Full-automatic labeling detection device for wafer packaging box
By designing a fully automated labeling and inspection device for wafer packaging boxes, the problems of low efficiency and difficulty in guaranteeing quality of manual labeling were solved, achieving automated and efficient labeling and inspection, and reducing labor costs.
Patent Information
- Application Number
- CN202521909992.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2035-09-05
AI Technical Summary
In the prior art, the labeling process of wafer packaging boxes relies on manual operation, which is inefficient, costly, and difficult to ensure quality.
A fully automatic labeling and inspection device for wafer packaging boxes was designed, including a labeling table, a limit assembly, a labeling conveyor, a labeling device and a label printer. The label tearing assembly was used to tear off the incoming label and attach a new information label, and the inspection assembly was used to inspect the label quality, thus realizing automated operation.
It improved the efficiency and quality of wafer packaging box labeling, reduced labor costs, and ensured accurate label application and inspection.
Smart Images
Figure CN223444035U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to wafer packaging box packaging technical field, concretely relates to a kind of wafer packaging box full-automatic label detection device. BACKGROUND
[0002] Wafer needs to be chamfered and polished and cleaned before photoetch, and after the above processes, wafer is packed into clean wafer packaging box, and double aluminum foil bag is used to store and transport in vacuum state. The vacuum packaging process of the aluminum foil bag of the wafer packaging box is very important, which can effectively protect the wafer packaging box from damage and isolate particle contamination, and ensure the yield of the subsequent photoetch process of the wafer. The vacuum packaging of the wafer packaging box is still manually labeled, bagged, vacuumed, folded, taped and sealed by manual operation. When labeling manually, the old label attached to the wafer packaging box needs to be torn off first, and then a new label is attached to the specified area. The above method has low work efficiency, requires a large amount of manpower, has high labor cost, and the labeling quality is difficult to guarantee, which needs to be improved. SUMMARY
[0003] The utility model aims at overcoming the shortcomings of prior art, and provides a kind of wafer packaging box full-automatic label detection device.
[0004] The utility model discloses the following technical scheme:
[0005] A wafer packaging box full-automatic label detection device, comprising a labeling table, a labeling position arranged on the labeling table, a limiting assembly for limiting the wafer packaging box at the labeling position, a labeling conveying device arranged on the labeling table for conveying the wafer packaging box, a labeling device arranged on the labeling table, and a label printer arranged on the labeling table, the labeling device comprising a labeling manipulator arranged on the labeling table, a mounting disc arranged at the front end of the labeling manipulator, a first detection assembly arranged on the mounting disc in a circumferential direction, a label tearing assembly, and a labeling assembly, the first detection assembly, the label tearing assembly, and the labeling assembly are arranged on three sides of the mounting disc respectively, the first detection assembly and the labeling assembly are arranged oppositely, and the label tearing assembly is located between the first detection assembly and the labeling assembly, the wafer packaging box has a raw material label attached to the upper surface, the label tearing assembly tears off the raw material label, and the labeling assembly transfers and attaches the information label printed by the label printer to the upper surface of the wafer packaging box.
[0006] Preferably, the labeling conveying device comprises a conveying seat movable up and down for receiving the wafer packaging box, a lifting assembly connected and driven to move the conveying seat up and down, and a conveying mechanism arranged in the labeling table to drive the conveying seat and the lifting assembly to move, and the labeling table is formed with a first moving channel for the movement of the conveying seat.
[0007] Preferably, the lifting assembly comprises a lifting cylinder connected with the conveying seat and a sliding seat connected with the conveying mechanism for mounting the lifting cylinder, and the conveying mechanism drives the sliding seat to move in the first moving channel to drive the wafer packaging box to the labeling position for labeling or to convey the wafer packaging box after labeling outwards.
[0008] Preferably, the limiting assembly comprises two limiting seats oppositely arranged at both sides of the labeling position, two limiting plates movably arranged on the two limiting seats respectively and oppositely or away from each other, and two limiting cylinders arranged on the two limiting seats respectively and driving the opposite limiting plates to move, and the wafer packaging box at the labeling position is fixed between the two limiting plates.
[0009] Preferably, the labeling device further comprises a defective product temporary storage area arranged on the labeling table and a defective product carrying device for transferring the defective product to the defective product temporary storage area, and the first moving channel is provided with a transfer position at the end, the defective product temporary storage area comprises an NG material placement position arranged on the labeling table and opposite to the transfer position and a plurality of temporary storage positions arranged at intervals along the extension direction of the first moving channel, the labeling conveying device moves the wafer packaging box with labeling error to the transfer position, and the defective product carrying device carries the defective product at the transfer position to the temporary storage position.
[0010] Preferably, the defective product carrying device comprises a first carrying mechanism for carrying the defective product from the transfer position to the NG material placement position and a second carrying mechanism for moving the defective product from the NG material placement position to the temporary storage position, the labeling table is provided with a second moving channel arranged perpendicularly to the first moving channel and a third moving channel arranged in parallel to the first moving channel and communicating with the second moving channel, the transfer position is arranged at the junction of the first moving channel and the second moving channel, and the NG material placement position is arranged at the junction of the second moving channel and the third moving channel.
[0011] Preferably, the first carrying mechanism comprises a first carrying seat movably arranged in the second moving channel, a first driving assembly connected with and driving the first carrying seat to move up and down, and a first carrying module connected with the first driving assembly and driving the first carrying seat to move in the second moving channel, and the first driving assembly can drive the first carrying seat to move upwards to lift the defective product at the transfer position.
[0012] Preferably, the labeling device further comprises a discharging carrying device, the discharging carrying device moves the wafer packaging box with correct labeling outwards, and the discharging carrying device comprises a discharging frame, two discharging pneumatic clamps oppositely arranged on the discharging frame for clamping the wafer packaging box, and a multi-axis moving module connected with the discharging frame.
[0013] Preferably, the tear label assembly comprises a tear label frame connected with the mounting disc, a tear label suction nozzle arranged on the tear label frame, a tear label positioning plate movable up and down relative to the tear label suction nozzle, a first tear label cylinder arranged on the tear label frame to drive the tear label positioning plate to move up and down, and a second tear label cylinder arranged on the tear label frame to drive the first tear label cylinder to move left and right relative to the tear label suction nozzle, the tear label suction nozzle is adsorbed on the top surface of the incoming label, and the tear label positioning plate can clamp the incoming label together with the tear label suction nozzle.
[0014] Preferably, the label detection device further comprises a label seat arranged on the labeling table and located in front of the label printer, the label seat comprises a label frame arranged in front of the label printer, a label plate movable back and forth relative to the label printer to receive the information label, and a label cylinder arranged on the label frame to drive the label plate to move.
[0015] From the above description of the present application, compared with the prior art, the beneficial effects of the present application are: by limiting the structure of the labeling detection device, the wafer packaging box is fixed by the limiting assembly, the incoming label on the wafer packaging box is torn off by the labeling device, and a new information label is attached, and the structure of the labeling device is further limited, a first detection assembly is arranged, which can detect the information label printed by the label printer and the attached information label, so as to improve the qualified rate of wafer packaging box labeling; the overall device structure is simple, the automation of wafer packaging box labeling process can be realized, the labor cost is greatly reduced, and the labeling efficiency of wafer packaging box is effectively improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a structure diagram of the labeling detection device;
[0017] Figure 2 It is a partial structure diagram of the labeling detection device Figure 1 ;
[0018] Figure 3 It is a partial structure diagram of the labeling detection device Figure 2 ;
[0019] Figure 4 It is Figure 3 the enlarged view of A in FIG. 4;
[0020] Figure 5 It is Figure 3 the enlarged view of B in FIG. 4;
[0021] Figure 6 It is a structure diagram of the labeling device Figure 1 ;
[0022] Figure 7 It is a structure diagram of the labeling device Figure 2 ;
[0023] Figure 8 A schematic view of a wafer packaging box conveying state for a labeling conveying device;
[0024] Figure 9 A schematic view of a structure of a labeling conveying device;
[0025] Figure 10 A schematic view of a structure of a first conveying mechanism;
[0026] Figure 11 A schematic view of a structure of a waste label rack;
[0027] Figure 12 A schematic view of a structure of a wafer packaging box Figure 1 ;
[0028] Figure 13 A schematic view of a structure of a wafer packaging box Figure 2 ;
[0029] In the figure, 1, labeling station; 2, limiting assembly; 3, labeling conveying device; 4, labeling device; 5, label printer; 6, substandard temporary storage area; 7, substandard conveying device; 8, blank conveying device; 9, label seat; 10, wafer packaging box; 11, labeling position; 12, first moving channel; 13, buffer position; 14, transfer position; 15, second moving channel; 16, third moving channel; 17, waste label rack; 18, first limiting block; 21, limiting seat; 22, limiting plate; 23, limiting air cylinder; 31, conveying seat; 311, supporting pad; 312, positioning block; 32, lifting assembly; 321, lifting air cylinder; 322, sliding seat; 33, conveying mechanism; 41, labeling manipulator; 42, mounting disc; 43, first detection assembly; 44, label tearing assembly; 441, label tearing rack; 442, label tearing suction nozzle; 443, label tearing positioning plate; 444, first label tearing air cylinder; 445, second label tearing air cylinder; 45, labeling assembly; 451, labeling suction head; 452, labeling air cylinder; 453, labeling mounting rack; 454, spring pin; 61, NG material placement position; 62, temporary storage position; 63, second limiting block; 64, third limiting block; 71, first conveying mechanism; 711, first conveying seat; 712, first driving assembly; 713, first conveying module; 72, second conveying mechanism; 81, blanking rack; 82, blanking pneumatic clamping jaw; 83, multi-axis moving module; 91, label rack; 92, label plate; 93, label air cylinder; 101, positioning groove; 102, limiting groove; 103, label sticking area; 104, incoming label. DETAILED DESCRIPTION
[0030] The utility model will be further described below through specific embodiments.
[0031] REFERENCE Figures 1 to 13As shown, a full-automatic labeling and detecting device for wafer packaging boxes comprises a labeling table 1, a labeling position 11 arranged on the labeling table 1, a limiting assembly 2 for limiting wafer packaging boxes 10 at the labeling position 11, a labeling conveying device 3 arranged on the labeling table 1 for conveying wafer packaging boxes 10, a labeling device 4 arranged on the labeling table 1, a label printer 5 arranged on the labeling table 1, a substandard product temporary storage area 6 arranged on the labeling table 1, a substandard product conveying device 7 for transferring substandard products to the substandard product temporary storage area 6, a discharging conveying device 8 for discharging wafer packaging boxes 10 with qualified labels outward, and a label seat 9 arranged on the labeling table 1 in front of the label printer 5. The wafer packaging boxes 10 have incoming labels 104 attached to the upper surfaces. The labeling device 4 tears off the incoming labels 104 on the wafer packaging boxes 10 and attaches new information labels. One end of the incoming label 104 is attached to the wafer packaging box 10, and the other end is a free end not attached to the wafer packaging box 10. The free end of the incoming label 104 is not coated with a glue layer on the bottom surface, so as to facilitate the tearing off by the labeling device 4. The information label is fully attached to the central position on the top surface of the wafer packaging box 10, so as to ensure that the information label attached is not easy to fall off in the subsequent transfer process. Specifically, the top surface of the wafer packaging box 10 is provided with a label sticking area 103 for attaching the information label. The incoming label 104 is attached with basic information of the wafer packaging box 10, such as wafer box code. The information label contains information such as the number of wafers in the wafer packaging box 10, the model of the wafer packaging box 10, and edge removal, so the incoming label 104 needs to be replaced with the information label. Further, the label printer 5 is provided with two or more than two for printing information labels of different sizes. The label printer 5 is a prior art, and its working principle will not be described further.
[0032] The limiting assembly 2 comprises two limiting seats 21 arranged opposite to each other on both sides of the labeling position 11, two limiting plates 22 arranged on the two limiting seats 21 and movable towards or away from each other, and two limiting cylinders 23 arranged on the two limiting seats 21 and driving the two limiting plates 22 to move. The wafer packaging box 10 at the labeling position 11 is fixed between the two limiting plates 22. The wafer packaging box 10 is fixed at the labeling position 11 through the cooperation of the limiting plate 22 and the limiting cylinder 23, so as to facilitate the tearing and labeling of the wafer packaging box 10 by the labeling device 4.
[0033] The labeling conveying device 3 comprises a conveying seat 31 movable up and down for receiving the wafer packaging box 10, a lifting assembly 32 connected with and driving the conveying seat 31 to move up and down, and a conveying mechanism 33 arranged in the labeling station 1 and driving the conveying seat 31 and the lifting assembly 32 to move. The first moving channel 12 is formed on the labeling station 1 for the conveying seat 31 to move, and the front end of the first moving channel 12 is provided with the buffer position 13 and the rear end is provided with the transfer position 14. In operation, the wafer packaging box 10 can be carried to the buffer position 13 by the carrying manipulator or other transfer equipment, and then the wafer packaging box 10 is conveyed to the labeling position 11 by the conveying seat 31 cooperating with the lifting assembly 32 and the conveying mechanism 33 to perform the tearing and labeling work. Specifically, the lifting assembly 32 comprises a lifting cylinder 321 connected with the conveying seat 31 and a sliding seat 322 connected with the conveying mechanism 33 for mounting the lifting cylinder 321. The conveying mechanism 33 adopts a linear moving module which is a mature prior art and its specific structure and working principle will not be described further. When the conveying seat 31 drives the wafer packaging box 10 to move, the conveying mechanism 33 first drives the conveying seat 31 to move to the buffer position 13 or the labeling position 11, the lifting assembly 32 controls the conveying seat 31 to move upward to lift the wafer packaging box 10 so that it is separated upward from the labeling station 1, and then the conveying mechanism 33 controls the conveying seat 31 to move, and the wafer packaging box 10 moves to the labeling position 11 or the transfer position 14. At this time, the lifting assembly 32 controls the conveying seat 31 to move downward to reset, and the wafer packaging box 10 can be supported on the labeling position 11 or the transfer position 14. Further, two wide grooves perpendicular to the first moving channel 12 can be arranged on the labeling station 1, and the labeling position 11 and the buffer position 13 are defined by the intersection of the wide grooves and the first moving channel 12.
[0034] The conveying seat 31 is provided at the top with a support pad 311 for supporting the wafer packaging box 10 and two positioning blocks 312 arranged opposite to both sides of the support pad 311. The bottom of the wafer packaging box 10 is provided with positioning grooves 101 extending upward for the positioning blocks 312 to be embedded. When the conveying seat 31 moves upward to lift the wafer packaging box 10, the bottom of the wafer packaging box 10 is supported on the support pad 311, and the two positioning blocks 312 are positioned relative to the positioning grooves 101 to limit the wafer packaging box 10 during transfer.
[0035] The labeling device 4 comprises a labeling manipulator 41 arranged on the labeling table 1, a mounting disc 42 arranged at the front end of the labeling manipulator 41, a first detection assembly 43, a label tearing assembly 44 and a labeling assembly 45 which are arranged on the mounting disc 42 in a circumferential interval, wherein the first detection assembly 43, the label tearing assembly 44 and the labeling assembly 45 are arranged on three sides of the mounting disc 42 respectively, the first detection assembly 43 is arranged opposite to the labeling assembly 45, and the label tearing assembly 44 is located between the first detection assembly 43 and the labeling assembly 45; in operation, the label tearing assembly 44 tears the incoming label 104, the labeling assembly 45 transfers and attaches the information label printed by the label printer 5 on the upper surface of the wafer packaging box 10, and the first detection assembly 43 is used for detecting the information of the incoming label 104, the condition of the information label printed by the label printer 5 and the attachment condition of the information label; specifically, the first detection assembly 43 can adopt a CCD camera; the labeling assembly 45 comprises a labeling suction head 451, a labeling mounting frame 453 arranged on the mounting disc 42 and used for mounting the labeling suction head 451, a labeling cylinder 452 arranged on the mounting disc 42 and connected with the labeling mounting frame 453, and a plurality of spring pins 454 arranged between the labeling mounting frame 453 and the labeling suction head 451, the labeling suction head 451 is used for sucking and transferring the information label printed by the label printer 5 to the central position on the top surface of the wafer packaging box 10 for attachment, because the central position on the top surface of the wafer packaging box 10 is a curved surface, the labeling suction head 451 will be over-pressured when the information label is attached, at this time, the spring pins 454 can offset the over-pressured amount; then, when the labeling suction head 451 breaks the vacuum, the blowing of the labeling suction head 451 downward under the weight of the information label will make the information label attached on the top surface of the wafer packaging box 10.
[0036] The label tearing assembly 44 comprises a label tearing frame 441 connected with the mounting disc 42, a label tearing suction nozzle 442 arranged on the label tearing frame 441, a label tearing positioning plate 443 which can move up and down relative to the label tearing suction nozzle 442, a first label tearing cylinder 444 arranged on the label tearing frame 441 and used for driving the label tearing positioning plate 443 to move up and down, and a second label tearing cylinder 445 arranged on the label tearing frame 441 and used for driving the first label tearing cylinder 444 to move left and right relative to the label tearing suction nozzle 442, when the incoming label 104 is torn, the label tearing suction nozzle 442 is sucked on the top surface of the incoming label 104, the first label tearing cylinder 444 and the second label tearing cylinder 445 respectively control the label tearing positioning plate 443 to move so as to be clamped on the incoming label 104 by the label tearing suction nozzle 442, at this time, the labeling manipulator 41 works to control the label tearing assembly 44 to move along the X-axis, Y-axis and Z-axis respectively according to a preset trajectory, so as to tear the incoming label from the top surface of the wafer packaging box 10; specifically, a waste label frame 17 can be arranged on the labeling table 1 and used for placing the torn incoming label and the problematic information label.
[0037] The substandard temporary storage area 6 includes an NG material placement position 61 arranged opposite the transfer position 14 on the labeling table 1 and a plurality of temporary storage positions 62 arranged at intervals along the extension direction of the first moving channel 12. After the information label is attached, the first detection assembly 43 detects the information label. When the information label has serious wrinkles, missing corners, broken corners, blurred information, missing information, or a label position offset that is too large, the labeling conveying device 3 moves the wafer packaging box 10 with the incorrectly attached label to the transfer position 14, and the substandard product handling device 7 then moves the substandard product at the transfer position 14 to the temporary storage position 62 for subsequent processing by a worker. Because the labeling label is completely attached to the top surface of the wafer packaging box 10, when a problem occurs, it can only be moved to the substandard temporary storage area 6 for subsequent processing.
[0038] The substandard product handling device 7 includes a first handling mechanism 71 that moves the substandard product from the transfer position 14 to the NG material placement position 61 and a second handling mechanism 72 that moves the substandard product from the NG material placement position 61 to the temporary storage position 62. The labeling table 1 is provided with a second moving channel 15 arranged perpendicular to the first moving channel 12 and a third moving channel 16 arranged in parallel with the second moving channel 15 and communicating with the first moving channel 12. The transfer position 14 is arranged at the intersection of the first moving channel 12 and the second moving channel 15, and the NG material placement position 61 is arranged at the intersection of the second moving channel 15 and the third moving channel 16. Four first limiting blocks 18 arranged in a matrix are arranged at the four right angles of the labeling position 11, the buffer position 13, the transfer position 14, and the NG material placement position 61. The wafer packaging box 10 is provided with four limiting grooves 102 for the four first limiting blocks 18 to be embedded in. When the size of the wafer packaging box 10 is 6 inches, the four first limiting blocks 18 will be embedded in the four limiting grooves 102, respectively, to limit the wafer packaging box 10 at each position. When the size of the wafer packaging box 10 is 8 inches, the wafer packaging box 10 can be directly supported on the table surface of the labeling table 1 and limited by the limiting assembly 2. The temporary storage position 62 is provided with four second limiting blocks 63 arranged in a matrix and two third limiting blocks 64 arranged in a strip shape between the same side two second limiting blocks 63. The four second limiting blocks 63 and the two third limiting blocks 64 form the temporary storage position 62. When the wafer packaging box 10 moves to the temporary storage position 62, it is supported on the table surface of the labeling table 1 and limited between the two third limiting blocks 64 and the four second limiting blocks 63. Specifically, the installation positions of the third limiting blocks 64 and the second limiting blocks 63 can be adjusted according to wafer packaging boxes 10 of different sizes. Further, the structure of the second handling mechanism 72 is the same as that of the labeling conveying device 3, and no further description of the specific structure is provided here.
[0039] The first conveying mechanism 71 comprises a first conveying seat 711 movably arranged in the second moving channel 15, a first driving assembly 712 connected with and driving the first conveying seat 711 to move up and down, and a first conveying module 713 connected with the first driving assembly 712 to drive the first conveying seat 711 to move in the second moving channel 15. In work, the first driving assembly 712 can drive the first conveying seat 711 to move up to lift the defective product in the transfer position 14, so that the defective product is separated from the table top of the labeling table 1, and then the first conveying module 713 controls the first driving assembly 712 to drive the defective product to move to the NG material placing position 61, and the first driving assembly 712 controls the first conveying seat 711 to move down so that the defective product is supported on the NG material placing position 61 and is conveyed to the designated temporary storage position 62 by the second conveying mechanism 72. Specifically, the first driving assembly 712 can adopt a pneumatic cylinder to control the up and down movement of the first conveying seat 711. Further, the first conveying seat 711 is arranged in the same manner as the conveying seat 31, and the specific structure and working principle thereof will not be described further here. The first conveying module 713 adopts a linear movement module, which is a mature prior art.
[0040] The unloading conveying device 8 moves the labeled qualified wafer packaging box 10 in the transfer position 14 to the unloading position, and then the clamping jaw module takes the material for unloading. The unloading conveying device 8 comprises an unloading rack 81, two unloading pneumatic clamping jaws 82 arranged oppositely on the unloading rack 81 for clamping the wafer packaging box 10, and a multi-axis movement module 83 connected with the unloading rack 81. The multi-axis movement module 83 comprises an X-axis movement module, a Y-axis movement module and a Z-axis movement module, which cooperate with the unloading pneumatic clamping jaws 82 to move the labeled qualified wafer packaging box 10 outward.
[0041] The label seat 9 comprises a label rack 91 arranged in front of the label printer 5, a label plate 92 movably arranged relative to the label printer 5 for receiving the information label, and a label pneumatic cylinder 93 arranged on the label rack 91 to drive the label plate 92 to move. The label plate 92 is coated with an anti-sticking coating, so that the information label printed by the label printer 5 will not adhere to the label plate 92, affecting the adsorption and transfer of the labeling assembly 45.
[0042] The labeling working principle of the wafer packaging box 10 is as follows:
[0043] Step one, the wafer packaging box 10 is conveyed to the buffer position 13 by the conveying manipulator or the transfer equipment, and the labeling conveying device 3 conveys the wafer packaging box 10 at the buffer position 13 to the labeling position 11.
[0044] Step two, the first detection assembly 43 collects information of the incoming label 104 on the top surface of the wafer packaging box 10, controls the corresponding label printer 5 to print an information label according to the obtained information, controls the label tearing assembly 44 to tear off the incoming label 104 through the label mechanical arm 41, and then the first detection assembly 43 detects the information label on the label seat 9 by taking a photo, when the information label has a defect, the label application assembly 45 transfers and places the information label on the waste label rack 17, and controls the label printer 5 to re-print an information label; when the information label is qualified, the label mechanical arm 41 controls the label application assembly 45 to transfer and attach the qualified information label on the label seat 9 to the top surface of the wafer packaging box 10;
[0045] Step three, the first detection assembly 43 detects the attached information label by taking a photo, when the attached information label has a defect, the wafer packaging box 10 is moved to the transfer position 14 by the labeling conveying device 3, and is placed in the defective product temporary storage area 6 through the defective product conveying device 7; when the attached information label is qualified, the wafer packaging box 10 is moved to the transfer position 14 by the labeling conveying device 3, and is conveyed to the next device for processing through the qualified wafer packaging box 10 by the unloading conveying device 8.
[0046] The wafer packaging box 10 is fixed by the limiting assembly 2, the incoming label 104 on the wafer packaging box 10 is torn off by the labeling device 4, and a new information label is attached, and the structure of the labeling device 4 is further limited, the first detection assembly 43 is arranged, the information label printed by the label printer 5 and the attached information label can be detected, so that the qualified rate of the wafer packaging box 10 labeling is improved; the overall device structure is simple, the wafer packaging box 10 labeling process can be automated, the labor cost is greatly reduced, and the wafer packaging box 10 labeling efficiency is effectively improved.
[0047] The above is only a preferred embodiment of the present application, and therefore cannot limit the scope of the present application, that is, equivalent changes and modifications made according to the patent range and content of the specification should still be within the scope of the present application.
Claims
1. A fully automatic labeling detection device for wafer packaging boxes, characterized by: The labeling machine comprises a labeling platform, a labeling position arranged on the labeling platform, a limiting component for limiting the wafer packaging box at the labeling position, a labeling conveying device arranged on the labeling platform to transport the wafer packaging box, a labeling device arranged on the labeling platform and a label printer arranged on the labeling platform, the labeling device comprises a labeling robot arranged on the labeling platform, a mounting plate arranged at the front end of the labeling robot and a first detection component, a label tearing component and a labeling component arranged on the mounting plate with circumferential intervals, the first detection component, the label tearing component and the labeling component are respectively arranged on three sides of the mounting plate, the first detection component and the labeling component are arranged opposite to each other, and the label tearing component is located between the first detection component and the labeling component; an incoming material label is attached to the upper surface of the wafer packaging box, the label tearing component tears off the incoming material label, and the labeling component transfers the information label printed by the label printer to the upper surface of the wafer packaging box.
2. The fully automatic labeling detection device for wafer packaging boxes according to claim 1, characterized in that: The labeling conveying device includes a conveying seat that can move up and down to receive the wafer packaging box, a lifting component that connects and drives the conveying seat to move up and down, and a conveying mechanism arranged in the labeling platform to drive the conveying seat and the lifting component to move. A first moving channel for the conveying seat to move is formed on the labeling platform.
3. The fully automatic labeling detection device for wafer packaging boxes according to claim 2, characterized in that: The lifting assembly includes a lifting cylinder connected to the conveying seat and a sliding seat connected to the conveying mechanism for installing the lifting cylinder. The conveying mechanism drives the sliding seat to move in the first moving channel to drive the wafer packaging box to the labeling position for labeling or to transport the wafer packaging box outward after labeling.
4. The fully automatic labeling detection device for wafer packaging boxes according to claim 1, characterized in that: The limiting assembly includes two limiting seats relatively arranged on both sides of the labeling position, two limiting plates respectively arranged on the two limiting seats and movable toward or away from each other, and two limiting cylinders respectively arranged on the two limiting seats for driving the relative movement of the limiting plates. The wafer packaging box located at the labeling position is fixed between the two limiting plates.
5. The fully automatic labeling detection device for wafer packaging boxes according to claim 2, characterized in that: It also includes a defective product temporary storage area set on the labeling table and a defective product handling device that transfers defective products to the defective product temporary storage area. A transfer position is set at the end of the first moving channel. The defective product temporary storage area includes an NG material placement position set on the labeling table opposite to the transfer position and a plurality of temporary storage positions set at intervals along the extension direction of the first moving channel. The labeling conveying device moves the wafer packaging box with incorrect labeling to the transfer position, and the defective product handling device transports the defective products from the transfer position to the temporary storage position.
6. The fully automatic labeling detection device for wafer packaging boxes according to claim 5, characterized in that: The defective product handling device includes a first handling mechanism for handling defective products from the intermediate transfer position to the NG material placement position and a second handling mechanism for moving defective products from the NG material placement position to the temporary storage position. The labeling table is provided with a second moving channel arranged perpendicular to the first moving channel and a third moving channel connecting the second moving channel and arranged parallel to the first moving channel. The intermediate transfer position is arranged at the junction of the first moving channel and the second moving channel, and the NG material placement position is arranged at the junction of the second moving channel and the third moving channel.
7. The fully automatic labeling detection device for wafer packaging boxes according to claim 6, characterized in that: The first conveying mechanism includes a first conveying seat that can move up and down and is arranged in the second moving channel, a first driving component that is connected to and drives the first conveying seat to move up and down, and a first conveying module that is connected to the first driving component to drive the first conveying seat to move in the second moving channel. The first driving component can drive the first conveying seat to move upward to lift the defective products in the transfer position.
8. The fully automatic labeling detection device for wafer packaging boxes according to claim 5, characterized in that: It also includes a material unloading and handling device, which moves the wafer packaging box that has passed the labeling at the transfer position outward. The material unloading and handling device includes a material unloading rack, two pneumatic unloading clamps relatively arranged on the material unloading rack for clamping the wafer packaging box, and a multi-axis moving module connected to the material unloading rack.
9. The fully automatic labeling detection device for wafer packaging boxes according to claim 1, characterized in that: The label tearing assembly includes a label tearing frame connected to the mounting plate, a label tearing nozzle arranged on the label tearing frame, a label tearing positioning plate that can move up and down relative to the label tearing nozzle, a first label tearing cylinder arranged on the label tearing frame to drive the label tearing positioning plate to move up and down, and a second label tearing cylinder arranged on the label tearing frame to drive the first label tearing cylinder to move left and right relative to the label tearing nozzle. The label tearing nozzle is adsorbed on the top surface of the incoming label, and the label tearing positioning plate can cooperate with the label tearing nozzle to clamp the incoming label.
10. The fully automatic labeling detection device for wafer packaging boxes according to claim 1, characterized in that: It also includes a label holder arranged on the labeling table in front of the label printer, the label holder includes a label rack arranged in front of the label printer, a label plate that can move back and forth relative to the label printer for receiving information labels, and a label cylinder arranged on the label rack to drive the label plate to move.