Power supply device

Abstract

The utility model provides a power supply device. The power supply device comprises a transformer unit, a rectification unit and a heat dissipation component. The transformer unit comprises a first winding, a second winding and a magnetic core. The rectifying unit comprises a circuit board, a plurality of rectifying tubes and a plurality of output filter capacitors, the circuit board is adjacent to the transformer unit, the second winding is electrically connected to the circuit board, the circuit board is provided with a first surface and a second surface which are opposite to each other, and the first surface faces the transformer unit; wherein the heat dissipation part covers a rectification module formed by the transformer unit and the rectification unit, so that the power supply device can play an optimal heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to an assembly structure of electronic components, in particular to a power supply device. Background Art

[0002] With the explosive growth of data volumes, traditional air cooling technology has become unable to meet the heat dissipation needs of high-density servers. Cold plate technology, as an efficient and environmentally friendly cooling method, is gradually becoming the preferred choice for data center construction.

[0003] As one of the primary heat-generating components within a server power supply, the rectifier module (a combination of a transformer and rectifier diodes) is complex. A key technology in cold plate power supply design is to ensure balanced heat dissipation (simultaneously dissipating heat from both the transformer and rectifier diodes) through a cold plate. Components requiring heat dissipation within a rectifier module typically include the transformer windings and core within the transformer unit, as well as the rectifier diodes within the rectifier unit.

[0004] On the other hand, server power supply designs often aim for maximum efficiency at half load, so the transformer's winding and core losses are often designed to be nearly identical at half load. However, at full load, this design increases winding losses by a factor of four, while core losses remain essentially unchanged. Therefore, winding heat dissipation becomes a key consideration in this type of design. Sometimes, even core heat dissipation is sacrificed to provide better winding heat dissipation.

[0005] In view of this, it is necessary to provide a power supply device that optimizes heat dissipation performance by arranging and combining components and heat dissipation parts in the transformer unit and the rectifier unit, and solves the defects of the prior art. Utility Model Content

[0006] The present utility model provides a power supply device. In a rectifier module formed by a transformer unit and a rectifier unit, the windings in the transformer unit that require heat dissipation, as well as the output filter capacitor and / or rectifier tube in the rectifier unit, are positioned adjacent to heat dissipation components to optimize heat dissipation. In some applications, the rectifier tubes have stringent heat dissipation requirements. For example, to save costs, the rectifier module may select rectifier tubes with higher on-resistance and higher heat generation, so the rectifier tubes may be positioned adjacent to heat dissipation components. In other applications, the rectifier tubes in the rectifier unit are placed on the side of the circuit board facing the transformer to minimize AC losses. Since the output filter capacitor is the filter capacitor at the output end of the rectifier circuit, it experiences high ripple and significant heat generation in low-voltage, high-current applications. Temperature also significantly affects the lifespan of the capacitor. One solution is to add more capacitors, but this takes up a considerable amount of space. Therefore, effective heat dissipation can help improve overall power density. Therefore, the present invention places the output filter capacitor upwards adjacent to the heat dissipation component, or places the output filter capacitor sideways adjacent to the metal plate connected to the heat dissipation component, giving full play to the heat dissipation advantage of the heat dissipation component to take away the heat generated by the output filter capacitor to ensure the life of the output filter capacitor, thereby using fewer capacitors to achieve filtering while meeting the heat dissipation requirements, thereby improving power density. On the other hand, the rectifier tube in the rectifier unit faces the transformer. Since the primary harmonic in the secondary current component of the transformer mainly flows through the rectifier tube, the secondary harmonics and above flow through the filter capacitor, and the amplitude of the primary harmonic is relatively large, the rectifier tube is placed on the side facing the transformer, and the current loop path formed is the shortest, which can reduce the rectifier tube loss and the rectifier plate loss. It should be understood that since the number of output filter capacitors is generally large, in some embodiments, some of the output filter capacitors can also face the heat dissipation component or the metal side plate, and the remaining output filter capacitors and the rectifier tube are set on the same side.

[0007] Another object of the present invention is to provide a power supply device. A transformer unit and a rectifier unit are arranged below a heat sink along the X-direction. The transformer unit utilizes a U-shaped magnetic core, and the windings are wound around the upper magnetic column and then directed toward the heat sink, allowing a portion of the windings to dissipate heat adjacent to the heat sink. Of course, the windings are not limited to litz wire or copper foil. Furthermore, the transformer unit's windings are connected to the rectifier unit's circuit board via side pins. The winding pins are inserted into the rectifier unit's circuit board via a base plate. The windings and filter capacitors and / or rectifiers are positioned on opposite sides of the circuit board, allowing the filter capacitors and / or rectifiers to dissipate heat adjacent to the metal plates on the sides. The metal plates may have water channels within them and may be integrally formed with the heat sink or separately provided. The edges of the heat sink may also conform to the shape of the windings. The transformer unit and rectifier unit are simultaneously positioned in a trough whose top surface is the heat sink. The side panels of the trough are metal plates, and the trough is filled with thermally conductive adhesive to dissipate heat from at least the transformer unit and the rectifier unit. On the other hand, when the transformer unit's windings extend from the top edge, the rectifier unit is located between the transformer unit and the heat sink. The transformer unit utilizes a U-shaped magnetic core. After the windings are wound around the upper magnetic column, the windings extend through a base plate and are inserted into the circuit board of the upper rectifier unit. The rectifier tube and output filter capacitor are positioned on opposite sides of the circuit board, allowing the output filter capacitor and / or rectifier tube to dissipate heat adjacent to the heat sink. The transformer unit and rectifier unit can be simultaneously accommodated in a trough whose top surface serves as a heat sink. The trough is further filled with thermally conductive adhesive to dissipate heat from the transformer unit and rectifier unit. Thus, the windings in the transformer unit and the output filter capacitor and / or rectifier tube in the rectifier unit are adjacent to the heat sink and side panels, which helps optimize the heat dissipation efficiency of the power supply device. It should be understood that the term "adjacent" as used herein does not mean direct contact or abutment, but also includes contact or abutment with a certain air gap, or with an insulating medium inserted between the two, or with a heat dissipation medium such as a metal plate between the two. Since the heat dissipation components or sides are all metal plates, in order to meet safety insulation requirements, some devices need to be inserted with an insulating medium between them and the heat dissipation components before they are in contact or bonded with the heat dissipation components. The insulating medium can be insulating tape, insulating glue, insulating pads, etc., and the present invention does not impose any restrictions on this.

[0008] Another object of the present invention is to provide a power supply device. The transformer unit and rectifier unit are arranged and combined adjacent to a heat sink to optimize heat dissipation efficiency. When the transformer unit utilizes a U-shaped magnetic core, the windings are wound around the upper magnetic column and then adjacent to the heat sink for heat dissipation. The circuit boards of the two rectifier units can be positioned on opposite sides of the transformer unit, allowing the output filter capacitors (typically MLCCs (Multilayer Ceramic Capacitors)) and / or rectifier tubes to be adjacent to metal side plates for heat dissipation. Multiple transformer units and rectifier units are alternately arranged and assembled to form multiple rectifier modules. When the multiple rectifier modules are adjacent to each other, the heat sink is adjacent to the top sides of the windings of the multiple transformer units for heat dissipation. Multiple shared side plates can extend downward from the heat sink to between any two adjacent rectifier modules. One side of the shared side plate is adjacent to the rectifier module of any two adjacent rectifier modules, while the other side of the shared side plate is adjacent to the side of the winding of any two adjacent rectifier modules. A conforming curved surface can also be formed between the shared side plate and the heat sink to conform to the shape of the corresponding windings. Multiple transformer units and multiple rectifier units are stacked correspondingly and arranged in the X direction to form multiple rectifier modules. When multiple rectifier modules are arranged adjacent to each other, multiple accommodating slots can accommodate the combination of transformer units and rectifier units. The filter capacitors and / or rectifier tubes can be adjacent to the heat dissipation components for heat dissipation. The common side plate can extend downward from the heat dissipation components to between any two adjacent rectifier modules. One side of the common side plate is adjacent to the side of the winding of the former of any two adjacent rectifier modules, and the other side of the common side plate is adjacent to the side of the winding of the latter of any two adjacent rectifier modules. The arrangement and combination of the components in the transformer units and rectifier units, the heat dissipation components, and the accommodating slots all help to achieve optimal heat dissipation efficiency.

[0009] To achieve the above objectives, one aspect of the present invention provides a power supply device. The power supply device includes a transformer unit, a rectifier unit, and a heat sink. The transformer unit includes a first winding, a second winding, and a magnetic core. The rectifier unit includes a circuit board, multiple rectifier tubes, and multiple output filter capacitors. The circuit board is disposed adjacent to the transformer unit, and the second winding is electrically connected to the circuit board. The circuit board has a first surface and a second surface that are opposite to each other, with the first surface facing the transformer unit. The heat sink covers the rectifier module formed by the transformer unit and the rectifier unit.

[0010] In one embodiment, a plurality of rectifier tubes are disposed on a first surface of a circuit board, and at least part of a plurality of output filter capacitors are disposed on a second surface of the circuit board.

[0011] In one embodiment, the plurality of output filter capacitors are all disposed on the second surface of the circuit board.

[0012] In one embodiment, the plurality of rectifier tubes are disposed on the second side of the circuit board, and at least some of the plurality of output filter capacitors are disposed on the first side of the circuit board.

[0013] In one embodiment, the plurality of output filter capacitors are all disposed on the first side of the circuit board.

[0014] In one embodiment, the magnetic core includes a first magnetic column and a second magnetic column, the first winding is wrapped around the first magnetic column, and the second winding is disposed outside the first winding, wherein the first magnetic column is located between the heat dissipation member and the second magnetic column.

[0015] In one embodiment, the heat dissipation member is adjacent to the top side of the second winding, and the circuit board and the transformer unit are disposed along a horizontal direction.

[0016] In one embodiment, an edge of the heat dissipation member is fitted with the shape of the second winding.

[0017] In one embodiment, the power supply device includes two rectifier units, wherein the second winding of the transformer unit is electrically connected to the circuit board of the two rectifier units respectively, and the circuit boards of the two rectifier units are disposed on opposite sides of the transformer unit.

[0018] In one embodiment, the circuit board is located between the heat dissipation member and the transformer unit, and the plurality of rectifier tubes or the plurality of output filter capacitors disposed on the second side of the circuit board are adjacent to the heat dissipation member.

[0019] In one embodiment, the transformer unit and the rectifier unit are disposed in the accommodating groove, the accommodating groove is filled with heat-conducting glue to at least dissipate heat of the transformer unit and the rectifier unit, and the heat dissipation member covers the top of the accommodating groove.

[0020] In one embodiment, the accommodating groove includes a plurality of side plates, and the heat dissipation member serves as a top plate of the accommodating groove to form a groove body accommodating the transformer unit and the rectifier unit.

[0021] In one embodiment, the plurality of side plates and the heat dissipation member are integrally formed.

[0022] In one embodiment, the accommodating groove includes a plurality of side plates and a top plate to form a groove body accommodating the transformer unit and the rectifier unit, and the heat dissipation member covers the top plate.

[0023] In one embodiment, the circuit board is located between the heat dissipation member and the transformer unit, and the heat dissipation member is adjacent to the plurality of output filter capacitors.

[0024] In one embodiment, each side plate and / or top plate of the accommodating groove is a metal plate to transfer heat to the heat dissipation member.

[0025] In one embodiment, the metal plate has a water channel therein.

[0026] In one embodiment, the power supply device includes N transformer units and N rectifier units that are arranged and assembled accordingly to form N rectifier modules that are adjacently arranged in a accommodating tank. The accommodating tank includes multiple side panels, of which (N-1) side panels are shared by the N rectifier modules, where N is an integer and N≥2.

[0027] In one embodiment, the magnetic core includes two magnetic covers, and the first magnetic column and the second magnetic column are connected between the two magnetic covers.

[0028] In one embodiment, the second winding is made of a copper foil, and the pins of the second winding are connected to the circuit board through a substrate.

[0029] In one embodiment, the second winding is wound by a litz wire, and the pins of the second winding are connected to the circuit board through a substrate.

[0030] In one embodiment, the heat dissipation component is a liquid cooling plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above contents, and are not intended to limit the present invention.

[0032] Figure 1 An exploded view of a power supply device according to a first preferred embodiment of the present invention is disclosed;

[0033] Figure 2 An exploded view of the transformer unit according to a first preferred embodiment of the present invention is disclosed;

[0034] Figure 3 A structural perspective diagram of a transformer unit according to a first preferred embodiment of the present invention is disclosed;

[0035] Figure 4 A side view of a power supply device according to a first preferred embodiment of the present invention is disclosed;

[0036] Figure 5 A side view of a power supply device according to a second preferred embodiment of the present invention is disclosed;

[0037] Figure 6 A side view of a power supply device according to a third preferred embodiment of the present invention is disclosed;

[0038] Figure 7 A side view of a power supply device according to a fourth preferred embodiment of the present invention is disclosed;

[0039] Figure 8 A side view of a power supply device according to a fifth preferred embodiment of the present invention is disclosed;

[0040] Figure 9 A side view of a power supply device according to a sixth preferred embodiment of the present invention is disclosed;

[0041] Figure 10 An exploded view of the structure of the transformer unit of the seventh preferred embodiment of the present invention is disclosed;

[0042] Figure 11 A structural perspective diagram of a transformer unit according to a seventh preferred embodiment of the present invention is disclosed;

[0043] Figure 12 An exploded view of the transformer unit according to an eighth preferred embodiment of the present invention is disclosed;

[0044] Figure 13 A structural perspective view of a transformer unit according to an eighth preferred embodiment of the present invention is disclosed;

[0045] Figure 14 A side view of a power supply device according to an eighth preferred embodiment of the present invention is disclosed;

[0046] Figure 15 A side view of a power supply device according to a ninth preferred embodiment of the present invention is disclosed;

[0047] Figure 16 An exploded view of the transformer unit according to the tenth preferred embodiment of the present invention is disclosed;

[0048] Figure 17 A structural perspective diagram of a transformer unit according to a tenth preferred embodiment of the present invention is disclosed; and

[0049] Figure 18 A side view of a power supply device according to an eleventh preferred embodiment of the present invention is disclosed. DETAILED DESCRIPTION

[0050] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be modified in various ways without departing from the scope of the present invention, and the description and drawings therein are essentially for illustrative purposes and not for limiting the present invention. For example, if the following content of the present invention describes a first feature being arranged on or above a second feature, it means that it includes an embodiment in which the first feature and the second feature are directly in contact, and also includes an embodiment in which the additional feature can be arranged between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, different embodiments of the present invention may use repeated reference symbols and / or labels. This repetition is for the purpose of simplicity and clarity and is not intended to limit the relationship between the various embodiments and / or the described appearance structures. Furthermore, to facilitate the description of the relationship between one component or feature and another (plural) component or (plural) feature in the drawings, spatially related terms such as "upper," "lower," "left," "right," and similar terms may be used. In addition to the orientations shown in the drawings, spatially related terms are used to cover different orientations of the device in use or operation. The device may also be positioned differently (e.g., rotated 90 degrees or in other orientations), and the description of the spatially related terms used may be interpreted accordingly. In addition, when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be an intervening component. In addition, it is understood that although terms such as "first" and "second" may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are intended to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" used in this manner includes any or all combinations of one or more of the related listed items.

[0051] Figure 1 An exploded view of a power supply device according to a first preferred embodiment of the present invention is disclosed. Figure 2 A structural exploded view of a transformer unit according to a first preferred embodiment of the present invention is disclosed. Figure 3 A structural stereoscopic diagram of a transformer unit according to a first preferred embodiment of the present utility model is disclosed. Figure 4A side view of a power supply device according to a first preferred embodiment of the present invention is disclosed. In this embodiment, the present invention provides a power supply device 1, comprising a transformer unit 10, a rectifier unit 20, and a heat sink 31. The transformer unit 10 and the rectifier unit 20 form a rectifier module 2. The transformer unit 10 comprises a first winding 11a, a second winding 11b, and a magnetic core 12. The magnetic core 12 comprises a first magnetic column 121 and a second magnetic column 122. The first winding 11a surrounds the first magnetic column 121, and the second winding 11b is disposed outside the first winding 11a. In this embodiment, the magnetic core 12 further comprises two magnetic covers 123 and 124, with the first magnetic column 121 and the second magnetic column 122 connected between the two magnetic covers 123 and 124. In this embodiment, the rectifier unit 20 comprises a circuit board 21, a plurality of rectifier tubes 22, and a plurality of output filter capacitors 23. The circuit board 21 is disposed adjacent to the transformer unit 10, and the second winding 11b is electrically connected to the circuit board 21. In this embodiment, the first winding 11a is wound, for example, using litz wire. The second winding 11b is made, for example, of copper foil. The pin 111 of the second winding 11b is connected to the circuit board 21 of the rectifier unit 20 via a substrate 112. The circuit board 21 has a first surface 211 and a second surface 212 opposite each other, with the first surface 211 facing the transformer unit 10. In this embodiment, multiple rectifier tubes 22 are disposed on the first surface 211 of the circuit board 21, and multiple output filter capacitors 23 are disposed on the second surface 212 of the circuit board 21. The rectifier module 2 formed by the transformer unit 10 and the rectifier unit 20 is located between a heat sink 31 and the mainboard of the power supply device. The first magnetic column 121 is located between the heat sink 31 and the second magnetic column 122. The heat sink 31 has an input and an output, and is connected to an external cooling source. External refrigerant is fed into the heat sink and then returned to the external cooling source, achieving cyclic cooling. In some embodiments, the heat sink is a liquid cooling plate, where the refrigerant is a coolant such as water or ethanol. It should be understood that the heat sink 31 is the same length as the power supply device along the X-axis and is used to dissipate heat from the components in the entire power supply device, including but not limited to the rectifier module 2. For ease of description, the length of the heat sink 31 of the present invention is substantially the same as the length of the rectifier module 2 along the X-axis, for illustrative purposes only.

[0052] In this embodiment, the heat sink 31 is adjacent to the top side of the second winding 11b. The circuit board 21 of the rectifier unit 20 and the transformer unit 10 are arranged horizontally (i.e., along the X-axis). Since the transformer unit 10 and the rectifier unit 20 are arranged horizontally along the Y-axis below the heat sink 31, the transformer unit 10 utilizes two U-shaped magnetic cores to form a first magnetic column 121, a second magnetic column 122, and two magnetic covers 123 and 124. The first winding 11a and the second winding 11b are wound around the upper first magnetic column 121 and then face the heat sink 31, allowing the top side of the second winding 11b to be adjacent to the heat sink 31 for heat dissipation.

[0053] It should be noted that the first winding 11a and the second winding 11b are not limited to being formed of litz wire or copper foil. In this embodiment, the second winding 11b of the transformer unit 10 is connected to the circuit board 21 of the rectifier unit 20 via a side pin. The pin 111 of the second winding 11b is inserted into the circuit board 21 of the rectifier unit 20 via a substrate 112.

[0054] In this embodiment, the transformer unit 10 and the rectifier unit 20 are both placed in a trough 300. The trough 300 is filled with thermally conductive adhesive 40 to dissipate heat from at least the transformer unit 10 and the rectifier unit 20. In this embodiment, the top of the trough 300 is formed by a heat dissipation component 31. The trough 300 is, for example, a sealed, glue-filled space surrounded by four side panels 32, 33, 35, and 36. In one embodiment, the side panels 32, 33, 35, and 36 of the trough 300 are metal plates. In other embodiments, the metal plates may have water channels (not shown). In other words, the trough 300 may, for example, utilize the heat dissipation component 31 as its top plate to form a trough body that accommodates the transformer unit 10 and the rectifier unit 20. In this embodiment, the trough 300 includes multiple side panels 32, 33, 35, and 36, and the trough 300 and the heat dissipation component 31 are integrally formed. In other embodiments, the side panels 32, 33, 35, and 36 of the receiving tank 300 may be first assembled and then secured to the heat dissipation component 31 to form the receiving tank 300. The present invention is not limited to this. Of course, the size, shape, and configuration of the receiving tank 300 may also be adjusted based on actual application requirements, and the present invention is not limited to this.

[0055] In some embodiments, the second winding 11b and the plurality of output filter capacitors 23 are disposed on opposite sides of the circuit board 21, allowing the plurality of output filter capacitors 23 to dissipate heat adjacent to the side panels 32. Since the side panels 32, 33, 35, and 36 of the receiving slot 300 are metal plates, heat is easily transferred to the heat sink 31, enabling the power supply 1 to achieve optimal heat dissipation. Furthermore, the plurality of rectifier tubes 22 in the rectifier unit 20 are placed on the first surface 211 of the circuit board 21 facing the transformer unit 10 to minimize AC losses. Because the plurality of output filter capacitors 23 are filter capacitors at the output end of the rectifier circuit, they experience high ripple and significant heat generation in low-voltage, high-current applications. Temperature significantly impacts the lifespan of the capacitors. While this can be addressed by adding more capacitors, this would occupy a considerable volume. Therefore, effective heat dissipation of the plurality of output filter capacitors 23 would be beneficial in improving overall power density. Therefore, the present invention places multiple output filter capacitors 23 adjacent to the side panels 32, fully leveraging the heat dissipation advantages of the heat sink 31 to dissipate heat generated by the multiple output filter capacitors 23, thereby ensuring the lifespan of the multiple output filter capacitors 23. This allows for filtering with fewer capacitors while still meeting heat dissipation requirements, thereby improving overall power density. Furthermore, the multiple rectifiers 22 in the rectifier unit 20 face the transformer unit 10 rather than the heat dissipation side panels 32. When the transformer unit 10 interacts with the rectifier unit 20, the primary harmonic of the transformer secondary current primarily flows through the rectifiers 22, while the secondary harmonics and above primarily flow through the output filter capacitors 23. Because the primary harmonic has a larger amplitude, the rectifiers 22 are placed on the first side 211 facing the transformer unit 10, thereby minimizing losses in the rectifiers 22 and the rectifier circuit board 21. Conversely, if the rectifiers 22 were also placed on the second side 212 of the circuit board 21, adjacent to the side panels 32, the current loop path away from the transformer unit 10 would be longer, resulting in increased losses. In addition, it should be noted that since the number of output filter capacitors 23 is generally large, in some embodiments, some of the output filter capacitors 23 can be located adjacent to the side plate 32, while the remaining output filter capacitors 23 and the rectifier tube 22 are located on the same surface. Of course, the present invention is not limited to this.

[0056] Figure 5 The side view of the power supply device of the second preferred embodiment of the present invention is disclosed. In this embodiment, the power supply device 1' and Figures 1 to 4The power supply device 1 shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be described here. In this embodiment, the accommodating groove 300' includes a plurality of side plates 32, 33, 35, 36 and a top plate 34 to form a groove body accommodating the transformer unit 10 and the rectifier unit 20, and the heat dissipation component 31 covers the top plate 34. Since the accommodating groove 300' and the heat dissipation component 31 are designed separately, it is more convenient to modularize after the accommodating groove 300' is filled with glue. Of course, the present application is not limited thereto.

[0057] Figure 6 A side view of a power supply device of a third preferred embodiment of the present application is disclosed. In this embodiment, the power supply device 1a is similar to the power supply device 1, and the same reference numerals represent the same components, structures and functions, which will not be described here. Figures 1 to 4The power supply device 1 shown is similar, and like component numbers represent like components, structures, and functions, so a detailed description thereof will not be repeated here. In this embodiment, the power supply device 1a includes three transformer units 10 and three rectifier units 20 arranged alternately in the horizontal direction (i.e., the X-axis direction) to form three rectifier modules 2 adjacently disposed in a receiving slot 30. The heat dissipation member 31 is adjacent to the top side of the second windings 11b of the three transformer units 10. The receiving slot 30 includes two side panels 37 shared by the three rectifier modules 2. The two shared side panels 37 extend downward from the heat dissipation member 31 to between any two adjacent ones of the three rectifier modules 2. In this embodiment, each of the two shared side panels 37 has a first side surface 371 and a second side surface 372, each of which is opposite to each other. The first side surface 371 is adjacent to the output filter capacitor 23 of the first of any two adjacent ones of the three rectifier modules 2, while the second side surface 372 is adjacent to the side of the second winding 11b of the second of any two adjacent ones of the three rectifier modules 2, thereby optimizing heat dissipation for the power supply device 1a. In other embodiments, a power supply device 1a includes N transformer units 10 and N rectifier units 20 arranged alternately in a horizontal direction (i.e., the X-axis direction) to form N adjacent rectifier modules. The heat sink 31 is adjacent to the top sides of the second windings 11b of the N transformer units 10. The N rectifier modules 2 include (N-1) common side plates 37, wherein the (N-1) common side plates 37 extend downward from the heat sink 31 to between any two adjacent ones of the N rectifier modules 2, where N is an integer and N ≥ 2. Thus, the multiple transformer units 10 and the multiple rectifier units 20 are alternately arranged to form the multiple rectifier modules 2. When the multiple rectifier modules 2 are adjacent to each other, the heat sink 31 is adjacent to the top sides of the second windings 11b of the multiple transformer units 10 to dissipate heat, and the multiple common side plates 37 can extend downward from the heat sink 31 to between any two adjacent ones of the multiple rectifier modules 2. The first side surface 371 of the shared side plate 37 is adjacent to the output filter capacitor 23 of any two adjacent rectifier modules 2, while the second side surface 372 of the shared side plate 37 is adjacent to the side of the second winding 11b of any two adjacent rectifier modules 2. This allows the power supply device 1a to achieve optimal heat dissipation. Of course, the present invention is not limited to this.

[0058] Figure 7 The side view of the power supply device of the fourth preferred embodiment of the present utility model is disclosed. In this embodiment, the power supply device 1b and Figures 1 to 4 The power supply device 1 shown is similar, and like component numbers represent like components, structures, and functions, so a detailed description thereof will not be repeated here. In this embodiment, an edge of the heat dissipation member 31 connected to the side plate 33 further forms a conforming arc surface 34 that conforms to the shape of the second winding 11b, thereby increasing the area over which the second winding 11b can dissipate heat through the heat dissipation member 31. Of course, the present invention is not limited to this embodiment.

[0059] Figure 8 The side view of the power supply device of the fifth preferred embodiment of the present utility model is disclosed. In this embodiment, the power supply device 1c and Figure 6 The power supply device 1a shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, a plurality of transformer units 10 and a plurality of rectifier units 20 are alternately arranged and assembled to form a plurality of rectifier modules 2, and when the plurality of rectifier modules 2 are adjacent to each other, the heat dissipation component 31 is adjacent to the top side of the second winding 11b of the plurality of transformer units 10 for heat dissipation. In addition, when the plurality of common side plates 37 extend downward from the heat dissipation component 31 to between any two adjacent ones of the plurality of rectifier modules 2, the connection between the common side plates 37 and the heat dissipation component 31 further forms a fitting arc surface 373. The fitting arc surface 373 fits the shape of the corresponding second winding 11b, effectively increasing the area of ​​each second winding 11b that is dissipated by the heat dissipation component 31. Of course, the present invention is not limited to this.

[0060] Figure 9 The side view of the power supply device of the sixth preferred embodiment of the present invention is disclosed. In this embodiment, the power supply device 1d and Figures 1 to 4 The power supply device 1 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the power supply device 1d further includes two rectifier units 20 and 20'. The second winding 11b of the transformer unit 10 includes a first sub-winding 11b' and a second sub-winding 11b", which are electrically connected to the circuit boards 21 of the two rectifier units 20 and 20', respectively. The circuit boards 21 of the two rectifier units 20 and 20' are disposed on opposite sides of the transformer unit 10. Because the transformer unit 10 utilizes two U-shaped magnetic cores to form a first magnetic column 121 and a second magnetic column 122 disposed one above the other, the first winding 11a is wound around the upper first magnetic column 121, followed by the first sub-winding 11b' and the second sub-winding 11b", respectively. This allows the first sub-winding 11b' and the second sub-winding 11b" of the second winding 11b to dissipate heat with one side adjacent to the heat sink 31. The circuit boards 21 of the two rectifier units 20 and 20' can be disposed on opposite sides of the transformer unit 10, allowing the output filter capacitor 23 to dissipate heat adjacent to the side panels 32 and 33, thereby optimizing heat dissipation efficiency.

[0061] Figure 10 A structural exploded view of a transformer unit according to a seventh preferred embodiment of the present invention is disclosed. Figure 11 The structure of the transformer unit of the seventh preferred embodiment of the present invention is disclosed. In this embodiment, the transformer unit 10a and Figures 1 to 9The transformer unit 10 shown is similar, and like reference numerals represent like components, structures, and functions, and are not further described herein. In this embodiment, the second winding 11b is wound, for example, with a litz wire 113. The pin 111 of the second winding 11b is connected to the circuit board 21 of the rectifier unit 20 via a substrate 112.

[0062] Figure 12 A structural exploded view of a transformer unit according to an eighth preferred embodiment of the present invention is disclosed. Figure 13 A structural stereoscopic diagram of a transformer unit according to an eighth preferred embodiment of the present invention is disclosed. Figure 14 The side view of the power supply device of the eighth preferred embodiment of the present utility model is disclosed. In this embodiment, the power supply device 1e and Figures 1 to 4 The power supply device 1 shown is similar, and like component numbers represent like components, structures, and functions, and will not be further described here. In this embodiment, the circuit board 21 of the rectifier unit 20 is located between the heat sink 31 and the transformer unit 10b, and the heat sink 31 is adjacent to the plurality of output filter capacitors 23. In this embodiment, when the second winding 11b of the transformer unit 10b extends from the top edge, the transformer unit 10b and the rectifier unit 20 can be simultaneously accommodated in a receiving groove 300 whose top surface is the heat sink 31. The receiving groove 300 is further filled with thermally conductive adhesive 40 to dissipate heat from the transformer unit 10b and the rectifier unit 20. The transformer unit 10b utilizes two U-shaped magnetic cores to form a first magnetic column 121, a second magnetic column 122, and two magnetic covers 123 and 124. The first winding 11a and the second winding 11b are wound around the upper first magnetic column 121 and then face the heat sink 31, allowing the top side of the second winding 11b to be adjacent to the heat sink 31 for heat dissipation. The pin 111 of the second winding 11b is inserted into the circuit board 21 of the upper rectifier unit 20 through the base plate 112. The second winding 11b and the filter capacitor 23 are respectively arranged on opposite sides of the circuit board 21, so that the filter capacitor 23 can be adjacent to the heat dissipation component 31 for heat dissipation, and the left and right sides of the second winding 11b can be adjacent to the side panels 32 and 33 for heat dissipation. As a result, the second winding 11b in the transformer unit 10b and the filter capacitor 23 in the rectifier unit 20 are adjacent to the heat dissipation component 31 and the side panels 32 and 33, which is conducive to optimizing heat dissipation efficiency. It should be noted that since the number of output filter capacitors 23 is generally large, in some embodiments, some of the output filter capacitors 23 can also face the heat dissipation component 31, and the remaining output filter capacitors 23 and the rectifier tube 22 can be arranged on the same side. Of course, the present invention is not limited to this.

[0063] Figure 15 The side view of the power supply device of the ninth preferred embodiment of the present utility model is disclosed. In this embodiment, the power supply device 1f and Figures 12 to 14The power supply device 1e shown is similar, and the same component numbers represent the same components, structures and functions, which are not described here. In this embodiment, the power supply device 1f includes three transformer units 10b and three rectifier units 20 corresponding to the stack and arranged along the X direction to form three rectifier modules 2 arranged adjacent in the accommodating groove 30, the heat dissipation member 31 adjacent to the output filter capacitor 23 of the three rectifier units 20, and the accommodating groove 30 including two side plates 37 shared with the three rectifier modules 2. The two shared side plates 37 extend downward from the heat dissipation member 31 to between any two adjacent rectifier modules 2. In this embodiment, each of the two shared side plates 37 has a first side 371 opposite a second side 372. The first side 371 is adjacent to the side of the second winding 11b of the front of any two adjacent rectifier modules 2, and the second side 372 is adjacent to the side of the second winding 11b of the rear of any two adjacent rectifier modules 2, so that the power supply device has the best heat dissipation effect. In other embodiments, the power supply device 1f includes N transformer units 10b and N rectifier units 20 corresponding to the stack and arranged along the X direction to form N rectifier modules 2 arranged adjacent, the heat dissipation member 31 adjacent to the output filter capacitor 23 of the N rectifier units 20, and the N rectifier modules including (N-1) shared side plates 37, wherein the (N-1) shared side plates 37 extend downward from the heat dissipation member 31 to between any two adjacent rectifier modules 2, wherein N is an integer and N≥2. Thus, the plurality of transformer units 10b and the plurality of rectifier units 20 corresponding to the stack and arranged to form a plurality of rectifier modules 2, and the plurality of rectifier modules arranged adjacent, the heat dissipation member 31 adjacent to the output filter capacitor 23 of the plurality of rectifier units 20 for heat dissipation, and the plurality of shared side plates 37 can extend downward from the heat dissipation member 31 to between any two adjacent rectifier modules 2. The first side 371 and the second side 372 of the shared side plate 37 can be adjacent to the side of the second winding 11b of the plurality of rectifier modules 2, respectively. Thus, the power supply device 1f can have the best heat dissipation effect. Of course, the present application is not limited thereto.

[0064] Figure 16 The structural exploded view of the transformer unit of the tenth preferred embodiment of the present application is disclosed. Figure 17 The structural exploded view of the transformer unit of the tenth preferred embodiment of the present application is disclosed. In this embodiment, the transformer unit 10c and Figures 12 to 15 The transformer unit 10b shown is similar, and the same component numbers represent the same components, structures and functions, which are not described here. In this embodiment, the second winding 11b is wound by, for example, litz wire 113, and the pin 111 of the second winding 11b is connected to the circuit board 21 of the rectifier unit 20 through the substrate 112.

[0065] Figure 18The side view of the power supply device of the eleventh preferred embodiment of the present utility model is disclosed. In this embodiment, the power supply device 1g and Figures 12 to 14 The power supply device 1e shown is similar, and the same component numbers represent the same components, structures, and functions, which will not be repeated here. In this embodiment, in the power supply device 1g, the rectifier unit 20 uses, for example, a rectifier tube 22 with a larger on-resistance, which has more stringent heat dissipation requirements. The circuit board 21 of the rectifier unit 20 is located between the heat dissipation component 31 and the transformer unit 10b. The multiple rectifier tubes 22 are arranged on the second surface 212 of the circuit board 21, and the heat dissipation component 31 is adjacent to the multiple rectifier tubes 22. In this embodiment, when the second winding 11b of the transformer unit 10b extends from the top edge, the transformer unit 10b and the rectifier unit 20 can be simultaneously accommodated in the accommodating groove 300 whose top surface is the heat dissipation component 31. The pin 111 of the second winding 11b is inserted into the circuit board 21 of the upper rectifier unit 20 via a base plate 112. The second winding 11b and the rectifier 22 are respectively arranged on opposite sides of the circuit board 21, allowing the rectifier 22 to dissipate heat adjacent to the heat sink 31. The left and right sides of the second winding 11b are also adjacent to the side panels 32 and 33 for heat dissipation. Thus, the second winding 11b in the transformer unit 10b and the rectifier 22 in the rectifier unit 20 are adjacent to the heat sink 31 and the side panels 32 and 33, which helps optimize the heat dissipation efficiency of the power supply device 1g. It should be noted that, since the number of output filter capacitors 23 is generally large, in this embodiment, the output filter capacitors 23 of the rectifier unit 20 can be arranged on both the first surface 211 and the second surface 212 of the circuit board 21. In this way, some of the output filter capacitors 23 and the rectifier 22 are arranged on the second surface 212 facing the heat sink 31. Of course, the present invention is not limited to this.

[0066] In summary, the present invention provides a power supply device. For the rectifier module formed by the transformer unit and the rectifier unit, the windings in the transformer unit that require heat dissipation, as well as the output filter capacitor and / or rectifier tube in the rectifier unit, are placed adjacent to heat dissipation components, so that the power supply device can achieve the best heat dissipation effect. In some application scenarios, the rectifier tube has more stringent heat dissipation requirements. For example, to save costs, the rectifier tube selected for the rectifier module has a larger on-resistance and generates more heat, so the rectifier tube can be placed adjacent to the heat dissipation component. In other application scenarios, the rectifier tube in the rectifier unit is placed on the side of the circuit board facing the transformer to minimize AC loss. Since the output filter capacitor is the filter capacitor at the output end of the rectifier circuit, in low-voltage and high-current situations, the ripple on the capacitor is large and the heat is more serious, and the temperature has a significant impact on the life of the capacitor. One solution is to add more capacitors, but this will occupy a certain volume. Therefore, if it can be properly cooled, it will help improve the overall power density. Therefore, the present invention positions the output filter capacitor upwardly, adjacent to the heat sink, or laterally, adjacent to the metal plate connected to the heat sink. This fully utilizes the heat dissipation advantages of the heat sink to dissipate heat generated by the output filter capacitor, thereby ensuring the lifespan of the output filter capacitor. This allows for filtering with fewer capacitors while meeting heat dissipation requirements, thereby improving power density. Furthermore, the rectifier tubes in the rectifier unit face the transformer. Since the primary harmonics of the transformer's secondary current primarily flow through the rectifier tubes, while the secondary harmonics and above flow through the filter capacitors, which have a larger amplitude, the rectifier tubes are placed on the side facing the transformer, creating the shortest current loop path and reducing rectifier tube and rectifier plate losses. It should be understood that, since the number of output filter capacitors is generally large, in certain embodiments, some of the output filter capacitors may face the heat sink or metal side plate, while the remaining output filter capacitors and the rectifier tubes are positioned on the same side. When the transformer unit and the rectifier unit are arranged below the heat sink along the X-direction, the transformer unit utilizes a U-shaped magnetic core, with the windings wound around the upper magnetic column and then facing the heat sink, allowing some of the windings to dissipate heat adjacent to the heat sink. Of course, the winding is not limited to being made of litz wire or copper foil. In addition, the winding of the transformer unit is connected to the circuit board of the rectifier unit by a side pin, and the winding pin is inserted into the circuit board of the rectifier unit through a substrate. The winding and the filter capacitor and / or rectifier tube are respectively arranged on two opposite sides of the circuit board, so that the filter capacitor and / or rectifier tube can be adjacent to the metal plate on the side for heat dissipation. There may be a water channel inside the metal plate, and the metal plate may also be integrally formed with the heat dissipation component or separately provided. The edge of the heat dissipation component may also fit the shape of the winding. The transformer unit and the rectifier unit are simultaneously placed in a receiving groove whose top surface is a heat dissipation component. The side plate of the receiving groove is a metal plate, and the receiving groove is filled with thermal conductive glue to dissipate heat to at least the transformer unit and the rectifier unit.On the other hand, when the transformer unit's windings extend from the top edge, the rectifier unit is positioned between the transformer unit and the heat sink. The transformer unit utilizes a U-shaped magnetic core. After the windings are wound around the upper magnetic column, the windings extend through a base plate and are inserted into the circuit board of the upper rectifier unit. The rectifier tube and output filter capacitor are positioned on opposite sides of the circuit board, allowing the output filter capacitor and / or rectifier tube to dissipate heat adjacent to the heat sink. The transformer unit and rectifier unit can be simultaneously accommodated in a trough whose top surface serves as a heat sink. The trough is further filled with thermally conductive adhesive to dissipate heat from the transformer unit and rectifier unit. Thus, the windings in the transformer unit and the output filter capacitor and / or rectifier tube in the rectifier unit are adjacent to the heat sink and side panels, which helps optimize the heat dissipation efficiency of the power supply device. It should be understood that the term "adjacent" as used herein does not mean direct contact or abutment, but also includes contact or abutment with a certain air gap, or with an insulating medium inserted between the two, or with a heat dissipation medium such as a metal plate between the two. Because the heat sink or side panels are made of metal plates, some components must be interposed with an insulating medium before contacting or attaching to the heat sink to meet safety insulation requirements. This insulating medium can be insulating tape, adhesive, or pads, but this is not a limitation of the present invention. The transformer unit and rectifier unit are arranged and combined adjacent to the heat sink to optimize heat dissipation efficiency. When the transformer unit utilizes a U-shaped magnetic core, the windings are wound around the upper magnetic column and directed toward the heat sink for heat dissipation. The circuit boards of the two rectifier units can be positioned on opposite sides of the transformer unit, allowing the output filter capacitors (typically MLCCs (Multilayer Ceramic Capacitors)) and / or rectifier tubes to dissipate heat adjacent to the metal side panels. Multiple transformer units and rectifier units are alternately arranged and assembled to form multiple rectifier modules. When the multiple rectifier modules are adjacent to each other, the heat sink is positioned adjacent to the top sides of the windings of the multiple transformer units for heat dissipation. Multiple shared side panels can extend downward from the heat sink to between any two adjacent rectifier modules. One side surface of the common side plate is adjacent to the rectifier module of any two adjacent ones among the multiple rectifier modules, and the other side surface of the common side plate is adjacent to the side of the winding of any two adjacent ones among the multiple rectifier modules. A fitting arc surface can also be formed between the common side plate and the heat dissipation component to fit the corresponding winding shape. A plurality of transformer units and a plurality of rectifier units are stacked correspondingly and arranged and assembled along the X direction to form a plurality of rectifier modules. When the plurality of rectifier modules are arranged adjacent to each other, a plurality of accommodating grooves can be used to accommodate the combination of transformer units and rectifier units. The filter capacitor and / or rectifier tube can be adjacent to the heat dissipation component for heat dissipation. The common side plate can extend downward from the heat dissipation component to between any two adjacent ones among the multiple rectifier modules. One side surface of the common side plate is adjacent to the side of the winding of any two adjacent ones among the multiple rectifier modules, and the other side surface of the common side plate is adjacent to the side of the winding of any two adjacent ones among the multiple rectifier modules.The arrangement of the components and heat dissipation parts, the heat sink and the accommodating groove in the transformer unit and the rectifier unit can help to achieve the optimal heat dissipation efficiency.

[0067] The present application can be modified by those skilled in the art without departing from the scope of the claims.

Claims

1. A power supply device, characterized in that: include: A transformer unit includes a first winding, a second winding and a magnetic core; a rectifier unit comprising a circuit board, a plurality of rectifier tubes, and a plurality of output filter capacitors, wherein the circuit board is disposed adjacent to the transformer unit, and the second winding is electrically connected to the circuit board, wherein the circuit board has a first surface and a second surface opposite to each other, and the first surface faces the transformer unit; and A heat dissipation component covers a rectifier module formed by the transformer unit and the rectifier unit.

2. The power supply device according to claim 1, wherein: The plurality of rectifier tubes are arranged on the first surface of the circuit board, and at least part of the plurality of output filter capacitors are arranged on the second surface of the circuit board.

3. The power supply device according to claim 2, wherein: The plurality of output filter capacitors are all disposed on the second surface of the circuit board.

4. The power supply device according to claim 1, wherein: The plurality of rectifier tubes are arranged on the second surface of the circuit board, and at least part of the plurality of output filter capacitors are arranged on the first surface of the circuit board.

5. The power supply device according to claim 4, wherein: The plurality of output filter capacitors are all disposed on the first surface of the circuit board.

6. The power supply device according to claim 1, wherein: The magnetic core includes a first magnetic column and a second magnetic column. The first winding surrounds the first magnetic column. The second winding is arranged outside the first winding. The first magnetic column is located between the heat dissipation component and the second magnetic column.

7. The power supply device according to claim 1, wherein: The heat dissipation component is adjacent to a top side of the second winding, and the circuit board and the transformer unit are arranged along a horizontal direction.

8. The power supply device according to claim 7, wherein: An edge of the heat dissipation component is in conformity with the shape of the second winding.

9. The power supply device according to claim 7, comprising two rectifier units, characterized in that: The second winding of the transformer unit is electrically connected to the circuit boards of the two rectifier units respectively, and the circuit boards of the two rectifier units are arranged on two opposite sides of the transformer unit.

10. The power supply device according to claim 1, wherein: The circuit board is located between the heat dissipation component and the transformer unit. The plurality of rectifier tubes or the plurality of output filter capacitors arranged on the second surface of the circuit board are adjacent to the heat dissipation component.

11. The power supply device according to claim 7, 9 or 10, characterized in that: The transformer unit and the rectifier unit are both placed in a receiving groove, and the receiving groove is filled with thermal conductive glue to at least dissipate heat from the transformer unit and the rectifier unit, wherein the heat dissipation component covers the top of the receiving groove.

12. The power supply device according to claim 11, wherein: The accommodating tank includes a plurality of side plates, and the heat dissipation component serves as a top plate of the accommodating tank to form a tank body for accommodating the transformer unit and the rectifier unit.

13. The power supply device according to claim 12, wherein: The plurality of side plates are integrally formed with the heat dissipation component.

14. The power supply device according to claim 11, wherein: The accommodating tank includes a plurality of side plates and a top plate to form a tank body for accommodating the transformer unit and the rectifier unit, and the heat dissipation component is covered on the top plate.

15. The power supply device according to claim 11, wherein Each side plate and / or top plate of the accommodating tank is a metal plate to transfer heat to the heat dissipation component.

16. The power supply device according to claim 15, wherein: The metal plate has a water channel therein.

17. The power supply device according to claim 1, wherein: N transformer units and N rectifier units are arranged and assembled accordingly to form N rectifier modules, and the N rectifier modules are adjacently arranged in a accommodating tank. The accommodating tank includes multiple side panels, of which N-1 side panels are shared by the N rectifier modules, N is an integer, and N≥2.

18. The power supply device according to claim 6, wherein: The magnetic core includes two magnetic covers, and the first magnetic column and the second magnetic column are connected between the two magnetic covers.

19. The power supply device according to claim 1, wherein: The second winding is made of a copper foil, and the pins of the second winding are connected to the circuit board through a substrate.

20. The power supply device according to claim 1, wherein The second winding is wound by a litz wire, and the pins of the second winding are connected to the circuit board through a substrate.

21. The power supply device according to claim 1, wherein: The heat dissipation component is a liquid cooling plate.

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