Device for preventing battery printing slurry leakage from adhering sheet and conveying back

Abstract

The utility model relates to the field of solar cell production. According to the device for preventing the silicon wafers from being bonded and conveyed after slurry leakage in battery printing, the silicon wafers subjected to silk-screen printing enter a sintering furnace 3 through a chain conveying belt to be sintered, a baffle device 1 and a detection device 2 are installed above the chain conveying belt outside an inlet of the sintering furnace 3, and the lower surface of the baffle device 1 is rectangular; the vertical distance between the lower surface of the baffle device 1 and the upper surface of a silicon wafer on the chain conveyor belt is 0.5 times of the thickness of the silicon wafer, the detection device 2 is a parallel plate capacitor, an upper electrode plate of the parallel plate capacitor is located above the chain conveyor belt, and a lower electrode plate of the parallel plate capacitor is located below the chain conveyor belt. The distance between the upper electrode plate and the lower electrode plate is 40-45 mm, the vertical distance between the lower electrode plate and the lower surface of the silicon wafer is 5-15 mm, and the parallel plate capacitor is connected with a capacitance measuring device.

Description

TECHNICAL FIELD

[0001] The utility model relates to the solar cell production field. BACKGROUND

[0002] The silicon crystal solar cell generally includes silk screen printing process, and the main mode is screen cloth printing technology. In the silk screen printing process, the change of screen tension in the printing process and whether the semi-finished product cell has the abnormal conditions such as sticking point scorching, edge collapse and foreign matter can cause the abnormal cracking and falling of the screen cloth, and under the condition of personnel carelessness, the cell, the paste and the screen cloth can enter the sintering furnace inside for high-temperature drying along with the conveying of the belt, the screen cloth is easy to burn under high temperature, and the paste becomes waste material after high-temperature sintering, thereby causing the generation of safety hazards and the waste of company materials. SUMMARY

[0003] The technical scheme to be solved by the utility model is: in the automatic sintering process, how to solve the problem that the paste leakage existing on the silicon wafer after silk screen printing causes sintering failure when the silicon wafer enters the sintering furnace.

[0004] The technical scheme adopted by the utility model is: a device for avoiding the sticking of the cell after the paste leakage after printing and the subsequent transmission, the silicon wafer after silk screen printing enters the sintering furnace 3 for sintering through the chain conveyor, the baffle device 1 and the detection device 2 are installed above the chain conveyor at the inlet of the sintering furnace 3, the lower surface of the baffle device 1 is rectangular, the vertical distance between the lower surface of the baffle device 1 and the upper surface of the silicon wafer on the chain conveyor is 0.5 times the thickness of the silicon wafer, the detection device 2 is a parallel plate capacitor, the upper electrode plate of the parallel plate capacitor is above the chain conveyor, the lower electrode plate of the parallel plate capacitor is below the chain conveyor, the spacing between the upper electrode plate and the lower electrode plate is 40-45 mm, the vertical distance between the lower electrode plate and the lower surface of the silicon wafer is 5-15 mm, and the parallel plate capacitor is connected with the capacitance measuring device.

[0005] The baffle device 1 includes an integrated connection of a cuboid plate and a triangular plate, in the cross section of the cuboid plate and the triangular plate, the angle of the triangular plate not in contact with the cuboid plate is 20-40 °, and the angle of the triangular plate not in contact with the cuboid plate faces the direction of the silicon wafer.

[0006] The detection device 2 is a plurality of parallel arranged parallel plate capacitors, and the connecting lines of the plurality of parallel plate capacitors are the same as the conveying direction of the chain conveyor.

[0007] The utility model has the advantages that the baffle device can collect the paste leakage after the screen cloth explosion, when the sticking or the residual paste caused by the screen cloth explosion occurs, the detection device can timely find and stop, and the sticking after transmission is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0008] Fig. 1 is a structural schematic diagram of the utility model;

[0009] Fig. 2 is a three view schematic diagram of the baffle device;

[0010] Fig. 3 is a plurality of parallel plate capacitor arrangement schematic diagram;

[0011] Wherein, 1, baffle device, 2, detection device, 3, sintering furnace. Embodiment

[0012] As Figs. 1-3 Indicated, a kind of avoid battery printing slurry leakage after sticking piece after transmission device, silicon wafer through chain conveyor enters sintering furnace 3 and is sintered after silk screen printing.The sintering furnace 3 is used to dry the slurry on silicon wafer, remove organic components in slurry, complete aluminum back field and grid line sintering.

[0013] In silk screen printing process, the abnormal cracking and falling of screen cloth can be caused by the change of screen tension during printing process and whether semi-finished battery piece has abnormal conditions such as sticking point scorching, edge collapse, foreign matter, etc., under the condition of personnel carelessness, battery piece, slurry and screen cloth will enter sintering furnace 3 inside for high temperature drying along with the transmission of belt, screen cloth is easy to burn under high temperature, slurry becomes waste after high temperature sintering, thereby leading to the generation of safety hazard and the waste of company material.

[0014] In order to solve the above problems, a baffle device 1 and a detection device 2 are installed above the chain conveyor outside the inlet of sintering furnace 3 in the embodiment, the purpose of baffle device 1 is to remove foreign matter higher than the set height to avoid entering the inside of sintering furnace 3.

[0015] In the embodiment, the baffle device 1 is an integrated connection of cuboid plate and triangular plate, in the cross section of cuboid plate and triangular plate, the angle of triangular plate not in contact with cuboid plate is 20-40 °, the angle of triangular plate not in contact with cuboid plate faces the direction of silicon wafer.The lower surface of the baffle device 1 is rectangular, the vertical distance between the lower surface of the baffle device 1 and the upper surface of silicon wafer on the chain conveyor is 0.5 times the thickness of silicon wafer.The baffle device 1 spans the chain conveyor.

[0016] In the embodiment, the detection device 2 is parallel plate capacitor, the upper electrode plate of the parallel plate capacitor is above the chain conveyor, the lower electrode plate of the parallel plate capacitor is below the chain conveyor, the spacing between the upper electrode plate and the lower electrode plate is 40-45 mm, the vertical distance between the lower electrode plate and the lower surface of silicon wafer is 5-15 mm, and the parallel plate capacitor is connected with capacitance measuring device.

[0017] When the silicon wafer on the chain conveyor passes through the parallel plate capacitor, if the silicon wafer is normal (no sticking point burning, edge collapse, foreign matter, etc.), the capacitance change of the parallel plate capacitor is within a set range. When an abnormal situation occurs (sticking point burning, edge collapse, foreign matter, etc.), the capacitance change of the parallel plate capacitor exceeds the set range. At this time, a stop signal is sent to the chain conveyor, the abnormal silicon wafer is checked and removed, and then the process continues. The loss of the abnormal silicon wafer after sintering is avoided. The silicon wafer before sintering can be printed again after removing the surface paste.

[0018] In order to avoid damage or other situations of a parallel plate capacitor, the detection device 2 uses a plurality of parallel arranged parallel plate capacitors, and the connection lines of the plurality of parallel plate capacitors are in the same direction as the conveying direction of the chain conveyor. Each parallel plate capacitor is respectively connected to a capacitance measuring device.

[0019] In actual use, the capacitance measuring device can be connected to a PLC, and the operation of the chain conveyor is controlled by the PLC.

[0020] After application, the situation of the mesh cloth and the paste flowing into the sintering furnace will not occur similar situation compared to the previous single track, which can occur 5-7 times per month on average, and safety accidents can be avoided. At the same time, the single track can reduce the paste scrap by 2-3 kg per month, and save production cost by 12000 yuan per month.

Claims

1. A device for preventing battery printing from leaking paste and then bonding the wafers. The silicon wafers after screen printing are conveyed into a sintering furnace (3) through a chain conveyor for sintering. The device is characterized by: A baffle device (1) and a detection device (2) are installed above the chain conveyor outside the inlet of the sintering furnace (3), the lower surface of the baffle device (1) is rectangular, and the vertical distance between the lower surface of the baffle device (1) and the upper surface of the silicon wafer on the chain conveyor is 0.5 times the thickness of the silicon wafer. The detection device (2) is a parallel plate capacitor, the upper electrode plate of the parallel plate capacitor is above the chain conveyor, and the lower electrode plate of the parallel plate capacitor is below the chain conveyor. The spacing between the upper electrode plate and the lower electrode plate is 40-45 mm, and the vertical distance between the lower electrode plate and the lower surface of the silicon wafer is 5-15 mm. The parallel plate capacitor is connected to a capacitance measuring device.

2. The device for preventing battery printing from leaking paste after bonding and transferring according to claim 1, characterized in that: The baffle device (1) comprises an integrally connected rectangular plate and a triangular plate, wherein in the cross section of the rectangular plate and the triangular plate, the angle of the triangular plate that does not contact the rectangular plate is 20-40 degrees, and the angle of the triangular plate that does not contact the rectangular plate faces the direction of the silicon wafer.

3. The device for preventing battery printing leakage after bonding and transfer according to claim 1, characterized in that: The detection device (2) is a plurality of parallel plate capacitors arranged in parallel, and the connection line of the plurality of parallel plate capacitors is in the same direction as the conveying direction of the chain conveyor belt.

Images