Semiconductor device and vacuum gate valve thereof
By introducing a buffer mechanism into the vacuum gate valve and fitting the buffer seat with the sealing plate, the problem of particle introduction during the opening and closing of the vacuum gate valve is solved, thereby improving the cleanliness of semiconductor equipment and product yield.
Patent Information
- Application Number
- CN202422896143.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-11-26
AI Technical Summary
Existing vacuum gate valves are prone to introducing particles during the switching process, affecting the cleanliness of semiconductor equipment and product yield.
A vacuum gate valve is designed, including a sealing plate and a buffer mechanism. The buffer mechanism consists of a buffer seat and a buffer elastic member. The buffer seat is movably connected to the semiconductor device through a buffer connector. The buffer elastic member supports the buffer seat and the sealing plate to reduce vibration and particle introduction.
By reducing vibration and the falling and lifting of particles, the introduction of particles into semiconductor equipment is reduced, and the cleanliness of the equipment and product yield are improved.
Smart Images
Figure CN223424667U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a semiconductor device and a vacuum gate valve thereof. Background Art
[0002] A vacuum gate valve (or vacuum valve) is an isolation valve arranged at the window of a chamber for transferring wafers in a semiconductor device, and is used to isolate between vacuum chambers or between a vacuum chamber and the atmospheric environment.
[0003] In semiconductor equipment, the cleanliness of the transmission system is crucial to the etching process's performance. End users typically evaluate the equipment's cleanliness based on its particle performance. Maintaining a high-cleanliness chamber environment requires strict control of particle generation from components within the equipment that could potentially introduce particles. Only by controlling particle generation at the source can a clean process environment be ensured. During the opening and closing of vacuum gate valves, the valve seat can easily introduce particles into the semiconductor equipment, impacting product yield.
[0004] Therefore, how to reduce the introduction of particles into semiconductor devices when the vacuum gate valve is switched is a technical problem that those skilled in the art urgently need to solve. Utility Model Content
[0005] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor device and a vacuum gate valve thereof, which can reduce vibration during the switching process of the vacuum gate valve and reduce the introduction of particles into the semiconductor device.
[0006] To achieve the purpose of this application, a vacuum gate valve is provided for opening or closing an opening of a semiconductor device, comprising a sealing plate and a buffer mechanism, wherein:
[0007] The sealing plate is used to seal the opening of the semiconductor device;
[0008] The buffer mechanism includes a buffer seat and a buffer elastic member. The buffer seat is located between the sealing plate and the semiconductor device and is movably connected to the semiconductor device through a buffer connector. The buffer seat has a through hole corresponding to the opening of the semiconductor device. The buffer elastic member is located between the buffer seat and the semiconductor device and is used to support the buffer seat to fit the sealing plate.
[0009] In some embodiments, there are multiple buffer elastic members distributed around the via hole.
[0010] In some embodiments, the buffer seat includes a plurality of countersunk connection holes, the countersunk connection holes are distributed around the via hole, the buffer connector is passed through the countersunk connection holes, and is used to connect the buffer seat to the semiconductor device, and the buffer connector is clearance-matched with the countersunk connection holes;
[0011] The buffer elastic members are sleeved on the outer circumference of the buffer connecting member in a one-to-one correspondence.
[0012] In some embodiments, the buffer seat is provided with a receiving groove for receiving the buffer elastic member, the receiving groove is arranged around the countersunk connecting hole, and the buffer elastic member partially penetrates into the receiving groove.
[0013] In some embodiments, the device further includes a first sealing member, which is located on a side of the buffer seat facing away from the fitting surface of the buffer seat and is arranged around the through hole.
[0014] In some embodiments, the valve body and the driving mechanism are further included, wherein the driving mechanism is used to drive the sealing plate to fit the buffer seat, and the valve body is used to be connected to the semiconductor device;
[0015] The valve body includes a through hole passing through the valve body along a first direction and an installation cavity passing through the through hole along a second direction. The through hole is used to correspond to the opening of the semiconductor device when the valve body is connected to the semiconductor device. The sealing plate is arranged in the installation cavity. The driving mechanism penetrates into the installation cavity and is connected to the sealing plate. The buffer seat is located on the cavity wall of the installation cavity and is arranged around the through hole.
[0016] In some embodiments, a cavity wall of the mounting cavity is provided with a mounting groove surrounding the through hole, and the buffer seat is provided in the mounting groove.
[0017] In some embodiments, the buffer seat has a stepped surface arranged around the through hole, and the stepped surface is arranged opposite to the bottom surface of the mounting groove.
[0018] In some embodiments, a second sealing member is further included, which is located on a side of the valve body adapted to fit the semiconductor device and is disposed around the through hole.
[0019] The present application also provides a semiconductor device, comprising a vacuum chamber and any one of the vacuum gate valves described above, wherein the vacuum gate valve is connected to an opening of the semiconductor device and is used to control the opening of the semiconductor device to be opened or closed.
[0020] This application has the following beneficial effects:
[0021] The vacuum gate valve provided in the present application is used to open or close the opening of a semiconductor device, and includes a sealing plate and a buffer mechanism, wherein the sealing plate is used to seal the opening of the semiconductor device; the buffer mechanism includes a buffer seat and a buffer elastic member, the buffer seat is located between the sealing plate and the semiconductor device, and is movably connected to the semiconductor device through a buffer connector, the buffer seat has a through hole corresponding to the opening of the semiconductor device, and the buffer elastic member is located between the buffer seat and the semiconductor device, and is used to support the buffer seat so that a buffer gap is formed between the buffer seat and the semiconductor device. In the process of the sealing plate driving the opening of the semiconductor device of the buffer seat, the buffer seat is always in contact with the sealing plate under the support of the buffer elastic member. On the one hand, the vibration of the buffer seat is reduced, and the falling and lifting of particles are reduced. On the other hand, the particles shaken off by the vibration are prevented from entering between the buffer seat and the sealing plate, thereby reducing the introduction of particles into the semiconductor device.
[0022] The present application also provides a semiconductor device including the above vacuum gate valve, and having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 An exploded view of a vacuum gate valve provided in a specific embodiment of the present application;
[0024] Figure 2 for Figure 1 Main view of the medium vacuum gate valve;
[0025] Figure 3 for Figure 1 Side view of the medium vacuum gate valve and vacuum chamber;
[0026] Figure 4 for Figure 1 Cross-sectional view of the medium vacuum gate valve and vacuum chamber
[0027] Figure 5 An exploded view of a vacuum gate valve provided in another specific embodiment of the present application;
[0028] Figure 6 for Figure 5 Schematic diagram of the structure of the middle valve body;
[0029] Figure 7 for Figure 5 Schematic diagram of the structure of the middle buffer seat;
[0030] Figure 8 for Figure 5 Side cross-section of the medium vacuum gate valve;
[0031] Figure 9 for Figure 8 A partial enlarged view of the
[0032] Figure 10 for Figure 5Cross-sectional view of the medium vacuum gate valve;
[0033] Figure 11 for Figure 5 Partial schematic diagram of the medium vacuum gate valve;
[0034] Figure 12 This is a schematic structural diagram of the semiconductor device provided in this application.
[0035] in, Figures 1 to 12 The accompanying drawings are:
[0036] Vacuum gate valve 100, sealing plate 110, third sealing ring 111, buffer seat 120, countersunk connecting hole 121, step surface 122, through hole 123, first sealing member 124, accommodating groove 125, screw 130, buffer elastic member 140, driving mechanism 150, valve body 160, through hole 161, mounting cavity 162, mounting groove 163, second sealing member 164, semiconductor equipment 200, opening 201, process chamber 210, transfer chamber 220. DETAILED DESCRIPTION
[0037] In order to enable those skilled in the art to better understand the technical solution of the present application, the semiconductor device and the vacuum gate valve thereof provided by the present application are described in detail below with reference to the accompanying drawings.
[0038] The vacuum gate valve provided in the present application is used to open or close the opening of the semiconductor device, and the transmission component passes through the semiconductor device. When transmission is required, the vacuum gate valve opens the opening, and after the transmission is completed, the vacuum gate valve closes the opening.
[0039] like Figure 1 As shown, the vacuum gate valve 100 includes a sealing plate 110 and a buffer mechanism. The sealing plate 110 is used to seal the opening of the semiconductor device 200. The buffer mechanism includes a buffer seat 120 and a buffer elastic member 140. The buffer seat 120 has a through hole 123 corresponding to the opening 201 of the semiconductor device 200. The transport component passes through the through hole 123 when entering and exiting the semiconductor device 200. The buffer seat 120 is movably connected to the semiconductor device 200 via a buffer connector 140. The buffer seat 120 is movable toward and away from the semiconductor device 200. The buffer elastic member 140 is located between the buffer seat 120 and the semiconductor device 200 and supports the buffer seat 120, thereby forming a buffer gap between the buffer seat 120 and the semiconductor device 200. The buffer elastic member 140 applies a supporting force to the buffer seat 120 in a direction away from the semiconductor device 200. Under the action of the supporting force, the buffer seat 120 moves away from the semiconductor device 200, forming a buffer gap between the buffer seat 120 and the semiconductor device 200. The buffer elastic member 140 can be a spring or an elastic block, etc. The material of the spring can be steel wire, rubber, polyester or memory alloy, etc.
[0040] Sealing plate 110 is used to cover via 123 and to drive buffer seat 120 to seal opening 201 of semiconductor device 200. Bulk seat 120 moves toward semiconductor device 200 under the push of sealing plate 110, and the buffer gap gradually shrinks and eventually disappears. Buffer seat 120 seals opening 201 by means of a close fit.
[0041] In this embodiment, during the sealing process of opening 201, buffer seat 120, supported by buffer elastic member 140, remains in contact with sealing plate 110. The relative position of buffer seat 120 and sealing plate 110 remains unchanged, thereby reducing vibration of buffer seat 120 and particles dropped or lifted due to vibration, thereby minimizing the introduction of particles into semiconductor device 200. Furthermore, because buffer seat 120 and sealing plate 110 remain in contact at all times, particles cannot enter between them. This prevents particles from entering semiconductor device 200 through via 123 during the closing process, further minimizing the introduction of particles into semiconductor device 200.
[0042] In some embodiments, the number of the buffer elastic members 140 is multiple and distributed around the via hole 123. Figure 1 As shown, multiple buffer elastic members 140 are distributed around the through hole 123. Each buffer elastic member 140 provides support for the buffer seat 120, so that the outer periphery of the through hole 123 fits closely with the sealing plate 110, thereby preventing a gap from forming between the buffer seat 120 and the sealing plate 110. In addition, each buffer elastic member 140 can also ensure that the buffer seat 120 is evenly stressed, preventing the buffer seat 120 from tilting and affecting the sealing effect.
[0043] In some embodiments, the buffer mechanism further includes a buffer connector. The buffer seat 120 can be directly connected to the semiconductor device 200 through the buffer connector, or the buffer connector can be connected to other components and then connected to the semiconductor device 200 through the components. For example, Figures 1 to 4 In the illustrated embodiment, the buffer seat 120 is directly connected to the semiconductor device 200 via a buffer connector. Figures 4 to 10 In the illustrated embodiment, the vacuum gate valve 100 further includes a valve body 160, the buffer seat 120 is connected to the valve body 160 via a buffer connector, and the valve body 160 is fixedly connected to the semiconductor device 200. Of course, the buffer seat 120 and the semiconductor device 200 may also be connected in other ways, which are not limited here.
[0044] Optionally, the buffer connection member may be a screw 130, and the buffer seat 120 includes a plurality of countersunk connection holes 121, the countersunk connection holes 121 are distributed around the through hole 123, and the screw 130 is passed through the countersunk connection hole 121. The semiconductor device 200 or the valve body 160 may be provided with a threaded hole corresponding to the position of the countersunk connection hole 121, and the screw 130 passes through the countersunk connection hole 121 and is connected to the threaded hole, thereby connecting the buffer seat 120 to the semiconductor device 200. The surface of the buffer seat 120 that fits with the sealing plate 110 is a fitting surface. The nut of the screw 130 can be immersed in the countersunk connection hole 121 to prevent the nut from protruding from the fitting surface of the buffer seat 120 and affecting the sealing effect between the buffer seat 120 and the sealing plate 110. Multiple screws 130 connect the buffer seat 120 to the semiconductor device 200, ensuring the reliability of the connection. In addition, the screw 130 is loosely fitted with the countersunk connection hole 121, and the buffer seat 120 can move along the axial direction of the screw 130, thereby achieving a movable connection between the buffer seat 120 and the semiconductor device 200. Of course, the buffer connector can also adopt other structures. For example, the buffer connector can be a pressure plate that is connected to the semiconductor device 200 and limits the buffer seat 120 on the side away from the semiconductor device 200, thereby achieving a movable connection between the buffer seat 120 and the semiconductor device 200.
[0045] Optionally, the buffer elastic members 140 are sleeved on the outer circumference of the screws 130 in a one-to-one correspondence. The screws 130 can guide the buffer elastic members 140 to prevent the buffer elastic members 140 from tilting.
[0046] In some embodiments, the buffer seat 120 is provided with a receiving groove 125 for accommodating the buffer elastic member 140. The receiving groove 125 is arranged around the countersunk connecting hole, and the buffer elastic member 140 partially extends into the receiving groove 125. The semiconductor device 200 or the valve body 160 may also be provided with a receiving groove 125. One end of the buffer elastic member 140 of the semiconductor device 200 extends into the receiving groove 125 of the buffer seat 120, while the other end can extend into the receiving groove 125 of the semiconductor device 200 or the valve body 160. When the sealing plate 110 drives the buffer seat 120 to seal the opening 201 of the semiconductor device 200, the buffer elastic member 140 is completely accommodated in the receiving groove 125, and the buffer seat 120 and the valve body 160 or the semiconductor device 200 are in contact with each other, achieving a seal. Of course, the semiconductor device 200 or the valve body 160 may also not be provided with a receiving groove 125, and the buffer elastic member 140 can be completely accommodated in the receiving groove 125 of the buffer seat 120.
[0047] In some embodiments, the vacuum gate valve 100 further includes a first sealing member 124, which is located on a side of the buffer seat 120 facing away from the contact surface of the buffer seat 120 and is disposed around the via 123. When the sealing plate 110 drives the buffer seat 120 to seal the opening 201 of the semiconductor device 200, the first sealing member 124 surrounds the via 123 and the outer periphery of the opening 201 of the semiconductor device 200 and contacts the semiconductor device 200. The pressure between the buffer seat 120 and the semiconductor device 200 causes the first sealing member 124 to elastically deform, thereby achieving a seal between the buffer seat 120 and the semiconductor device 200. The first sealing member 124 can improve the sealing effect between the buffer seat 120 and the semiconductor device 200 and prevent particles from entering the opening 201 of the semiconductor device 200.
[0048] A specific implementation method provided in this application is as follows Figures 1 to 4 As shown, the vacuum gate valve 100 adopts a structure without a valve body 160, and the buffer seat 120 is directly connected to the semiconductor device 200. Figure 1 As shown, the buffer seat 120 is connected to the semiconductor device 200 via screws 130. The buffer seat 120 has a plurality of countersunk connection holes 121 arranged around the through-holes 123. The screws 130 pass through the countersunk connection holes 121 and connect to threaded holes distributed around the periphery of the opening 201 of the semiconductor device 200. The screws 130 and the countersunk connection holes 121 are loosely matched, and the buffer elastic members 140 are mounted on the periphery of the screws 130 in a one-to-one correspondence. The buffer elastic members 140 push the buffer seat 120, creating a buffer gap between it and the semiconductor device 200. The nuts of the screws 130 limit the position of the buffer seat 120, thereby limiting the size of the buffer gap.
[0049] The vacuum gate valve 100 also includes a drive mechanism 150. When the sealing plate 110 is in a position blocking the opening 201 of the semiconductor device 200, the drive mechanism 150 is configured to drive the sealing plate 110 to move in a first direction, i.e., toward or away from the semiconductor device 200. The drive mechanism 150 is configured to drive the sealing plate 110 to move in a second direction, i.e., between a position blocking the opening 201 of the semiconductor device 200 and a position not blocking the opening 201 of the semiconductor device 200. During the closing process of the vacuum gate valve 100, the drive mechanism 150 first drives the sealing plate 110 to move in the second direction. When the sealing plate 110 is blocking the opening 201 of the semiconductor device 200, the drive mechanism 150 drives the sealing plate 110 to move in the first direction, causing the sealing plate 110 to mate with the buffer seat 120. The drive mechanism 150 further pushes the buffer seat 120 to mate with the outer periphery of the opening 201 of the semiconductor device 200, thereby sealing the opening 201 of the semiconductor device 200. Otherwise, the vacuum gate valve 100 can be opened.
[0050] As the sealing plate 110 pushes the buffer seat 120 into contact with the outer periphery of the opening 201 of the semiconductor device 200, the buffer seat 120, supported by the buffer elastic member 140, remains in contact with the sealing plate 110. This reduces vibrations of the sealing plate 110 and the buffer seat 120, thereby reducing particles that are shaken off and lifted during this process. Furthermore, the sealing plate 110 and the buffer seat 120 are in close contact and sealed, preventing particles from entering between the sealing plate 110 and the buffer seat 120, thereby reducing the amount of particles that enter the opening 201 of the semiconductor device 200. The vacuum gate valve 100 utilizes a structure without a valve body 160, resulting in a simplified structure, reduced size, and less difficulty in arranging the vacuum gate valve 100.
[0051] Another specific embodiment provided by this application is as follows Figures 5 to 11 As shown, the vacuum gate valve 100 also includes a valve body 160, which is sealed with the semiconductor device 200. The buffer seat 120 is mounted within the valve body 160. The drive mechanism 150 is connected to the sealing plate 110 and is used to move the sealing plate 110 between a closed position and an open position. In the open position, the sealing plate 110 does not block the opening 201 of the semiconductor device 200. In the closed position, the sealing plate 110 presses the buffer seat 120 against the semiconductor device 200, thereby sealing the opening 201 of the semiconductor device 200.
[0052] Optional, such as Figure 5 As shown, the installation cavity 162 has an opening 201 at one end away from the driving mechanism 150, and the buffer seat 120 can be installed into the installation cavity 162 through the opening 201 of the installation cavity 162. The valve body 160 also includes a cover plate for closing the opening 201 of the installation cavity 162.
[0053] Optional, such as Figure 6 As shown, valve body 160 includes a through hole 161 extending through valve body 160 in a first direction and a mounting cavity 162 extending through through hole 161 in a second direction. Through hole 161 is configured to correspond to opening 201 of semiconductor device 200 when valve body 160 is connected to semiconductor device 200. Sealing plate 110 is disposed within mounting cavity 162. Drive mechanism 150 partially extends into mounting cavity 162 and connects to sealing plate 110, driving sealing plate 110 to move between a closed position and an open position. The movement method can be referred to in the previous embodiment and will not be further described here. Buffer seat 120 is located on the cavity wall of mounting cavity 162 near semiconductor device 200 and is disposed around through hole 161. During the closing process of vacuum gate valve 100, sealing plate 110 moves along the second direction of drive mechanism 150, aligning with buffer seat 120 and driving buffer seat 120 to align with valve body 160, thereby sealing opening 201 of semiconductor device 200.
[0054] Optional, such as Figures 8 to 10As shown, the buffer seat 120 includes a plurality of countersunk connection holes 121 arranged around the through hole 123, and the cavity wall of the mounting cavity 162 is provided with threaded holes corresponding to the countersunk connection holes 121. The screws 130 pass through the countersunk connection holes 121 and are connected to the threaded holes, as shown in FIG. Figure 11 As shown, the buffer elastic member 140 is sleeved on the outer periphery of the screw 130 .
[0055] In some embodiments, as Figure 6 and Figure 8 As shown, the wall of the mounting cavity 162 is provided with a mounting groove 163 surrounding the through hole 161, and the buffer seat 120 is disposed in the mounting groove 163. The sealing plate 110 moves within the mounting cavity 162 under the drive mechanism 150, and the buffer seat 120 does not need to occupy additional space within the mounting cavity 162, thereby reducing the size of the vacuum gate valve 100.
[0056] In some embodiments, as Figure 7 As shown, the buffer seat 120 has a stepped surface 122 arranged around the through hole 123. The stepped surface 122 is arranged opposite the bottom surface of the mounting groove 163. When the vacuum gate valve 100 is closed, the stepped surface 122 of the buffer seat 120 is in contact with the bottom surface of the mounting groove 163, thereby achieving a seal between the buffer seat 120 and the valve body 160.
[0057] Optional, such as Figure 7 As shown, the buffer seat 120 is provided with a receiving groove 125 for accommodating the buffer elastic member 140. The receiving groove 125 is arranged around the countersunk connecting hole, and one end of the buffer elastic member 140 is inserted into the receiving groove 125 of the buffer seat 120. The valve body 160 is also provided with a receiving groove 125. The receiving groove 125 is arranged around the threaded hole, and the other end of the buffer elastic member 140 is inserted into the receiving groove 125 of the valve body 160. The sum of the depths of the receiving groove 125 of the buffer seat 120 and the receiving groove 125 of the valve body 160 is greater than or equal to the length of the buffer elastic member 140 when fully compressed, and less than the length of the buffer elastic member 140 when fully extended. When the vacuum gate valve 100 is closed, the buffer elastic member 140 is completely located in the receiving groove 125, thereby ensuring that the step surface 122 of the buffer seat 120 and the bottom surface of the mounting groove 163 are in close contact.
[0058] In some embodiments, as Figure 7 As shown, the vacuum gate valve 100 further includes a second sealing member 164, which is located on one side of the valve body 160 that is adapted to contact the vacuum chamber and is disposed around the through hole 161. When the valve body 160 is connected to the semiconductor device 200, the two squeeze and deform the second sealing member 164, thereby improving the sealing effect between the valve body 160 and the semiconductor device 200.
[0059] Optional, such as Figure 9As shown, a first sealing member 124 is provided on the side of the buffer seat 120 facing away from the contact surface of the buffer seat 120. The first sealing member 124 is arranged around the via 123. When the sealing plate 110 drives the buffer seat 120 to seal the opening 201 of the semiconductor device 200, the first sealing member 124 surrounds the via 123 and the outer periphery of the opening 201 of the semiconductor device 200 and contacts the semiconductor device 200. The pressure between the buffer seat 120 and the semiconductor device 200 causes the first sealing member 124 to elastically deform, thereby achieving a seal between the buffer seat 120 and the semiconductor device 200. The first sealing member 124 and the second sealing member 164 cooperate to achieve a double seal between the vacuum gate valve 100 and the semiconductor device 200, thereby improving the sealing effect between the vacuum gate valve 100 and the semiconductor device 200.
[0060] Optional, such as Figure 8 As shown, the sealing plate 110 is provided with a third sealing member 111 for mating with the buffer seat 120. When the vacuum gate valve 100 is closed, the mating surfaces of the sealing plate 110 and the buffer seat 120 are in close contact, and the third sealing member 111 surrounds the periphery of the through hole 123. The compressive force between the sealing plate 110 and the buffer seat 120 squeezes the third sealing member 111, causing it to elastically deform, thus improving the sealing effect between the sealing plate 110 and the buffer seat 120.
[0061] In this embodiment, the vacuum gate valve 100 includes a valve body 160, with a buffer seat 120 disposed within the valve body 160. A mounting groove 163 is provided within the valve body 160 to mate with the buffer seat 120, increasing the contact area between the buffer seat 120 and the valve body 160 and improving the sealing effect of the vacuum gate valve 100. Furthermore, a second sealing member 164 is provided between the valve body 160 and the semiconductor device 200, further enhancing the sealing effect between the valve body 160 and the semiconductor device 200.
[0062] The present application also provides a semiconductor device 200, comprising a vacuum chamber and a vacuum gate valve 100 in any of the above embodiments. The vacuum gate valve 100 is connected to an opening 201 of the semiconductor device 200 and is used to control the opening 201 of the semiconductor device 200 to be opened or closed. Figure 12 As shown, the vacuum chamber may include a process chamber 210 and a transfer chamber 220 , and the vacuum gate valve 100 may be disposed between vacuum chambers or between the vacuum chamber and the atmospheric environment.
[0063] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.
Claims
1. A vacuum gate valve for opening or closing an opening of a semiconductor device, characterized in that: It includes a sealing plate and a buffer mechanism, wherein: The sealing plate is used to seal the opening of the semiconductor device; The buffer mechanism includes a buffer seat and a buffer elastic member. The buffer seat is located between the sealing plate and the semiconductor device and is movably connected to the semiconductor device through a buffer connector. The buffer seat has a through hole corresponding to the opening of the semiconductor device. The buffer elastic member is located between the buffer seat and the semiconductor device and is used to support the buffer seat to fit the sealing plate.
2. The vacuum gate valve according to claim 1, characterized in that: There are multiple buffer elastic members, which are distributed around the via hole.
3. The vacuum gate valve according to claim 2, characterized in that: The buffer seat includes a plurality of countersunk connection holes, which are distributed around the via hole. The buffer connector is inserted into the countersunk connection holes to connect the buffer seat to the semiconductor device. The buffer connector is clearance-matched with the countersunk connection holes. The buffer elastic members are sleeved on the outer circumference of the buffer connecting member in a one-to-one correspondence.
4. The vacuum gate valve according to claim 3, characterized in that: The buffer seat is provided with a receiving groove for receiving the buffer elastic member. The receiving groove is arranged around the countersunk connecting hole, and the buffer elastic member partially penetrates into the receiving groove.
5. The vacuum gate valve according to claim 1, characterized in that: The invention also includes a first sealing member, which is located on a side of the buffer seat away from the fitting surface of the buffer seat and is arranged around the through hole.
6. The vacuum gate valve according to any one of claims 1 to 5, characterized in that: It also includes a valve body and a driving mechanism, wherein the driving mechanism is used to drive the sealing plate to fit the buffer seat, and the valve body is used to be connected to the semiconductor device; The valve body includes a through hole passing through the valve body along a first direction and an installation cavity passing through the through hole along a second direction. The through hole is used to correspond to the opening of the semiconductor device when the valve body is connected to the semiconductor device. The sealing plate is arranged in the installation cavity. The driving mechanism penetrates into the installation cavity and is connected to the sealing plate. The buffer seat is located on the cavity wall of the installation cavity and is arranged around the through hole.
7. The vacuum gate valve according to claim 6, characterized in that: The cavity wall of the installation cavity is provided with an installation groove around the through hole, and the buffer seat is arranged in the installation groove.
8. The vacuum gate valve according to claim 7, characterized in that: The buffer seat has a step surface arranged around the through hole, and the step surface is arranged opposite to the bottom surface of the mounting groove.
9. The vacuum gate valve according to claim 6, characterized in that: The valve body further includes a second sealing member, which is located on a side of the valve body adapted to fit the semiconductor device and is disposed around the through hole.
10. A semiconductor device, characterized in that: It comprises a vacuum chamber and the vacuum gate valve according to any one of claims 1 to 9, wherein the vacuum gate valve is connected to the opening of the semiconductor device and is used to control the opening of the semiconductor device to be opened or closed.