Film sticking machine for semiconductor device

Abstract

The film sticking machine for the semiconductor device comprises a film sticking machine shell, a machine cover and a film roll placing assembly, the film roll placing assembly is installed at the top end of one side of the film sticking machine shell, and one side of the film roll placing assembly is movably hinged to the machine cover; a film roll winding and unwinding assembly is installed in the film pasting machine shell, a partition plate is arranged on one side in the film pasting machine shell, an unwinding opening is formed in the partition plate, and a film roll is connected with the film roll winding and unwinding assembly through the unwinding opening; a cutting assembly is installed on the machine cover and located above the film roll winding and unwinding assembly. The automatic film laminating and convenient automatic winding functions in the film laminating process are achieved through the film roll winding and unwinding assembly, the film laminating efficiency is improved, meanwhile, the cutting assembly capable of adjusting the cutting radius is further installed, and flexible adjustment of the cutting radius can be achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor processing equipment, especially relates to a film sticking machine for semiconductor device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and is a basic material for manufacturing semiconductor chips. Because the wafer surface has high smoothness requirement, is prone to wear during processing, and therefore, the wafer surface is usually covered with a film to protect the wafer structure.

[0003] At present, wafer film sticking mostly relies on manual operation, and the operator needs to manually pull out a protective film, then cover it on the semiconductor surface, and then take out the waste film, which is time-consuming and laborious, affects the film sticking efficiency, and moreover, the cutting radius of the cutting device cannot be adjusted according to the size of the semiconductor before film sticking, thereby affecting the cutting flexibility. In view of the above, it is necessary to provide a semiconductor device film sticking machine capable of quickly winding and unwinding the film roll and flexibly adjusting the cutting radius to solve the above technical defects. SUMMARY

[0004] The utility model discloses a film sticking machine for semiconductor device, which realizes automatic film covering and automatic winding in the film sticking process through the film roll winding and unwinding assembly, improves the film sticking efficiency, and is also provided with a cutting assembly capable of flexibly adjusting the cutting radius.

[0005] The utility model provides a kind of film sticking machine for semiconductor device, including film sticking machine shell, machine cover and film roll placement assembly, the film roll placement assembly is installed in the film sticking machine shell one side top, machine cover is movably hinged in the film roll placement assembly one side;The film sticking machine shell is internally provided with film roll winding and unwinding assembly, and the film sticking machine shell is internally provided with baffle on one side, and the baffle is provided with unwinding port, and film roll is connected with the film roll winding and unwinding assembly by the unwinding port;The machine cover is installed with cutting assembly, and the cutting assembly is located above the film roll winding and unwinding assembly. Through the setting film roll winding and unwinding assembly, automatic winding and unwinding are carried out during film sticking process, improve film sticking efficiency, and cutting assembly can flexibly adjust cutting radius according to different wafer size, improve cutting flexibility.

[0006] The film sticking machine shell is internally provided with placement plate, the placement plate is provided with reserved slot, four groups of adjusting sliding slots are arranged in the reserved slot, and the adjusting sliding slots are provided with limiting baffle by sliding block. According to the different wafer semiconductor size, the position of the limiting baffle is flexibly adjusted, and the wafer is flexibly limited.

[0007] The film winding and unwinding assembly comprises parallel displacement driving units, winding units are installed on the displacement driving units, and the displacement driving units drive the winding units to perform winding work.

[0008] The displacement driving units comprise screw rails arranged on both sides of the placing plate, screws are installed in the screw rails, one end of the screw is connected with a servo motor, a screw sleeve is assembled on the screw, the winding unit is connected with the screw sleeve, the screw rotates to drive the screw sleeve to move along the screw rail and perform film pasting.

[0009] The winding unit comprises a winding shaft, an adhesive strip is fixedly connected with the winding shaft, a driving motor is installed in the screw sleeve, and the driving motor drives the winding shaft to drive the film to move and perform film pasting and winding.

[0010] The cutting assembly comprises a cutting handle, a cutting blade and a lifting unit, the cutting handle is installed on the outer end surface of the cover, the lower end of the cutting handle penetrates through the cover and is installed with the lifting unit, the lower end of the lifting unit is installed with the cutting blade, and the cutting blade is lifted and rotated to cut the film by rotating the cutting handle.

[0011] The cutting assembly further comprises a mounting sleeve arranged on the outer end surface of the cover, a cutting rod is slidingly installed in the mounting sleeve, a guide groove is arranged on the cover and corresponds to the position of the cutting rod, the lower end of the cutting handle is located in the guide groove, and the cutting rod and the mounting sleeve are fixedly connected through a locking unit to ensure the stability during cutting.

[0012] The locking unit comprises a fixing hole arranged on the cutting rod, a through hole is arranged on the mounting sleeve, and the through hole and the fixing hole are fixed through a fixing bolt. When the cutting radius is adjusted, the cutting rod moves in the mounting sleeve, and then the cutting rod is fixed through the fixing bolt, so that the cutting radius is adjusted.

[0013] The unwinding opening is horizontally arranged with the winding shaft, so that the film pasting process is smoothly performed.

[0014] The bottom end of the film pasting machine shell is fixedly connected with an anti-skid seat, and the top end of the cover is provided with a visual window, so that the stability of the film pasting machine during the film pasting process is ensured, and the process condition during the film pasting process is observed.

[0015] Compared with the prior art, the film winding and unwinding assembly is arranged, the screw and the winding shaft are driven by the motor to rotate, the functions of automatically pasting the film on the wafer and automatically winding during the process are realized, the film pasting efficiency is improved, the cutting assembly with adjustable cutting radius is further installed, the cutting radius is flexibly adjusted by moving the cutting rod in the mounting sleeve, and the wafer is flexibly limited through the limiting baffle. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a schematic diagram of the front view structure of a film laminating machine for semiconductor devices provided by the utility model;

[0018] Figure 2 This is a schematic diagram of the top view of a film laminating machine for semiconductor devices provided by the utility model;

[0019] Figure 3 For the utility model Figure 2 A in the middle is an enlarged structural diagram;

[0020] Figure 4 The utility model provides a side view of the structure of a film laminating machine for semiconductor devices. DETAILED DESCRIPTION

[0021] The following is a clear and complete description of the technical solutions in the specific embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0022] In an embodiment of the present invention, a film laminating machine for semiconductor devices is provided. Figures 1-4 As shown, it includes a film laminating machine housing 1, a film roll retracting and unreeling assembly 2, a machine cover 3, a film roll placement assembly 4, a cutting assembly 5 and a placement plate 7.

[0023] like Figure 1 As shown, a film roll placement assembly 4 is mounted on the top of one side of the film laminating machine housing 1, with a cover 3 movably hinged to one side of the film roll placement assembly 4. A film roll reel assembly 2 is mounted inside the film laminating machine housing 1, and a partition 8 is provided on one side of the interior of the film laminating machine housing 1. The partition 8 is provided with a reel opening, through which the film roll is connected to the film roll reel assembly 2. A cutting assembly 5 is mounted on the cover 3 and is located above the film roll reel assembly 2. By arranging the film roll reel assembly to automatically reel in and out during the film laminating process, film laminating efficiency is improved, and the cutting assembly can flexibly adjust the cutting radius according to different wafer sizes, improving film cutting flexibility.

[0024] like Figure 2As shown, a placement plate 7 is installed in the laminating machine housing 1. The placement plate 7 is provided with a reserved groove 6. The reserved groove 6 is provided with four sets of adjustment slots 61. The adjustment slots 61 are installed with limit baffles 62 through sliders. According to the different sizes of the wafer semiconductors, the position of the limit baffles 62 can be flexibly adjusted to flexibly limit the wafer.

[0025] The film roll rewinding assembly 2 includes a displacement drive unit arranged in parallel, and the rewinding unit is installed on the displacement drive mechanism, and the displacement drive mechanism drives the rewinding unit to perform the rewinding work. The displacement drive unit includes a screw guide rail 22 arranged on both sides of the placement plate 7, a screw is installed in the screw guide rail, one end of the screw is connected to the servo motor 24, a screw sleeve 23 is installed on the screw, and the rewinding unit is connected to the screw sleeve 23. The rotation of the screw drives the screw sleeve 23 to move along the screw guide rail to perform film application. The rewinding unit includes a rewinding shaft 21, and an adhesive strip is fixedly connected to the rewinding shaft 21, such as Figure 3 As shown, a driving motor 25 is installed inside the screw sleeve 23, and the winding shaft 21 drives the film to move for film application and winding.

[0026] like Figure 4 As shown, the cutting assembly 5 includes a cutting handle 51, a cutting blade 53, and a lifting unit. The cutting handle 51 is mounted on the outer end surface of the cover 3, and its lower end passes through the cover 3 and is mounted with the lifting unit. The cutting blade 53 is mounted at the lower end of the lifting unit. Rotating the cutting handle 51 drives the cutting blade 53 to rotate and cut the film. The cutting assembly also includes a mounting sleeve 54 disposed on the outer end surface of the cover. The cutting rod 52 is slidably mounted within the mounting sleeve 54. A guide groove is provided on the cover 3 corresponding to the position of the cutting rod 52. The lower end of the cutting handle 51 is located within the guide groove. The cutting rod 52 and the mounting sleeve 54 are fixedly connected by a locking unit to ensure stable cutting. The locking unit includes a fixing hole provided on the outside of the cutting rod 52 and a through hole provided on the mounting sleeve 54. The through hole and the fixing hole are fixed by fixing bolts. When adjusting the cutting radius, the cutting rod 52 moves inside the mounting sleeve 54 and is then fixed with fixing bolts to achieve flexible adjustment of the cutting radius.

[0027] The unwinding port is level with the reel shaft to ensure smooth film lamination.

[0028] The bottom end of the film laminating machine housing 1 is fixedly connected with an anti-slip seat, and the top of the machine cover 3 is provided with a viewing window to ensure the stability of the film laminating machine during the film laminating process and facilitate observation of the process during the film laminating process.

[0029] The utility model discloses a work mode as follows: wafer is placed in the reserved groove 6, and through the spacing baffle 62 spacing clamping to wafer, the starting end of film is adhered on the winding shaft 21 before pasting the film, then start servo motor 24, drive the rotation of the lead screw, and the lead screw sliding sleeve 23 drives the winding shaft 21 to move from the starting end at the unwinding mouth to the working end, and the winding shaft 21 drives the film to cover on the wafer surface; hold the cutting handle 51 and press down, and the lifting unit drives the cutting blade 53 to move down to the wafer above, and rotates the cutting handle 51 and drives the cutting blade 53 to rotate and cut the film, and according to the size of wafer, adjust the position of cutting rod 52 in the mounting sleeve 54 before cutting, and through the fixed bolt, cutting rod 52 is fixed, and the cutting radius is adjusted; drive motor 25 drives the winding shaft 21 to rotate and winds the excess waste film, realizes the function of automatic film covering.

[0030] It is obvious for those skilled in the art that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point, the embodiments should be regarded as exemplary and non-restrictive, the scope of the utility model is defined by the appended claims instead of the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims should be included in the utility model. Any figure mark in the claims should not be regarded as limiting the involved claims.

Claims

1. A film laminating machine for semiconductor devices, characterized in that: The invention comprises a film laminating machine housing (1), a machine cover and a film roll placement assembly (4), wherein the film roll placement assembly (4) is installed at the top of one side of the film laminating machine housing (1), and a cover (3) is movably hinged on one side of the film roll placement assembly (4); a film roll reeling assembly (2) is installed inside the film laminating machine housing (1), a partition (8) is provided on one side of the interior of the film laminating machine housing (1), a reeling opening is provided on the partition (8), and the film roll is connected to the film roll reeling assembly (2) through the reeling opening; a cutting assembly (5) is installed on the machine cover (3), and the cutting assembly (5) is located above the film roll reeling assembly (2); a placement plate (7) is installed inside the film laminating machine housing (1); the film roll reeling assembly (2) comprises a displacement drive unit arranged in parallel, and a reeling unit is installed on the displacement drive unit; the displacement drive unit comprises a screw guide rail (22) arranged on both sides of the placement plate, a screw guide is installed in the screw guide rail (22), and one end of the screw guide is connected to a servo motor ( 24), a screw sleeve (23) is mounted on the screw rod, and a winding unit is connected to the screw sleeve (23); the winding unit includes a winding shaft (21), an adhesive strip is fixedly connected to the winding shaft (21), and a driving motor (25) is installed inside the screw sleeve (23); the cutting assembly (5) includes a cutting handle (51), a cutting blade (53) and a lifting unit, the cutting handle (51) is mounted on the outer end surface of the machine cover (3), and the lower end passes through the machine cover (3) and is installed with the lifting unit, and the lower end of the lifting unit is installed with the cutting blade (53); the cutting assembly (5) also includes a mounting sleeve (54) arranged on the outer end surface of the machine cover (3), a cutting rod (52) is slidably mounted in the mounting sleeve (54), a guide groove is arranged on the machine cover corresponding to the position of the cutting rod, the lower end of the cutting handle (51) is located in the guide groove, and the cutting rod (52) and the mounting sleeve (54) are fixedly connected by a locking unit.

2. A film laminating machine for semiconductor devices according to claim 1, characterized in that: A reserved groove (6) is provided on the placement plate (7), and four groups of adjustment slides (61) are provided in the reserved groove (6). The adjustment slides (61) are provided with a limit baffle (62) via a slider.

3. The semiconductor device laminating machine according to claim 1, characterized in that: The locking unit comprises a cutting rod (52) with a fixing hole provided on the outside, and a mounting sleeve (54) with a through hole provided on the mounting sleeve, wherein the through hole and the fixing hole are fixed by fixing bolts.

4. The semiconductor device laminating machine according to claim 1, wherein: The unwinding port is at the same height as the reeling shaft (21).

5. The semiconductor device laminating machine according to claim 1, characterized in that: The bottom end of the film laminating machine housing (1) is fixedly connected to an anti-slip seat, and the top end of the machine cover (3) is provided with a viewing window.

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