Pyrolysis glue protective film
By designing a thermal debonding protective film, the problems of insufficient viscosity control and flame retardancy of existing protective films after debonding are solved, and safe and reliable viscosity control and flame retardancy effects at high temperatures are achieved, which is suitable for the protection of electronic components such as LED chips.
Patent Information
- Application Number
- CN202422521900.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-10-18
AI Technical Summary
Existing protective films have low or no adhesion after debonding, which makes it difficult to meet the viscosity control requirements of high-end electronic component processing and lacks flame retardant properties.
A pyrolytic adhesive protective film was designed, which includes a substrate layer, a corrosion-resistant layer, a flame-retardant layer, a pyrolytic layer and a release layer. The pyrolytic layer is activated at a specific temperature to achieve precise control of viscosity and prevent combustion at high temperatures.
It achieves precise control of maintaining a certain viscosity or completely losing viscosity after debonding, protecting electronic components from damage and preventing combustion at high temperatures, thereby improving the safety and reliability of the protective film.
Smart Images
Figure CN223445471U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED chip technical field, concretely is a pyrolysis glue protection film. BACKGROUND
[0002] LED chip is a kind of solid-state semiconductor device, is the core component of LED lamp, that is, P-N junction.Its main function is to convert electrical energy into light energy, and the main material of chip is monocrystalline silicon.Semiconductor wafer is composed of two parts, one part is P-type semiconductor, and hole is dominant in it, and the other end is N-type semiconductor, and mainly electron is in this side.
[0003] LED protection film is a kind of thin film material for protecting LED chip or other electronic components, and in the manufacturing and processing of electronic components, protection film plays the role of preventing pollution, scratching and static damage.
[0004] At present, the existing protection film usually has fixed adhesion, and the adhesion is low or no adhesion after debonding, however, with the increasing demand of high-end refinement processing of electronic components, higher requirements are put forward for the adhesion control of protection film. UTILITY MODEL CONTENT
[0005] The utility model aims at providing a pyrolysis glue protection film to solve the problems in the above background.
[0006] To achieve the above object, the utility model provides the following technical scheme:
[0007] A pyrolysis glue protection film, comprising
[0008] The substrate layer is provided with a corrosion-resistant layer on one side, and the other side of the corrosion-resistant layer is provided with a flame-retardant layer;
[0009] The side of the substrate layer away from the corrosion-resistant layer is provided with a pyrolysis layer, the other side of the pyrolysis layer is provided with a protection layer, and the other side of the protection layer is provided with a release layer.
[0010] Preferably, the substrate layer uses polyethylene terephthalate, and the thickness of the substrate layer is 50-100 μm;
[0011] Preferably, the corrosion-resistant layer uses polytetrafluoroethylene or fluorinated ethylene propylene, and the thickness of the corrosion-resistant layer is 10-20 μm;
[0012] Preferably, the flame-retardant layer uses flame-retardant polyester or flame-retardant polyamide, and the thickness of the flame-retardant layer is 10-20 μm;
[0013] Preferably, the pyrolysis layer uses pyrolysis glue, and the thickness of the pyrolysis layer is 20-30 μm;
[0014] Preferably, the activation range of the pyrolysis layer is 80-120℃.
[0015] Compared with the prior art, the pyrolysis protective film has the beneficial effects of:
[0016] 1. The pyrolysis protective film, the main function of the pyrolysis layer is to achieve precise control of adhesion by heating, ensuring that after debonding, it still maintains a certain adhesion or completely loses adhesion, facilitating peeling and not damaging the protected surface.
[0017] 2. The pyrolysis protective film, the main function of the flame-retardant layer is to improve the flame-retardant performance of the protective film, ensuring that the film does not burn under high temperature or fire conditions, thereby protecting the covered electronic components from fire damage. BRIEF DESCRIPTION OF DRAWINGS
[0018] Fig. 1 is a schematic diagram of the overall front structure of the present application;
[0019] Fig. 2 is a schematic diagram of the overall cross-sectional structure of the present application.
[0020] In the figure: 1, base material layer; 2, corrosion-resistant layer; 3, flame-retardant layer; 4, pyrolysis layer; 5, protective layer; 6, release layer. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0022] As shown in the technical scheme provided by the present application: Figs. 1-2
[0023] A pyrolysis adhesive protective film, comprising a substrate layer 1, one side of the substrate layer 1 is provided with a corrosion-resistant layer 2, the other side of the corrosion-resistant layer 2 is provided with a flame-retardant layer 3; the side of the substrate layer 1 away from the corrosion-resistant layer 2 is provided with a pyrolysis layer 4, the other side of the pyrolysis layer 4 is provided with a protective layer 5, and the other side of the protective layer 5 is provided with a release layer 6; the substrate layer 1 uses polyethylene terephthalate, and the thickness of the substrate layer 1 is 50-100μm; the corrosion-resistant layer 2 uses polytetrafluoroethylene or fluorinated ethylene propylene, and the thickness of the corrosion-resistant layer 2 is 10-20μm; the flame-retardant layer 3 uses flame-retardant polyester or flame-retardant polyamide, and the thickness of the flame-retardant layer 3 is 10-20μm; the pyrolysis layer 4 uses pyrolysis adhesive, and the thickness of the pyrolysis layer 4 is 20-30μm; the activation range of the pyrolysis layer 4 is 80-120℃;
[0024] In this embodiment, the substrate layer 1 uses polyethylene terephthalate, which has good mechanical properties and chemical resistance, providing a basic support and protection for the protective film; the corrosion-resistant layer 2 uses polytetrafluoroethylene or fluorinated ethylene propylene, which can effectively resist chemical corrosion and protect the substrate layer 1 and other structural layers from being corroded by corrosive substances; the flame-retardant layer 3 uses flame-retardant polyester or flame-retardant polyamide, which has good flame-retardant properties and can improve the fire safety of the protective film; the pyrolysis layer 4 uses pyrolysis adhesive, which undergoes pyrolysis reaction at a specific temperature to achieve debonding function; the protective layer 5 protects the pyrolysis layer 4 from external factors; the release layer 6 facilitates the use and storage of the protective film, and the protective film can be easily peeled off from the release layer 6 when in use.
[0025] Working principle: under unheated conditions, the pyrolysis layer 4 has a certain initial adhesion, which can firmly adhere to the surface of the electronic components that need protection. At this time, the overall structure of the protective film remains intact, the substrate layer 1 provides mechanical support, the corrosion-resistant layer 2 and the flame-retardant layer 3 provide chemical corrosion resistance and flame retardant protection respectively, and the protective layer 5 and the release layer 6 protect the pyrolysis layer 4 and facilitate use respectively; when the protective film needs to be peeled off, heating can be used to make the pyrolysis layer 4 reach its activation temperature range (80-120℃). Within this temperature range, the heat-sensitive agent in the pyrolysis layer 4 is activated, triggering the pyrolysis reaction; the heat-sensitive agent is activated at high temperature, starting to decompose or change its chemical structure. The decomposition or structural change of the heat-sensitive agent leads to the reduction of the adhesion of the pyrolysis adhesive layer, making the protective film easy to peel off. By adjusting the content of the heat-sensitive agent and the heating temperature, the degree of adhesion reduction can be precisely controlled, ensuring that after peeling off, it still maintains a certain adhesion or completely loses adhesion. After debonding, the protective film can be easily peeled off from the surface of the protected electronic components, and the pyrolysis layer 4 still maintains a certain adhesion, ensuring that it will not cause damage to the surface of the components during the peeling process.
[0026] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A pyrolytic adhesive protective film, characterized in that: include A base material layer (1), wherein a corrosion-resistant layer (2) is provided on one side of the base material layer (1), and a flame-retardant layer (3) is provided on the other side of the corrosion-resistant layer (2); A pyrolysis layer (4) is provided on the side of the substrate layer (1) away from the corrosion-resistant layer (2), a protective layer (5) is provided on the other side of the pyrolysis layer (4), and a release layer (6) is provided on the other side of the protective layer (5).
2. The thermal adhesive protective film according to claim 1, characterized in that: The substrate layer (1) is made of polyethylene terephthalate, and the thickness of the substrate layer (1) is 50-100 μm.
3. The pyrolytic adhesive protective film according to claim 1, characterized in that: The corrosion-resistant layer (2) is made of polytetrafluoroethylene or fluorinated ethylene propylene, and the thickness of the corrosion-resistant layer (2) is 10-20 μm.
4. The pyrolytic adhesive protective film according to claim 1, characterized in that: The flame retardant layer (3) is made of flame retardant polyester or flame retardant polyamide, and the thickness of the flame retardant layer (3) is 10-20 μm.
5. The pyrolytic adhesive protective film according to claim 1, characterized in that: The pyrolytic layer (4) is made of pyrolytic adhesive, and the thickness of the pyrolytic layer (4) is 20-30 μm.
6. The pyrolytic adhesive protective film according to claim 5, characterized in that: The activation range of the pyrolytic layer (4) is 80-120°C.