Optical module shell of die-casting square heat pipe

Abstract

The utility model relates to the technical field of optical communication, in particular to an optical module shell of a die-casting square heat pipe, which comprises a square heat pipe, a shell main body and a radiating fin, and is characterized in that the shell main body is arranged in a metal cage for shielding signals; the shell body comprises a circuit board installation area, the square heat pipe is arranged on the outer surface corresponding to the circuit board installation area in a die-casting mode, at least one cooling fin is installed on the upper surface of the square heat pipe, and the cooling fin and the metal cage or the adjacent cooling fin form an airflow channel. The upper end faces of the cooling fins abut against the metal cage, so that air flows in the airflow channel after entering the metal cage. Through the above mode, the embodiment of the utility model can increase the air flowing efficiency, and air flows through the air flow channel to take away the heat on the radiating fins, thereby improving the radiating efficiency of the optical module.

Description

Technical Field

[0001] The embodiment of the utility model relates to the field of optical communication technology, and in particular to an optical module housing of a die-cast square heat pipe. Background Art

[0002] In the field of optical communications, equipment products using SFP optical modules can be installed in metal cages, the purpose of which is to provide shielding and assist in heat dissipation of the optical modules.

[0003] However, the metal cage has limited heat dissipation space reserved for the optical module, which restricts the heat dissipation effect of the optical module. How to improve the heat dissipation of the optical module within the limited space of the metal cage is the current major problem. Summary of the Invention

[0004] In response to the above-mentioned defects of the prior art, an embodiment of the present invention provides an optical module housing with a die-cast square heat pipe. By arranging a heat sink on the square heat pipe, an air flow channel can be formed between the heat sink and the inner wall of the metal cage, which can increase the efficiency of air flow. The air flowing through the air flow channel can take away the heat from the heat sink, thereby improving the heat dissipation efficiency of the optical module in the metal cage.

[0005] To solve the above technical problems, a technical solution adopted in an embodiment of the present invention is as follows: providing an optical module housing with a die-cast square heat pipe, the optical module housing comprising a square heat pipe, a housing body, and a heat sink, wherein the housing body is installed in a metal cage for shielding signals;

[0006] The shell body includes a circuit board mounting area, the square heat pipe is die-cast on the outer surface corresponding to the circuit board mounting area, at least one heat sink is installed on the upper surface of the square heat pipe, the heat sink and the metal cage or the adjacent heat sink form an air flow channel, and the upper end surface of the heat sink abuts the metal cage, so that air enters the metal cage and flows in the air flow channel.

[0007] Optionally, the upper end surface of the square heat pipe is an inclined surface, and the heat sink is trapezoidal, so that the heat dissipation at different locations on the heat sink is different, which is used to accelerate the flow speed of air in the air flow channel.

[0008] Optionally, the inclined surface of the heat sink is mounted on the inclined surface of the square heat pipe.

[0009] Optionally, the heat sink includes an upper bottom surface, a lower bottom surface, an inclined surface, and a horizontal surface. The horizontal surface is parallel to and abuts the upper end surface of the metal cage. The area of ​​the upper bottom surface is larger than that of the lower bottom surface. The upper bottom surface is arranged near the mounting port of the metal cage so that air enters from the mounting port and flows out from the heat dissipation holes on the upper end surface of the metal cage.

[0010] Optionally, an air nozzle is provided on the upper bottom surface or the lower bottom surface, and the air nozzle is connected to the square heat pipe, and the square heat pipe is vacuumed through the air nozzle.

[0011] Optionally, the circuit board mounting area includes a chip mounting area, and the chip mounting area is arranged near the upper bottom surface.

[0012] Optionally, a limiting plate is provided in the square heat pipe, and the liquid medium at both ends of the square heat pipe is regulated by the limiting plate.

[0013] Optionally, copper powder is provided inside the square heat pipe.

[0014] Optionally, the air nozzle is a one-way valve structure.

[0015] Optionally, the heat sink is made of copper.

[0016] An embodiment of the present utility model provides an optical module housing with a die-cast square heat pipe. The optical module housing includes a square heat pipe, a shell body, and a heat sink. The square heat pipe is die-cast on the outer surface corresponding to the circuit board mounting area. At least one heat sink is installed on the upper surface of the square heat pipe. The heat sink and the metal cage or adjacent heat sinks form an air flow channel. The upper end surface of the heat sink abuts the metal cage, so that air flows in the air flow channel after entering the metal cage, which can increase the efficiency of the air flow. The air flowing through the air flow channel can take away the heat on the heat sink, thereby improving the heat dissipation efficiency of the optical module in the metal cage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0018] Figure 1 It shows a structural diagram of an optical module housing in one embodiment of the present utility model;

[0019] Figure 2 The figure shows the internal structure of a square heat pipe in one embodiment of the present invention.

[0020] 1. Heat sink; 2. Square heat pipe; 3. Housing body; 4. Metal cage; 5. Current limiting plate; 6. Mounting port; 101. Upper bottom surface; 102. Inclined surface; 103. Horizontal surface; 104. Lower bottom surface; 201. Air nozzle. DETAILED DESCRIPTION

[0021] The following embodiments of the technical solution of the present invention are described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0022] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this utility model belongs.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0024] In addition, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of this utility model, "plurality" means more than two, unless otherwise specifically defined.

[0025] In this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0026] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0027] Figure 1 A structural diagram of an optical module housing with a die-cast square heat pipe in an embodiment of the present invention is shown. The optical module housing includes a square heat pipe 2, a shell body 3, and a heat sink 1. The shell body 3 is installed in a metal cage 4 for shielding signals; the shell body 3 includes a circuit board mounting area, and the square heat pipe 2 is die-cast on the outer surface corresponding to the circuit board mounting area. At least one heat sink 1 is installed on the upper surface of the square heat pipe 2. The heat sink 1 and the metal cage 4 or adjacent heat sinks 1 form an air flow channel. The upper end surface of the heat sink 1 abuts the metal cage 4, so that air enters the metal cage 4 and flows in the air flow channel.

[0028] The shape of the heat pipe can be various, such as rectangular, trapezoidal, etc. Its bottom surface is flat and die-cast on the circuit board mounting area of ​​the shell body 3, and heat exchange is carried out with efficient shell body 3. The heat sink 1 is installed on any one or more surfaces of the heat pipe other than the bottom surface. Figure 2As shown, in one implementation, the heat pipe is square, and the heat sink 1 is installed on the upper surface of the heat pipe. The heat inside the heat pipe will be transferred to the heat sink 1. The upper end surface of the heat sink 1 is in contact with the inner wall of the metal cage 4, so that an air flow channel parallel to the upper end surface of the metal cage 4 is formed between the heat sink 1 and the heat sink 1, or between the heat sink 1 and the inner wall of the metal cage 4, which can increase the efficiency of air flow. The air flowing through the air flow channel can take away the heat on the heat sink 1. Among them, the upper end surface of the square heat pipe 2 is an inclined surface, and the heat sink 1 is trapezoidal, so that the heat dissipation at different locations on the heat sink 1 is different, which is used to accelerate the flow speed of air in the air flow channel. Among them, the shape of the metal cage 4 is rectangular, the upper end surface of the square heat pipe 2 is set as an inclined surface, and the inclined surface 102 of the heat sink 1 is installed on the upper end surface of the square heat pipe 2. The shape of the square heat pipe 2 and the heat sink 1 is complementary to each other to form a rectangle, so as to fully fit the shape of the inside of the metal cage 4, make full use of the space, and increase the heat dissipation performance. Among them, because the upper end surface of the square heat pipe 2 is rectangular, the cooling medium inside it takes different paths when it vaporizes and rises to the upper end surface, resulting in different heat dissipation efficiencies at both ends of the heat pipe. This embodiment takes into account that during the operation of the optical module, the heat generated near the chip position in the circuit board mounting area is greater than that in other places, so that the different heat dissipation efficiencies at both ends of the rectangular heat pipe can be more suitable for the heat dissipation needs of the optical module. Specifically, the heat sink 1 includes an upper bottom surface 101, a lower bottom surface 104, an inclined surface 102, and a horizontal surface 103. The horizontal surface 103 is parallel to and abuts the upper end surface of the metal cage 4. The area of ​​the upper bottom surface 101 is larger than that of the lower bottom surface 104. The upper bottom surface 101 is arranged near the mounting port 6 of the metal cage 4 so that air enters from the mounting port 6 and flows out from the heat dissipation holes on the upper end surface of the metal cage 4. Among them, the upper bottom surface 101 is installed corresponding to the end of the square heat pipe 2. The volume of the square heat pipe 2 is small at this end and gradually increases in volume toward the other end. Since the area of ​​the heat sink 1 at the upper bottom surface 101 is the largest and the heat dissipation effect is the best, and the heat pipe has the lowest height and the smallest volume at the end corresponding to the upper bottom surface 101, the path of the cooling medium in the gasification process is the shortest, and the heat dissipation effect of the heat pipe at this location is the best, so that the heat dissipation effect of the heat pipe at the end is the best, and the end can correspond to the chip mounting position of the circuit board mounting area, which can maximize the use of the heat dissipation effect of the heat pipe in this embodiment, and the heat dissipation speed of the heat sink 1 on the upper bottom surface 101 is greater than the heat dissipation speed of the lower bottom surface 104, and a stable airflow direction can be formed in the airflow channel to improve the heat dissipation speed of the heat sink 1. In addition, a limiting plate 5 is provided inside the square heat pipe 2, and the liquid medium at both ends of the square heat pipe 2 is regulated by the limiting plate 5. The upper end surface of the square heat pipe 2 is an inclined surface, and during the liquefaction process of the cooling medium, it will flow in the inclined direction of the inclined surface, so that there is more cooling liquid at one end of the square heat pipe 2 than at the other end, so that the chip mounting area at one end of the square heat pipe 2 can be cooled more.Furthermore, a limiting plate 5 is provided in the square heat pipe 2, and the liquid medium at both ends of the square heat pipe 2 is regulated by the limiting plate 5. The limiting plate 5 is provided in the middle of the square heat pipe 2. After the cooling medium flows back to the end of the square heat pipe 2 through the inclined surface, it is blocked and stored by the limiting plate 5. By setting the height of the limiting plate 5, the height of the coolant at both ends of the square heat pipe 2 can be adjusted, thereby controlling the local cooling efficiency of the square heat pipe 2. The heat sink 1 is made of copper. Compared with common materials such as aluminum and stainless steel, copper has higher thermal conductivity, which can improve the heat exchange efficiency of the heat sink 1 and improve the thermal conductivity.

[0029] In one embodiment of the present invention, an air nozzle 201 is provided on the upper bottom surface 101 or the lower bottom surface 104 . The air nozzle 201 is in communication with the square heat pipe 2 , and the square heat pipe 2 is vacuumed through the air nozzle 201 .

[0030] The heat pipe is evacuated using a nozzle 201, which can create a vacuum state inside the heat pipe. The heat pipe is then filled with a cooling medium such as water, ammonia, or ethylene glycol. The bottom surface of the heat pipe is attached to the surface of the housing body 3, and the connection between the two can be soldering, thermal adhesive bonding, screw mounting, die casting, etc. Most of the heat generated by the optical module during operation is generated by the mainboard on which the electrical components are installed. The heat is exchanged between the housing and the bottom surface of the heat pipe, causing the cooling medium in the heat pipe to evaporate, thereby reducing the heat of the optical module housing and the circuit board. The gaseous cooling medium rises to the upper end surface of the heat pipe and condenses and refluxes, thereby circulating the heat and cooling the optical module, ensuring the working efficiency of the optical module. In one implementation, the heat pipe can be filled with copper powder, and the cooling medium can be distilled water, which is evenly distributed in the square heat pipe 2 by sintering. In a vacuum environment, after the external heat is transferred to the bottom of the square heat pipe 2, the liquid water vaporizes under the action of the heat and circulates in the square heat pipe 2. Under the catalysis of the sintered copper powder, it condenses at various locations, transferring heat. Among them, the gas nozzle 201 can adopt a one-way valve structure. The one-way valve allows the gas in the square heat pipe 2 to be extracted and blocks the external gas from entering the square heat pipe 2. After vacuuming, the air pressure in the square heat pipe 2 is lower than that in the outside, and the external gas cannot enter, thereby suppressing the gas in the square heat pipe 2 from overflowing, and also achieving the effect of sealing the square heat pipe 2.

[0031] It should be finally pointed out that: the above embodiments are only used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. An optical module housing with a die-cast square heat pipe, characterized in that: The optical module housing comprises a square heat pipe (2), a housing body (3), and a heat sink (1); the housing body (3) is installed in a metal cage (4) for shielding signals; The shell body (3) includes a circuit board mounting area, the square heat pipe (2) is die-cast on the outer surface corresponding to the circuit board mounting area, at least one heat sink (1) is mounted on the upper surface of the square heat pipe (2), the heat sink (1) and the metal cage (4) or adjacent heat sinks (1) form an air flow channel, and the upper end surface of the heat sink (1) abuts against the metal cage (4), so that air enters the metal cage (4) and flows in the air flow channel.

2. The optical module housing according to claim 1, wherein: The upper end surface of the square heat pipe (2) is an inclined surface, and the heat sink (1) is trapezoidal, so that the heat dissipation amount at different locations on the heat sink (1) is different, which is used to accelerate the flow speed of air in the air flow channel.

3. The optical module housing according to claim 2, wherein: The inclined surface (102) of the heat sink (1) is mounted on the inclined surface of the square heat pipe (2).

4. The optical module housing according to claim 3, wherein: The heat sink (1) comprises an upper bottom surface (101), a lower bottom surface (104), an inclined surface (102), and a horizontal surface (103); the horizontal surface (103) is parallel to and abuts against the upper end surface of the metal cage (4); the upper bottom surface (101) has a larger area than the lower bottom surface (104); the upper bottom surface (101) is arranged near the mounting opening (6) of the metal cage (4) so ​​that air enters from the mounting opening (6) and flows out from the heat dissipation holes on the upper end surface of the metal cage (4).

5. The optical module housing according to claim 4, wherein: An air nozzle (201) is provided on the upper bottom surface (101) or the lower bottom surface (104); the air nozzle (201) is in communication with the square heat pipe (2); and the square heat pipe (2) is vacuumed through the air nozzle (201).

6. The optical module housing according to claim 2, wherein: The circuit board mounting area includes a chip mounting area, and the chip mounting area is arranged close to the upper bottom surface (101).

7. The optical module housing according to claim 6, wherein: A flow limiting plate (5) is provided in the square heat pipe (2), and the liquid medium at both ends of the square heat pipe (2) is regulated by the flow limiting plate (5).

8. The optical module housing according to claim 1, wherein: Copper powder is arranged inside the square heat pipe (2).

9. The optical module housing according to claim 5, wherein: The air nozzle (201) is a one-way valve structure.

10. The optical module housing according to claim 1, wherein: The heat sink (1) is made of copper.

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