Intelligent chip test vibration platform

Abstract

The utility model relates to an intelligent chip test vibration platform, which comprises a vibration box, chip installation structures are uniformly distributed on the rear side of the upper end of the vibration box, the upper end of each chip installation structure is provided with a pressing structure, each chip installation structure comprises a test groove, four moving plates are arranged in the test groove, and the moving plates are arranged on the upper end of the vibration box. A pair of elastic pieces is arranged between the groove surface of the test groove and the adjacent moving plate; by arranging the moving plates and the elastic pieces, chips of different specifications are placed among the four moving plates, four-side clamping can be achieved, the applicability is high, and the structure is simple; by arranging the pressure dividing feet and the rectangular plate, the movable plate is pressed downwards, and the situation that the clamping effect is affected due to the fact that the movable plate shifts in the vibration process is prevented; through the arrangement of the buffer plate and the spring assembly, the vibration between the chip and the moving plate caused by the impact force is reduced through the deformation buffer of the spring assembly, and the abrasion of the chip clamping position is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test technical field especially, relate to a kind of intelligent chip test vibration platform. BACKGROUND

[0002] Chip is the most important part in electronic equipment, bears the function of completing operation, processing task and control storage;Generally need to pass through chip's vibration detection in chip manufacturing process, so need to use test vibration control device, however, the clamping structure of the existing chip test vibration device is inconvenient to adjust, poor in applicability to chips of various specifications, and lacks shock-absorbing design in the clamping process, and the chip is easily damaged during clamping, therefore we design a kind of intelligent chip test vibration platform.

[0003] Patent No. CN202223321951.8 is a Chinese utility model patent, which discloses a kind of chip test vibration control device, including vibration box, the front side of the upper end surface of the vibration box is fixed with control box, and the rear side is fixed with control platform, the control box is equipped with the bearing connection of through left and right box wall screw rod, and the box is equipped with moving rod sliding connection, the moving rod is equipped with the threaded block of screw thread engagement with screw rod, the moving rod is equipped with sleeve rod through the side wall of sliding slot box, the sliding slot box is fixed in control box upper side, and it is equipped with clamping mechanism sliding connection in it, the free end of sleeve rod contacts the lower end of clamping mechanism, the upper end of moving rod is fixed with limiting mechanism;The utility model has the advantages that the chip does not shake during vibration detection, the vibration detection result of chip is accurate, and the practicality of the device is improved, but the utility model has the following problems: first, the clamping adjustment structure of the utility model is complex, and many components need to be adjusted to detect chips of different specifications, which is time-consuming and laborious, and second, it does not have the design of clamping shock absorption, and the chip is easily damaged by clamping impact during clamping. UTILITY MODEL CONTENT

[0004] The utility model aims at the deficiencies of prior art, by setting up moving plate and elastic piece, pressure foot and rectangular plate, buffer plate and spring assembly, solve the technical problems that the clamping structure of existing chip test vibration device is complex and inconvenient to adjust, poor in applicability to chips of various specifications, and lacks shock-absorbing design in the clamping process, and the clamping position of chip is easily damaged during clamping.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] The utility model provides a kind of intelligent chip test vibration platform, including vibration box, the upper end rear side position of the vibration box is uniformly distributed chip mounting structure, the upper end of the chip mounting structure is equipped with compression structure, the chip mounting structure includes test slot, four moving plates are equipped in the slot of the test slot, and a pair of elastic members is equipped between the slot face of the test slot and adjacent the moving plate.

[0007] As a kind of preference, the moving plate is trapezoidal block, and the upper end of the moving plate is equipped with extension plate, and the lower end of the extension plate is in abutment with the upper surface of vibration box.

[0008] As a kind of preference, the compression structure includes L-shaped support, the front end of the L-shaped support is equipped with bearing plate, the upper end of the bearing plate is equipped with down pressure cylinder, and the piston rod of the down pressure cylinder is connected with down pressure plate through the lower end of bearing plate.

[0009] As a kind of preference, the lower end of the down pressure plate is uniformly distributed with a first connecting sleeve, the inner surface of the first connecting sleeve is equipped with spring assembly, the lower end of the spring assembly is connected with second connecting sleeve, and the lower end of the second connecting sleeve is connected with buffer plate.

[0010] As a kind of preference, the four side positions of the buffer plate are equipped with pressure distribution foot, and the lower end of the pressure distribution foot is equipped with rectangular plate.

[0011] As a kind of preference, the upper end left lower corner of the vibration box is equipped with control panel, and the front end of the vibration box is equipped with access door, and the front end right side position of the access door is equipped with handle.

[0012] The utility model discloses a kind of intelligent chip test vibration platform, including vibration box, the upper end rear side position of the vibration box is uniformly distributed chip mounting structure, the upper end of the chip mounting structure is equipped with compression structure, the chip mounting structure includes test slot, four moving plates are equipped in the slot of the test slot, and a pair of elastic members is equipped between the slot face of the test slot and adjacent the moving plate.

[0013] (1) the utility model discloses through setting moving plate and elastic member, different specifications chip is placed between four moving plates, elastic member is contracted under pressure, so that moving plate is pressed to move outward, to play the role of four side clamping to chip, high applicability, simple structure.

[0014] (2) the utility model discloses through setting pressure distribution foot and rectangular plate, because elastic member is prone to shaking in the process of chip vibration and makes clamping effect worse, and pressure distribution foot and rectangular plate are pressed to the moving plate downward under the action of down pressure cylinder, to prevent moving plate from being displaced in the process of vibration and influence clamping effect.

[0015] (3) the utility model discloses through setting buffer plate and spring assembly, when down pressure cylinder drives down pressure plate to move downward, impact force is directly acted on spring assembly, so that spring assembly is deformed and buffered, to reduce the vibration between chip and moving plate caused by impact force, reduce the abrasion of chip holding position.

[0016] In summary, the utility model has the advantages of simple structure, good shock-absorbing effect, and stable clamping, and is particularly suitable for the field of chip testing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a structural diagram of the vibration platform for testing smart chips.

[0019] Figure 2 This is a schematic diagram of the chip mounting structure.

[0020] Figure 3 It is a structural diagram of the buffer plate part and the lower pressure plate part. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present utility model are clearly and completely described below with reference to the accompanying drawings.

[0022] Example 1

[0023] like Figures 1 to 3 As shown, the utility model provides an intelligent chip test vibration platform, including a vibration box 1, a chip mounting structure 2 is evenly distributed on the upper rear side of the vibration box 1, for placing the chip to be tested therein for vibration testing, and a clamping structure 3 is provided on the upper end of the chip mounting structure 2, and an auxiliary movable plate 22 is used to stably clamp the chip to be tested. The chip mounting structure 2 includes a test slot 21, and four movable plates 22 are provided in the slot of the test slot 21, and a pair of elastic members 23 are provided between the slot surface of the test slot 21 and the adjacent movable plates 22, which can be springs or elastic components such as elastic balls. When chips of different specifications are placed between the four movable plates 22, the elastic members 23 are compressed and contracted, so that the movable plates 22 are compressed and move outward, thereby clamping the chip on four sides. It has high applicability and simple structure.

[0024] Further, if Figure 2 As shown, the movable plate 22 is a trapezoidal block, and an extension plate 24 is provided at the upper end of the movable plate 22, which increases the contact area between the upper end of the movable plate 22 and the rectangular plate 310. The lower end of the extension plate 24 abuts the upper surface of the vibration box 1 to prevent the extension plate 24 from over-pressing the movable plate 22 during the compression process, causing the movable plate 22 to tilt and affecting the clamping effect of the chip.

[0025] Further, as shown in Figure 1 The pressing structure 3 includes an L-shaped support 31, the front end of the L-shaped support 31 is provided with a bearing plate 32 for placing a downward pressing cylinder 33, the upper end of the bearing plate 32 is provided with the downward pressing cylinder 33, the piston rod of the downward pressing cylinder 33 penetrates through the lower end of the bearing plate 32 and is connected with a downward pressing plate 34, the downward pressing cylinder 33 works under the control of the control panel 4 and drives the downward pressing plate 34 to move up and down, thereby realizing automatic pressing down and resetting.

[0026] Further, as shown in Figure 3 The lower end of the downward pressing plate 34 is uniformly distributed with a first connecting sleeve 35, the inner surface of the first connecting sleeve 35 is provided with a spring assembly 36, when the downward pressing cylinder 33 drives the downward pressing plate 34 to move downward, the impact force is directly applied to the spring assembly 36, so that the spring assembly 36 is deformed and buffered, thereby reducing the vibration between the chip and the moving plate 22 caused by the impact force and reducing the abrasion of the chip holding position, the lower end of the spring assembly 36 is connected with a second connecting sleeve 37, the first connecting sleeve 35 and the second connecting sleeve 37 are rubber sleeves, when the spring assembly 36 is excessively compressed, the collision between the buffer plate 38 and the downward pressing plate 34 is prevented, and the lower end of the second connecting sleeve 37 is connected with the buffer plate 38.

[0027] Further, four side positions of the buffer plate 38 are provided with pressure distribution feet 39, the lower end of the pressure distribution feet 39 is provided with a rectangular plate 310, because the elastic member 23 is prone to shaking in the process of chip vibration and thus the clamping effect is poor, the pressure distribution feet 39 and the rectangular plate 310 press the moving plate 22 downward under the action of the downward pressing cylinder 33, thereby preventing the moving plate 22 from being displaced in the process of vibration and affecting the clamping effect.

[0028] Further, as shown in Figure 1 The upper left corner of the vibration box 1 is provided with a control panel 4, a person tests the chip vibration by operating the control panel 4, and the front end of the vibration box 1 is provided with a maintenance door 11, the front right side of the maintenance door 11 is provided with a handle 12, so as to facilitate opening the maintenance door 11 and maintaining the internal components of the vibration box 1.

[0029] Working process: first, the chip to be detected is placed between the four moving plates 22, the elastic member 23 is compressed to shrink, so that the moving plate 22 is pressed to move outward, thereby playing a four-sided clamping role on the chip; further, the control panel 4 is operated, so that the downward pressing cylinder 33 works and drives the downward pressing plate 34 to move downward, so that the rectangular plate 310 gradually moves downward and contacts with the extension plate 24; at the same time, the spring assembly 36 is deformed in the middle under the impact of the downward pressing force, thereby reducing the vibration between the chip and the moving plate 22 caused by the impact force and reducing the abrasion of the chip holding position; further, the pressing structure 3 presses the moving plate 22, and the chip vibration test can be performed by operating the control panel 4.

[0030] In the description of the present application, it should be understood that the terms "front", "rear", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0031] Of course, in the present technical solution, those skilled in the art should understand that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element can be one, and in another embodiment, the number of the element can be multiple, and the term "one" cannot be understood as a limitation on the number.

[0032] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any changes or replacements easily thought of by those skilled in the art under the technical hints of the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A smart chip testing vibration platform, characterized by: The invention comprises a vibration box (1), a chip mounting structure (2) is evenly distributed on the rear side of the upper end of the vibration box (1), a pressing structure (3) is provided at the upper end of the chip mounting structure (2), the chip mounting structure (2) comprises a test slot (21), four movable plates (22) are provided in the slot of the test slot (21), and a pair of elastic members (23) are provided between the slot surface of the test slot (21) and the adjacent movable plates (22).

2. The intelligent chip testing vibration platform according to claim 1, characterized in that: The movable plate (22) is a trapezoidal block, and an extension plate (24) is provided at the upper end of the movable plate (22), and the lower end of the extension plate (24) abuts against the upper surface of the vibration box (1).

3. The intelligent chip testing vibration platform according to claim 1, characterized in that: The pressing structure (3) comprises an L-shaped bracket (31), a load-bearing plate (32) is provided at the front end of the L-shaped bracket (31), a downward pressure cylinder (33) is provided at the upper end of the load-bearing plate (32), and a piston rod of the downward pressure cylinder (33) passes through the lower end of the load-bearing plate (32) and is connected to the downward pressure plate (34).

4. The intelligent chip testing vibration platform according to claim 3, characterized in that: A No. 1 connecting sleeve (35) is evenly distributed on the lower end of the lower pressure plate (34), a spring assembly (36) is provided on the inner surface of the No. 1 connecting sleeve (35), the lower end of the spring assembly (36) is connected to the No. 2 connecting sleeve (37), and the lower end of the No. 2 connecting sleeve (37) is connected to the buffer plate (38).

5. The intelligent chip testing vibration platform according to claim 4, characterized in that: The four side surfaces of the buffer plate (38) are each provided with a presser foot (39), and the lower end of the presser foot (39) is provided with a rectangular plate (310).

6. The intelligent chip testing vibration platform according to claim 1, characterized in that: A control panel (4) is provided at the lower left corner of the upper end of the vibration box (1), and an inspection door (11) is provided at the front end of the vibration box (1), and a handle (12) is provided at the right side of the front end of the inspection door (11).

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