Circuit board copper deposition electroplating equipment

Abstract

The utility model is applicable to the technical field of circuit board copper deposition and electroplating, and provides circuit board copper deposition and electroplating equipment, which comprises a bottom plate, a copper plating tank and a water tank, wherein a frame, a scrubbing tank, an electroplating tank and a water tank are fixedly mounted at the top of the bottom plate; the transverse electric sliding rail is arranged on the inner wall of the top of the frame; the longitudinal electric sliding rail is fixedly mounted on the transverse electric sliding rail output block; the electric cylinder is fixedly mounted on an output block of the longitudinal electric sliding rail; the clamping and fixing mechanism is arranged on an output rod of the electric cylinder and is used for clamping and fixing the circuit board; and the brushing mechanism is arranged on the inner wall of the brushing pool and is used for brushing the circuit board. According to the circuit board copper deposition electroplating equipment provided by the scheme, copper deposition electroplating can be carried out on the circuit board, and the circuit board can be efficiently brushed before copper deposition electroplating, so that impurities and dust attached to the circuit board are removed, and time and labor are saved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board copper plating technology, especially relates to a circuit board copper plating equipment. BACKGROUND

[0002] The name of circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper plate, impedance board, PCB, super-thin circuit board, super-thin circuit board, printing (copper etching technology) circuit board and the like. Circuit board makes circuit miniaturization, intuition, and plays an important role for the batch production of fixed circuit and the optimization of electric appliance layout.

[0003] In the process of circuit board processing, circuit board copper plating equipment is needed to carry out copper plating processing to circuit board, but the existing circuit board copper plating equipment often does not have the scrubbing function of circuit board, so manual scrubbing of circuit board is needed before electroplating, which is time-consuming and laborious. UTILITY MODEL CONTENTS

[0004] The utility model provides a kind of circuit board copper plating equipment, to solve the problem that the existing circuit board copper plating equipment often does not have the scrubbing function of circuit board raised in the above background technology.

[0005] To solve the above problems, the utility model is realized as follows: a kind of circuit board copper plating equipment, comprising: top fixedly installed with the frame, scrubbing pool, electroplating pool and water tank bottom plate;Horizontal electric slide rail is arranged on the inner wall of the top of the frame;Vertical electric slide rail is fixedly installed on the output block of the horizontal electric slide rail;Electric cylinder is fixedly installed on the output block of the vertical electric slide rail;Clamping and fixing mechanism is arranged on the output rod of the electric cylinder for clamping and fixing circuit board;Scrubbing mechanism is arranged on the inner wall of the scrubbing pool, and the scrubbing mechanism is used to scrub circuit board;Driving mechanism is arranged on the inner wall of the scrubbing mechanism, and the driving mechanism is used to drive multiple rotating tubes to rotate synchronously.

[0006] Preferably, the clamping and fixing mechanism comprises: a U-shaped plate fixedly installed on the output rod of the electric cylinder;Screw rod is rotatably installed on the inner wall of the U-shaped plate and is provided with multiple sections of external threads with opposite rotation directions;Servo motor is fixedly installed on the U-shaped plate and connected with the screw rod;Multiple limit rods are fixedly installed on the inner wall of the U-shaped plate;Multiple clamping plates are threadedly sleeved on the screw rod and slidably connected with multiple limit rods.

[0007] Preferably, the side of each of the multiple clamping plates close to each other is provided with a corrugated non-slip pad, and the multiple corrugated non-slip pads are made of silica gel material.

[0008] Preferably, the brush washing mechanism comprises: a housing fixedly installed on the inner wall of the brush washing pool; a plurality of rotary joints fixedly installed on the housing; a plurality of rotating tubes respectively arranged on the plurality of rotary joints and rotationally connected with the housing; and a plurality of soft brush hairs and a plurality of spray heads respectively arranged on the plurality of rotating tubes.

[0009] Preferably, the driving mechanism comprises: a single-groove synchronous wheel driving motor fixedly installed on the inner wall of the housing; a plurality of double-groove synchronous wheels fixedly sleeved on the plurality of rotating tubes; and a plurality of synchronous belts sleeved on the single-groove synchronous wheel and the plurality of double-groove synchronous wheels.

[0010] Preferably, the inner wall of the water tank is provided with a water pump, the water outlet end of the water pump is provided with a conduit, one end of the conduit extends to the inside of the brush washing pool, a plurality of communication pipes are arranged on the conduit, and the plurality of communication pipes are connected with the plurality of rotary joints respectively.

[0011] Preferably, the bottom of the brush washing pool and the electroplating pool is provided with a liquid discharge pipe, the two liquid discharge pipes are provided with liquid discharge valves respectively, the water tank is provided with a water filling opening, and the water filling opening is provided with a sealing cover.

[0012] Compared with the related art, the circuit board copper plating equipment has the following beneficial effects:

[0013] Compared with the prior art, the circuit board copper plating equipment provided by the scheme comprises a bottom plate, a frame, a brush washing pool, an electroplating pool and a water tank are fixedly installed on the bottom plate, the circuit board can be subjected to copper plating treatment through the electroplating liquid in the electroplating pool, the top inner wall of the frame is provided with a horizontal electric sliding rail, the output block of the horizontal electric sliding rail is fixedly provided with a vertical electric sliding rail, the output block of the vertical electric sliding rail is provided with an electric cylinder, the output rod of the electric cylinder is provided with a clamping and fixing mechanism, the mechanism can accurately and stably clamp the circuit board, so as to facilitate subsequent processing, the brush washing mechanism is arranged in the brush washing pool, and is used for deeply cleaning the circuit board clamped on the clamping and fixing mechanism and removing surface dirt and oxides, the inner wall of the brush washing mechanism is further provided with a driving mechanism, the mechanism can drive the plurality of rotating tubes to synchronously rotate, so as to improve the brushing efficiency and ensure the thorough cleaning of the surface of the circuit board, through the series of automatic operations, the circuit board copper plating equipment realizes rapid, efficient and accurate processing of the circuit board, the cooperation of the horizontal and vertical electric sliding rails and the electric cylinder enables the circuit board to be flexibly moved in the equipment, so as to facilitate the transfer between different processing pools, and the design of the clamping and fixing mechanism and the brush washing mechanism ensures the stability and cleaning effect of the circuit board during processing, in addition, the equipment is further provided with the water tank, which is used for providing water resources required for cleaning and ensuring the smooth progress of the whole processing process.

[0014] In summary, the circuit board copper plating equipment of the patent realizes efficient and accurate copper plating treatment of the circuit board through the unique mechanical structure and automatic operation, and greatly improves the production efficiency and quality of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a schematic view of the main view of the circuit board copper plating equipment provided by the utility model;

[0016] Figure 2 For Figure 1 is a schematic view of the three-dimensional assembly structure of the clamping plate and the corrugated non-slip pad in the middle;

[0017] Figure 3 For Figure 1 is an enlarged structural schematic view of the A part shown in the middle;

[0018] Figure 4 For Figure 3 is an enlarged structural schematic view of the B part shown in the middle;

[0019] Figure 5 For Figure 3 is an enlarged structural schematic view of the C part shown in the middle.

[0020] Reference signs: 1, bottom plate; 2, frame; 3, brushing pool; 4, electroplating pool; 5, water tank; 6, horizontal electric sliding rail; 7, vertical electric sliding rail; 8, electric cylinder; 9, U-shaped plate; 10, screw rod; 11, servo motor; 12, limiting rod; 13, clamping plate; 14, corrugated non-slip pad; 15, shell; 16, rotary joint; 17, rotating pipe; 18, spray head; 19, soft brush; 20, driving motor; 21, single-groove synchronous wheel; 22, double-groove synchronous wheel; 23, water pump; 24, conduit; 25, communication pipe; 26, liquid discharge pipe; 27, liquid discharge valve. DETAILED DESCRIPTION

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application; the use herein of terms such as "comprise", "comprising", "comprises", "including", "includes" or "contain" or "containing" is to be construed in a non-exclusive sense as meaning that other steps, features or components not specifically recited are optional and can be added; the use herein of terms such as "first", "second" and "third" and the like is to be construed as distinguishing between similar objects going from one to the next in a serial fashion and does not necessarily imply that the objects so called are necessarily to be in a serial order, unless explicitly stated; the use herein of terms such as "inner", "outer", "left", "right" and the like indicates relative positions or orientation relationships based on the positions or orientation relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0022] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive or alternative embodiments. It is expressly understood that the embodiments described herein are merely examples from a whole class of comparable embodiments which those skilled in the art will readily appreciate. The term "comprising" is intended to mean that the process or composition include the recited elements, but not excluding others.

[0023] The utility model discloses an embodiment provides a kind of circuit board copper deposition plating equipment, as shown in Figures 1-5 It includes: the bottom plate 1 of the frame 2, the brush washing pool 3, the plating pool 4 and the water tank 5 of top fixed installation;Horizontal electric slide rail 6 is arranged on the inner wall of the top of the frame 2;Vertical electric slide rail 7 is fixedly installed on the output block of the horizontal electric slide rail 6;Electric cylinder 8 is fixedly installed on the output block of the vertical electric slide rail 7;Clamping and fixing mechanism is arranged on the output rod of the electric cylinder 8 for clamping and fixing circuit board;Brushing mechanism is arranged on the inner wall of the brush washing pool 3, and the brushing mechanism is used for brushing circuit board;Driving mechanism is arranged on the inner wall of the brushing mechanism, and the driving mechanism is used to drive multiple rotating tubes 17 to rotate synchronously.

[0024] In this embodiment, including the bottom plate 1, on which fixedly installed frame 2, brush pool 3, electroplating pool 4 and water tank 5, through the electroplating solution in the electroplating pool 4 can be carried out to the circuit board copper plating treatment, the top inner wall of frame 2 is provided with transverse electric slide rail 6, the output block of transverse electric slide rail 6 is fixed with longitudinal electric slide rail 7, the output block of longitudinal electric slide rail 7 is installed with electric cylinder 8, the output rod of electric cylinder 8 is equipped with clamping fixed mechanism, the mechanism can accurately and stably clamp circuit board, to facilitate subsequent processing, in the inside of brush pool 3, be provided with brush washing mechanism, for the circuit board clamped on clamping fixed mechanism is deeply cleaned, removes surface dirt and oxide, the inner wall of brush washing mechanism is also equipped with driving mechanism, the mechanism can drive multiple rotating tubes 17 synchronous rotation, to improve the efficiency of brush washing, ensure that the surface of circuit board is thoroughly cleaned, through a series of automatic operation, the copper plating equipment for circuit board of the patent realizes the fast, efficient and accurate processing of circuit board, the cooperation of transverse and longitudinal electric slide rail and electric cylinder makes circuit board can move flexibly inside the equipment, it is convenient to shift between different processing pools, and the design of clamping fixed mechanism and brush washing mechanism guarantees the stability and cleaning effect of circuit board during processing, in addition, the equipment is also equipped with water tank 5 for providing the water resources required for cleaning, to ensure the smooth progress of the whole processing process;

[0025] In summary, the copper plating equipment for circuit board of the patent realizes efficient and accurate copper plating treatment of circuit board through its unique mechanical structure and automatic operation, which greatly improves the production efficiency and quality of circuit board.

[0026] In further preferred embodiments of the present application, the clamping and fixing mechanism comprises: a U-shaped plate 9 fixedly installed on the output rod of the electric cylinder 8; a screw rod 10 rotatably installed on the inner wall of the U-shaped plate 9 and having multiple sections of external threads with opposite rotation directions; a servo motor 11 fixedly installed on the U-shaped plate 9 and connected with the screw rod 10; multiple limiting rods 12 fixedly installed on the inner wall of the U-shaped plate 9; and multiple clamping plates 13 threadedly sleeved on the screw rod 10 and slidably connected with the multiple limiting rods 12.

[0027] In this embodiment, the servo motor 11 drives the screw rod 10 to rotate, and the rotation of the screw rod 10 drives the multiple clamping plates 13 to move closer to each other, thereby clamping and fixing the multiple circuit boards.

[0028] In further preferred embodiments of the present application, one side of each of the multiple clamping plates 13 moving closer to each other is provided with a corrugated anti-skid pad 14, and each of the multiple corrugated anti-skid pads 14 is made of silica gel.

[0029] In this embodiment, the corrugated anti-skid pad 14 can improve the stability of the clamped and fixed circuit board.

[0030] The further preferable embodiment of the utility model further relates to a brush washing mechanism, which comprises: a shell 15 fixedly installed on the inner wall of the brush washing pool 3; a plurality of rotary joints 16 fixedly installed on the shell 15; a plurality of rotating tubes 17 respectively arranged on the plurality of rotary joints 16 and rotationally connected with the shell 15; a plurality of soft brush hairs 19 and a plurality of spray heads 18 respectively arranged on the plurality of rotating tubes 17.

[0031] In the embodiment, the plurality of soft brush hairs 19 on the plurality of rotating tubes 17 and the water sprayed by the plurality of spray heads 18 can brush the circuit board.

[0032] The further preferable embodiment of the utility model further relates to a driving mechanism, which comprises: a single-groove synchronous wheel 21 driving motor 20 fixedly installed on the inner wall of the shell 15; a plurality of double-groove synchronous wheels 22 respectively fixedly sleeved on the plurality of rotating tubes 17; and a plurality of synchronous belts respectively sleeved on the single-groove synchronous wheel 21 and the plurality of double-groove synchronous wheels 22.

[0033] In the embodiment, the plurality of rotating tubes 17 are driven to synchronously rotate by the driving motor 20, the single-groove synchronous wheel 21, the plurality of double-groove synchronous wheels 22 and the plurality of synchronous belts.

[0034] The further preferable embodiment of the utility model further relates to that the inner wall of the water tank 5 is provided with a water pump 23, the water outlet end of the water pump 23 is provided with a conduit 24, one end of the conduit 24 extends to the inside of the brush washing pool 3, the conduit 24 is provided with a plurality of communication pipes 25, and the plurality of communication pipes 25 are connected with the plurality of rotary joints 16 respectively.

[0035] In the embodiment, the water in the water tank 5 can be pumped out by the water pump 23 and discharged into the plurality of rotary joints 16 through the conduit 24 and the plurality of communication pipes 25.

[0036] The further preferable embodiment of the utility model further relates to that the bottom of the brush washing pool 3 and the electroplating pool 4 is provided with a liquid discharge pipe 26, the two liquid discharge pipes 26 are provided with a liquid discharge valve 27 respectively, the water tank 5 is provided with a water filling opening, and the water filling opening is provided with a sealing cover.

[0037] In the embodiment, the waste water in the brush washing pool 3 and the electroplating liquid in the electroplating pool 4 can be discharged through the two liquid discharge pipes 26 and the two liquid discharge valves 27.

[0038] Compared with the related art, the device can not only electroplate copper on the circuit board, but also efficiently brush the circuit board before copper plating, so that the impurities and dust attached to the circuit board are removed, and time and labor are saved.

[0039] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways.

[0040] The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the protection scope of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application. Although the present application has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still combine, add or delete the features in the embodiments of the present application according to the circumstances without creative labor, so as to obtain different other technical solutions which do not deviate from the concept of the present application in essence. These technical solutions also belong to the scope of protection of the present application.

Claims

1. A circuit board copper plating equipment, characterized in that: include: The bottom plate with the frame, scrubbing pool, electroplating pool and water tank fixed on the top; a transverse electric slide rail provided on the top inner wall of the frame; A longitudinal electric slide rail fixedly mounted on the transverse electric slide rail output block; An electric cylinder fixedly mounted on the output block of the longitudinal electric slide rail; A clamping and fixing mechanism provided on the output rod of the electric cylinder for clamping and fixing the circuit board; A scrubbing mechanism provided on the inner wall of the scrubbing pool, the scrubbing mechanism being used to scrub the circuit board; A driving mechanism is arranged on the inner wall of the brushing mechanism, and the driving mechanism is used to drive the multiple rotating tubes to rotate synchronously.

2. The circuit board copper plating equipment according to claim 1, characterized in that: The clamping and fixing mechanism comprises: A U-shaped plate fixedly mounted on the output rod of the electric cylinder; A screw is rotatably mounted on the inner wall of the U-shaped plate and is provided with multiple sections of external threads with opposite rotation directions; A servo motor fixedly mounted on the U-shaped plate and connected to the screw; A plurality of limiting rods fixedly mounted on the inner wall of the U-shaped plate; A plurality of clamping plates are threadedly sleeved on the screw rod and slidably connected to the plurality of limiting rods.

3. The circuit board copper electroplating equipment according to claim 2, characterized in that: A corrugated anti-skid pad is provided on one side of the plurality of clamping plates close to each other, and the plurality of corrugated anti-skid pads are all made of silicone material.

4. The circuit board copper electroplating equipment according to claim 1, characterized in that: The scrubbing mechanism comprises: A housing fixedly mounted on the inner wall of the scrubbing pool; a plurality of rotary joints fixedly mounted on the housing; a plurality of rotating tubes respectively provided on the plurality of rotating joints and rotatably connected to the housing; A plurality of soft bristles and a plurality of nozzles are respectively arranged on the plurality of rotating tubes.

5. The circuit board copper electroplating equipment according to claim 4, characterized in that: The driving mechanism comprises: A motor fixedly mounted on the inner wall of the housing and provided with a single-slot synchronous wheel drive motor; a plurality of double-groove synchronous wheels respectively fixedly sleeved on the plurality of rotating tubes; A plurality of synchronous belts are respectively sleeved on the single-groove synchronous wheel and the plurality of double-groove synchronous wheels.

6. The circuit board copper electroplating equipment according to claim 4, characterized in that: A water pump is provided on the inner wall of the water tank, a conduit is provided at the water outlet of the water pump, one end of the conduit extends to the interior of the scrubbing pool, a plurality of connecting pipes are provided on the conduit, and the plurality of connecting pipes are respectively connected to the plurality of rotary joints.

7. The circuit board copper electroplating equipment according to claim 1, characterized in that: The bottoms of the scrubbing pool and the electroplating pool are both provided with drainage pipes, both drainage pipes are provided with drainage valves, the water tank is provided with a water inlet, and the water inlet is provided with a sealing cover.

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