Warped wafer placing device

Abstract

The utility model relates to a warped wafer placing device which comprises a box body, supporting pieces and limiting pieces, the multiple supporting pieces are arranged, every two supporting pieces are oppositely arranged, fixedly installed on the inner wall of the box body and telescopically arranged in the direction perpendicular to the inner wall, and the supporting pieces are used for supporting warped wafers. The limiting piece is installed on the surface of the supporting piece. According to the application, the support piece which is arranged in a telescopic manner can be extended or shortened along the direction perpendicular to the inner wall of the box body for mounting the support piece so as to adapt to the warping wafers with different sizes, and the limiting piece can be propped against the side walls of the warping wafers, so that the side walls of the warping wafers are subjected to propping acting force and are matched with the support piece which is arranged in a telescopic manner; and the risk problem that warping wafers of different sizes are damaged in the storage and taking-out process can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a warped wafer placing device. BACKGROUND

[0002] The wafer is in the shape of a warped wafer and needs to be stored in a placing box. When it is needed to be taken out, a mechanical arm can be used to lift the wafer out of the box.

[0003] At present, since the wafer has a large warpage and different sizes of wafers have different sizes, the wafer box used in the related art can only support the placement of a large warped wafer. However, in the actual production process, since the sizes of wafers are different, the fixed-size clamping slot cannot be accurately applied to wafers of multiple sizes at the same time, which causes a risk of damage to the wafer during storage and taking out. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide a warped wafer placing device to solve the problem of the risk of damage to wafers of different sizes during storage and taking out.

[0005] The box body comprises:

[0006] A plurality of support members are oppositely arranged, fixedly installed on the inner wall of the box body, and arranged in a telescopic manner in a direction perpendicular to the inner wall. The support members are used to support the warped wafer.

[0007] A limiting member is installed on the surface of the support member. The limiting member is used to abut against the side wall of the warped wafer.

[0008] In one embodiment, the support member comprises:

[0009] A first telescopic plate is fixedly installed on one side wall of the box body. A first positioning hole is formed in another side wall adjacent to the one side wall.

[0010] A second telescopic plate is provided with a plurality of second positioning holes corresponding to the first positioning hole.

[0011] A positioning member is used to align and connect the first positioning hole with any one of the second positioning holes.

[0012] In one embodiment, the second telescopic plate is sleeved on the first telescopic plate. The second telescopic plate can be moved to switch the second positioning hole aligned with the first positioning hole.

[0013] In one embodiment, the positioning member comprises:

[0014] A positioning elastic member is placed at the bottom of the first positioning hole.

[0015] A positioning slider is fixedly connected to one end of the positioning elastic member away from the bottom of the first positioning hole and is used for clamping at any one of the second positioning holes.

[0016] In one of the embodiments, the positioning slider comprises:

[0017] A column is fixedly connected to one end of the positioning elastic member away from the bottom of the first positioning hole;

[0018] A hemispherical body is fixedly installed at one end of the column away from the positioning elastic member and is used for clamping at any one of the second positioning holes.

[0019] In one of the embodiments, the limiting member comprises a limiting rod, which is installed on the surface of the support member and is used for abutting against the side wall of the warped wafer.

[0020] In one of the embodiments, one end of the limiting rod is movably connected to the support member, and the other end of the limiting rod is used for abutting against the side wall of the warped wafer.

[0021] In one of the embodiments, the limiting member further comprises a pad, which is fixedly installed on the surface of the support member and is used for abutting against the warped wafer.

[0022] In one of the embodiments, the pad is provided with a limiting hole, and the limiting rod is installed in the limiting hole.

[0023] In one of the embodiments, a plurality of limiting members are provided, which are arranged on the surface of the support member that is used for contacting the warped wafer and are arranged at intervals in a direction perpendicular to the extension direction of the support member.

[0024] The above-mentioned warped wafer placing device comprises a box body, a support member and a limiting member. A plurality of support members are provided, each two of which are oppositely arranged, fixedly installed on the inner wall of the box body and arranged in a telescopic manner in a direction perpendicular to the inner wall. The warped wafers to be supported are placed between each two of the oppositely arranged support members. The limiting member is installed on the surface of the support member. The support member arranged in a telescopic manner can be extended or shortened in a direction perpendicular to the inner wall of the box body on which the support member is installed, so as to adapt to warped wafers of different sizes. The limiting member is used for abutting against the side wall of the warped wafer, so that the side wall of the warped wafer is subjected to the abutting force, and in cooperation with the telescopic support member, the risk of damage of the warped wafers of different sizes during storage and taking out can be avoided. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 FIG. 2 is a side view of a warped wafer placing device according to an embodiment of the present application;

[0026] Figure 2 Figure 1 is a front view of a warped wafer placing device according to an embodiment of the present application;

[0027] Figure 3 Figure 2 is a top view of a warped wafer placing device according to an embodiment of the present application;

[0028] Figure 4 Figure 3 is a structural schematic view of a support part and a limiting part of a warped wafer placing device according to an embodiment of the present application.

[0029] 100, box body; 200, support; 210, first telescopic plate; 220, second telescopic plate; 230, positioning part; 231, positioning elastic part; 232, positioning sliding block; 300, limiting part; 310, limiting rod; 320, cushion block. DETAILED DESCRIPTION

[0030] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways other than those described herein, and by persons skilled in the art without departing from the scope of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if these terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential” and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0032] In addition, if these terms “first”, “second” appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by “first”, “second” can explicitly or implicitly include at least one of the features. In the description of the present application, if the term “multiple” appears, the meaning of “multiple” is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0033] In the present application, unless specifically defined otherwise and limited, if there are terms such as "mount", "connect", "connection", "fix", and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless specifically defined otherwise and limited, if there are terms such as "mount", "connect", "connection", "fix", and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in the present application are for illustrative purposes only and are not the only implementation.

[0036] The present application provides a warped wafer placing device, as shown in Figures 1 to 3 The present application provides a warped wafer placing device, as shown in Figure 1 The present application provides a warped wafer placing device, as shown in Figure 2 The present application provides a warped wafer placing device, as shown in Figure 3 The present application provides a warped wafer placing device, as shown in

[0037] The support member 200 can be extended or shortened in a direction perpendicular to the inner wall of the box body 100 on which the support member 200 is mounted, so as to adapt to different sizes of the warped wafer, and the limiting member 300 can abut against the side wall of the warped wafer, so that the side wall of the warped wafer is subjected to the abutting force, and in cooperation with the telescopic support member 200, the risk of damage to the warped wafer of different sizes during storage and taking out can be avoided.

[0038] With reference to Figure 4 In some embodiments, the support member 200 can include a first telescopic plate 210, a second telescopic plate 220, and a positioning member 230. One side wall of the first telescopic plate 210 is fixedly mounted to the inner wall of the box body 100, and a first positioning hole is formed in another side wall adjacent to the one side wall; one side wall of the second telescopic plate 220 is provided with a plurality of second positioning holes corresponding to the first positioning hole; and the positioning member 230 is used for aligning and connecting the first positioning hole with any one of the second positioning holes.

[0039] Exemplarily, the support members 200 can be distributed on the side walls of the box body 100 at intervals, and can be distributed on the opposite side walls of two box bodies 100, or can be distributed on four side walls. The intervals between the support members 200 on the same side wall can be equal or unequal.

[0040] Exemplarily, the first telescopic plate 210 and the second telescopic plate 220 can be slidably connected, and the two can be temporarily fixed relative to each other by passing through the first positioning hole and the second positioning hole at the same time through the positioning member 230, or the positional relationship between the second telescopic plate 220 and the second telescopic plate 220 can be changed by switching the second positioning hole aligned with the first positioning hole, so as to change the support area formed by the combination of the second telescopic plate 220 and the first telescopic plate 210. For example, the second telescopic plate 220 can be sleeved on the first telescopic plate 210, and the second telescopic plate 220 can be moved to switch the second positioning hole aligned with the first positioning hole. Further, the first positioning hole and the second positioning hole can both be circular and have the same diameter.

[0041] Further, in some embodiments, the positioning member 230 can include a positioning elastic member 231 and a positioning sliding block 232. The positioning elastic member 231 is placed at the bottom of the first positioning hole; and the positioning sliding block 232 is fixedly connected to one end of the positioning elastic member 231 away from the bottom of the first positioning hole, and is used for being clamped at any one of the second positioning holes.

[0042] Exemplarily, the positioning elastic member 231 can be fixedly connected at the bottom of the first positioning hole, or can be detachably placed at the bottom of the first positioning hole in use. The positioning elastic member 231 can be a spring, rubber or the like, and can also be other connecting members with elasticity. In use, the user can compress the positioning elastic member 231 by using external force, so that the positioning sliding block 232 connected with the positioning elastic member 231 moves towards the bottom of the first positioning hole, thereby being separated from the second positioning hole. Subsequently, the second telescopic plate 220 can be moved to switch the second positioning hole in alignment with the first positioning hole. When the positioning sliding block 232 moves to the next second positioning hole, the user can stop applying external force, so that the positioning elastic member 231 recovers and drives the positioning sliding block 232 to be clamped at the second positioning hole, thereby completing the telescopic action of the support 200.

[0043] Exemplarily, in some embodiments, the positioning sliding block 232 can include a column body and a hemispherical body. The column body is fixedly connected to one end of the positioning elastic member 231 away from the bottom of the first positioning hole. The hemispherical body is fixedly installed at one end of the column body away from the positioning elastic member 231, and is used for clamping at any one of the second positioning holes.

[0044] In use, the user can move the second telescopic plate 220 by using external force, so that the second positioning hole on the second telescopic plate 220 is shifted, and the edge of the second positioning hole abuts on the spherical surface of the hemispherical body to provide pressure to the hemispherical body, so that the hemispherical body and the column body jointly move towards the bottom of the first positioning hole to compress the positioning elastic member 231, thereby making the hemispherical body separate from the second positioning hole. Subsequently, the user continues to move the second telescopic plate 220 to switch the second positioning hole in alignment with the first positioning hole, so that the hemispherical body is clamped at the next second positioning hole.

[0045] In some embodiments, the above-mentioned limiting member 300 can include a limiting rod 310 installed on the surface of the support 200, and the limiting rod 310 is used for abutting on the side wall of the warped wafer. Exemplarily, the limiting rod 310 can be fixedly installed on the surface of the support 200 for contacting the warped wafer. When the support 200 is telescoped to a length suitable for the warped wafer, the support 200 contacts the lower surface of the warped wafer, and the limiting rod 310 abuts on the side surface of the warped wafer, thereby limiting the movement of the warped wafer. Further, the limiting rod 310 can also be provided as a telescopic rod structure, and is extended after the second telescopic plate 220 is moved to a position suitable for the warped wafer, thereby abutting on the side surface of the warped wafer.

[0046] Exemplarily, one end of the limiting rod 310 can be movably connected with the support 200, and the other end of the limiting rod 310 is used to abut against the side wall of the warped wafer. When the support 200 is telescoped to a length suitable for the warped wafer, the limiting rod 310 can abut against the side wall of the warped wafer after moving a certain distance on the support 200.

[0047] Exemplarily, the limiting member 300 can further include a pad 320 fixedly installed on the surface of the support 200 and used to abut against the warped wafer. The pad 320 is used to elevate the warped wafer, so that the robot does not touch the wafer when it is inserted between two layers, thereby avoiding damage to the wafer. The pad 320 can be arranged on the surface of the second telescopic plate 220 and close to the wafer placement area. The pad on each second telescopic plate 220 can be two, four, or the like.

[0048] Further, a limiting hole can be formed in the pad 320, and the limiting rod 310 can be installed in the limiting hole. The limiting rod 310 can abut against the side wall of the limiting hole and move in the limiting hole. In some embodiments, the limiting rod 310 can be fixedly connected with a driving member, which can be a driving motor. During the process of placing and taking the wafer, the driving member drives the limiting rod 310 to move to a target position. Further, a limiting spring can be placed in the limiting hole. When the wafer is stably placed on the surface of the support 200, the limiting spring abuts against the side of the limiting rod 310 away from the warped wafer, so that the limiting rod 310 can tightly abut against the side of the wafer, thereby generating a clamping force on the wafer together with the other limiting rod 310 arranged oppositely. Exemplarily, the pad 320 can be a block or plate structure with a flexible contact surface, so as to play a buffering role when contacting the warped wafer, and further protect the edge of the wafer from being damaged.

[0049] In some embodiments, a plurality of limiting members 300 can be arranged on the surface of the support 200 used to contact the warped wafer and spaced apart along a direction perpendicular to the telescoping direction of the support 200. Further, the spacings between different limiting members 300 can be equal or unequal. The number of limiting members 300 on the two oppositely arranged supports 200 can be the same.

[0050] The technical features of the above-described embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, they shall be considered as the scope of the present disclosure.

[0051] The above embodiments only express several implementation ways of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A device for placing warped wafers, characterized in that: The device comprises: Box body; A plurality of support members, each two of which are arranged opposite to each other, fixedly mounted on the inner wall of the box body, and retractably arranged in a direction perpendicular to the inner wall, the support members being used to support the warped wafer; A limiting member is installed on the surface of the supporting member, and the limiting member is used to abut against the side wall of the warped wafer.

2. The device according to claim 1, characterized in that The support member comprises: A first telescopic plate, wherein one side wall of the first telescopic plate is fixedly mounted on the inner wall of the box body, and a first positioning hole is formed on the other side wall adjacent to the one side wall; a second telescopic plate, wherein a side wall of the second telescopic plate is provided with a plurality of second positioning holes corresponding to the first positioning holes; A positioning member is used to align and connect the first positioning hole with any one of the second positioning holes.

3. The device according to claim 2, characterized in that The second telescopic plate is sleeved on the first telescopic plate, and the second telescopic plate can be moved to switch the second positioning hole aligned with the first positioning hole.

4. The device according to claim 2, characterized in that The positioning member includes: A positioning elastic member is placed at the bottom of the first positioning hole; The positioning slide block is fixedly connected to one end of the positioning elastic member away from the bottom of the first positioning hole and is used for being clamped at any one of the second positioning holes.

5. The device according to claim 4, characterized in that The positioning slider comprises: A column, fixedly connected to an end of the positioning elastic member away from the bottom of the first positioning hole; The hemisphere is fixedly mounted on one end of the column away from the positioning elastic member, and is used for being clamped in any one of the second positioning holes.

6. The device according to any one of claims 1 to 5, characterized in that The limiting member includes a limiting rod, which is installed on the surface of the supporting member and is used to abut against the side wall of the warped wafer.

7. The device according to claim 6, characterized in that One end of the limiting rod is movably connected to the supporting member, and the other end of the limiting rod is used to abut against the side wall of the warped disc.

8. The device according to claim 7, characterized in that The limiting member further includes a pad, which is fixedly mounted on the surface of the supporting member and is used for abutting against the warped wafer.

9. The device according to claim 8, characterized in that The cushion block is provided with a limiting hole, and the limiting rod is installed in the limiting hole.

10. The device according to claim 1, characterized in that There are multiple limiting members, which are arranged on the surface of the support member for contacting the warped wafer and are arranged at intervals along a direction perpendicular to the extension and contraction direction of the support member.

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