Polycrystalline silicon carbide wafer grinding and polishing device

Abstract

The utility model discloses a polycrystalline silicon carbide wafer grinding and polishing device, and relates to the field of polycrystalline silicon carbide wafers. The device comprises a supporting base, a first rotating disc and a second rotating disc, a second stabilizing groove is fixed to the top of the inner side of the supporting base, third adjusting teeth are arranged in the middle of the inner side of the supporting base, a first stabilizing groove is fixed to the top of the outer side of the first rotating disc, and first adjusting teeth are arranged in the middle of the outer side of the first rotating disc. A limiting ring is fixed to the outer side of the bottom of the first rotating disc, four sets of placing grooves are formed in the tops of the six sets of second rotating discs, stabilizing rings are fixed to the tops of the outer sides of the six sets of second rotating discs, and second adjusting teeth are arranged in the middles of the outer sides of the six sets of second rotating discs; according to the polycrystalline silicon carbide wafer grinding and polishing device, multiple groups of polycrystalline silicon carbide wafers can be conveniently and synchronously ground and polished, and meanwhile, a cost-saving transmission mode is adopted, so that energy consumption is reduced when the multiple groups of polycrystalline silicon carbide wafers are ground and polished.

Description

TECHNICAL FIELD

[0001] The utility model relates to polycrystal silicon carbide wafer field, concretely is polycrystal silicon carbide wafer grinding and polishing device. BACKGROUND

[0002] Polycrystal silicon carbide wafer with its high hardness, high thermal conductivity and wide band gap characteristics, plays an important role in the semiconductor field, it can not only improve the stability and efficiency of electronic devices in extreme environment, also is widely used in power electronics, radio frequency microwave and optoelectronic key field, promotes the development of emerging industries such as electric vehicles, 5G communication, with the continuous progress of technology, the market potential of polycrystal silicon carbide wafer is increasingly prominent, is expected to lead the semiconductor industry to a new height.

[0003] However, the traditional polycrystal silicon carbide wafer grinding and polishing device in polishing polycrystal silicon carbide wafer, part of polycrystal silicon carbide wafer grinding and polishing device can only polish and grind a single group of polycrystal silicon carbide wafer, thereby leading to poor polishing and grinding efficiency, unable to better improve work efficiency. UTILITY MODEL CONTENT

[0004] Therefore, the utility model discloses a polycrystal silicon carbide wafer grinding and polishing device can conveniently polish and grind multiple groups of polycrystal silicon carbide wafer simultaneously, thereby improving grinding efficiency, and when grinding multiple groups of polycrystal silicon carbide wafer, a cost-saving transmission mode is adopted, thereby greatly saving energy consumption when polishing and grinding multiple groups of polycrystal silicon carbide wafer.

[0005] To achieve the above object, the utility model provides the following technical scheme: polycrystal silicon carbide wafer grinding and polishing device, including support base, first rotating disc and second rotating disc, the inner side top of support base is fixed with second stable groove, and the inner side middle part of support base is provided with third adjusting tooth, the outer side top of first rotating disc is fixed with first stable groove, and the outer side middle part of first rotating disc is provided with first adjusting tooth, the bottom outer side of first rotating disc is fixed with limit ring, and is slidably combined with support base, six groups are arranged on the outer side of first rotating disc based on second rotating disc annular array, and the top of six groups second rotating disc is all provided with four groups of placing groove, the outer side top of six groups second rotating disc is all fixed with stable ring, and is slidably combined with first stable groove and second stable groove respectively, the outer side middle part of six groups second rotating disc is all provided with second adjusting tooth, and is adapted to engage with first adjusting tooth and third adjusting tooth respectively.

[0006] The second stabilizing groove and the first stabilizing groove are used to provide limiting functions for the plurality of stabilizing rings on the top of the outer side of the second rotating disc, the third adjusting tooth and the first adjusting tooth are respectively adapted to engage with the second adjusting tooth, thereby driving the plurality of second rotating discs to perform regular revolution and rotation, the limiting ring is used to provide stability for the first rotating disc during rotation, and the placing groove is used to place the polycrystalline silicon carbide wafer.

[0007] Further, the bottom of the support base is provided with a plurality of support feet, and the top of the support base is fixed with a workbench, and the top of the workbench is fixed with a support column at each corner.

[0008] By adopting the above technical scheme, the plurality of support feet provided at the bottom of the support base significantly enhances the stability of the entire device, the workbench is fixed at the top of the support base, which provides a convenient and stable work platform for the operator, and the support column is used to provide stability for the top plate above.

[0009] Further, the top of the four support columns is fixed with a top plate, and a motorized telescopic rod is installed on one side of the top of the top plate, the output end of the motorized telescopic rod penetrates through the top plate and is provided with a pressing plate, and the motorized telescopic rod is electrically connected with the control center.

[0010] By adopting the above technical scheme, the top plate fixed on the top of the four support columns provides stable upper structure support for the entire device, and the motorized telescopic rod installed on one side of the top of the top plate penetrates through the top plate and is connected with the pressing plate through its output end, thereby realizing accurate grinding and polishing of the polycrystalline silicon carbide wafer.

[0011] Further, the bottom of the pressing plate is attached with a grinding and polishing disc, and the top of the pressing plate is fixed with two limiting rods which limit the sliding of the top plate.

[0012] By adopting the above technical scheme, the grinding and polishing disc attached to the bottom of the pressing plate is a key component for realizing the grinding and polishing of the polycrystalline silicon carbide wafer, and the two limiting rods fixed on the top of the pressing plate limit the sliding of the top plate, which significantly enhances the stability of the movement of the pressing plate in the vertical direction.

[0013] Further, a drive motor is installed in the support base, the output end of the drive motor is fixedly connected with the bottom of the first rotating disc, and the drive motor is electrically connected with the control center.

[0014] By adopting the above technical scheme, the drive motor installed in the support base provides a power source for the entire device, and the electrical connection of the drive motor with the control center enables the rotation speed, rotation direction and other parameters of the drive motor to be accurately controlled through the control center.

[0015] Further, the bottom of the six groups of second rotating discs is fixed with a limiting column, and is in clamping and sliding connection with the supporting base.

[0016] By adopting the above technical scheme, the limiting column fixed at the bottom of the six groups of second rotating discs can ensure the stability of the second rotating discs in the revolution and rotation.

[0017] To sum up, the utility model mainly has the following beneficial effects:

[0018] 1. The utility model discloses a third adjusting tooth, a second adjusting tooth and a first adjusting tooth are arranged, when the driving motor drives the first rotating disc to rotate, the first adjusting tooth on the outer side of the first rotating disc is in meshing connection with the second adjusting tooth on the outer side of the plurality of second rotating discs, and the second adjusting tooth on the outer side of the plurality of second rotating discs is in meshing connection with the third adjusting tooth on the inner side of the supporting base simultaneously, so that the plurality of second rotating discs are in clamping and sliding connection with the supporting base through the limiting column at the bottom, and revolution is carried out around the central axis of the first rotating disc and rotation is carried out around the central axis of the second rotating disc.

[0019] 2. The utility model discloses a second stabilizing groove, a stabilizing ring and a first stabilizing groove are arranged, the first stabilizing groove on the outer side of the top of the first rotating disc is in sliding clamping connection with the stabilizing ring on the top of the plurality of second rotating discs, and the stabilizing ring on the top of the plurality of second rotating discs is in sliding clamping connection with the second stabilizing groove on the inner side of the top of the supporting base, so that the plurality of second rotating discs have good stability when revolving around the central axis of the second rotating disc and revolving around the central axis of the first rotating disc, and the second stabilizing groove, the stabilizing ring and the first stabilizing groove can shield the third adjusting tooth, the second adjusting tooth and the first adjusting tooth, so that the third adjusting tooth, the second adjusting tooth and the first adjusting tooth do not cause danger to the operator.

[0020] 3. The utility model discloses a limiting ring, which can make the first rotating disc have good stability when rotating, so that the first rotating disc can keep a stable rotating state when driving the plurality of second rotating discs, and the plurality of second rotating discs can rotate more stably, and four placing grooves for placing polycrystalline silicon carbide wafers are arranged on the top of each second rotating disc in the plurality of second rotating discs, so that a plurality of polycrystalline silicon carbide wafers can be polished and ground synchronously. DRAWINGS

[0021] Figure 1 It is a whole side view structure schematic diagram of the utility model;

[0022] Figure 2 It is a front view sectional structure schematic diagram of the utility model;

[0023] Figure 3 It is a front view sectional structure schematic diagram of the supporting base inside the utility model;

[0024] Figure 4 Figure 1 is a schematic diagram of the overall structure of the first rotating disc and the plurality of second rotating discs connected according to the present application.

[0025] In the figure: 1, support base; 2, support foot; 3, workbench; 4, support column; 5, top plate; 6, electric telescopic rod; 7, lower pressing plate; 8, grinding and polishing disc; 9, limiting rod; 10, driving motor; 11, first rotating disc; 12, first stabilizing groove; 13, first adjusting tooth; 14, limiting ring; 15, second rotating disc; 16, stabilizing ring; 17, second adjusting tooth; 18, limiting column; 19, placing groove; 20, second stabilizing groove; 21, third adjusting tooth. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application.

[0027] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application, and in addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "setting" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements, and for those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] The embodiments of the present application will be described below according to the overall structure of the present application.

[0030] In this embodiment:

[0031] A polycrystalline silicon carbide wafer grinding and polishing device, such as Figures 1-4As shown, including support base 1, the first rotating disc 11 and the second rotating disc 15, the inner side of the top of the support base 1 is fixed with the second stable groove 20, and the inner side of the middle of the support base 1 is provided with the third adjusting tooth 21, the outer side of the top of the first rotating disc 11 is fixed with the first stable groove 12, and the outer side of the middle of the first rotating disc 11 is provided with the first adjusting tooth 13, the bottom of the outer side of the first rotating disc 11 is fixed with the limiting ring 14, and is slidably engaged with the support base 1, the second rotating disc 15 is arranged in an annular array based on the outer side of the first rotating disc 11, and six groups of the second rotating disc 15 are provided with four groups of the placing groove 19 at the top, the outer side of the top of the six groups of the second rotating disc 15 is fixed with the stable ring 16, and is slidably engaged with the first stable groove 12 and the second stable groove 20 respectively, the outer side of the middle of the six groups of the second rotating disc 15 is provided with the second adjusting tooth 17, and is engaged with the first adjusting tooth 13 and the third adjusting tooth 21 respectively;

[0032] Wherein, the second rotating disc 15 is slidably engaged with the first stable groove 12 and the second stable groove 20 through the stable ring 16, ensuring its stability during revolution and rotation, the limiting ring 14 at the bottom of the first rotating disc 11 is slidably engaged with the support base 1, further enhancing the stability of the entire device, the first rotating disc 11 and the second rotating disc 15 are engaged through the first adjusting tooth 13 and the second adjusting tooth 17, and the third adjusting tooth 21 provided in the middle of the inner side of the support base 1 is engaged with the second adjusting tooth 17 of the second rotating disc 15, so that the second rotating disc 15 has regular rotation and revolution, and the polycrystalline silicon carbide wafer in the placing groove 19 at the top of the second rotating disc 15 rotates synchronously.

[0033] Referring to Figure 1 , Figure 2 and Figure 3 , the bottom of the support base 1 is provided with a plurality of support feet 2, and the top of the support base 1 is fixed with a workbench 3, and the top of the workbench 3 is fixed with a support column 4 at each corner;

[0034] Wherein, the support feet 2 not only increase the contact area of the device with the ground, but also can disperse the vibration and stress generated during the operation of the device, so as to ensure that the device can remain stable during the grinding and polishing process, the design of the workbench 3 enables the operator to easily place, take out and observe the polycrystalline silicon carbide wafer during the grinding and polishing process, thereby improving the work efficiency and the convenience of operation, and the support column 4 provides stable support function for the parts above.

[0035] Referring to Figure 1 , Figure 2 and Figure 3The top of the four groups of support columns 4 is fixed with a top plate 5, and the top plate 5 is installed with an electric telescopic rod 6 on one side of the top of the top plate 5, the output end of the electric telescopic rod 6 penetrates the top plate 5 and is provided with a pressing plate 7, and the electric telescopic rod 6 is electrically connected with the control center;

[0036] The top plate 5 not only ensures the overall structural strength of the device, but also provides a stable basis for the electric telescopic rod 6 installed thereon, thereby ensuring that the electric telescopic rod 6 can maintain precision and stability during operation, so that the pressing plate 7 can accurately adjust the position through the electric telescopic rod 6 according to the instruction of the control center, thereby uniformly polishing the wafer.

[0037] Referring to Figure 1 , Figure 2 and Figure 3 , the bottom of the pressing plate 7 is attached with a polishing disc 8, and the top of the pressing plate 7 is fixed with two groups of limiting rods 9 and is limited to slide with the top plate 5;

[0038] The polishing disc 8 is made of high wear-resistant and high-precision material, which can ensure uniform and consistent polishing force during polishing, thereby effectively removing impurities and uneven parts on the surface of the wafer, improving the surface quality and smoothness of the wafer. The limiting rods 9 can smoothly and accurately slide along the predetermined track when the pressing plate 7 moves up and down under the drive of the electric telescopic rod 6, avoiding affecting the polishing precision due to deviation or shaking.

[0039] Referring to Figure 1 and Figure 2 , the inside of the support base 1 is installed with a drive motor 10, and the output end of the drive motor 10 is fixedly connected with the bottom of the first rotating disc 11, and the drive motor 10 is electrically connected with the control center;

[0040] The drive motor 10 can stably output rotary torque, and the output end thereof is fixedly connected with the bottom of the first rotating disc 11 to directly drive the first rotating disc 11 to rotate. This electrical connection mode not only realizes remote control of the drive motor 10, but also facilitates automatic and intelligent upgrading of the device, improving operation convenience and production efficiency.

[0041] Referring to Figure 3 and Figure 2 Figure 3 Figure 2 Figure 4 , the bottom of the six groups of second rotating discs 15 is fixed with a limiting column 18, and is slidingly engaged with the support base 1;

[0042] The limiting column 18 and the support base 1 are slidingly engaged to form a stable support and guide structure, so that the second rotating disc 15 can move along the predetermined track, avoiding deviation or shaking.

[0043] The utility model discloses an implementation principle is: first, the support base 1 is placed on the specified position through the support bottom foot 2 stably, then the multiple quantity's polycrystalline silicon carbide wafer is placed in six groups second rotating disc 15 top's four groups of placing groove 19 respectively, subsequently through control center starts electric telescopic handle 6, lets electric telescopic handle 6 push the lower pressure plate 7 of below to descend, the lower pressure plate 7 passes through the two groups of limiting rod 9 of top one side to carry out the limiting sliding with the top plate 5, thereby has good stability, when the lower pressure plate 7 drops, the grinding and polishing disc 8 of lower pressure plate 7 bottom will follow the drop, when drops to the suitable position after grinding and polishing disc 8 will contact with the top surface of polycrystalline silicon carbide wafer, then through control center starts drive motor 10, lets drive motor 10 drive first rotating disc 11 and rotate, the limiting ring 14 of first rotating disc 11 bottom will through with the stable rotation of support base 1's sliding engagement, simultaneously first rotating disc 11 will pass through the first adjusting tooth 13 of outside middle part to with the second adjusting tooth 17 of multiple second rotating disc 15 outside middle part is engaged to let multiple second rotating disc 15 rotate, the second adjusting tooth 17 of multiple second rotating disc 15 outside will be engaged with the third adjusting tooth 21 in the support base 1, thereby let multiple second rotating disc 15 with the middle axis of itself rotate, also will with the middle axis of first rotating disc 11 carry out circular revolution, thereby drive the polycrystalline silicon carbide wafer in the four groups of placing groove 19 of above with the bottom of grinding and polishing disc 8 and polish, when grinding and polishing, the stabilizing ring 16 of multiple second rotating disc 15 top outside will be slid with the second stabilizing groove 20 in the support base 1 and the first stabilizing groove 12 of first rotating disc 11 outside top respectively, thereby to provide stable sliding revolution and rotation, simultaneously the bottom of multiple second rotating disc 15 will be slid with the inside of support base 1 through the limiting post 18 and be engaged, let multiple second rotating disc 15 when revolution and rotation, have multiple stability, finally by control center to through electric telescopic handle 6 slowly let lower pressure plate 7 descend, thereby let the grinding and polishing disc 8 of lower pressure plate 7 bottom to the polycrystalline silicon carbide wafer of majority and polish.

[0044] The parts not involved in the utility model are the same as the prior art or can be realized by using the prior art, and will not be described in detail here.

[0045] Although the embodiments of the utility model have been shown and described, the specific embodiments are only the explanation of the utility model, and are not the limitation of the utility model, and the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable way, and the person skilled in the art can make the modification, replacement and change of the embodiment without creative contribution after reading the specification without departing from the principles and purposes of the utility model, but as long as in the claim range of the utility model, it is protected by the patent law.

Claims

1. A polycrystalline silicon carbide wafer grinding and polishing device, characterized by: It comprises a supporting base (1), a first rotating disk (11) and a second rotating disk (15); A second stabilizing groove (20) is fixed on the inner top of the support base (1), and a third adjusting tooth (21) is provided on the inner middle of the support base (1); a first stabilizing groove (12) is fixed on the outer top of the first rotating disk (11), and a first adjusting tooth (13) is provided on the outer middle of the first rotating disk (11); a limiting ring (14) is fixed on the outer side of the bottom of the first rotating disk (11) and is engaged and slidable with the support base (1); the second rotating disk (15) is fixed based on the first rotating disk (11); Six groups are arranged in a circular array on the outer side of the movable disk (11), and four groups of placement grooves (19) are opened on the top of each of the six groups of second rotating disks (15). Stability rings (16) are fixed on the outer tops of each of the six groups of second rotating disks (15), and are respectively slidably engaged with the first stability groove (12) and the second stability groove (20). Second adjustment teeth (17) are respectively provided on the middle part of the outer sides of the six groups of second rotating disks (15), and are respectively adapted to mesh with the first adjustment teeth (13) and the third adjustment teeth (21).

2. The polycrystalline silicon carbide wafer grinding and polishing device according to claim 1, characterized in that: The bottom of the support base (1) is provided with a plurality of support feet (2), and a workbench (3) is fixed on the top of the support base (1), and support columns (4) are fixed at the four corners of the top of the workbench (3).

3. The polycrystalline silicon carbide wafer grinding and polishing device according to claim 2, characterized in that: A top plate (5) is fixed on the top of the four groups of support columns (4), and an electric telescopic rod (6) is installed on one side of the top of the top plate (5). The output end of the electric telescopic rod (6) passes through the top plate (5) and is provided with a lower pressure plate (7), and the electric telescopic rod (6) is electrically connected to the control center.

4. The polycrystalline silicon carbide wafer grinding and polishing device according to claim 3, characterized in that: The bottom of the lower pressing plate (7) is fitted with a grinding and polishing disc (8), and two groups of limiting rods (9) are fixed on the top of the lower pressing plate (7) and are limitedly slidable with the top plate (5).

5. The polycrystalline silicon carbide wafer grinding and polishing device according to claim 1, characterized in that: A driving motor (10) is installed inside the supporting base (1), and the output end of the driving motor (10) is fixedly connected to the bottom of the first rotating disk (11), and the driving motor (10) is electrically connected to the control center.

6. The polycrystalline silicon carbide wafer grinding and polishing device according to claim 1, characterized in that: The bottoms of the six groups of the second rotating disks (15) are all fixed with limiting columns (18), and are all engaged and slidable with the supporting base (1).

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