Three-axis wireless vibration sensor

Abstract

The utility model relates to the technical field of industrial internet of things-intelligent monitoring, in particular to a three-axis wireless vibration sensor. The sensor respectively measures the temperature of a measured object and acceleration values in the X-axis direction, the Y-axis direction and the Z-axis direction through a temperature measurement module and a three-axis acceleration sensor on a bottom PCB, converts the temperature and the acceleration values into analog values, and transmits the analog values to a processing chip. The processed data is uploaded to a collector through the ZigBee chip and the horizontally and vertically arranged antenna modules, and then is uploaded to a platform through a 4G network, thereby achieving the remote monitoring of the vibration and temperature of the equipment. The sensor has the advantages that the temperature measuring unit is closer to a measured object, the temperature measuring effect is better, vibration in the three-axis direction can be measured at the same time, the occupied space is small, carrying is convenient, and deployment and movement are flexible. According to the utility model, the defects of equipment management and maintenance modes in the prior art are overcome, and the reliability and the safety of the machine are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of industrial Internet intelligent monitoring equipment, and specifically relates to a three-axis wireless vibration sensor. Background Art

[0002] In the current field of intelligent monitoring in the Industrial Internet of Things (IIoT), wireless vibration sensors are widely used for equipment health monitoring and fault warning. Most existing sensors utilize exposed PCBs and batteries, with the equipment powered on and off via an external switch interface. These sensors typically provide basic temperature and vibration measurement capabilities, but the temperature measurement unit is located far from the object being measured, and most can only measure vibration in a single direction. Furthermore, hardware integration is low, requiring multiple independent modules to collect and process signals such as vibration, acceleration, and temperature. This results in bulky devices and makes them difficult to carry.

[0003] Existing sensor designs have numerous shortcomings. First, the PCB and battery are directly exposed inside the device, posing not only a safety hazard but also increasing the risk of misoperation by non-professionals. Second, the temperature measurement unit is located far from the object being measured, making it susceptible to environmental factors and resulting in low temperature measurement accuracy. Furthermore, vibration measurements in a single direction cannot fully reflect the operating status of the device, limiting the sensor's application in intelligent monitoring. Finally, the low hardware integration makes the device bulky and inconvenient to carry, and the battery cannot be installed and removed separately, increasing the difficulty of device deployment and movement. Utility Model Content

[0004] The purpose of this utility model is to provide a three-axis wireless vibration sensor with a safer structure, more accurate temperature measurement, more comprehensive vibration measurement, and easy portability and deployment.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0006] The utility model proposes a three-axis wireless vibration sensor, comprising:

[0007] The bottom of the housing 1 is provided with a raised portion;

[0008] A main PCB board, on which an MCU chip and an antenna module are provided;

[0009] A temperature measurement PCB board is provided with an ADC chip, a three-axis acceleration sensor and a temperature measurement module; wherein the temperature measurement module is located inside the raised portion and is signal-connected to the MCU chip; the three-axis acceleration sensor is signal-connected to the ADC chip, and the ADC chip is signal-connected to the main PCB board.

[0010] Furthermore, a cover plate is provided at the bottom of the shell and is magnetically attached to the raised portion, and the raised portion and the cover plate form a plane after being assembled.

[0011] Furthermore, a notch is provided on the inner side surface of the shell for accommodating a switch portion of the three-axis wireless vibration sensor.

[0012] Furthermore, the temperature measurement PCB board is independently arranged from the main PCB board, and the two are connected via a socket cable.

[0013] Furthermore, the antenna modules include two, which are placed horizontally and vertically respectively.

[0014] Furthermore, the main PCB board is also provided with a ZigBee chip connected to the MCU chip and the ADC chip signal, and the ZigBee chip is connected to the antenna module signal for transmitting the collected vibration signal and temperature signal to an external device.

[0015] The beneficial effects of the present invention are:

[0016] The three-axis wireless vibration sensor proposed in this utility model achieves close contact between the temperature measurement unit and the object being measured through an optimized structural design, significantly improving temperature measurement accuracy. At the same time, the integrated three-axis accelerometer can comprehensively monitor the vibration state of the device in the X, Y, and Z directions, providing more comprehensive data support for equipment health monitoring. Furthermore, the sensor's miniaturized design not only facilitates portability and deployment, but also reduces maintenance costs and increases flexibility. The sensor achieves wireless data transmission through a ZigBee chip and antenna module, providing an efficient and reliable solution for intelligent monitoring of the Industrial Internet of Things, effectively improving the reliability and safety of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of the three-axis wireless vibration sensor proposed by the utility model;

[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the three-axis wireless vibration sensor proposed by the present invention.

[0019] In the figure: 1. Shell; 2. Cover; 3. Raised part; 4. Notch; 5. Battery compartment; 6. Main PCB board; 7. Temperature measurement PCB board; 61. MCU chip; 62. Antenna module; 71. ADC chip; 72. Three-axis acceleration sensor; 73. Temperature measurement module. DETAILED DESCRIPTION

[0020] The present application is described in further detail below in conjunction with the accompanying drawings. It is necessary to point out that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technicians in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0021] Example 1

[0022] like Figure 1-2 As shown, this embodiment proposes a three-axis wireless vibration sensor, including: a shell 1, a main PCB board 6 and a temperature measurement PCB board 7; a raised portion 3 is provided at the bottom of the shell 1; an MCU chip 61 and an antenna module 62 are provided on the main PCB board 6; an ADC chip 71, a three-axis acceleration sensor 72 and a temperature measurement module 73 are provided on the temperature measurement PCB board 7; wherein the temperature measurement module 73 is located inside the raised portion 3 and is signal-connected to the MCU chip 61; the three-axis acceleration sensor 72 is signal-connected to the ADC chip 71, and the ADC chip 71 is signal-connected to the main PCB board 6.

[0023] In this embodiment, the temperature measurement module 73 is specifically a temperature sensor (e.g., an LM73 temperature sensor, an LM73-Q1 temperature sensor, etc.). During implementation, the temperature measurement module 73 transmits the collected temperature signal to the MCU chip 61. A three-axis accelerometer 72 (e.g., an ADXL345, LIS3DH, etc.) is also mounted on the temperature measurement PCB 7. This accelerometer measures the acceleration of the object in the X, Y, and Z axes, converts the acceleration into analog values, and transmits them to the ADC chip 71 at the bottom. The ADC chip 71 then processes the received analog data into digital data and transmits it to the main PCB 6.

[0024] Combine Figure 1 The bottom of the housing 1 is provided with a cover plate 2 that magnetically engages with the raised portion 3. When assembled, the raised portion 3 and the cover plate 2 form a flat surface. It will be appreciated that in this embodiment, the raised portion 3 is used to mount the temperature measurement module, thereby reducing the distance from the object being measured and improving temperature measurement results. Mounting the temperature measurement module 73 directly on the bottom of the main PCB 1, as close as possible to the object being measured, effectively reduces interference from environmental factors and significantly improves temperature measurement accuracy.

[0025] As a preference, the inner side of the housing 1 is provided with a notch 4 (such as Figure 1 The dotted part of the middle shell is used to accommodate the switch part of the three-axis wireless vibration sensor. Optionally, the switch part is specifically a toggle switch for easy user operation.

[0026] Optionally, the sensor also includes a battery system. The housing 1 protects the sensor's internal structure, and a battery compartment is located within the housing 1 to house the batteries. A main PCB 6 is mounted on the battery compartment. The batteries are electrically connected to the main PCB 6 and provide power to the components on the main PCB 6. A battery cover is externally mounted on the battery compartment to conceal the main PCB 6 and the batteries.

[0027] More specifically, the main PCB 6 houses a boost converter that converts the battery voltage to the 3.4V voltage required by the various chips, powering the MCU and memory chips. Two other power supply control chips power two low-dropout voltage regulators, which output 5V and 3.3V, respectively, providing power input to the bottom temperature measurement PCB 7. This PCB is connected to the main PCB 6 via a 15-pin socket cable.

[0028] As an example, the temperature measurement PCB board 7 is set independently from the main PCB board 6, and the two are connected by a socket cable. At the same time, the separation design of the temperature measurement PCB board 7 and the main PCB board 6 is convenient for subsequent maintenance and upgrades.

[0029] Preferably, two antenna modules 62 are provided, one mounted horizontally and the other vertically. These two antenna modules are positioned horizontally and vertically, respectively. This allows for longer signal transmission and improved quality, regardless of whether the sensor is positioned horizontally or vertically. Optional antenna modules 62 include ceramic antennas, PCB antennas, and spring antennas, all of which support placement in various orientations, including horizontal and vertical.

[0030] Preferably, the main PCB board 6 is further provided with a ZigBee chip connected to the MCU chip 61 and the ADC chip 71 , and the ZigBee chip is connected to the antenna module for transmitting the collected vibration signal and temperature signal to an external device.

[0031] For example, in a specific implementation, the sensor is placed on the machine casing or the motor casing. The device can monitor the vibration waveform on the device and collect its index values, which are uploaded to an external device, such as a collector, through a ZigBee chip. The collector processes the data collected by multiple sensors and uploads it to the platform through a 4G network antenna. The platform records the historical information of the measurement points, and has a complete understanding of the long life cycle of the machine. When the vibration waveform is abnormal, the fault type can be obtained in the first time.

[0032] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A three-axis wireless vibration sensor, characterized in that: include: A housing (1), wherein a protrusion (3) is provided at the bottom of the housing (1); A main PCB board (6), wherein an MCU chip (61) and an antenna module (62) are provided on the main PCB board (6); A temperature measurement PCB board (7) is provided with an ADC chip (71), a three-axis acceleration sensor (72), and a temperature measurement module (73); wherein the temperature measurement module (73) is located inside the raised portion (3) and is signal-connected to the MCU chip (61); the three-axis acceleration sensor (72) is signal-connected to the ADC chip (71), and the ADC chip (71) is signal-connected to the main PCB board (6).

2. A three-axis wireless vibration sensor according to claim 1, characterized in that: The bottom of the shell (1) is provided with a cover plate (2) that is magnetically attached to the raised portion (3); the raised portion (3) and the cover plate (2) form a plane after being assembled.

3. The three-axis wireless vibration sensor according to claim 1, characterized in that: The inner side surface of the housing (1) is provided with a notch (4) for accommodating the switch portion of the three-axis wireless vibration sensor.

4. The three-axis wireless vibration sensor according to claim 1, characterized in that: The temperature measurement PCB board (7) is independently arranged from the main PCB board (6), and the two are connected via a socket cable.

5. The three-axis wireless vibration sensor according to claim 1, characterized in that: The antenna modules (62) include two, which are respectively arranged horizontally and vertically.

6. The three-axis wireless vibration sensor according to claim 1, characterized in that: The main PCB board (6) is also provided with a ZigBee chip connected to the MCU chip (61) and the ADC chip (71) by signal. The ZigBee chip is connected to the antenna module by signal and is used to transmit the collected vibration signal and temperature signal to an external device.

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