Laser cutting device for semiconductor substrate

Abstract

The utility model relates to the technical field of laser cutting devices, in particular to a laser cutting device for a semiconductor substrate, which comprises a laser cutting device body, a side plate and a filter plate, a support frame is hinged to the lower portion of the side plate, mounting grooves are formed in the front side and the rear side of the inner wall of the support frame, and connecting blocks are inserted into the inner walls of the mounting grooves. A pull block is mounted at the top of the filter plate; the filter plate cleaning device has the beneficial effects that the supporting frames are opened towards the two sides respectively to drive the rubber clamping heads to slide along the inner walls of the arc-shaped grooves and to be separated, so that the supporting frames can be opened and the filter plate can be cleaned without the aid of tools by an operator, the use of the operator is facilitated, the cleaning efficiency is also improved, and meanwhile, the connecting plates are hinged to the inner walls of the folding grooves, so that the cleaning efficiency is improved. And the rubber clamping head is driven to be inserted into the inner wall of the clamping groove, so that the rubber clamping head is prevented from being damaged, the protection effect is improved, and the using effect and practicability of the laser cutting device are further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser cutting device technical field, concretely is a kind of laser cutting device for semiconductor substrate. BACKGROUND

[0002] With the continuous progress of science and technology, semiconductor industry plays a vital role in modern electronic equipment, and the precision and efficiency of the manufacturing process of semiconductor substrate, as the core carrier of electronic components, directly affect the performance and reliability of the final product, so laser cutting device is needed to process semiconductor substrate to improve the precision of cutting.

[0003] In the prior art, in order to prevent the internal components from overheating, a cooling fan is usually used to cool the inside of the traditional laser cutting device during use, so as to reduce the risk of overheating of internal electrical components and increase its service life. However, in the process of cooling, in order to prevent dust or impurities from the outside from entering the inside of the device with air, a filter plate is usually provided to filter these dust or impurities. After a long time of use, a large amount of dust will adhere to the surface of the filter plate, causing the air inlet hole of the filter plate to be blocked, affecting the cooling effect. At this time, the operator needs to use tools to disassemble and clean the filter plate. Since tools are needed for disassembly and assembly, it is not convenient for the operator to use, and the cleaning efficiency is affected.

[0004] Therefore, a laser cutting device for semiconductor substrate is needed to solve the problem that the existing laser cutting device needs to be disassembled and cleaned by the operator with tools after a long time of use, thereby affecting the cleaning efficiency. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a laser cutting device for semiconductor substrate to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a laser cutting device for semiconductor substrate, comprising a laser cutting device body, a side plate and a filter plate, the lower part of the side plate is hinged with a support frame, the inner wall of the support frame is provided with a mounting groove on the front and rear sides, the inner wall of the mounting groove is inserted with a connecting block, and the top of the filter plate is provided with a pull block.

[0007] Preferably, the front and rear sides of the support frame are provided with folding grooves, the inner wall of the folding groove is hinged with a connecting plate, the top of the connecting plate is provided with a rubber clamp, the proximal side of the connecting plate on the front and rear sides is provided with a push plate, the bottom wall of the folding groove is provided with a clamping groove, the proximal side of the folding groove on the front and rear sides is provided with a placing groove, and the middle part of the side plate is provided with an arc-shaped groove on the front and rear sides.

[0008] Preferably, the rubber clamp is inserted into the inner wall of the arc groove, and the rubber clamp is in an extruded deformation state, and the adjacent sides of the front and rear shift plates are both inserted into the inner wall of the placement groove.

[0009] Preferably, the connecting plates on the front and rear sides are symmetrically arranged. When the connecting plates are hinged downward on the inner wall of the folding groove, the rubber clamp is pushed and inserted into the inner wall of the groove, and the rubber clamp is in an extruded deformation state on the inner wall of the groove.

[0010] Preferably, rubber balls are installed on both the left and right sides of the upper portion of the installation slot, and a plurality of fitting grooves are provided on both the left and right sides of the connecting block.

[0011] Preferably, the rubber ball is inserted into the inner wall of the upper fitting groove, and the rubber ball is in an extruded deformed state.

[0012] Preferably, the connection blocks on the front and rear sides are installed between the filter plates, and the filter plates are plugged into the inner wall of the support frame.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The laser cutting device for semiconductor substrates proposed by the utility model opens the support frame to both sides respectively, drives the rubber clamp to slide along the inner wall of the arc groove and disengage, so that the operator can open the support frame and clean the filter plate without the help of tools, which is not only convenient for the operator to use, but also improves the cleaning efficiency. At the same time, the connecting plate is hinged and received to the inner wall of the folding groove, and drives the rubber clamp to insert into the inner wall of the groove, thereby preventing the rubber clamp from being damaged, thereby improving the protection effect, and further improving the use effect and practicality of the laser cutting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the utility model;

[0016] Figure 2 This is the right side view of the utility model;

[0017] Figure 3 This is a schematic diagram of the support frame structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the side panel structure of the utility model;

[0019] Figure 5 for Figure 4 Structural cross-section at AA in the middle;

[0020] Figure 6 This is a schematic diagram of the structure of the connecting plate of the utility model;

[0021] Figure 7 for Figure 6Structure section view at B-B;

[0022] Figure 8 Structure schematic view of the connecting block of the utility model;

[0023] Figure 9 Structure schematic view of the rubber ball of the utility model;

[0024] Figure 10 Structure schematic view of the push plate of the utility model.

[0025] In the figure: 1, laser cutting device body; 2, side plate; 3, filter plate; 4, support frame; 5, arc-shaped groove; 6, connecting plate; 7, connecting block; 8, pull block; 9, fitting groove; 10, mounting groove; 11, rubber ball; 12, placing groove; 13, folding groove; 14, clamping groove; 15, push plate; 16, rubber chuck. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme of the utility model to be described clearly and completely, and the advantages to be more clear and apparent, the following will be further described in detail with the embodiments of the utility model combined with the drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all the embodiments, only to explain the embodiments of the utility model, and not to limit the embodiments of the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor are within the scope of the utility model.

[0027] Embodiment one: please refer to Figures 1 to 10 The utility model provides a kind of technical scheme: a kind of laser cutting device for semiconductor substrate, including laser cutting device body 1, side plate 2 and filter plate 3, its laser cutting device body 1 adopts semiconductor laser to cut the object needed to cut and processes, since semiconductor laser has higher photoelectric conversion efficiency and good beam quality, to improve the precision of laser cutting machine body 1 when cutting, in turn improve the quality and yield of cutting product, the lower part of side plate 2 is hinged with support frame 4, support frame 4 is equipped with mounting groove 10 in the inner wall of both sides, connecting block 7 is inserted in the inner wall of mounting groove 10, pull block 8 is installed at the top of filter plate 3;Connecting block 7 is installed between both sides and filter plate 3, filter plate 3 is inserted in the inner wall of support frame 4, to facilitate pulling pull block 8, drive filter plate 3 to slide along the inner wall of support frame 4 and separate from support frame 4, in turn facilitate subsequent cleaning or replacing filter plate 3.

[0028] First, pull the support frame 4 hinge and open on both sides, then pull the pull block 8, drive the filter plate 3 along the inner wall of the support frame 4 sliding, while driving the two sides of the connecting block 7 along the inner wall of the installation slot 10 sliding and disengaging from the support frame 4, so that the operator can clean the filter plate 3 without tools, after the completion of the filter plate 3 reset and inserted into the inner wall of the support frame 4, the support frame 4 hinge and side plate 2 installed together, in order to subsequent cleaning use, so as to improve the use effect of the laser cutting device body 1.

[0029] Example two: based on example one, in order to realize the support frame 4 and side plate 2 between the clamping together, and also can prevent the phenomenon of damage to the rubber clamp 16, the support frame 4 of the two sides are provided with folding groove 13, the inner wall of the folding groove 13 hinge has a connecting plate 6, the top of the connecting plate 6 is provided with rubber clamp 16, the similar side of the two sides of the connecting plate 6 is provided with a dial plate 15, the bottom wall of the folding groove 13 is provided with a clamping groove 14, the similar side of the two sides of the folding groove 13 is provided with a placing groove 12, the middle of the two sides of the side plate 2 is provided with an arc slot 5; the rubber clamp 16 is inserted into the inner wall of the arc slot 5, and the rubber clamp 16 is in extrusion deformation state, so as to indirectly increase the friction between the support frame 4 and the side plate 2 by using the rubber clamp 16, thereby improving the stability of the support frame 4 installation, the similar side of the two sides of the dial plate 15 is inserted into the inner wall of the placing groove 12, so as to open the connecting plate 6 by dialing the dial plate 15; the two sides of the connecting plate 6 are symmetrically arranged, the connecting plate 6 is downwardly hinged in the inner wall of the folding groove 13, the rubber clamp 16 is inserted into the inner wall of the clamping groove 14, and the rubber clamp 16 is in extrusion deformation state in the inner wall of the clamping groove 14, so as to drive the connecting plate 6 to hinge and store in the inner wall of the folding groove 13 when cleaning the filter plate 3, while driving the rubber clamp 16 to insert into the inner wall of the clamping groove 14, thereby preventing damage to the rubber clamp 16 during maintenance.

[0030] First, pull the support frame 4 on both sides of the hinge and open, so that the rubber clamp head 16 on the top of the two sides is driven along the inner wall of the arc-shaped groove 5, and gradually separates from the arc-shaped groove 5, then the back of the two connecting plates 6 is folded, the rubber clamp head 16 is driven to rotate with the folding of the connecting plate 6, so that the rubber clamp head 16 is inserted into the inner wall of the clamping groove 14, and the push plate 15 is driven to separate from the placing groove 12, then the pull block 8 can be pulled, the filter plate 3 is driven to slide along the inner wall of the support frame 4, and the connecting block 7 on the front and rear sides is driven to slide along the inner wall of the mounting groove 10 and separate from the support frame 4, so that the operator can clean the filter plate 3 without tools, after finishing, the filter plate 3 is reset and inserted into the inner wall of the support frame 4, and the push plate 15 is pushed to drive the connecting plate 6 to hinge and fold, so that the rubber clamp head 16 is separated from the clamping groove 14, at this time, the push plate 15 is inserted into the inner wall of the placing groove 12, then the support frame 4 is folded, and the rubber clamp head 16 is inserted into the inner wall of the arc-shaped groove 5, and the support frame 4 is clamped together with the side plate 2, so as to be used for subsequent cleaning.

[0031] Example three: on the basis of example two, in order to improve the efficiency of filter plate 3 cleaning, the upper left and right sides of the mounting groove 10 are provided with rubber balls 11, and the left and right sides of the connecting block 7 are provided with a plurality of fitting grooves 9; the rubber ball 11 is inserted into the inner wall of the upper side fitting groove 9, and the rubber ball 11 is in extrusion deformation state, so that the fitting groove 9 on the left and right sides of the connecting block 7 is fitted with the rubber ball 11 one by one and vibrates, so as to shake off the dust on the surface of the filter plate 3, to facilitate the operator to clean.

[0032] When the pull block 8 is pulled outwards to drive the filter plate 3 to separate from the inner wall of the support frame 4, because the upper left and right sides of the mounting groove 10 are provided with rubber balls 11, and the left and right sides of the connecting block 7 are provided with fitting grooves 9, so that the fitting grooves 9 are fitted with the rubber balls 11 one by one, and the connecting block 7 is in vibration state by the elasticity of the rubber ball 11, and drives the filter plate 3, so as to shake off the dust or impurities on the surface of the filter plate 3, to facilitate the operator to clean, so as to further improve the cleaning effect.

[0033] In actual use, first, the support frame 4 is pulled to the two sides respectively and opened, so that the rubber clamping head 16 on the top of the support frame 4 is driven to slide along the inner wall of the arc-shaped groove 5 and gradually separate from the arc-shaped groove 5, then the two connecting plates 6 are folded back, the rubber clamping head 16 is driven to rotate with the folding of the connecting plate 6, so that the rubber clamping head 16 is inserted into the inner wall of the clamping groove 14, and the push plate 15 is driven to separate from the placing groove 12, then the pull block 8 is pulled, the filter plate 3 is driven to slide along the inner wall of the support frame 4, and the connecting block 7 on the front and back sides of the filter plate 3 is driven to slide along the inner wall of the mounting groove 10 and separate from the support frame 4, so that the filter plate 3 can be cleaned without the help of tools by the operator, after finishing, the filter plate 3 is reset and inserted into the inner wall of the support frame 4, and the push plate 15 is pushed to drive the connecting plate 6 to hinge and fold, so that the rubber clamping head 16 is separated from the clamping groove 14, at this time, the push plate 15 is inserted into the inner wall of the placing groove 12, then the support frame 4 is folded, so that the rubber clamping head 16 is inserted into the inner wall of the arc-shaped groove 5, and the support frame 4 and the side plate 2 are clamped together, so as to be used for subsequent cleaning, thereby improving the use effect of the laser cutting device body 1.

[0034] When the pull block 8 is pulled outward to drive the filter plate 3 to separate from the inner wall of the support frame 4, the upper left and right sides of the mounting groove 10 are provided with rubber balls 11, and the left and right sides of the connecting block 7 are provided with fitting grooves 9, so that the plurality of fitting grooves 9 are matched with the rubber balls 11 one by one, and the connecting block 7 is in a vibrating state by the elasticity of the rubber balls 11, and the filter plate 3 is driven, so that the dust or impurities on the surface of the filter plate 3 are shaken off, so as to be cleaned by the operator, thereby further improving the cleaning effect.

[0035] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to the embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A laser cutting device for semiconductor substrates, comprising a laser cutting device body (1), a side plate (2) and a filter plate (3), characterized in that: The lower part of the side plate (2) is hinged with a support frame (4), the inner wall of the support frame (4) is provided with mounting grooves (10) on both the front and rear sides, the inner wall of the mounting groove (10) is plugged with a connecting block (7), and the top of the filter plate (3) is provided with a pull block (8); The connection blocks (7) on the front and rear sides are both installed between the filter plates (3), and the filter plates (3) are plugged into the inner wall of the support frame (4).

2. The laser cutting device for semiconductor substrates according to claim 1, wherein: The support frame (4) is provided with a folding groove (13) on both the front and rear sides, the inner wall of the folding groove (13) is hinged with a connecting plate (6), the top of the connecting plate (6) is installed with a rubber clamp (16), the adjacent sides of the connecting plates (6) on the front and rear sides are installed with a dial plate (15), the bottom wall of the folding groove (13) is provided with a clamping groove (14), the adjacent sides of the folding groove (13) on both the front and rear sides are provided with a placement groove (12), and the middle of the side plate (2) is provided with an arc groove (5) on both the front and rear sides.

3. The laser cutting device for semiconductor substrates according to claim 2, characterized in that: The rubber clamp (16) is inserted into the inner wall of the arc groove (5), and the rubber clamp (16) is in an extruded deformation state. The adjacent sides of the front and rear shift plates (15) are both inserted into the inner wall of the placement groove (12).

4. The laser cutting device for semiconductor substrates according to claim 2, wherein: The connecting plates (6) on the front and rear sides are symmetrically arranged. When the connecting plates (6) are hinged downward on the inner wall of the folding groove (13), the rubber clamp (16) is pushed and inserted into the inner wall of the clamping groove (14), and the rubber clamp (16) is in an extruded and deformed state on the inner wall of the clamping groove (14).

5. The laser cutting device for semiconductor substrates according to claim 1, wherein: Rubber balls (11) are installed on both the left and right sides of the upper portion of the installation groove (10), and a plurality of fitting grooves (9) are provided on both the left and right sides of the connection block (7).

6. The laser cutting device for semiconductor substrates according to claim 5, characterized in that: The rubber ball (11) is inserted into the inner wall of the upper fitting groove (9), and the rubber ball (11) is in an extruded deformed state.

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