rotating mechanism, and the careful design and coordinated action of the rotating mechanism (including the rotating shaft 10, the first motor 11 and the gear 12) provide the 3D circuit board correction device with an efficient, precise and stable circuit board switching function, which significantly improves the automation level and overall efficiency of the circuit board leveling process.

[0025] In a further preferred embodiment of the present invention, the adjusting mechanism includes: a screw 13 rotatably mounted on the mounting frame 5, the screw 13 threadedly passing through the assembly plate 6; a guide rod 14 fixed on the mounting frame 5, the guide rod 14 passing through the assembly plate 6; a second motor 15 fixed on the mounting frame 5, which is a power source for driving the screw 13; and bevel teeth 16 respectively fixedly mounted on the output shaft of the second motor 15 and on the screw 13, and the two bevel teeth 16 are meshed with each other.

[0026] The second motor 15 precisely controls the rotation of the screw 13 through the engagement of the bevel teeth 16, thereby realizing the vertical movement of the assembly plate 6, and thereby realizing the height of the correction shell 8. It ensures that the correction shell 8 can apply appropriate pressure to the circuit boards of different thicknesses or warping degrees, thereby realizing the automation of the adjustment mechanism and significantly improving the accuracy and automation level of the circuit board leveling.

[0027] In a further preferred embodiment of the present invention, a support frame 17 is symmetrically fixedly installed on the installation box 2, and a ball 18 is embedded on the top of the support frame 17. An annular groove is opened at the bottom of the installation plate 3, and the annular groove is adapted to the ball 18.

[0028] In this embodiment, the support frame 17 is symmetrically fixedly mounted on the mounting box 2, and the top of the support frame 17 is inlaid with a ball 18, which is used to reduce the friction during the rotation of the mounting plate 3 and ensure the smoothness of the rotation; the ball 18 is inlaid on the top of the support frame 17 and is adapted to the annular groove at the bottom of the mounting plate 3. The rolling of the ball reduces friction and enhances the smoothness of the rotation; the annular groove is opened at the bottom of the mounting plate 3 and is adapted to the ball 18, ensuring that the mounting plate 3 can slide smoothly along the ball 18 during rotation, thereby improving the rotation efficiency and stability; the synergistic effect of these components ensures the smoothness and stability of the rotation of the mounting plate 3.

[0029] In a further preferred embodiment of the present invention, a temperature controller is provided on the assembly plate 6 for adjusting the temperature of the electric heating plate 9 , and a plurality of foot pads are symmetrically fixedly mounted on the bottom of the base plate 1 .

[0030] In this embodiment, a thermostat is mounted on the assembly plate 6 to precisely control the temperature of the electric heating plate 9. This ensures that the heating and softening process of the circuit board can be finely adjusted according to the board's material properties and degree of warping, preventing overheating or underheating, thereby achieving efficient and safe leveling. Foot pads are symmetrically fixed to the bottom of the base plate 1. The use of the foot pads increases friction between the device and the ground, preventing movement due to external forces during operation and ensuring stability and safety throughout the entire leveling process.

[0031] In a further preferred embodiment of the present invention, the installation box 2 is provided with an openable and closable inspection door, the inspection door is hinged to the installation box 2 by a hinge, and the inspection door is provided with a door lock.

[0032] In this embodiment, an access door is provided on the installation box 2 and is connected to the installation box 2 by a hinge, ensuring that it can be opened and closed. The access door is also provided with a door lock to ensure the safety of the interior of the device. The provision of the access door facilitates regular maintenance and inspection of components within the installation box 2, such as the first motor 11 and the gear 12, to ensure the normal operation of the rotating mechanism.

[0033] In a further preferred embodiment of the present invention, a connecting frame is fixedly mounted on the assembly plate 6, a detachable connecting block is provided on the connecting frame, the bottom end of the connecting block is fixedly connected to the connecting plate 7, a bolt is provided on the connecting frame, and the bolt thread passes through the connecting block.

[0034] In this embodiment, the connecting frame is fixedly mounted on the assembly plate 6 to support and secure the connecting block, ensuring its stability and connection reliability. A detachable connecting block is mounted on the connecting frame and connected to the connecting frame via bolts. The bottom end of the connecting block is fixedly connected to the connecting plate 7. This design allows the connecting block to be easily removed and replaced when needed, improving maintenance and replacement efficiency. Bolts thread through the connecting block, and the connecting block is secured or detached by tightening or loosening the bolts, ensuring a secure and replaceable connection.

[0035] To sum up, the base plate 1, the mounting box 2 and the mounting frame 5 form a stable support structure to ensure the stability of the entire correction process. The mounting plate 3 and the assembly plate 6 realize automatic switching and precise leveling of the circuit board through precise rotation and lifting control, which significantly improves the leveling efficiency and accuracy; the first motor 11 and the second motor 15 serve as power sources, and through the engagement of the gear 12 and the bevel gear 16, the automatic control of the rotation mechanism and the adjustment mechanism is realized, thereby enhancing the flexibility and automation level of the device; the support frame 17 and the ball 18 are combined to reduce the friction during the rotation of the mounting plate 3, ensure smooth and stable rotation, and improve the stability of the leveling process; the screw 13 and the guide rod 14 ensure the vertical movement of the assembly plate 6, so that the correction shell 8 can apply appropriate pressure according to the thickness or warping degree of the circuit board, thereby improving the adaptability and leveling effect of the device; the electric heating plate 9 provides a uniform heat source, softens the circuit board material, effectively solves the warping problem, and improves the flatness of the circuit board after leveling, thereby improving the overall quality and reliability of the electronic product.

[0036] It is worth noting that the circuits, electronic components and modules involved in the present invention are all existing technologies and can be fully implemented by those skilled in the art. Needless to say, the content protected by the present invention does not involve improvements to software and methods.

[0037] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope to be protected by the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making any creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope to be protected by the present invention.

Claims

1. A 3D circuit board shape correction device, characterized in that: include: A base plate, with an installation box fixedly mounted on the top of the base plate; A rotatable and adjustable mounting plate is provided on the mounting box, and a plurality of placement seats are symmetrically fixedly mounted on the mounting plate for placing the 3D circuit board to be calibrated; A mounting frame, the mounting frame being fixedly mounted on the top of the base plate, and the mounting frame being provided with a height-adjustable assembly plate; A connecting plate, the connecting plate is arranged on the assembly plate, a shape-correcting shell is fixedly installed on the bottom of the connecting plate, used for leveling the D circuit board placed in the placement seat, and an electric heating plate is arranged in the shape-correcting shell; A rotating mechanism for regulating the rotation of the mounting plate to switch the position of the placement seat, wherein the rotating mechanism is provided on the mounting box; An adjusting mechanism for regulating the lifting of the assembly plate is provided on the mounting frame.

2. The 3D circuit board shape correction device according to claim 1, wherein: The rotating mechanism adjusting mechanism comprises: A rotating shaft is rotatably mounted on the mounting box, wherein the top end of the rotating shaft is fixedly connected to the bottom end of the mounting plate; A first motor fixed in the mounting box is a power source for driving the rotating shaft; Gears are fixedly mounted on the output shaft of the first motor and the rotating shaft respectively, and the two gears are meshed with each other.

3. The 3D circuit board shape correction device according to claim 1, wherein: The regulating mechanism comprises: Rotating a screw mounted on the mounting bracket, wherein the screw thread passes through the assembly plate; A guide rod fixed to the mounting frame, the guide rod passing through the assembly plate; A second motor fixed to the mounting frame is a power source for driving the screw; The bevel teeth are respectively fixedly mounted on the output shaft of the second motor and the screw, and the two bevel teeth are meshed with each other.

4. The 3D circuit board shape correction device according to claim 1, wherein: A support frame is symmetrically fixedly mounted on the installation box, a top end of the support frame is inlaid with a ball, and an annular groove is provided at the bottom of the installation plate, and the annular groove is adapted to the ball.

5. The 3D circuit board shape correction device according to claim 1, wherein: The assembly plate is provided with a temperature controller for regulating the temperature of the electric heating plate, and a plurality of foot pads are symmetrically fixedly mounted on the bottom of the base plate.

6. The 3D circuit board shape correction device according to claim 1, wherein: The installation box is provided with an openable and closable inspection door, the inspection door is hinged to the installation box through a hinge, and the inspection door is provided with a door lock.

7. The 3D circuit board shape correction device according to claim 1, wherein: A connecting frame is fixedly mounted on the assembly plate, a detachable connecting block is provided on the connecting frame, a bottom end of the connecting block is fixedly connected to the connecting plate, a bolt is provided on the connecting frame, and the bolt thread passes through the connecting block.

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