Wind scooper and server

Abstract

The utility model provides a wind scooper and a server, relates to the computer field, wherein the wind scooper comprises a buffer structure, the buffer structure comprises a buffer flat plate and a buffer inclined plate, the buffer flat plate clings to an air outlet of a graphics processor in a case; the air guide structure comprises an air guide flat plate and an air guide inclined plate, and the air guide flat plate is tightly attached to an air inlet of the power supply in the case; and the connecting structure is connected with the buffer inclined plate and the air guide inclined plate. According to the embodiment of the invention, the technical problem of low heat dissipation efficiency of the graphics processor is solved.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of computers, and in particular to an air guide cover and a server. Background Art

[0002] With the rapid development of high-performance computing and artificial intelligence, the application of graphics processing units (GPUs) is becoming increasingly widespread. Currently, forced air cooling is commonly used, with an air scoop installed between the GPU and power supply unit (PSU) for isolation. However, traditional air scoop designs often result in high air resistance, reducing overall heat dissipation performance and resulting in low GPU cooling efficiency.

[0003] Therefore, there is a technical problem in the prior art that the heat dissipation efficiency of the graphics processor is low. Utility Model Content

[0004] The embodiments of the present utility model provide an air guide cover and a server, so as to at least solve the technical problem of low heat dissipation efficiency of a graphics processor in the related art.

[0005] According to one embodiment of the present application, an air guide cover is provided, comprising: a buffer structure, the buffer structure comprising a buffer flat plate and a buffer inclined plate, the buffer flat plate being in close contact with the air outlet of a graphics processor in a chassis; an air guide structure, the air guide structure comprising an air guide flat plate and an air guide inclined plate, the air guide flat plate being in close contact with the air inlet of a power supply in the chassis; and a connecting structure, the connecting structure connecting the buffer inclined plate and the air guide inclined plate.

[0006] As an optional solution, one side of the buffer inclined plate is connected to the buffer flat plate, and the other side is connected to the connecting structure, and the connecting structure is parallel to the buffer flat plate.

[0007] As an optional solution, one side of the wind guide inclined plate is connected to the wind guide flat plate, and the other side is connected to the connecting structure, and the connecting structure is parallel to the wind guide flat plate.

[0008] As an optional solution, the first angle between the buffer inclined plate and the buffer flat plate is smaller than a first angle threshold.

[0009] As an optional solution, the second angle between the above-mentioned wind guide inclined plate and the above-mentioned wind guide flat plate is smaller than a second angle threshold.

[0010] As an optional solution, the width of the above-mentioned connecting structure is greater than the width of the above-mentioned buffer structure, and the width of the above-mentioned connecting structure is greater than the width of the above-mentioned air guide structure.

[0011] As an optional solution, the buffer structure, the air guide structure and the connection structure are made of lightweight materials, and an insulating coating is sprayed on the surface of the lightweight materials.

[0012] According to another embodiment of the present application, a server is provided, including the above-mentioned air guide cover and a chassis, the above-mentioned air guide cover is fixed to the above-mentioned chassis, the above-mentioned chassis has a built-in power supply and a graphics processor, and the above-mentioned air guide cover is connected to the air outlet of the above-mentioned graphics processor and the air inlet of the above-mentioned power supply.

[0013] As an optional solution, the server further includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is used to detect the temperature of the air outlet of the graphics processing unit, and the second temperature sensor is used to detect the temperature of the air inlet of the power supply unit.

[0014] As an optional solution, the server further includes a positioning structure, and the air guide cover is fixed to the chassis via the positioning structure, and the positioning structure is used to adjust the installation angle of the air guide cover in the chassis.

[0015] Through the embodiments provided in this application, a combination of a buffer plate and a buffer ramp, positioned in close proximity to the air outlet of a graphics processing unit (hereinafter referred to as the GPU module), achieves a preliminary, gentle deceleration of the high-speed airflow at the GPU module's outlet, reduces sudden changes in wind pressure, avoids increased wind resistance and backflow due to excessive wind pressure, and thereby increases the cooling air volume of the GPU module. By utilizing a combination of a guide plate and a guide ramp, positioned in close proximity to the air inlet of a power supply (hereinafter referred to as the PSU module), the hot air exhausted from the GPU module is effectively guided around the PSU module's air inlet area, preventing the high-temperature airflow from directly impacting the PSU module and maintaining a relatively stable PSU inlet air temperature. The transition design, which connects the buffer ramp and the guide ramp through a connecting structure, not only guides the airflow in a smooth direction but also maintains the continuity and stability of the airflow, improving airflow utilization efficiency, reducing turbulence and backflow, and ensuring the unobstructed flow of the independent air ducts of the GPU module and the PSU module, thereby achieving the technical effect of improving the heat dissipation efficiency of the graphics processor and resolving the technical problem of low heat dissipation efficiency of the graphics processor in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 is a structural schematic diagram of an air guide cover according to an embodiment of the present application;

[0018] Figure 2 This is a schematic diagram of the connection structure of an air guide cover in a chassis according to an embodiment of the present application;

[0019] Figure 3 is a structural diagram of a server according to an embodiment of the present application;

[0020] Figure 4 This is a structural diagram of another server according to an embodiment of the present application. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0022] It should be noted that the terms "first", "second", etc. in the present invention are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0023] As an optional solution, this embodiment provides an air guide cover, such as Figure 1 Shown, including:

[0024] Buffer structure 101, comprising a buffer plate 1001 and a buffer inclined plate 1002, wherein the buffer plate 1001 is closely attached to the air outlet of the graphics processor in the chassis;

[0025] The air guide structure 103 includes an air guide plate 1003 and an air guide inclined plate 1004. The air guide plate 1003 is closely attached to the air inlet of the power supply in the chassis.

[0026] The connecting structure 102 connects the buffer inclined plate 1002 and the wind guide inclined plate 1004 .

[0027] Optionally, in this embodiment, the buffer structure includes a buffer flat plate and a buffer inclined plate, wherein the angle of the buffer inclined plate may be, but is not limited to, less than 25°. Optionally, the buffer structure is installed at the lower end of the air outlet of the GPU module. Its design objective is to guide the airflow discharged from the GPU module through the buffer inclined plate to smoothly decelerate the airflow, reduce sudden changes in wind pressure, avoid impact on subsequent air duct structures, and prevent airflow backflow.

[0028] Optionally, in this embodiment, the air guide structure includes an air guide plate and an air guide slant plate. The air guide plate is positioned in close proximity to the air inlet of the PSU module. Its design objective is to guide the hot air exhausted from the GPU module around the air inlet area of ​​the PSU module, preventing the hot air from directly impacting the PSU module and preventing the air inlet temperature of the PSU module from being too high, thereby maintaining normal operation of the PSU module and extending its service life.

[0029] Optionally, in this embodiment, a connecting structure connects the buffering inclined plate and the air guide inclined plate to guide and smooth airflow. This structure ensures that hot air exhausted from the GPU module is smoothly redirected, avoiding turbulence and backflow, improving airflow efficiency and reducing energy loss, while maintaining unobstructed airflow in the independent air ducts of the GPU module and PSU module.

[0030] It should be noted that the connection structure may be, but is not limited to, a section of a flat plate, and may be, but is not limited to, be parallel to the buffer plate and the wind guide plate.

[0031] Optionally, in this embodiment, an air scoop is installed between the air outlet of the GPU module and the air inlet of the PSU module within the chassis, isolating the air duct of the GPU module from the air duct of the PSU module, forming two independent air ducts. The air scoop adopts a stepped structural design, specifically including a buffer structure, an air guide structure, and a connection structure.

[0032] Optionally, in this embodiment, the buffer structure is close to the lower end of the air outlet of the GPU module, and can be, but not limited to, a flat plate plus a small-angle inclined plate design. The angle of the inclined plate can be, but not limited to, less than 25°. When the airflow discharged from the GPU module overcomes the height difference between the lower end of the GPU module and the upper end of the PSU module, preliminary buffering is performed to slowly reduce the wind speed, preventing a sudden drop in speed from impacting subsequent structures, causing excessive wind pressure and backflow of wind, and allowing the wind to flow more smoothly.

[0033] It can be understood that the connection structure plays a role in guiding the direction of airflow and maintaining airflow stability, so that the air outlet of the GPU module can flow more evenly to the PSU module, thereby improving the utilization efficiency of the airflow.

[0034] Optionally, in this embodiment, the air guide structure can be, but is not limited to, a small-angle inclined plate plus a flat plate design, which is close to the air inlet of the PSU module. The hot air exhausted by the GPU module passes through the connecting structure and is effectively guided to the area outside the air inlet of the PSU module, avoiding the hot air being directly inhaled by the PSU module, thereby achieving air duct isolation between the GPU module and the PSU module, reducing the air outlet resistance of the GPU module, and improving the overall heat dissipation efficiency and the air intake volume of the GPU module.

[0035] It should be noted that, through CFD simulation comparison, when there is no air duct, the air inlet flow rate of the GPU module is 55CFM, and the air inlet temperature of the PSU module is 37.8C; when using a conventional one-stage air duct, the air inlet flow rate of the GPU module is increased to 62CFM, the outlet air pressure of the GPU module is 1600Pa, and the air inlet temperature of the PSU module is 38.5C; when using the stepped air duct of this embodiment, the air inlet flow rate of the GPU module is further increased to 66CFM, the outlet air pressure of the GPU module is 1200Pa, and the air inlet temperature of the PSU module is 38.3C. With respect to the air inlet flow rate of the GPU module, the stepped air duct provided in this embodiment increases the air inlet flow rate by 20% compared to that without an air duct, reduces the outlet air pressure by 25% compared to that of the one-stage air duct, and the air inlet temperature fluctuation of the PSU module is ≤1°C.

[0036] It is understandable that through the above-mentioned air guide cover, more cooling air flows into the GPU module, which can significantly improve the heat dissipation effect of the GPU module and ensure that the GPU module works stably under high power consumption. The air outlet pressure of the GPU module is 25% lower than that of installing a one-stage air guide cover, which effectively reduces the flow resistance of the airflow, makes the air circulation smoother, reduces energy loss, and improves the overall efficiency of the cooling system. While achieving the above-mentioned good heat dissipation effect, the air inlet temperature of the PSU module is basically unaffected, ensuring that the PSU module can operate in a suitable temperature environment, and improving the stability and reliability of the entire GPU module server. The stepped structural design can achieve air duct isolation between the GPU module and the PSU module, taking into account both the heat dissipation effect and system stability.

[0037] To further illustrate, a schematic diagram of the connection structure of the air guide cover in the chassis is as follows: Figure 2 As shown, the air scoop 201 is used to connect the power supply 203 and the graphics processor 204. The air scoop 201, the power supply 203 and the graphics processor 204 are located in the chassis 202. Specifically, the air scoop 201 includes three sections: a buffer structure 205, an air guide structure 207 and a connecting structure 206. The buffer structure 205 includes a buffer plate 2001 and a buffer inclined plate 2002. The buffer plate 2001 is in close contact with the air outlet of the graphics processor 204. The air guide structure 207 includes an air guide plate 2003 and an air guide inclined plate 2004. The air guide plate 2003 is in close contact with the air inlet of the power supply 203. The connecting structure 206 connects the buffer inclined plate 2002 and the air guide inclined plate 2004.

[0038] Through the embodiment provided by the present application, by means of the combined structure of the buffer plate and the buffer inclined plate close to the air outlet of the graphics processor, the initial gentle deceleration of the high-speed airflow at the air outlet of the GPU module is achieved, the sudden change of wind pressure is reduced, the increase of wind resistance and backflow of wind caused by excessive wind pressure are avoided, and the cooling air volume of the GPU module is increased. By utilizing the combined structure of the air guide plate and the air guide inclined plate close to the air inlet of the power supply, the hot air discharged from the GPU module is effectively guided to bypass the air inlet area of ​​the PSU module, the high-temperature airflow is avoided from directly impacting the PSU module, and the relative stability of the PSU air inlet temperature is maintained. The transition design of connecting the buffer inclined plate and the air guide inclined plate through the connecting structure not only guides the smooth turning of the airflow, but also maintains the continuity and stability of the airflow, improves the utilization efficiency of the airflow, reduces turbulence and backflow, ensures the smooth flow of the independent air ducts of the GPU module and the PSU module, and thus achieves the technical effect of improving the heat dissipation efficiency of the graphics processor.

[0039] As an optional solution, one side of the buffer inclined plate is connected to the buffer flat plate, and the other side is connected to the connecting structure, and the connecting structure is parallel to the buffer flat plate.

[0040] Optionally, in this embodiment, the connection structure may be, but is not limited to, a flat plate structure, one end of which is connected to the buffer inclined plate, and the other end of which is connected to the wind guide inclined plate.

[0041] It should be noted that the connection structure is parallel to the buffer plate, which helps to maintain the continuity and stability of the airflow, ensures a smooth transition of the airflow between the buffer section and the isolation section, and reduces turbulence and energy loss that may occur at the turning point of the airflow.

[0042] Through the embodiments provided in this application, the airflow can flow more smoothly from the air outlet of the GPU module to the air inlet of the PSU module, reducing wind resistance and noise, improving the utilization rate of the airflow, and thereby improving the heat dissipation performance of the GPU module.

[0043] As an optional solution, one side of the wind guide inclined plate is connected to the wind guide flat plate, and the other side is connected to the connecting structure, and the connecting structure is parallel to the wind guide flat plate.

[0044] Optionally, in this embodiment, the connection structure may be, but is not limited to, a flat plate structure, one end of which is connected to the buffer inclined plate, and the other end of which is connected to the wind guide inclined plate.

[0045] It should be noted that the connection structure is parallel to the air guide plate, which helps to maintain the continuity and stability of the airflow, ensures a smooth transition of the airflow between the buffer section and the isolation section, and reduces turbulence and energy loss that may occur at the turning point of the airflow.

[0046] Through the embodiments provided in this application, the airflow can flow more smoothly from the air outlet of the GPU module to the air inlet of the PSU module, reducing wind resistance and noise, improving the utilization rate of the airflow, and thereby improving the heat dissipation performance of the GPU module.

[0047] As an optional solution, the first included angle between the buffer inclined plate and the buffer flat plate is smaller than the first angle threshold.

[0048] Optionally, in this embodiment, the first angle threshold is set to ensure that the airflow discharged from the GPU module's air outlet is smoothly decelerated, reducing wind pressure fluctuations and preventing airflow backflow or unnecessary turbulence. Optionally, the first angle threshold may be, but is not limited to, 25°, and may also be, but is not limited to, other angles; this embodiment imposes no fixed restriction on this.

[0049] Through the embodiments provided in the present application, by controlling the angle of the inclined plate of the buffer structure, the relationship between the cooling air volume and the wind resistance is effectively balanced, which not only ensures that the GPU module can obtain sufficient cooling airflow, but also prevents energy consumption and heat dissipation efficiency reduction caused by excessive wind resistance, thereby improving the heat dissipation effect and operation stability of the entire GPU module.

[0050] As an optional solution, the second included angle between the inclined air guide plate and the flat air guide plate is smaller than the second angle threshold.

[0051] Optionally, in this embodiment, the second angle threshold is set to ensure smooth airflow into the PSU module and reduce wind pressure variations. Optionally, the second angle threshold may be, but is not limited to, 25°, or other angles, and this embodiment does not impose a fixed restriction on this.

[0052] Through the embodiments provided in this application, by controlling the angle of the inclined plate of the air guide structure, the relationship between the cooling air volume and the wind resistance is effectively balanced, thereby improving the heat dissipation effect and operating stability of the entire GPU module.

[0053] As an optional solution, the width of the connecting structure is greater than the width of the buffer structure, and the width of the connecting structure is greater than the width of the air guide structure.

[0054] Optionally, in this embodiment, the width of the connection structure is greater than the width of the buffer structure and the wind guide structure, so as to better disperse the wind flow out of the GPU module, reduce local wind resistance, and improve wind flow utilization efficiency.

[0055] Through the embodiments provided in the present application, by setting the width of the connection structure, it is possible to improve the airflow dispersion effect of the GPU module, thereby achieving the technical effect of improving the heat dissipation efficiency of the GPU module.

[0056] As an optional solution, the buffer structure, the air guide structure and the connection structure are made of lightweight materials, and the surface of the lightweight materials is sprayed with insulating paint.

[0057] Optionally, in this embodiment, the materials used for various parts of the air guide cover can be but are not limited to lightweight materials, wherein the lightweight materials can be but are not limited to new inorganic composite materials composed of alkali-resistant glass fiber as reinforcement, sulfoaluminate low-alkalinity cement as binder and suitable aggregates, which are used to replace traditional materials to achieve the purpose of structural weight reduction.

[0058] Optionally, in this embodiment, the lightweight material may be, but is not limited to, aluminum alloy or engineering plastic, which has a good strength-to-weight ratio and is suitable for use inside a server.

[0059] Optionally, in this embodiment, the surface of the lightweight material is sprayed with insulating paint to prevent conductivity problems and ensure the safety of the internal circuits of the server.

[0060] The embodiments provided herein reduce the weight burden within the server, helping to improve overall efficiency. The insulating coating ensures that the air guide does not become a hidden danger to the internal circuits, thereby improving operational safety and stability.

[0061] As an optional solution, this embodiment provides a server, such as Figure 3 As shown, it includes an air scoop 301 and a chassis 302 . The air scoop 301 is fixed to the chassis 302 . The chassis 302 has a built-in power supply 303 and a graphics processor 304 . The air scoop 301 is connected to the air outlet of the graphics processor 304 and the air inlet of the power supply 303 .

[0062] Optionally, in this embodiment, an air scoop is located inside the chassis, mounted between the GPU module's air outlet and the PSU module's air inlet, isolating the GPU module's air duct from the PSU module's air duct to form two independent air ducts. The air scoop adopts a stepped structural design, specifically including a buffer structure, a connecting section, and an air scoop structure.

[0063] Optionally, in this embodiment, the buffer structure is close to the lower end of the air outlet of the GPU module, and adopts a flat plate plus a small-angle inclined plate design, and the inclined plate angle is less than 25°. Its main function is to perform preliminary buffering when the airflow discharged by the GPU module overcomes the height difference between the lower end of the GPU module and the upper end of the PSU module, allowing the wind speed to slowly decrease, preventing a sudden drop in speed from impacting subsequent structures, causing excessive wind pressure and backflow of wind, and making the airflow smoother.

[0064] Optionally, in this embodiment, the connecting structure is a flat plate structure. The connecting structure and the air guide structure play the role of guiding the direction of the airflow and maintaining the stability of the airflow, so that the air output from the GPU module can flow more evenly to the PSU module, thereby improving the utilization efficiency of the airflow.

[0065] Optionally, in this embodiment, the air guide structure adopts a small-angle inclined plate plus a flat plate design, which is close to the air inlet of the PSU module. The hot air exhausted by the GPU module is effectively guided to the area outside the air inlet of the PSU module after passing through the airflow transition section, avoiding the hot air from being directly inhaled by the PSU module, thereby achieving isolation between the GPU module and the PSU module air duct, reducing the air outlet resistance of the GPU module, and improving the overall heat dissipation efficiency and the air intake volume of the GPU module.

[0066] Through the embodiment provided by the present application, by means of the combined structure of the buffer plate and the buffer inclined plate close to the air outlet of the graphics processor, the initial gentle deceleration of the high-speed airflow at the air outlet of the GPU module is achieved, the sudden change of wind pressure is reduced, the increase of wind resistance and backflow of wind caused by excessive wind pressure are avoided, and the cooling air volume of the GPU module is increased. By utilizing the combined structure of the air guide plate and the air guide inclined plate close to the air inlet of the power supply, the hot air discharged from the GPU module is effectively guided to bypass the air inlet area of ​​the PSU module, the high-temperature airflow is avoided from directly impacting the PSU module, and the relative stability of the PSU air inlet temperature is maintained. The transition design of connecting the buffer inclined plate and the air guide inclined plate through the connecting structure not only guides the smooth turning of the airflow, but also maintains the continuity and stability of the airflow, improves the utilization efficiency of the airflow, reduces turbulence and backflow, ensures the smooth flow of the independent air ducts of the GPU module and the PSU module, and thus achieves the technical effect of improving the heat dissipation efficiency of the graphics processor.

[0067] As an optional solution, the server further includes a first temperature sensor and a second temperature sensor, the first temperature sensor being used to detect the temperature of the air outlet of the graphics processing unit, and the second temperature sensor being used to detect the temperature of the air inlet of the power supply unit.

[0068] Optionally, in this embodiment, the first temperature sensor is used to detect the ambient temperature around the GPU module in real time, and the second temperature sensor is used to detect the ambient temperature around the PSU module in real time to evaluate the heat dissipation effect and the server operating status.

[0069] Through the embodiments provided in this application, the integration of temperature sensors enables the server to monitor the operating temperature of key components in real time, adjust the heat dissipation strategy in a timely manner, and avoid overheating, thereby improving the reliability and operating efficiency of the server and extending the service life of the GPU module and PSU module.

[0070] As an optional solution, the server further includes a positioning structure, through which the air guide cover is fixed to the chassis, and the positioning structure is used to adjust the installation angle of the air guide cover in the chassis.

[0071] Optionally, in this embodiment, the positioning structure may be a positioning pin or other form of fixing device, so that the air guide cover can function stably at a specific position to avoid displacement due to vibration or the like during operation of the server.

[0072] Optionally, in this embodiment, the positioning structure can be used to adjust the installation angle of the air guide cover in the chassis, that is, the installation angle of the air guide cover with the GPU module and the installation angle with the PSU module, so as to adapt to different models of GPU modules and PSU modules.

[0073] Through the embodiments provided in the present application, the air guide cover can be securely installed in the chassis, ensuring the air duct isolation effect of the GPU module and the PSU module, and avoiding the degradation of heat dissipation performance due to position offset.

[0074] Further example, a structural diagram of a server, such as Figure 4 As shown, the system includes an air scoop 401 and a chassis 402. The air scoop 401 is fixed to the chassis 402. The chassis 402 houses a power supply 403 and a graphics processor 404. The air scoop 401 connects the air outlet of the graphics processor 404 to the air inlet of the power supply 403. The air scoop 401 is tightly attached to the power supply 403 via a first positioning structure 405, and tightly attached to the graphics processor 404 via a second positioning structure 406. The chassis 402 houses a first temperature sensor 407 for detecting the ambient temperature near the air inlet of the power supply 403. The chassis 402 also houses a second temperature sensor 408 for detecting the ambient temperature near the air outlet of the graphics processor 404.

[0075] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0076] In the above embodiments of the present invention, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0077] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are merely illustrative, and actual implementations may have other division methods, such as multiple components can be combined or integrated into another system, or some features can be ignored or not implemented.

Claims

1. An air guide cover, characterized in that: include: A buffer structure, comprising a buffer plate and a buffer inclined plate, wherein the buffer plate is closely attached to the air outlet of the graphics processor in the chassis; An air guide structure, comprising an air guide flat plate and an air guide inclined plate, wherein the air guide flat plate is closely attached to the air inlet of the power supply in the chassis; A connecting structure connects the buffer inclined plate and the wind guide inclined plate.

2. The air guide cover according to claim 1, characterized in that: One side of the buffer inclined plate is connected to the buffer flat plate, and the other side is connected to the connecting structure. The connecting structure is parallel to the buffer flat plate.

3. The air guide cover according to claim 1, characterized in that: One side of the wind guide inclined plate is connected to the wind guide flat plate, and the other side is connected to the connecting structure, and the connecting structure is parallel to the wind guide flat plate.

4. The air guide cover according to claim 1, wherein: A first included angle between the buffer inclined plate and the buffer flat plate is smaller than a first angle threshold.

5. The air guide cover according to claim 1, characterized in that: A second included angle between the wind guide inclined plate and the wind guide flat plate is smaller than a second angle threshold.

6. The air guide cover according to claim 1, characterized in that: The width of the connecting structure is greater than the width of the buffer structure, and the width of the connecting structure is greater than the width of the wind guide structure.

7. The air guide cover according to claim 1, characterized in that: The buffer structure, the air guide structure and the connection structure are made of lightweight materials, and the surfaces of the lightweight materials are sprayed with insulating paint.

8. A server, characterized in that: It comprises an air scoop and a chassis according to any one of claims 1 to 7, wherein the air scoop is fixed to the chassis, the chassis has a built-in power supply and a graphics processor, and the air scoop is connected to the air outlet of the graphics processor and the air inlet of the power supply.

9. The server according to claim 8, wherein: The server further includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is used to detect the temperature of the air outlet of the graphics processor, and the second temperature sensor is used to detect the temperature of the air inlet of the power supply.

10. The server according to claim 8, wherein: The server further includes a positioning structure, through which the air guide cover is fixed to the chassis, and the positioning structure is used to adjust the installation angle of the air guide cover on the chassis.

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