Testing device for semiconductor processing
By designing a test device for semiconductor processing that automatically adjusts the angle of the inspection light and firmly clamps the device, the jitter problem caused by manual adjustment is solved, achieving more accurate semiconductor inspection.
Patent Information
- Application Number
- CN202422640710.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-10-14
- Estimated Expiration
- 2034-10-31
AI Technical Summary
During the inspection of semiconductor materials, manual adjustment of the angle is prone to jitter, which makes observation inconvenient.
A test device for semiconductor processing is designed. By adjusting the coordination between the components and the clamping assembly, the angle of the detection lamp can be automatically adjusted and the semiconductor material can be firmly clamped to avoid shaking.
It effectively prevents the inconvenience of observation caused by material shaking during the detection process and achieves a more detailed detection effect.
Smart Images

Figure CN223435923U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor testing, in particular to a testing device for semiconductor processing. Background Art
[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. Diodes, for example, are devices made of semiconductors. Whether from the perspective of scientific and technological development or economic development, the importance of semiconductors is enormous. The core units of most electronic products, such as computers, mobile phones, or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential of all semiconductor materials.
[0003] At present, after the processing of substrate semiconductor materials is completed, they need to be inspected for surface defects. During the inspection process, industrial inspection lamps are generally used for light inspection. During operation, the lamp head of the industrial inspection lamp is vertically inspected on the table, and a black base cloth is laid directly underneath for easy observation. The substrate semiconductor material sheet is then placed under the light, and the material sheet is continuously tilted and the surface of the material is observed during this process. However, during the overall inspection operation, the material sheet is generally pinched manually and the angle is manually adjusted. During this suspended process, the human hand is prone to slight shaking, which is not convenient for detailed observation. For this reason, a testing device for semiconductor processing is proposed. Utility Model Content
[0004] The purpose of the present invention is to provide a testing device for semiconductor processing to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a testing device for semiconductor processing, comprising a detection lamp, wherein the detection lamp is rotatably connected to a lamp pole, the bottom end of the lamp pole is slidably connected to a fixed cylinder, a sliding groove is provided on the fixed cylinder, and the bottom end of the fixed cylinder is fixedly connected to a base; further comprising an adjustment component, wherein the adjustment component is arranged in the fixed cylinder and connected to the lamp pole, and comprises a sliding shaft arranged on the lamp pole and adapted to the sliding groove, a rotating shaft rotatably connected to the fixed cylinder is arranged below the sliding shaft, and a rectangular groove is provided on the rotating shaft; a clamping component, wherein the clamping component is arranged on the rotating shaft and located above the base, and comprises a flip rod arranged on the rotating shaft and fixedly connected to the rotating shaft at one end.
[0006] Preferably, the adjustment assembly includes a protective box arranged on the fixed cylinder and fixedly connected thereto, the protective box is provided with a matching groove adapted to the flip rod, and a first gear fixedly connected to the rotating shaft is provided in the protective box, the first gear is meshedly connected with a rack plate fixedly connected to the lamp pole, the rack plate is located in the fixed cylinder, and the rotating shaft is connected to a pulling mechanism connected to the protective box.
[0007] Preferably, the pulling mechanism includes a tension spring arranged in the rectangular groove and fixedly connected to the rotating shaft at one end, the other end of the tension spring is fixedly connected to a rectangular shaft, the rectangular shaft is slidingly connected to the rotating shaft through the rectangular groove, and a limiting member is provided at one end of the rectangular shaft away from the tension spring.
[0008] Preferably, the limiting member includes a limiting seat arranged on the protective box and fixedly connected thereto, a toothed groove is provided on the limiting seat, and a toothed block is fixedly connected to one end of the rectangular shaft away from the tension spring, the toothed block is adapted to the toothed groove, and a rotating block is rotatably connected to the toothed block.
[0009] Preferably, the clamping assembly includes a rotating ring arranged on the flip rod and rotatably connected thereto, the rotating ring being located on the flip rod at one end away from the rotating axis, a stabilizing clamp being arranged in the rotating ring, and the axis of the stabilizing clamp being fixedly connected to the rotating ring.
[0010] Preferably, a plurality of operating notches are provided on the rotating block to facilitate manual operation of the rotating block.
[0011] Preferably, the clamping end of the stabilizing clamp is provided with an anti-slip rubber block, which helps the stabilizing clamp to clamp the semiconductor material to be tested more stably.
[0012] Compared with the prior art, the beneficial effects of the present invention are:
[0013] The utility model effectively solves the problem that in the original overall detection operation process, the material sheet is generally pinched manually and the angle is manually adjusted. During this hanging process, the human hand is prone to slight shaking, which makes it inconvenient to observe carefully. When testing substrate-type semiconductor materials, the whole is first adjusted to a working state by operating the adjustment component, and then the substrate-type semiconductor material is clamped by the clamping component. At the same time, the observation angle of the material can be switched at will, which also prevents the inconvenience of observation caused by material shaking during detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of the utility model;
[0015] Figure 2for Figure 1 Enlarged view of area A in the middle;
[0016] Figure 3 This is a schematic diagram of the overall structure of the utility model from another perspective;
[0017] Figure 4 This is a schematic diagram of the internal structure of the groove of the utility model;
[0018] Figure 5 This is a schematic diagram of the internal structure of the support platform of the utility model;
[0019] Figure 6 This is a schematic diagram of the internal structure of the support platform of the utility model.
[0020] In the figure: 1-detection lamp; 2-lamp pole; 3-fixed cylinder; 4-sliding groove; 5-base; 6-adjustment assembly; 7-sliding shaft; 8-rotating shaft; 9-rectangular groove; 10-clamping assembly; 11-flip rod; 12-protection box; 13-matching groove; 14-first gear; 15-rack plate; 16-pulling mechanism; 17-tension spring; 18-rectangular shaft; 19-limiting piece; 20-limiting seat; 21-toothed groove; 22-toothed block; 23-rotating block; 24-rotating ring; 25-stabilizing clamp. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0022] See also Figure 1-6 The utility model provides a technical solution: a test device for semiconductor processing, comprising a detection lamp 1, which is rotatably connected to a lamp pole 2. The rotatable connection between the detection lamp 1 and the lamp pole 2 can facilitate adjustment of the angle between the detection lamp 1 and the lamp pole 2, and the bottom end of the lamp pole 2 is slidably connected to a fixed cylinder 3, which has a sliding groove 4 on the fixed cylinder 3, and the bottom end of the fixed cylinder 3 is fixedly connected to a base 5. The color of the base 5 is preferably pure black, which can save the step of laying a black base pad and is convenient for direct observation; it also includes an adjustment component 6, which is arranged in the fixed cylinder 3 and connected to the lamp pole 2, and includes a sliding shaft 7 arranged on the lamp pole 2 and adapted to the sliding groove 4, and a rotating shaft 8 rotatably connected to the fixed cylinder 3 is arranged below the sliding shaft 7, and a rectangular groove 9 is opened on the rotating shaft 8; a clamping component 10, which is arranged on the rotating shaft 8 and located above the base 5, and includes a flip rod 11 arranged on the rotating shaft 8 and fixedly connected to it at one end.
[0023] The adjustment assembly 6 includes a protective box 12 provided on the fixed cylinder 3 and fixedly connected thereto, a matching groove 13 is provided on the protective box 12 that is adapted to the flip rod 11, and a first gear 14 fixedly connected to the rotating shaft 8 is provided in the protective box 12, the first gear 14 is meshed with a rack plate 15 fixedly connected to the lamp pole 2, the rack plate 15 is located in the fixed cylinder 3, the rotating shaft 8 is connected to a pulling mechanism 16 connected to the protective box 12, the pulling mechanism 16 includes a tension spring 17 provided in the rectangular groove 9 and one end of which is fixedly connected to the rotating shaft 8, and the other end of the tension spring 17 is fixedly connected There is a rectangular shaft 18, which is slidingly connected to the rotating shaft 8 through a rectangular groove 9. A limit member 19 is provided at the end of the rectangular shaft 18 away from the tension spring 17. The limit member 19 includes a limit seat 20 provided on the protective box 12 and fixedly connected thereto. A toothed groove 21 is provided on the limit seat 20. A toothed block 22 is fixedly connected to the end of the rectangular shaft 18 away from the tension spring 17. The toothed block 22 is adapted to the toothed groove 21. A rotating block 23 is rotatably connected to the toothed block 22. In addition, in order to facilitate manual operation of the rotating block 23, a plurality of operating notches are provided on the rotating block 23.
[0024] The clamping assembly 10 includes a rotating ring 24 arranged on the flip rod 11 and rotatably connected thereto. The rotating ring 24 is located on the flip rod 11 at an end away from the rotating axis 8. A stabilizing clamp 25 is provided in the rotating ring 24. The axis of the stabilizing clamp 25 is fixedly connected to the rotating ring 24. In order to enable the stabilizing clamp 25 to clamp the semiconductor material to be tested more stably, a non-slip rubber block is provided at the clamping end of the stabilizing clamp 25.
[0025] When testing substrate-type semiconductor materials, first hold and pull the rotating block 23, and the rotating block 23 drives the rotatably connected toothed block 22 to move, and the toothed block 22 then drives the fixedly connected rectangular shaft 18 to move. When the rectangular shaft 18 slides outward in the rectangular groove 9, it drives the tension spring 17 to stretch until the toothed block 22 moves out of the toothed groove 21. At this time, hold the lamp pole 2 again and pull it upward, and the lamp pole 2 slides upward in the fixed cylinder 3, and the rack plate 15 fixedly connected to the lamp pole 2 follows and rises. The rack plate 15 is engaged with the first gear 14, and the first gear 14 is driven by the rack plate 15 to move. The first gear 14 further drives the rotating shaft 8 to rotate, and the rotating shaft 8 then drives the rectangular shaft 18 to rotate through the rectangular groove 9, and the rectangular shaft 18 drives the toothed block 22 to rotate. When the toothed block 22 is driven to rotate, it is in a rotating state with the rotating block 23, and the rotating block 23 remains stationary. At the same time, when the lamp pole 2 rises, the sliding shaft 7 on the lamp pole 2 slides accordingly on the sliding groove 4. When the lamp pole 2 rises to the required height, the rotating block 23 is slowly pushed back, and the tension spring 17 cooperates and contracts, and finally the toothed block 22 is stuck in the toothed groove 21 in the rotated state, so that the lamp pole 2 drives the detection lamp 1 to maintain the current height;
[0026] When the rotating shaft 8 rotates, it also drives the fixedly connected flip rod 11 to rotate. The flip rod 11 moves in the matching groove 13 on the protective box 12 when being driven. When the rotating shaft 8 stops rotating, the stabilizing clamp 25 is pressed to open its clamping end, and the substrate-type semiconductor material to be tested is placed and clamped by the stabilizing clamp 25 to replace the human hand holding the material to prevent it from shaking during testing. When the angle needs to be adjusted during the testing process, the stabilizing clamp 25 is rotated, and the rotating ring 24 on the stabilizing clamp 25 rotates continuously in conjunction with the flip rod 11, thereby preventing the inconvenience of observation caused by the shaking of the material during testing.
[0027] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.
[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor processing test device, characterized in that: include: A detection lamp (1), wherein the detection lamp (1) is rotatably connected to a lamp pole (2), the bottom end of the lamp pole (2) is slidably connected to a fixed cylinder (3), a sliding groove (4) is provided on the fixed cylinder (3), and the bottom end of the fixed cylinder (3) is fixedly connected to a base (5); Also includes: An adjustment component (6), the adjustment component (6) is arranged in the fixed cylinder (3) and connected to the lamp pole (2), and includes a sliding shaft (7) arranged on the lamp pole (2) and adapted to the sliding groove (4), a rotating shaft (8) rotatably connected to the fixed cylinder (3) is arranged below the sliding shaft (7), and a rectangular groove (9) is provided on the rotating shaft (8); A clamping assembly (10) is provided on the rotating shaft (8) and is located above the base (5), and comprises a flip rod (11) provided on the rotating shaft (8) and fixedly connected to the rotating shaft at one end.
2. The semiconductor processing test device according to claim 1, wherein: The adjustment assembly (6) includes a protection box (12) arranged on the fixed cylinder (3) and fixedly connected thereto, a matching groove (13) adapted to the flip rod (11) is provided on the protection box (12), and a first gear (14) fixedly connected to the rotating shaft (8) is provided in the protection box (12), the first gear (14) is meshedly connected to a rack plate (15) fixedly connected to the lamp pole (2), the rack plate (15) is located in the fixed cylinder (3), and the rotating shaft (8) is connected to a pulling mechanism (16) connected to the protection box (12).
3. The semiconductor processing test device according to claim 2, wherein: The pulling mechanism (16) includes a tension spring (17) arranged in the rectangular groove (9) and fixedly connected to the rotating shaft (8) at one end; the other end of the tension spring (17) is fixedly connected to a rectangular shaft (18); the rectangular shaft (18) is slidably connected to the rotating shaft (8) through the rectangular groove (9); and a limiting member (19) is provided at one end of the rectangular shaft (18) away from the tension spring (17).
4. The semiconductor processing test device according to claim 3, wherein: The limiting member (19) includes a limiting seat (20) arranged on the protection box (12) and fixedly connected thereto, the limiting seat (20) is provided with a toothed groove (21), and one end of the rectangular shaft (18) away from the tension spring (17) is fixedly connected with a toothed block (22), the toothed block (22) is adapted to the toothed groove (21), and a rotating block (23) is rotatably connected to the toothed block (22).
5. The semiconductor processing test device according to claim 4, wherein: The clamping assembly (10) comprises a rotating ring (24) arranged on the flip rod (11) and rotatably connected thereto, the rotating ring (24) being located on the flip rod (11) at one end away from the rotating shaft (8), a stabilizing clamp (25) being arranged in the rotating ring (24), and the axis of the stabilizing clamp (25) being fixedly connected to the rotating ring (24).
6. The semiconductor processing test device according to claim 4, wherein: The rotating block (23) is provided with a plurality of operating notches.
7. The semiconductor processing test device according to claim 5, wherein: The clamping end of the stabilizing clamp (25) is provided with an anti-slip rubber block.