Server

Abstract

The utility model relates to the field of servers, and discloses a server which is used for integrating an air cooling heat dissipation structure and a liquid cooling heat dissipation structure. The server comprises a front module, a fan module, a mainboard node module, a liquid cooling module, a middle module and a rear module. The fan module, the mainboard node module and the rear module are arranged along a first direction; the fan module and the front module are arranged in the second direction. The mainboard node module, the liquid cooling module and the middle module are arranged along a third direction; wherein the mainboard node module comprises at least one mainboard node assembly, and when the number of the mainboard node assemblies is multiple, the multiple mainboard node assemblies are arranged in the second direction; the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the thickness direction of the server.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of servers, in particular to a server. BACKGROUND

[0002] The air-liquid hybrid cooling scheme has obvious advantages in improving cooling efficiency, reducing energy consumption, improving reliability and stability, adapting to different scenarios, reducing noise and being environmentally friendly, and therefore is increasingly valued in modern server design. Therefore, how to compatibly use the air cooling and liquid cooling schemes in a server is a technical problem to be solved by those skilled in the art. CONTENT OF THE UTILITY MODEL

[0003] The application discloses a server for integrating air cooling and liquid cooling structures to meet the cooling requirements of all components inside the server.

[0004] To achieve the above object, the application provides the following technical scheme:

[0005] A server comprises a front module, a fan module, a mainboard node module, a liquid cooling module, a middle module and a rear module.

[0006] The fan module, the mainboard node module and the rear module are arranged along a first direction; the fan module and the front module are arranged along a second direction; and the mainboard node module, the liquid cooling module and the middle module are arranged along a third direction.

[0007] The mainboard node module comprises at least one mainboard node assembly, and when the mainboard node assembly is multiple, the multiple mainboard node assemblies are arranged along the second direction; the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the thickness direction of the server.

[0008] The above server comprises a front module, a fan module, a mainboard node module, a liquid cooling module, a middle module and a rear module; and the layout of the modules inside the server is as follows:

[0009] The fan module, the mainboard node module and the rear module are arranged along a first direction; the fan module and the front module are arranged along a second direction; and the mainboard node module, the liquid cooling module and the middle module are arranged along a third direction; the first direction, the second direction and the third direction are perpendicular to each other. The fan module is located at one end of the server, the liquid cooling module is located in the middle of the server, and is stacked between the mainboard node module and the middle module.

[0010] In an embodiment, the first direction is the length direction of the server, the second direction is the width direction of the server, and the third direction is the thickness direction of the server.

[0011] The server provided by the embodiments of the present application integrates a fan module and a liquid cooling module on the basis of completing the arrangement of various modules, can have both air cooling and liquid cooling heat dissipation modes, and meets the heat dissipation requirements of all components inside the server.

[0012] In some embodiments, the server further comprises a chassis;

[0013] The chassis comprises a chassis base and a chassis upper cover; the chassis upper cover covers the chassis base and forms an internal space of the chassis with the chassis base;

[0014] The chassis base is provided with a plurality of installation compartments towards one side of the front end of the server, and the plurality of installation compartments are arranged along a second direction; the plurality of installation compartments comprise a fan compartment; the fan compartment comprises a compartment partition plate, and the fan compartment forms an installation opening for allowing the fan module to enter and exit towards one end of the outside of the chassis; a back plate is fixedly arranged on the chassis base, and the back plate is located on the side of the fan compartment away from the installation opening;

[0015] The fan module is plugged with the back plate through a blind plug connector and is locked with the compartment partition plate through a detachable connection structure.

[0016] The fan module is located at one end of the server chassis, such as the front end, and the installation opening of the fan is located on the end face of the chassis, so that the fan module can be maintained without opening the chassis upper cover. The fan module is plugged with the blind plug connector on the chassis base, so as to realize the blind plug function of the fan module and greatly improve the operation convenience of the server chassis.

[0017] In some embodiments, the fan module is provided with a buckle for clamping with the compartment partition plate towards one end of the outside of the chassis.

[0018] The buckle comprises a clamping portion and a pulling portion, and the pulling portion is used to drive the clamping portion to be unlocked with the compartment partition plate.

[0019] The fan module is clamped and locked with the chassis base, and the fan module and the chassis base can be unlocked by driving the pulling portion, so as to greatly improve the convenience of disassembling the fan module.

[0020] In some embodiments, the plurality of installation compartments further comprise a hard disk compartment; the front module is installed in the hard disk compartment; and the front module is a first hard disk module or a second hard disk module.

[0021] The hard disk compartment on the chassis base can adapt to two front modules, i.e., the first hard disk module and the second hard disk module. The first hard disk module and the second hard disk module have the same installation structure and can be installed in cooperation with the same hard disk compartment, so as to increase interchangeability and enable the server to select and install appropriate hard disk modules as needed.

[0022] In some embodiments, the chassis base comprises a node mounting surface; the mainboard node module comprises a first mainboard node assembly and a second mainboard node assembly.

[0023] The first mainboard node assembly and the second mainboard node assembly are both mounted on the node mounting surface.

[0024] The server provided by the embodiments of the present application comprises two mainboard node assemblies, i.e., a first mainboard node assembly and a second mainboard node assembly. The first mainboard node assembly and the second mainboard node assembly are mounted on the same plane, i.e., the node mounting surface, so that the individual work and maintenance of each node can be met, and the maintenance convenience of the mainboard node is increased.

[0025] In some embodiments, the chassis base is provided with a first box lug and a second box lug, and the first box lug and the second box lug are both located at the front end of the server; wherein:

[0026] The first box lug is provided with a plurality of functional interfaces in signal connection with the first mainboard node assembly, and the second box lug is provided with a plurality of functional interfaces in signal connection with the second mainboard node assembly.

[0027] The first box lug and the second box lug are designed at the front end of the server, the functional interfaces on the first box lug are in signal connection with the first mainboard node assembly, and the functional interfaces on the second box lug are in signal connection with the second mainboard node assembly, so that the communication between the server chassis and the outside world is greatly expanded, and the use convenience of the server chassis is increased.

[0028] In some embodiments, the liquid cooling module comprises a support frame, a cold plate and a cold pipe;

[0029] The cold plate is fixed to the mainboard node module by the support frame and is in thermal contact with the mainboard node module;

[0030] The cold pipe is fixed to the side of the cold plate away from the mainboard node module.

[0031] The cold plate inside the server chassis is fixed on the plurality of mainboard node assemblies, and one cold plate is used to achieve the heat dissipation of the entire mainboard node module. The support frame is designed between the mainboard node module and the cold plate, the fixing structure is simple and reliable, the cost is low, and the influence of the cold plate on the mainboard module is avoided.

[0032] In some embodiments, the chassis base comprises a first side plate and a second side plate oppositely arranged along a second direction;

[0033] The inside of the chassis comprises a first wiring area, a cold pipe passing area and a second wiring area arranged in sequence along the second direction;

[0034] The first wiring area and the second wiring area are provided with wire clamps for wire arrangement, the wire clamps in the first wiring area are mounted on the first side plate, and the wire clamps in the second wiring area are mounted on the second side plate.

[0035] The cold pipes of the liquid cooling module are arranged in the cold pipe wiring area.

[0036] The internal design of the server case separates the cold pipe wiring area and the wiring area, so that the internal case is more tidy, and maintenance is more convenient.

[0037] In some embodiments, the first side plate and the second side plate are provided with a clamping groove structure matched with the middle module.

[0038] The middle module is fixed to the first side plate and the second side plate by fasteners.

[0039] The server supports the middle module, which is stacked above the liquid cooling module and fixed to the two side plates of the case base. The fixing structure is simple and reliable, and the cost is low.

[0040] In some embodiments, the rear module includes a half-height half-length module and a full-height half-length module; or, the rear module includes a full-height half-length module and a hard disk module.

[0041] The case base is provided with a first mounting position and a second mounting position on the side facing the rear end of the server, and the first mounting position and the second mounting position are arranged along the second direction; the first mounting position is used to mount the half-height half-length module or the hard disk module; and the second mounting position is used to mount the full-height half-length module.

[0042] The first mounting position and the second mounting position on the case base can adapt to two kinds of rear modules; that is, the half-height half-length module and the full-height half-length module, or the hard disk module and the full-height half-length module. The half-height half-length module and the hard disk module have the same mounting structure and can be installed with the same mounting position, increasing interchangeability so that the server can select to install appropriate rear modules as needed. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 An exploded view of a server provided by an embodiment of the present application;

[0044] Figure 2 An installation process diagram of a front side fan module of a server provided by an embodiment of the present application Figure 1 ;

[0045] Figure 3 An installation process diagram of a front side fan module of a server provided by an embodiment of the present application Figure 2 ;

[0046] Figure 4 A structure diagram of a first hard disk module in front of a server is provided for an embodiment of the present application.

[0047] Figure 5 An installation completed diagram of a first hard disk module in front of a server is provided for an embodiment of the present application.

[0048] Figure 6 An installation completed diagram of a second hard disk module in front of a server is provided for an embodiment of the present application.

[0049] Figure 7 An installation structure diagram of a server case base and a mainboard tray is provided for an embodiment of the present application.

[0050] Figure 8 A front side structure diagram of a server is provided for an embodiment of the present application.

[0051] Figure 9 A structure diagram of a liquid cooling module in a server is provided for an embodiment of the present application.

[0052] Figure 10 An internal wiring and pipe distribution area division diagram of a server is provided for an embodiment of the present application.

[0053] Figure 11 A structure diagram of a middle module in a server is provided for an embodiment of the present application.

[0054] Figure 12 An installation structure diagram of a server case base and a middle module is provided for an embodiment of the present application.

[0055] Figure 13 An installation structure diagram of a rear module in back of a server is provided for an embodiment of the present application. Figure 1

[0056] An installation structure diagram of a rear module in back of a server is provided for an embodiment of the present application. Figure 14 Figure 2 An installation structure diagram of a full height and half length module in back of a server is provided for an embodiment of the present application.

[0057] Figure 15 A structure diagram of a half height and half length module in back of a server is provided for an embodiment of the present application.

[0058] Figure 16 A structure diagram of a 2.5 inch hard disk module in back of a server is provided for an embodiment of the present application.

[0059] Figure 17

[0060] ​​Figure 18 A schematic diagram of the installation structure of a rear-mounted 2.5-inch hard drive module for a server provided in an embodiment of the present application;

[0061] Icons: 100-chassis; 200-front module; 300-fan module; 400-motherboard node module; 500-liquid cooling module; 600-middle module; 700-rear module; 800-first chassis ear; 900-second chassis ear; 101-first area; 102-second area; 103-third area; 104-fourth area; 105-fifth area; 106-first wiring area; 107-cold pipe wiring area; 108-second wiring area; 110-chassis base; 120-chassis cover; 111-fan compartment; 112-hard disk compartment; 113-node installation surface; 114-first side panel; 115-second side panel; 116- First mounting position; 117 - Second mounting position; 118 - Crossbeam; 112a - Screw; 112b - I-pin; 114a - Wire clamp; 115a - Wire clamp; 115b - Slot structure; 118a - Guide pin; 118b - Thumb screw hole; 119a - Pin guide hole; 119b - I-pin slot; 119c - IO board bracket; 1111 - Partition plate; 1112 - Back panel; 1131 - I-pin; 1132 - Screw; 1111a - Slot; 1111b - Stopper; M1 - Male blind-mate connector; M2 - Female blind-mate connector; 210 - First hard drive module; 220 - Second hard drive module; 211-2. 5-inch hard drive bay; 212-2.5-inch hard drive; 2111-screw fixing structure; 2112-I-nail fixing structure; 310-clip; 311-clamping part; 312-pull part; 320-status light; 330-handle; 410-first motherboard node assembly; 420-second motherboard node assembly; 411-first motherboard tray; 421-second motherboard tray; 510-support frame; 520-cold plate; 530-cold pipe; 531-main pipe; 610-tray; 620-supercapacitor bracket; 630-cable management clip; 640-center half-height half-length module; 611-fixing screw hole; 612-I-nail; 613-thumb screw; 710-half-height Half-length module; 720-full-height half-length module; 730-hard drive module; 721-guide pin; 722-I-nail; 723-pin guide hole; 724-thumbnail; 711-module compartment; 712-backplane; 713-PCIe card; 711a-guide pin; 711b-I-nail; 711c-pin guide hole; 711d-thumbnail; 731-2.5-inch hard drive compartment; 732-2.5-inch hard drive; 733-hard drive backplane; 731a-I-nail; 731b-guide pin; 731c-fixing screw hole; 731d-bottom support frame; 731e-pin guide hole; 731f-thumbnail. DETAILED DESCRIPTION

[0062] First, let me introduce the application scenario of this application: With the rapid development of big data and the Internet era, the demand for servers has increased significantly, and performance requirements are getting higher and higher. At present, simple air-cooled servers are gradually unable to meet the heat dissipation capacity required by high-power central processing units and other functional parts. In addition, the fan is noisy, which will affect the reading and writing of the hard disk in the server, so the demand for liquid-cooled servers is gradually increasing. The liquid cooling structure is much better than air cooling in heat dissipation capacity and has low noise, but the existing liquid cooling structures on the market rarely cover all functional parts, and thus cannot dissipate heat for all functional parts in the server. In addition, if liquid cooling radiators are fully adopted, the overall cost of the server will also increase, and the maximum cost-effectiveness cannot be achieved.

[0063] Based on the above application scenarios, an embodiment of the present application provides a server that includes at least one motherboard node assembly. When multiple motherboard node assemblies are present, these assemblies are arranged side by side. This allows maintenance of one motherboard node assembly without removing the others, improving maintenance convenience. Furthermore, the server is compatible with both air-cooling and liquid-cooling solutions, maximizing the server's heat dissipation capacity.

[0064] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0065] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to imply or suggest relative importance or implicitly indicate the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0066] like Figure 1As shown, the embodiment of the present application provides a server, comprising: a front module 200, a fan module 300, a mainboard node module 400, a liquid cooling module 500, a middle module 600 and a rear module 700;

[0067] The fan module 300, the mainboard node module 400 and the rear module 600 are arranged along a first direction; the fan module 300 and the front module 200 are arranged along a second direction; the mainboard node module 400, the liquid cooling module 500 and the middle module 600 are arranged along a third direction;

[0068] The mainboard node module 400 comprises at least one mainboard node assembly, and when the mainboard node assembly is multiple, the multiple mainboard node assemblies are arranged along the second direction; the mainboard node module 400, the liquid cooling module 500 and the middle module 600 are arranged along the third direction; the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the thickness direction of the server. In an embodiment, as shown in Figure 1 The first direction is the X direction, the second direction is the Y direction, and the third direction is the Z direction.

[0069] The server comprises the front module 200, the fan module 300, the mainboard node module 400, the liquid cooling module 500, the middle module 600 and the rear module 700; the layout of each module inside the server is as follows:

[0070] Along the first direction, the fan module 300 and the front module 200 are arranged side by side along the second direction at one end of the server; the mainboard node module 400, the liquid cooling module 500 and the middle module 600 are arranged in layers along the third direction in the middle of the server; and the rear module is located at the other end of the server.

[0071] In an embodiment, the first direction is the length direction of the server, the second direction is the width direction of the server, and the third direction is the thickness direction of the server.

[0072] The server provided by the embodiment of the present application integrates the fan module and the liquid cooling module on the basis of completing the layout of each module, can have both air cooling and liquid cooling heat dissipation modes, and meets the heat dissipation requirements of all parts inside the server.

[0073] In some embodiments, as shown in Figure 1 The server comprises a case 100 and the front module 200, the fan module 300, the mainboard node module 400, the liquid cooling module 500, the middle module 600 and the rear module 700 inside the case; the case 100 comprises a case base 110 and a case upper cover 120, the case upper cover 120 is covered on the case base 110, and cooperates with the case base 110 to form the internal space of the case 100. Along the first direction, the internal space of the case 100 comprises a first area 101, a second area 102 and a third area 103;

[0074] The front module 200 and the fan module 300 are arranged in the first area 101, the mainboard node module 400, the liquid cooling module 500 and the middle module 600 are arranged in the second area 102, and the rear module 700 is arranged in the third area 103. In the second area 102: the mainboard node module 400 includes at least one mainboard node assembly, that is, the server supports multiple mainboard node assemblies, realizing two layout modes of multiple nodes and single node. And in the second area 102, the mainboard node module 400, the liquid cooling module 500 and the middle module 600 are stacked along the third direction. The first direction, the second direction and the third direction are perpendicular to each other.

[0075] The first area 101 is defined as the front side area of the server, the third area 103 is defined as the rear side area of the server, and the second area 102 is defined as the middle area of the server. The front module 200 and the fan module 300 are located at the front side of the server, the rear module 700 is located at the rear side of the server, the upper cover 120 of the case is located at the top side of the server, and the case base 110 is located at the bottom side of the server. When multiple mainboard node assemblies are installed in the server, the multiple mainboard node assemblies are arranged from left to right.

[0076] In some embodiments, as shown in Figure 2 The case base 110 is provided with multiple installation compartments towards the front end side of the server, and the multiple installation compartments are arranged along the second direction; the multiple installation compartments include the fan compartment 111; the fan compartment 111 includes a compartment partition plate 111, and the fan compartment 111 forms an installation opening for allowing the fan module 300 to enter and exit towards the outside end of the case 100; the back plate 1112 is fixed on the case base 110, and the back plate 1112 is located on the side of the fan module 300 away from the installation opening;

[0077] The fan module 300 is connected with the blind plug connector on the back plate 1112 through plug-in, and is locked with the compartment partition plate 1111 through the detachable connection structure.

[0078] The fan module 300 is located at one end of the server case, such as the front end, and the installation opening of the fan module 300 is located at the end face of the case 100, which can realize the maintenance of the fan module 300 without opening the upper cover 120 of the case. The fan module 300 is connected with the blind plug connector on the back plate 1112 through plug-in, realizing the blind plug function of the fan module 300, and greatly improving the operation convenience of the server case.

[0079] In an embodiment, as shown in Figure 2 and Figure 3As shown, the front side of the chassis base 110 is provided with a mounting space, which is divided into five mounting spaces by a plurality of warehouse partition plates arranged along the second direction. The five mounting spaces are arranged along the Y direction in turn. The five mounting spaces include four fan spaces 111, and each fan space 111 can install one fan module 300. The fan is modularized in the embodiment, which is convenient for installation and maintenance.

[0080] As shown in the figure, Figure 2 The installation opening of the fan space 111 for the fan module 300 to enter and exit is located at the front side of the server, and the fan module 300 can be installed into the fan space 111 from the front side of the server. The fan module 300 can be disassembled when the upper cover 120 of the chassis is assembled with the chassis base 110, without opening the upper cover.

[0081] As shown in the figure, Figure 3 The end of the fan space 111 away from the installation opening is provided with a back plate 1112 for electrical connection with the fan module 300, and the back plate 1112 is fixedly arranged on the chassis base 110. In one embodiment, the tail end of the fan module 300 is provided with a male header M1 of a blind plug connector, and the surface of the back plate 1112 away from the chassis base 110 is fixedly provided with a female header M2 of a blind plug connector. The male header M1 of the blind plug connector is plugged into the female header M2 of the blind plug connector to realize the blind plug function of the fan module 300.

[0082] In some embodiments, the end of the fan module 300 towards the outside of the chassis 100 is provided with a buckle 310 for clamping with the warehouse partition plate 1111; the buckle 310 includes a clamping portion 311 and a pulling portion 312, and the pulling portion 312 is used to drive the clamping portion 311 to be unlocked with the warehouse partition plate 1111.

[0083] The fan module 300 is clamped and locked with the chassis base 110, and the fan module 300 and the chassis base 110 can be unlocked by driving the pulling portion 312, which greatly improves the convenience of disassembling the fan module 300.

[0084] In one embodiment, as shown in the figure, Figure 2 A status lamp 320 is designed on the fan module 300, and the working state of the fan can be observed by the display of the status lamp 320, which is convenient for timely processing problems. In this embodiment, the handle 330 of the fan module 300 is used for installation and unlocking of the fan module 300. When unlocking, the pulling portion 312 is pressed, and the handle 330 is gripped at the same time for unlocking and installation. The fan module 300 is designed with a clamping groove 1111a on the fan space partition plate 1111 in the chassis base 110 of the server, which ensures that the fan module 300 does not fall out after installation. Figure 3 As shown in the figure, The rear side of the fan space partition plate 1111 is designed with a stop protruding bridge 1111b to prevent the fan module 300 from being installed too deep.

[0085] In some embodiments, the buckle 310 on the fan module 300 is located on one side of the fan module 300, such as the left side or the right side, to avoid affecting the installation of the fan module 300 in the adjacent fan compartment 111.

[0086] Such design modularizes the fan module and adopts a screwless design, which can support the fan module to be quickly disassembled and maintained without opening the cover, support blind insertion, and greatly improve the operation convenience of the server case.

[0087] In some embodiments, as shown in Figure 2 , the plurality of installation compartments further include a hard disk compartment 112; and the front module 200 is installed in the hard disk compartment 112; and the front module 200 is a first hard disk module 210 or a second hard disk module 220.

[0088] The hard disk compartment 112 on the case base 110 can be adapted to two front modules 200, i.e., the first hard disk module 210 and the second hard disk module 220, and the first hard disk module 210 and the second hard disk module 220 have the same installation structure and can be installed with the same hard disk compartment 112, increasing interchangeability so that the server can select to install a suitable hard disk module as needed.

[0089] In one embodiment, as shown in Figure 2 , the front side of the case base 110 is provided with an installation space, and the installation space is divided into five installation compartments by a plurality of compartment partitions arranged in a second direction, and the five installation compartments are arranged in sequence along the Y direction. The five installation compartments include four fan compartments 111 and one hard disk compartment 112, and two fan compartments 111 are respectively arranged on the two sides of the hard disk compartment 112. The hard disk compartment 112 can install one first hard disk module 210 such as a 2.5-inch hard disk module, or one second hard disk module 220 such as an E1.S module. The 2.5-inch hard disk module and the E1.S module have the same installation structure to adapt to the same hard disk compartment 112.

[0090] The following describes the interchangeable installation structure by taking the 2.5-inch hard disk module as an example:

[0091] As shown in Figure 4 , the front 2.5-inch hard disk module includes a 2.5-inch hard disk compartment 211, a 2.5-inch hard disk 212, and a hard disk back plate (not shown in the figure). The 2.5-inch hard disk compartment 211 is designed with a screw fixing structure 2111 and a I-shaped stud fixing structure 2112. As shown in Figure 5As shown, the server case 100 is locked by screws 112a at the front side and by nails 112b at the back side, which satisfies the installation and fixation of the front 2.5-inch hard disk module and the limiting function. This fixing structure is simple and reliable. Meanwhile, considering the interchangeability of the module, the front 2.5-inch hard disk module is designed as an integral module, and the server case base 110 is designed with a hard disk compartment 112, so that the server case 100 can satisfy the replacement of other hard disk module designs, and is not limited to the 2.5-inch hard disk module.

[0092] Figure 6 The structural diagram of installing the E1.S module for the hard disk compartment 112. The installation mode is consistent with that of the front 2.5-inch hard disk module, which will not be described herein.

[0093] In some embodiments, as shown in Figure 7 The case base 110 includes a node installation surface 113; the mainboard node module 400 includes a first mainboard node assembly 410 and a second mainboard node assembly 420; and the first mainboard node assembly 410 and the second mainboard node assembly 420 are both installed on the node installation surface 113.

[0094] The server provided by the embodiments of the present application includes two mainboard node assemblies, i.e., the first mainboard node assembly 410 and the second mainboard node assembly 420. The first mainboard node assembly 410 and the second mainboard node assembly 420 are installed on the same plane, i.e., the node installation surface 113, which can satisfy the independent work and maintenance of each node and increase the maintenance convenience of the mainboard node.

[0095] In one embodiment, the mainboard node module 400 includes two mainboard node assemblies, and each mainboard node assembly includes a mainboard tray and a node mainboard. The mainboard node assembly is installed on the case base 110 through the mainboard tray, and the node mainboard is installed on the node tray.

[0096] As shown in Figure 7 The server case mainboard node is designed on the same horizontal plane, i.e., the node installation surface 113, and the two mainboard node assemblies are distributed on the left and right sides of the server case, Figure 7 The first mainboard tray 411 of the first mainboard node assembly 410 and the second mainboard tray 421 of the second mainboard node assembly 420 are clamped by nails 1131 and fixed by hand screws 1132. The node mainboard of the first mainboard node assembly 410 is installed on the first mainboard tray 411, and the node mainboard of the second mainboard node assembly 420 is installed on the second mainboard tray 421. This design scheme realizes the installation of the first mainboard node assembly 410 and the second mainboard node assembly 420 on the same horizontal plane, can satisfy the independent work and maintenance of each node, and does not interfere with each other, thereby increasing the maintenance convenience of the mainboard node.

[0097] In some embodiments, as shown inFigure 8 As shown, the first and second box ears 800 and 900 are arranged on the chassis base 110 and located at the front end of the server; wherein:

[0098] The first box ear 800 is provided with a plurality of functional interfaces connected with the first mainboard node assembly 410, and the second box ear 900 is provided with a plurality of functional interfaces connected with the second mainboard node assembly 420.

[0099] The first and second box ears 800 and 900 are designed at the front end of the server, the functional interfaces on the first box ear 800 are connected with the first mainboard node assembly 410, and the functional interfaces on the second box ear 900 are connected with the second mainboard node assembly 420, which greatly expands the communication between the server chassis and the outside world and increases the use convenience of the server chassis.

[0100] In an embodiment, the middle region of the server chassis 100 contains two mainboard node assemblies, and each node mainboard supports two vertically distributed central processing units. In addition, each node is designed with an adaptive box ear, an input / output (IO) module, and an Open Compute Project (OCP) module, including switch keys, RJ45, Video Graphics Array (VGA), Type-C, and USB functional interfaces, which greatly expands the communication between the server chassis and the outside world and increases the use convenience of the server chassis.

[0101] As shown, Figure 8 The server chassis 100 is designed with the first and second box ears 800 and 900, the fan module 300, and the front module 200 at the front end. The first and second box ears 800 and 900 are respectively located at the left and right sides of the chassis 100. Figure 8 As shown, the fourth region 104 is defined as the left side region of the server, and the fifth region 105 is defined as the right side region of the server. The fourth region 104 is the control region of the first mainboard node assembly 410, and the fifth region 105 is the control region of the second mainboard node assembly 420.

[0102] In some embodiments, as shown, Figure 9 The liquid cooling module 500 includes a support frame 510, a cold plate 520, and a cold pipe 530. The cold plate 520 is fixed to the mainboard node module 400 through the support frame 510 and is in thermal contact with the mainboard node module 400. The cold pipe 530 is fixed to the side of the cold plate 520 away from the mainboard node module 400.

[0103] The cold plate 520 inside the server chassis 100 is fixed on the plurality of mainboard node assemblies, and one cold plate 520 is used to achieve the heat dissipation of the entire mainboard node module 400. The support frame 510 is designed between the mainboard node module 400 and the cold plate 520, and the fixing structure is simple and reliable, the cost is low, and the influence of the cold plate 520 on the mainboard module is avoided.

[0104] As shown in Figure 9 The liquid cooling module 500 includes a cold plate 520, a support frame 510, and a cold pipe 530. Two node mainboards share one cold plate 520; the cold plate 520 is fixed with the cold pipe 530 on the surface away from the mainboard.

[0105] It should be noted that, in view of stability, the support frame 510 is added below the cold plate 520, and the support frame 510 and the cold plate 520 are fixed by screws, and the support frame 510 and the mainboard are fixed by screws, so as to reduce the risk of damage to the mainboard due to insecure fixing.

[0106] In some embodiments, as shown in Figure 10 The chassis base 110 includes a first side plate 114 and a second side plate 115 arranged opposite in the second direction; the inside of the chassis 100 includes a first wiring area 106, a cold pipe area 107, and a second wiring area 108 arranged in sequence in the second direction;

[0107] The first wiring area 106 and the second wiring area 108 are both provided with wire clamps for wire arrangement, the wire clamp 114a in the first wiring area 106 is installed on the first side plate 114, and the wire clamp 115a in the second wiring area 108 is installed on the second side plate 115;

[0108] The cold pipe 530 of the liquid cooling module 500 is arranged in the cold pipe area 107.

[0109] The inside of the server chassis 100 is designed to separate the cold pipe area and the wiring area, so that the inside of the chassis 100 is more tidy, and maintenance is more convenient.

[0110] As shown in Figure 10As shown, the chassis base 110 includes a first side plate 114 and a second side plate 115 opposite in the width direction, the first side plate 114 can be defined as the left side plate of the chassis base 110 and the second side plate 115 can be defined as the right side plate of the chassis base 110 when viewed from the front end of the chassis 100; the first cable routing area 106 is close to the first side plate 114 and the second cable routing area 108 is close to the second side plate 115. The first cable routing area 106 and the second cable routing area 108 are cable routing areas inside the server chassis 100, and the internal cables of the server chassis 100 are bundled by the two side cable clips 114a and 115a. The cold pipes 530 on the cold plate 520 include a main pipe 531 and a plurality of branch pipes, the main pipe 531 extends along the rear end of the chassis 100 to the front end close to the second area 102, ensuring the entry and exit of the liquid in the cold pipe 530. The cold pipe pipe routing area 107 is the pipe routing area of the main pipe 531 of the cold pipe.

[0111] The embodiment of the present application separates the cold pipe and cable areas, clearly divides the functional areas, and makes the inside of the server chassis 100 more tidy, and the maintenance more convenient. The internal cables and cold pipes of the server chassis 100 can be maintained separately without interference.

[0112] In some embodiments, as shown in Figure 11 and Figure 12 The first side plate 114 is provided with a clamping groove structure (not shown in the figure) matched with the middle module 600, and the second side plate 115 is provided with a clamping groove structure 115b matched with the middle module 600.

[0113] The middle module 600 is fixed to the first side plate 114 and the second side plate 115 by fasteners.

[0114] The server supports the middle module 600, the middle module 600 is stacked above the liquid cooling module 500, and is fixed to the two side plates of the chassis base 110, the fixing structure is simple and reliable, and the cost is low.

[0115] As shown in Figure 11 The server chassis 100 supports the middle module 600, including a tray 610, a super capacitor support 620, a wire management clip 630 and a middle half-height half-length module 640. The tray 610 is designed with a screw hole 611 and a dowel 612. The dowel 612 cooperates with the clamping groove structure 115b in the server chassis base 110 which is matched with the dowel 612, and is fixed by screws 613 on both sides, as shown in Figure 12 The structure is simple and reliable, and the cost is low. The dowels 612 on both sides of the middle module 600 play a role in installation and positioning, and are fixed by screws. This combined fixing method has a simple and reliable structure.

[0116] In some embodiments, the rear module 700 includes a half-height, half-length (HHHL) module 710 and a full-height, half-length (FHHL) module 720; or, the rear module 700 includes a full-height, half-length module 720 and a hard disk module 730.

[0117] As shown in Figure 12 , the chassis base 110 is provided with a first mounting position 116 and a second mounting position 117 towards the rear side of the server, and the first mounting position 116 and the second mounting position 117 are staggered along the second direction; the first mounting position 116 is used to install a half-height, half-length module 710 or a hard disk module 730; and the second mounting position 117 is used to install a full-height, half-length module 720.

[0118] The first mounting position 116 and the second mounting position 117 on the chassis base 110 can be adapted to two kinds of rear modules 700; that is, a half-height, half-length module 710 and a full-height, half-length module 720, or a hard disk module 730 and a full-height, half-length module 720. The half-height, half-length module 710 and the hard disk module 730 have the same mounting structure and can be installed with the same mounting position, increasing the interchangeability so that the server can select to install the appropriate rear module according to the needs.

[0119] As shown in Figure 13 and Figure 14 , the rear side of the server chassis 100 is designed with mounting positions for rear half-height, half-length modules 710, rear full-height, half-length modules 720 and rear 2.5-inch hard disk modules 730, wherein the rear half-height, half-length modules 710 and the rear 2.5-inch hard disk modules 730 have consistent fixing structures and can be installed interchangeably with the same mounting position. The server chassis expandability is increased, and can be matched according to different use scenarios to maximize customer demand.

[0120] As shown in Figure 15 , the rear full-height, half-length module 720 is designed with a guide PIN 721, a dowel 722, a PIN dowel guide hole 723 and a hand screw 724. The rear window of the server chassis is designed to adapt to the PIN dowel guide hole 119a and the dowel slot 119b of the rear full-height, half-length module 720, and the guide PIN 118a and the hand screw hole 118b of the rear full-height, half-length module 720 are designed on the cross beam 118 to adapt to the rear full-height, half-length module 720. The above structure can be used to fix the rear full-height, half-length module 720 with the chassis base 110 of the server.

[0121] As shown in Figure 16As shown, the rear half-height half-length module 710 includes a module compartment 711, a riser backboard 712, and a half-height half-length PCIe card 713. The module compartment 711 is designed with a guide PIN 711a, a dowel 711b, a PIN dowel guide hole 711c, and a hand screw 711d.

[0122] As shown, the rear half-height half-length module 710 includes a module compartment 711, a riser backboard 712, and a half-height half-length PCIe card 713. The module compartment 711 is designed with a guide PIN 711a, a dowel 711b, a PIN dowel guide hole 711c, and a hand screw 711d. Figure 17 As shown, the rear half-height half-length module 710 includes a module compartment 711, a riser backboard 712, and a half-height half-length PCIe card 713. The module compartment 711 is designed with a guide PIN 711a, a dowel 711b, a PIN dowel guide hole 711c, and a hand screw 711d.

[0123] As shown, the rear half-height half-length module 710 includes a module compartment 711, a riser backboard 712, and a half-height half-length PCIe card 713. The module compartment 711 is designed with a guide PIN 711a, a dowel 711b, a PIN dowel guide hole 711c, and a hand screw 711d. Figure 18 As shown, the rear half-height half-length module 710 includes a module compartment 711, a riser backboard 712, and a half-height half-length PCIe card 713. The module compartment 711 is designed with a guide PIN 711a, a dowel 711b, a PIN dowel guide hole 711c, and a hand screw 711d.

[0124] In addition, the rear half-height half-length module and the rear 2.5-inch hard disk module share the chassis base PIN dowel guide hole 119a, the dowel slot 119b, and the guide PIN dowel 118a and the hand screw hole 118b structure on the crossbeam 118, realizing the disassembly and interchange of the rear half-height half-length module and the rear 2.5-inch hard disk module in the server chassis.

[0125] The server integrated air cooling and liquid cooling structure designs provided by the embodiments of the present application realize the heat dissipation requirements of all functional components inside the server. Meanwhile, the server supports two motherboard node components, and can realize two layout modes of double nodes and single node. Meanwhile, the cables and cold pipes of the chassis are divided into independent areas, so that the inside of the server chassis is more tidy, and maintenance is more convenient. In addition, the modules in the first front area and the third rear area of the server are structured and designed to be interchangeable, and can be flexibly configured according to actual use configuration requirements, fully realizing the flexible and variable structure.

[0126] It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application cover the modifications and variations of this application provided they come within the scope of the appended claims and their equivalents.

Claims

1. A server, characterized in that: include: Front module, fan module, motherboard node module, liquid cooling module, middle module and rear module; The fan module, the mainboard node module and the rear module are arranged along a first direction; The fan module and the front module are arranged along a second direction; The mainboard node module, the liquid cooling module and the central module are arranged along a third direction; Among them, the motherboard node module includes at least one motherboard node component, and when there are multiple motherboard node components, the multiple motherboard node components are arranged along the second direction; the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the thickness direction of the server.

2. The server according to claim 1, wherein: The server also includes a chassis; The chassis includes a chassis base and a chassis cover; the chassis cover is covered on the chassis base and forms an internal space of the chassis together with the chassis base; A plurality of mounting compartments are provided on a side of the chassis base facing the front end of the server, and the plurality of mounting compartments are arranged along a second direction; The multiple mounting bays include a fan bay; the fan bay includes a bay partition; an end of the fan bay facing the outside of the chassis forms a mounting opening for allowing the fan module to enter and exit; a back plate is fixedly provided on the chassis base, and the back plate is located on a side of the fan bay away from the mounting opening; The fan module is plugged into the back panel via a blind-plug connector and is locked to the compartment partition via a detachable connection structure.

3. The server according to claim 2, wherein: The fan module is provided with a buckle on one end facing the outside of the chassis for engaging with the compartment partition; The buckle includes a clamping portion and a pulling portion, and the pulling portion is used to drive the clamping portion to unlock the compartment partition.

4. The server according to claim 2, wherein: The multiple installation bays also include a hard disk bay; the front module is installed in the hard disk bay; the front module is a first hard disk module or a second hard disk module.

5. The server according to claim 2, wherein: The chassis base includes a node mounting surface; the motherboard node module includes a first motherboard node component and a second motherboard node component; The first mainboard node assembly and the second mainboard node assembly are both mounted on the node mounting surface.

6. The server according to claim 5, wherein: The chassis base is provided with a first chassis ear and a second chassis ear, and the first chassis ear and the second chassis ear are both located at the front end of the server; wherein: The first box ear is provided with a plurality of functional interfaces connected to the first mainboard node component signals, and the second box ear is provided with a plurality of functional interfaces connected to the second mainboard node component signals.

7. The server according to claim 2, wherein: The liquid cooling module includes a support frame, a cold plate and a cold pipe; The cold plate is fixed to the mainboard node module through the support frame and is in thermal contact with the mainboard node module; The cooling pipe is fixed on a side of the cold plate away from the mainboard node module.

8. The server according to claim 7, wherein: The chassis base includes a first side plate and a second side plate arranged opposite to each other along a second direction; The interior of the chassis includes a first wiring area, a cooling pipe wiring area, and a second wiring area arranged in sequence along the second direction; The first wiring area and the second wiring area are both provided with a wire clip for wiring, the wire clip in the first wiring area is mounted on the first side panel, and the wire clip in the second wiring area is mounted on the second side panel; The cooling pipes of the liquid cooling module are arranged in the cooling pipe routing area.

9. The server according to claim 8, wherein: The first side panel and the second side panel are both provided with a slot structure for engaging with the central module; The central module is fixed to the first side panel and the second side panel by fasteners.

10. The server according to claim 2, wherein: The rear module includes a half-height half-length module and a full-height half-length module; or, the rear module includes a full-height half-length module and a hard disk module; The chassis base is provided with a first mounting position and a second mounting position on the side facing the rear end of the server, and the first mounting position and the second mounting position are arranged along the second direction; the first mounting position is used to install the half-height and half-length module or the hard disk module; the second mounting position is used to install the full-height and half-length module.

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