Camera module and electronic equipment

By setting a groove structure on the support base, the adhesive layer is engaged with the support base, which enhances the bonding area and strength, solves the problem of insufficient bonding strength of the lens bracket, and improves the connection stability and equipment reliability of the camera module.

CN223437113UActive Publication Date: 2025-10-14GUANGZHOU LUXVISIONS INNOVATION TECH LTD
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Patent Information

Application Number
CN202422945714.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-10-14
Estimated Expiration
2034-11-29

AI Technical Summary

Technical Problem

The traditional method of bonding the lens bracket to the circuit board lacks bonding strength when the lens size is reduced, resulting in frequent debonding, affecting the camera function and equipment reliability.

Method used

A groove structure is provided on the support seat so that the adhesive layer can be accommodated therein, and the adhesion effect between the adhesive layer and the support seat is enhanced through biting, thereby increasing the bonding area and strength.

Benefits of technology

The bonding strength between the support base and the circuit board is improved, the risk of debonding is reduced, and the connection stability of the camera module and the reliability of the electronic equipment are improved.

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Abstract

The utility model relates to a camera module. The camera module comprises a circuit board; the supporting seat is arranged to support the lens; a groove structure is arranged on one side of the supporting seat along the axial direction of the camera module; and the adhesive layer is respectively connected with the circuit board and the supporting seat, and at least part of the structure of the adhesive layer can be accommodated in the groove structure. According to the camera module, the groove structure is arranged on the supporting seat, and when the groove structure is filled with the adhesive layer in a fluid state, occlusion between the adhesive layer and the supporting seat is realized, so that the bonding area of the side surface of the supporting seat is effectively increased, the adhesion effect of the adhesive layer is enhanced, and the bonding strength of the supporting seat and the circuit board is further improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a camera module and an electronic device. BACKGROUND

[0002] With the rapid development of modern electronic technology, consumers' demand for the lightness and thinness of portable electronic devices such as mobile phones and laptops is increasing. This trend not only promotes the innovation of hardware design, but also drives the continuous evolution of components towards miniaturization and integration. Among them, the reduction in size of the lens, as an important visual input device, is particularly significant.

[0003] In the assembly process of the lens assembly, the lens holder or fixing seat (i.e. Holder) plays a crucial supporting and fixing role, which ensures that the lens can be stably mounted on the printed circuit board (PCB) to achieve accurate image capture function. The traditional Holder fixing method mainly adopts the glue bonding technology, that is, the Holder is directly pasted on the surface of the PCB through a specific adhesive. The advantage of this method is that it is simple to operate, low in cost, and can meet the basic fixing needs to a certain extent.

[0004] However, as the size of the lens continues to shrink, the bonding area between the Holder and the PCB also decreases, which poses a serious challenge to the traditional bonding method. Specifically, when the adhesive area of the Holder becomes very limited, the traditional straight edge structure bonding method cannot fully utilize the contact area between the Holder and the PCB, resulting in the fact that the glue can only adhere to the local surface of the Holder. In this case, the adhesive strength between the Holder and the PCB will be greatly reduced, and it is difficult to withstand the mechanical stress brought by long-term use and external environmental changes.

[0005] More seriously, in the drop verification link of electronic product reliability test, due to the insufficient adhesive strength, the Holder is prone to delamination. This not only directly leads to the loosening or falling off of the lens assembly, thereby affecting the camera function of the device, but also may cause more serious hardware failure due to internal circuit short circuit or open circuit, ultimately affecting the user experience and increasing the maintenance cost of the product. CONTENT OF THE UTILITY MODEL

[0006] The present application provides a camera module and an electronic device, which can enhance the adhesion effect of the glue layer, thereby improving the bonding strength of the support seat and the circuit board.

[0007] In a first aspect, the present application provides a camera module, comprising:

[0008] a circuit board;

[0009] A support seat is arranged to support a lens; a groove structure is arranged on one side of the support seat along an axial direction of the camera module; and

[0010] An adhesive layer is connected with the circuit board and the support seat respectively, and at least part of the structure of the adhesive layer can be accommodated in the groove structure.

[0011] In a possible implementation, the support seat comprises a support body and a connecting portion, the connecting portion is arranged on a side of the support body away from the lens, and a circumferential outer side wall of the connecting portion is formed with the groove structure.

[0012] In a possible implementation, the connecting portion comprises a plurality of connecting bodies, and the plurality of connecting bodies are sequentially connected end to end; wherein an outer side wall of each connecting body is formed with the groove structure.

[0013] In a possible implementation, a side of the support seat away from the lens is provided with an accommodation space, and an inner side wall of the accommodation space is formed with the groove structure.

[0014] In a possible implementation, the groove structure comprises a plurality of sub-grooves, and the plurality of sub-grooves are sequentially and spacedly arranged.

[0015] In a possible implementation, the sub-groove comprises a first groove surface and two second groove surfaces, and the two second groove surfaces are symmetrically arranged on two sides of the first groove surface.

[0016] The first groove surface and the second groove surface have a preset angle therebetween.

[0017] In a possible implementation, the adhesive layer comprises a first adhesive body, a second adhesive body and a clamping portion, the second adhesive body is connected with the first adhesive body, the second adhesive body is arranged around the first adhesive body to form a ring shape, and the second adhesive body is connected with the support seat.

[0018] The clamping portion is connected with the first adhesive body, the first adhesive body is connected with the circuit board, and the clamping portion is embedded into the groove structure.

[0019] In a possible implementation, the clamping portion comprises a plurality of first clamping bodies, and the plurality of first clamping bodies are sequentially and spacedly arranged along a circumferential inner side wall of the second adhesive body.

[0020] In a possible implementation, the clamping portion comprises a plurality of second clamping bodies, and the plurality of second clamping bodies are spacedly arranged along a circumferential direction of the second adhesive body, the second clamping bodies are located on an inner side of the second adhesive body and have a preset distance from the second adhesive body.

[0021] In a second aspect, the present application provides an electronic device, comprising:

[0022] the device itself; and

[0023] As described in the first aspect, the camera module is connected to the device body.

[0024] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0025] The camera module and electronic device provided in the embodiments of the present application, by setting a groove structure on the support base, when the adhesive layer is filled into the groove structure in a fluid state, the bite between the adhesive layer and the support base is achieved, thereby effectively increasing the bonding area of ​​the side of the support base, enhancing the adhesion effect of the adhesive layer, and thereby improving the bonding strength between the support base and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0029] Figure 1 A schematic structural diagram of a camera module provided in an embodiment of the present application;

[0030] Figure 2 An exploded schematic diagram of a camera module provided in an embodiment of the present application;

[0031] Figure 3 A schematic diagram of the structure of the support base provided in an embodiment of the present application;

[0032] Figure 4 A schematic diagram of the structure of the adhesive layer provided in an embodiment of the present application;

[0033] Figure 5 An exploded schematic diagram of a camera module provided in an embodiment of the present application;

[0034] Figure 6 A schematic diagram of the structure of the support base provided in an embodiment of the present application;

[0035] Figure 7 The structure diagram of the glue layer provided by the embodiment of the application is shown.

[0036] Explanation of reference signs:

[0037] 1, lens; 2, circuit board; 3, support seat; 31, groove structure; 311, sub-groove; 3111, first groove surface; 3112, second groove surface; 312, through hole; 32, connecting part; 321, connecting branch; 33, support body; 34, accommodating space; 4, glue layer; 41, first glue body; 42, second glue body; 43, occlusion part; 431, first occlusion body; 432, second occlusion body. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the embodiments of the application clearer, the technical scheme of the embodiments of the application will be described clearly and completely below in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the application.

[0039] The following disclosure provides many different embodiments, or examples, for implementing different structures of the application. For the purpose of simplifying the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed.

[0040] For ease of description, spatial relative terms can be used herein to describe the positional relationship or movement of one element or feature relative to another element or feature as shown in the drawings, such as "inner", "outer", "inside", "outside", "below", "under", "above", "on", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over or reversed, or the orientation of the device is changed, the indicative directions will also change accordingly, for example: the element described as "below" or "under" other elements or features will be subsequently oriented as "above" or "above" other elements or features. Therefore, the example term "under" can include both up and down positions. The device can be additionally oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein are interpreted accordingly.

[0041] First embodiment

[0042] In some example embodiments, as shown in FIG. 1, a camera module is applied to an electronic device such as a mobile phone, a tablet computer, a portable computer, etc. to meet the user's demand for camera. Figures 1-4

[0043] The camera module includes a lens 1, a circuit board 2, a support seat 3 (Holder) and a glue layer 4. Of course, it can be understood that the camera module also includes a protective film, a motor (VCM), an IR filter, a gold wire, a sensor, electronic components and the like. The lens 1 is used to collect and refract light onto the sensor. The motor moves the lens 1 to achieve optical zoom. The IR filter is used to filter infrared light to avoid red bias in the picture. The sensor is a light-sensitive element that converts light signals into electrical signals and finally generates image data. The above-mentioned electronic components cooperate to support the normal use of the camera module. The actual situation is specific, and here it is not specifically limited.

[0044] ​The support seat 3 is a support structure of the lens 1, used for fixing the lens 1, preventing dust and stains from entering the lens, and playing a role of light shielding and sealing. The support seat 3 is made of, for example, a plastic material such as polycarbonate (PC), acrylonitrile butadiene styrene (ABS), liquid crystal polymer (LCP), and polyamide (PA46 / PA66), which improves the overall performance of the support seat 3 and ensures stable operation.

[0045] A groove structure 31 is arranged on one side of the support seat 3 along the axial direction of the camera module, and is used to enhance the adhesion effect of the glue layer 4. The glue layer 4 is connected with the circuit board 2 and the support seat 3 respectively, and at least part of the structure of the glue layer 4 can be accommodated in the groove structure 31 of the support seat 3, so as to realize the engagement of the glue layer 4 and the support seat 3 and increase the firmness and stability of the connection.

[0046] In this embodiment, as shown in Figures 1-4 The support seat 3 includes a support body 33 and a connecting portion 32. The support body 33 is provided with a through hole 312 along the axial direction of the camera module, and the through hole 312 is used to mount the lens 1. The connecting portion 32 is located on the side of the support body 33 away from the lens 1, and the circumferential outer wall of the connecting portion 32 forms the groove structure 31. The connecting portion 32 protrudes from the support body 33 along the axial direction of the camera module. This design makes the groove structure 31 easier to process and position, and is also conducive to the uniform distribution and effective embedding of the glue layer 4.

[0047] In order to further enhance the adhesion effect of the groove structure 31, the connecting portion 32 includes a plurality of connecting branches 321 connected in sequence. The plurality of connecting branches 321 are, for example, enclosed in a rectangular shape, and the shape enclosed by the connecting branches 321 can refer to the radial cross-sectional shape of the support body 33 to meet the requirements.

[0048] The outer wall of each connecting branch 321 forms the groove structure 31. This multi-branch structure not only increases the number and distribution range of the groove structure 31, but also improves the overall strength of the support seat 3 through the mutual support between the connecting branches 321.

[0049] In this embodiment, as shown in Figures 1-4 In order to optimize the distribution and effect of the groove structure 31, the groove structure 31 includes a plurality of sub-grooves 311. The plurality of sub-grooves 311 are arranged in sequence and at intervals, which not only ensures the continuity of the groove structure 31, but also avoids the problems of processing difficulty and stress concentration caused by the excessive length of a single groove structure 31. In addition, the plurality of sub-grooves 311 can also increase the engagement effect with the glue layer 4 and improve the stability.

[0050] Exemplarily, the sub-groove 311 comprises a first groove surface 3111 and two second groove surfaces 3112. The two second groove surfaces 3112 are symmetrically arranged on both sides of the first groove surface 3111 to form a trapezoidal sub-groove 311, and the first groove surface 3111 and the second groove surface 3112 have a preset angle, such as 45°-60°, which not only increases the complexity of the groove structure 31, but also enhances the friction and adhesion area between the glue layer 4 and the support seat 3 by changing the direction of the groove surface, thereby further improving the firmness of the connection.

[0051] In the embodiment, as shown in the drawings, Figures 1-4 The glue layer 4 comprises a first glue body 41, a second glue body 42, and an occlusion part 43. The second glue body 42 is connected with the first glue body 41, and the second glue body 42 is arranged around the first glue body 41 to form a ring shape, and the second glue body 42 is bonded with the support body 33 of the support seat 3.

[0052] The occlusion part 43 is connected with the first glue body 41, the first glue body 41 is connected with the circuit board 2, and the occlusion part 43 is embedded into the groove structure 31 of the support seat 3, which not only increases the strength and stability of the glue layer 4, but also further enhances the firmness of the connection through the embedding effect of the occlusion part 43 and the groove structure 31.

[0053] Exemplarily, in order to optimize the distribution and effect of the occlusion part 43, the occlusion part 43 comprises a plurality of first occlusion bodies 431, which are arranged in sequence and spaced apart along the circumferential inner wall of the second glue body 42, which not only ensures the continuity of the occlusion part 43, but also avoids the problems of processing difficulty and stress concentration caused by too dense occlusion part 43. Among them, the first occlusion body 431 corresponds to the above-mentioned sub-groove 311 one by one, and the first occlusion body 431 can be bonded with the first groove surface 3111 and the second groove surface 3112. The first occlusion body 431 is a convex structure, and the sub-groove 311 is a concave structure. When they are connected, they form a state of occlusion, which not only increases the contact area, but also realizes the state of interlocking, thereby further improving the firmness of the connection.

[0054] The camera module in the embodiment is provided with a groove structure 31 on the side connected with the circuit board 2 of the support seat 3, and the groove structure 31 has a plurality of sub-grooves 311 arranged on the four side walls of the connecting part 32. When the glue layer 4 is filled into the sub-groove 311 in a fluid state, the glue layer 4 and the sub-groove 311 of the support seat 3 form a state of interlocking teeth. Compared with the straight edge structure in the related art, the embodiment increases the bonding area of the side surface of the support seat 3, thereby increasing the bonding strength of the support seat 3 and the circuit board.

[0055] And the support seat 3 is provided with sub-slots 311 in both transverse and longitudinal directions, and when the adhesive layer 4 is filled into the sub-slots 311 in a fluid state, the adhesive layer 4 in the transverse sub-slots 311 can withstand transverse shear force, and the adhesive layer 4 in the longitudinal sub-slots 311 can withstand longitudinal shear force, thereby reducing the risk of adhesive separation of the support seat 3.

[0056] Second embodiment

[0057] The second embodiment has the same or similar basic structure as the first embodiment, and the difference lies in the structure between the support seat 3 and the adhesive layer 4. Further exemplary descriptions are made below to better understand the scheme in this embodiment.

[0058] In this embodiment, as shown in Figure 1 , Figures 5-7 , the side of the support seat 3 away from the lens 1 is provided with a containing space 34, and the inner side wall of the containing space 34 forms a groove structure 31. This design enables the adhesive layer 4 to be embedded more deeply inside the support seat 3, thereby further improving the stability and firmness of the connection.

[0059] The groove structure 31 includes a plurality of sub-slots 311, and the plurality of sub-slots 311 are arranged at intervals along the circumferential inner side wall of the containing space 34. The sub-slots 311 include first groove faces 3111 and second groove faces 3112, and the arrangement manner is the same as that in the first embodiment, which will not be repeated here.

[0060] In this embodiment, as shown in Figure 1 , Figures 5-7 , the adhesive layer 4 includes a first adhesive 41, a second adhesive 42, and a clamping portion 43. The arrangement manner of the first adhesive 41 and the second adhesive 42 is the same as that in the first embodiment, which will not be repeated here. The difference lies in that the clamping portion 43 includes a plurality of second clamping bodies 432, and the plurality of second clamping bodies 432 are arranged at intervals along the circumference of the second adhesive 42. The plurality of second clamping bodies 432 are located on the inner side of the second adhesive 42 and have a preset distance from the second adhesive 42. This design not only increases the number and distribution range of the clamping portion 43, but also adjusts the distance between the clamping portion 43 and the second adhesive 42 to clamp part of the structure of the support seat 3 between the clamping portion 43 and the second adhesive 42, thereby further optimizing the stability and firmness of the connection.

[0061] In this embodiment, the support seat 3 is internally provided with the groove structure 31, i.e., the inner side wall of the containing space 34, and a plurality of sub-slots 311 are arranged, so that the adhesive layer 4 and the support seat 3 form an interlocking state inside, and the adhesive layer 4 can be embedded more deeply inside the support seat 3, thereby further improving the stability and firmness of the connection and increasing the bonding strength between the support seat 3 and the circuit board 2.

[0062] Third embodiment

[0063] An electronic device comprising a device body and the camera module of any one of the first or second embodiments. The camera module is tightly connected with the device body through a specific connection method, such as threaded connection, buckle connection, etc., so as to ensure that the electronic device can stably capture and transmit image information. The electronic device not only has excellent camera performance, but also improves the overall reliability and durability by adopting the camera module design described above.

[0064] The camera module and the electronic device using the same provided by the present embodiment effectively solve the problem of insufficient connection strength of the camera module in the related art by adopting the support seat, groove structure and glue layer design in the above embodiments, thereby improving the overall performance and user experience of the electronic device.

[0065] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "has" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order in which they are described, unless specifically indicated as such. It is also to be understood that additional or alternative steps can be employed.

[0066] Although the terms first, second, third, and the like can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can be only used to differentiate one element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms when used herein do not imply a sequence or order unless the context clearly indicates otherwise. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.

[0067] The above description is merely that of a specific implementation of the present application, which enables those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Accordingly, the present application is not to be limited to these embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A camera module, characterized in that: include: circuit boards; A support base is configured to support the lens; the support base is provided with a groove structure along one side of the axial direction of the camera module; as well as The adhesive layer is connected to the circuit board and the support seat respectively, and at least a part of the structure of the adhesive layer can be accommodated in the groove structure.

2. The camera module according to claim 1, wherein: The support seat includes a support body and a connecting portion. The connecting portion is arranged on a side of the support body away from the lens, and the groove structure is formed on a circumferential outer side wall of the connecting portion.

3. The camera module according to claim 2, wherein: The connecting portion includes a plurality of connecting branches, which are sequentially connected end to end; wherein the outer side wall of each connecting branch is formed with the groove structure.

4. The camera module according to claim 1, wherein: An accommodating space is provided on a side of the support base facing away from the lens, and the groove structure is formed on an inner side wall of the accommodating space.

5. The camera module according to any one of claims 1 to 4, characterized in that: The slot structure includes a plurality of sub-slots, and the plurality of sub-slots are sequentially spaced apart.

6. The camera module according to claim 5, wherein: The sub-groove includes a first groove surface and two second groove surfaces, and the two second groove surfaces are symmetrically arranged on both sides of the first groove surface; Wherein, there is a preset angle between the first groove surface and the second groove surface.

7. The camera module according to claim 1, wherein: The adhesive layer includes a first colloid, a second colloid and a bite portion, the second colloid is connected to the first colloid, the second colloid is arranged along the first colloid to form a ring, and the second colloid is connected to the support seat; The engaging portion is connected to the first colloid, the first colloid is connected to the circuit board, and the engaging portion is embedded in the groove structure.

8. The camera module according to claim 7, wherein: The engaging portion includes a plurality of first engaging bodies, and the plurality of first engaging bodies are sequentially spaced apart along the circumferential inner side wall of the second colloid.

9. The camera module according to claim 7, wherein: The engaging portion includes a plurality of second engaging bodies, which are spaced apart along the circumference of the second colloid. The second engaging bodies are located inside the second colloid and have a preset distance from the second colloid.

10. An electronic device, characterized in that: include: Equipment body; as well as The camera module according to any one of claims 1 to 9, wherein the camera module is connected to the device body.