Semiconductor chip pin detection device

Abstract

The utility model discloses a semiconductor chip pin detection device, which comprises a detection table, a detection assembly arranged at the top of the detection table, a positioning assembly arranged at the top of the detection table and positioned below the detection assembly, and a collection box arranged at the top of the detection table and positioned in front of the detection assembly, a feeding assembly is arranged on the top of the detection table and located on the left side of the positioning assembly. The detection assembly is used for accurately detecting the chip pins; the positioning assembly is used for limiting and fixing the chip; the feeding assembly and the collecting box are used for automatically feeding and discharging chips respectively, and compared with an existing detection device, the overall practicability of the detection device is improved through the design; according to the semiconductor chip detection device, it can be avoided that the detection result is affected by deviation of the chips during detection, meanwhile, after detection is completed, the semiconductor chips can be put into the collection box through the detection assembly, and the detected semiconductor chips are recycled through the collection box.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip pin detection, and in particular relates to a semiconductor chip pin detection device. Background Art

[0002] The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging, and post-packaging testing. Semiconductor packaging testing refers to the process of processing tested wafers into independent chips according to product model and functional requirements. However, existing detection devices can only detect the length of pins, but cannot detect the gaps between pins of equidistant pins on chips. In addition, the detection devices often damage the pins and the chip itself during the detection process, resulting in inaccurate test data.

[0003] After searching, the announcement number: CN214333713U discloses a semiconductor chip pin detection device, including a base, a support frame and a top plate, a lower pressure plate is provided under the top plate, the top of the lower pressure plate is fixedly connected to a hydraulic cylinder, the top of the hydraulic cylinder is fixedly connected to the middle part of the bottom of the top plate, a detection groove is provided in the middle part of the upper surface of the base, a chip is placed inside the detection groove, pins are fixedly connected at both ends of the chip, the left inner wall and the right inner wall of the detection groove are fixedly connected to detection blocks, and pressure plates are provided above the two detection blocks; the utility model arranges pressure plates on both sides of the detection groove, when it is necessary to detect the pin, the servo motor drives the spur gear to rotate, the spur gear drives the rack to move, thereby driving the pressure plate to move, and then moves the pressure plate to the top of the pin, and at the same time, the pressure block is tightly pressed on the top of the pin due to the action of the reset spring, thereby preventing the pin from tilting upward;

[0004] Regarding the above-mentioned related technologies, the following defects still exist during use: when testing the chip, staff are required to load and unload the chip, the degree of automation is not high, and production efficiency is reduced. Therefore, it is particularly important to improve the existing detection device and design a new detection device to change the above-mentioned technical defects and improve the practicality of the overall adapter ring. Utility Model Content

[0005] (1) Technical problems to be solved

[0006] In response to the shortcomings of the existing technology, the purpose of this utility model is to provide a semiconductor chip pin detection device, which aims to solve the technical problem that under the existing technology, when testing chips, staff are required to load and unload chips, the degree of automation is not high, and production efficiency is reduced.

[0007] (2) Technical solution

[0008] In order to solve the above technical problems, the utility model provides a semiconductor chip pin detection device, which includes a detection platform, a detection component is provided on the top of the detection platform, a positioning component is provided on the top of the detection platform and below the detection component, a collection box is provided on the top of the detection platform and in front of the detection component, and a loading component is provided on the top of the detection platform and on the left side of the positioning component; the detection component is used to accurately detect the chip pins; the positioning component is used to limit and fix the chip; the loading component and the collection box are respectively used to automatically load and unload the chip.

[0009] When using the pin detection device of the present technical solution, first place the detection table at the designated position, load the chip to be detected through the loading assembly, move the chip through the detection assembly, move the chip into the positioning assembly, and limit and fix the chip through the positioning assembly to prevent the detection assembly from offsetting and affecting the detection results when detecting the chip. After the detection is completed, move the chip through the detection assembly and place it in a collection box, and recycle the detected chips through the collection box.

[0010] Preferably, the detection assembly includes a support frame, a movable column, a lifting cylinder, a movable platform, a detection head and a suction cup. The support frame is fixedly connected to the top of the detection platform, and the movable column is threadedly connected to the top of the support frame.

[0011] Furthermore, the front of the moving column is connected to two sets of moving platforms via two sets of lifting cylinders. The bottoms of the two moving platforms are respectively equipped with an inspection head and a suction cup. A moving motor is installed on the right side of the support frame, corresponding to the position of the moving column. The design of the inspection component facilitates the inspection of semiconductor chip pins. At the same time, the suction cup inside the inspection component can move the semiconductor chip, moving the chip from the loading assembly to the inspection assembly, and also from the inspection assembly to the collection box, thereby improving inspection efficiency.

[0012] Furthermore, the positioning assembly includes two sets of mounting plates, sliding columns, a support platform, a positioning platform and a positioning block. The two sets of mounting plates are fixedly connected to the top of the detection platform and are located below the detection assembly. Two sets of sliding columns are fixedly connected between the two sets of mounting plates.

[0013] Furthermore, a support platform is fixedly connected between the two sets of mounting plates and the two sets of sliding posts. Two sets of positioning platforms are slidably connected to the outside of the two sets of sliding posts and located between the two sets of mounting plates and the support platform. Positioning blocks are fixedly connected to the inside of the two sets of positioning platforms and located near the support platform. The design of the positioning assembly allows the semiconductor chip to be fixed in place by the positioning assembly, facilitating the detection of the semiconductor chip pins by the detection assembly and preventing chip displacement during detection that may affect the detection results.

[0014] Further, the feeding assembly comprises a feeding frame, a feeding conveyor belt, a feeding frame, a hydraulic cylinder and a feeding table, and the feeding frame is fixedly connected to the left side of the top detection component of the detection table.

[0015] Further, the top of the feeding frame is provided with the feeding conveyor belt, the top of the detection table and located in front of the feeding conveyor belt is provided with the feeding frame, and the top of the feeding frame is connected with the feeding table through the hydraulic cylinder.

[0016] (3) Advantageous effects

[0017] Compared with the prior art, the utility model has the beneficial effects that:

[0018] The pin detection device of the utility model is through the design of the detection component, the positioning component, the collecting box and the feeding assembly, transports the semiconductor chip through the feeding assembly, moves the semiconductor chip through the cooperation of the detection component, moves the semiconductor chip to the positioning component, fixes the semiconductor chip through the positioning component, facilitates the detection of the chip by the detection component, can avoid the deviation of the chip during detection and affect the detection result, and can put the semiconductor chip into the collecting box through the detection component after detection, and recycle the detected semiconductor chip through the collecting box. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the whole three-dimensional structure schematic diagram state one of the utility model;

[0020] Figure 2 It is the whole three-dimensional structure schematic diagram state two of the utility model;

[0021] Figure 3 It is the whole plane structure front view schematic diagram of the utility model;

[0022] Figure 4 It is the whole plane structure top schematic diagram of the utility model;

[0023] Figure 5 It is the whole plane structure top schematic diagram of the utility model; Figure 1 It is the whole plane structure top schematic diagram of the utility model;

[0024] The marks in the drawings are: 1, detection platform; 2, detection assembly; 201, support frame; 202, moving column; 203, lifting cylinder; 204, moving table; 205, detection head; 206, suction cup; 3, positioning assembly; 301, mounting plate; 302, sliding column; 303, support table; 304, positioning table; 305, positioning block; 4, collection box; 5, feeding assembly; 501, feeding frame; 502, feeding conveyor belt; 503, feeding frame; 504, hydraulic cylinder; 505, feeding table. DETAILED DESCRIPTION

[0025] The specific embodiment is a semiconductor chip pin detection device, the structure diagram of which is shown in Figure 1 The pin detection device comprises a detection platform 1, the top of the detection platform 1 is provided with a detection assembly 2, the top of the detection platform 1 and below the detection assembly 2 is provided with a positioning assembly 3, the top of the detection platform 1 and in front of the detection assembly 2 is provided with a collection box 4, and the top of the detection platform 1 and left of the positioning assembly 3 is provided with a feeding assembly 5.

[0026] Among them, please refer to Figures 1-5 The top of the detection platform 1 is provided with the detection assembly 2.

[0027] The detection assembly 2 is used for accurate detection of chip pins, and the specific structure of the detection assembly 2 is as follows:

[0028] The detection assembly 2 comprises a support frame 201, a moving column 202, a lifting cylinder 203, a moving table 204, a detection head 205 and a suction cup 206, the support frame 201 is fixedly connected to the top of the detection platform 1, the moving column 202 is threadedly connected to the top of the support frame 201, the front of the moving column 202 is connected with two groups of moving tables 204 through two groups of lifting cylinders 203, the bottoms of the two groups of moving tables 204 are respectively provided with the detection head 205 and the suction cup 206, and a moving motor is installed at a position corresponding to the moving column 202 on the right side of the support frame 201.

[0029] Specifically, in use, the moving column 202 is driven to rotate in the support frame 201 by the moving motor, then the two groups of moving tables 204 are driven to move by the rotation of the moving column 202, then the detection head 205 and the suction cup 206 are driven to move by the lifting cylinder 203, after the suction cup 206 is moved to above the feeding assembly 5, the suction cup 206 is driven to descend by the lifting cylinder 203, then the chip is adsorbed by the suction cup 206, the chip is adsorbed and moved into the positioning assembly 3 by the suction cup 206, the chip is fixed and positioned by the positioning assembly 3, then the chip is detected by the detection head 205, after the detection is completed, the chip is moved into the collection box 4 by the suction cup 206, and the chip is recycled by the collection box 4.

[0030] Then, please refer toFigures 1-5 A positioning component 3 is provided on the top of the detection platform 1 and below the detection component 2.

[0031] The positioning component 3 is used to limit and fix the chip. The specific structure of the positioning component 3 is as follows:

[0032] The positioning assembly 3 includes two groups of mounting plates 301, sliding columns 302, a support platform 303, a positioning platform 304 and a positioning block 305. The two groups of mounting plates 301 are fixedly connected to the top of the detection platform 1 and are located below the detection assembly 2. Two groups of sliding columns 302 are fixedly connected between the two groups of mounting plates 301. A support platform 303 is fixedly connected between the two groups of mounting plates 301 and the two groups of sliding columns 302. Two groups of positioning platforms 304 are slidably connected to the outside of the two groups of sliding columns 302 and located between the two groups of mounting plates 301 and the support platform 303. Positioning blocks 305 are fixedly connected to the inside of the two groups of positioning platforms 304 and located close to the support platform 303.

[0033] Specifically, the chip is moved to the positioning platform 304 by the detection component 2. A positioning motor is provided on the back of the mounting plate 301 and at a position corresponding to the sliding column 302. The sliding column 302 is a bidirectional screw rod, which drives the two sets of support platforms 303 to approach each other through the bidirectional screw rod, and clamps and fixes the chip in the positioning platform 304 through two sets of positioning blocks 305, so that the detection component 2 can detect the chip.

[0034] Also, see Figures 1-4 A loading assembly 5 is provided on the top of the inspection platform 1 and on the left side of the positioning assembly 3.

[0035] The loading assembly 5 and the collection box 4 are used to automatically load and unload chips. The specific structure of the loading assembly 5 is as follows:

[0036] The loading component 5 includes a loading rack 501, a loading conveyor belt 502, a feeding rack 503, a hydraulic cylinder 504 and a feeding platform 505. The loading rack 501 is fixedly connected to the left side of the top detection component 2 of the detection platform 1. The top of the loading rack 501 is provided with a loading conveyor belt 502. The feeding rack 503 is provided at the top of the detection platform 1 and in front of the loading conveyor belt 502. The top of the feeding rack 503 is connected to the feeding platform 505 through a hydraulic cylinder 504.

[0037] Specifically, the chip is moved by the rotation of the loading conveyor belt 502. At this time, the loading rack 501 supports the loading conveyor belt 502. The loading conveyor belt 502 transports the chip to the feeding platform 505. At this time, the hydraulic cylinder 504 drives the feeding rack 505 to move, and moves the feeding rack 505 to the bottom of the detection component 2, and the chip is adsorbed and fed through the detection component 2.

[0038] The overall three-dimensional structure schematic diagram state two of the pin detection device is as shown in Figure 2 The overall plane structure front view schematic diagram is as shown in Figure 3 The overall plane structure top view schematic diagram is as shown in Figure 4 The Figure 1 The enlarged structure schematic diagram in the middle A is as shown in Figure 5

[0039] When the device of the technical solution is used, first, the detection table 1 is placed at a designated position, the chip to be detected is fed by the feeding assembly 5, the chip is moved by the detection assembly 2, the chip is moved into the positioning assembly 3, the chip is fixed by the positioning assembly 3, the detection assembly 2 is prevented from deviating when detecting the chip to affect the detection result, the chip is moved by the detection assembly 2 after the detection is completed, the chip is put into the collection box 4, the chip after detection is recycled by the collection box 4, compared with the existing chip pin detection device, the practicability of the chip pin detection device is improved by the design.

[0040] The above embodiment is a preferred implementation scheme of the utility model, in addition, the utility model can be realized in other ways, and any obvious replacement without departing from the concept of the technical solution is within the protection scope of the utility model.​

Claims

1. A semiconductor chip pin detection device, comprising a detection platform (1), characterized in that: A detection component (2) is provided on the top of the detection platform (1); a positioning component (3) is provided on the top of the detection platform (1) and below the detection component (2); a collection box (4) is provided on the top of the detection platform (1) and in front of the detection component (2); a loading component (5) is provided on the top of the detection platform (1) and on the left side of the positioning component (3); the detection component (2) is used for accurately detecting chip pins; the positioning component (3) is used for limiting and fixing the chip; the loading component (5) and the collection box (4) are respectively used for automatically loading and unloading the chip.

2. A semiconductor chip pin detection device according to claim 1, characterized in that: The detection assembly (2) comprises a support frame (201), a movable column (202), a lifting cylinder (203), a movable platform (204), a detection head (205) and a suction cup (206); the support frame (201) is fixedly connected to the top of the detection platform (1); and the movable column (202) is threadedly connected to the top of the support frame (201).

3. A semiconductor chip pin detection device according to claim 2, characterized in that: The front of the movable column (202) is connected to two groups of movable platforms (204) via two groups of lifting cylinders (203); the bottoms of the two groups of movable platforms (204) are respectively provided with a detection head (205) and a suction cup (206); a movable motor is installed on the right side of the support frame (201) at a position corresponding to the movable column (202).

4. The semiconductor chip pin detection device according to claim 1, characterized in that: The positioning assembly (3) comprises two groups of mounting plates (301), sliding columns (302), a support platform (303), a positioning platform (304) and a positioning block (305); the two groups of mounting plates (301) are fixedly connected to the top of the detection platform (1) and are located below the detection assembly (2); and two groups of sliding columns (302) are fixedly connected between the two groups of mounting plates (301).

5. The semiconductor chip pin detection device according to claim 4, characterized in that: A support platform (303) is fixedly connected between the two groups of mounting plates (301) and the two groups of sliding columns (302); two groups of positioning platforms (304) are slidably connected to the outsides of the two groups of sliding columns (302) and located between the two groups of mounting plates (301) and the support platform (303); and positioning blocks (305) are fixedly connected to the insides of the two groups of positioning platforms (304) and located near the support platform (303).

6. The semiconductor chip pin detection device according to claim 1, characterized in that: The loading assembly (5) comprises a loading rack (501), a loading conveyor belt (502), a feeding rack (503), a hydraulic cylinder (504) and a feeding platform (505); the loading rack (501) is fixedly connected to the left side of the top detection assembly (2) of the detection platform (1).

7. A semiconductor chip pin detection device according to claim 6, characterized in that: A loading conveyor belt (502) is provided on the top of the loading rack (501), a feeding rack (503) is provided on the top of the inspection platform (1) and in front of the loading conveyor belt (502), and the top of the feeding rack (503) is connected to a feeding platform (505) via a hydraulic cylinder (504).

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