Compound semiconductor chip main body transfer disc

Abstract

The utility model relates to the technical field of transfer boxes, and provides a compound semiconductor chip main body transfer disc which comprises a base and a cover plate. A cover plate is arranged at the top end of the base, and a storage structure is arranged at the top end of the base; sliding grooves are formed in the bottom end of the base, lifting handles are arranged in the sliding grooves, and positioning structures are fixed to the bottom ends of the cover plates. By arranging the positioning structure, the convex block is fixed at the bottom end of the connecting rod and is in a right triangle design, so that when the connecting rod drives the convex block to be inserted into the guide groove, the inclined angle of the convex block extrudes the clamping block into the built-in groove; and when the clamping block moves to the bottom end of the guide groove, the clamping block moves to the position above the protruding block through the elastic force of the reset spring so as to clamp and position the cover plate, and during dismounting, the clamping block can be pulled to move into the built-in groove, so that the cover plate can be dismounted conveniently, and the purpose of being convenient to dismount and use is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a transfer box technical field, especially in a compound semiconductor chip main body transfer tray. BACKGROUND

[0002] With the development of the times, people are more and more widely used for compound semiconductor chips, compound semiconductor chip processing process sometimes will cut wafers into chip main body, then 2 times processing. After processing, slice packaging, in making main body and secondary processing, it involves transfer, and then in order to meet the actual transfer needs of semiconductor chips, the use of transfer box is essential.

[0003] The existing transfer box is made of plastic, and the chip may be bumped during the transfer process, thereby damaging the chip main body, thereby causing unnecessary loss, so that the traditional transfer box is difficult to meet the actual use requirement, and is difficult to disassemble and assemble conveniently during use, thereby being difficult to store and take out the chip conveniently, so that it is not convenient and effective during use. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a compound semiconductor chip main body transfer tray to solve the defects of the existing compound semiconductor chip main body transfer tray disassembly and assembly are inconvenient and the chip may be damaged during the transfer process.

[0005] In order to solve the above technical problem, the utility model provides the following technical scheme: a compound semiconductor chip main body transfer tray, including base and cover plate,

[0006] The top end of the base is provided with a cover plate, and the top end of the base is provided with a receiving structure.

[0007] The bottom end of the base is provided with a sliding groove, and the sliding groove is provided with a handle inside.

[0008] The positioning structure includes a connecting rod, a protrusion, a guide groove, an internal slot, a clamping block and a reset spring, the connecting rod is fixed to the bottom end of the cover plate, the bottom end of the connecting rod is fixed with a protrusion, the guide groove is uniformly provided on the top end of the base, the internal slot is provided on the inside of the base on one side of the guide groove, the internal slot is provided with a clamping block inside, and the clamping block is fixed with a reset spring on one side.

[0009] Preferably, the storage structure includes a groove, a limiting lining, a limiting groove, a reserved groove and a silicone wire. The groove is opened at the top of the base, the limiting lining is installed inside the groove, the limiting grooves are evenly opened inside the limiting lining, the reserved groove is opened at the bottom end of the cover plate, and the silicone wire is evenly arranged inside the reserved groove.

[0010] Preferably, the limiting lining is made of silica gel, and the limiting grooves are distributed at equal intervals inside the limiting lining.

[0011] Preferably, the silicone wires are distributed at equal intervals inside the reserved groove, and the handle is slidably connected inside the slide groove.

[0012] Preferably, the connecting rods are distributed at equal intervals on the bottom end of the cover plate, and the guide grooves are distributed at equal intervals on the top end of the base.

[0013] Preferably, one side of the clamping block extends to the outside of the base, and the side of the return spring away from the clamping block is fixedly connected to one side inside the built-in groove.

[0014] Preferably, one side of the clamping block is arranged at the top end of the protrusion, and the connecting rod and the clamping block form a clamping structure through the protrusion.

[0015] The utility model provides a compound semiconductor chip body transfer tray, which has the following advantages:

[0016] By providing a positioning structure, a protrusion is fixed at the bottom end of the connecting rod and the protrusion is designed in a right-angled triangle, so that when the connecting rod drives the protrusion to be inserted into the interior of the guide groove, the oblique angle of the protrusion squeezes the clamping block into the interior of the built-in groove, and when it moves to the bottom end of the guide groove, the clamping block moves to the top of the protrusion by the elastic force of the return spring, thereby locking and positioning the cover plate, and when removing, it is convenient to pull the clamping block to move it into the interior of the built-in groove, thereby facilitating the removal of the cover plate, thereby achieving the purpose of easy disassembly and use;

[0017] By providing a storage structure, a limiting lining is provided inside the groove, and the chip is placed inside the limiting groove to limit it. The limiting lining is silicone, which makes it difficult for the chip to be damaged inside the limiting groove due to bumps, etc., and in the process of closing the cover plate, the silicone lines evenly provided inside the reserved groove squeeze and limit the chip, thereby achieving the purpose of facilitating the storage and limiting of the chip while protecting it. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the main three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention when viewed from above;

[0020] Figure 3 It is a partial three-dimensional structure schematic view of the utility model.

[0021] Figure 4 It is a partial sectional three-dimensional structure schematic view of the utility model.

[0022] Figure 5 It is an enlarged structure schematic view of A of the utility model.

[0023] The reference signs in the drawing are explained as follows: 1, base; 2, cover plate; 3, storage structure; 301, groove; 302, limiting inner lining; 303, limiting groove; 304, reserved groove; 305, silica gel wire; 4, sliding groove; 5, handle; 6, positioning structure; 601, connecting rod; 602, protruding block; 603, guide groove; 604, built-in groove; 605, clamping block; 606, return spring. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0025] Please refer to Figures 1-5 The utility model provides a compound semiconductor chip main body transfer tray, including base 1 and cover plate 2.

[0026] Referring to Figure 3 As shown in the figure, the top end of the base 1 is provided with the cover plate 2, and the top end of the base 1 is provided with the storage structure 3, which includes the groove 301, the limiting inner lining 302, the limiting groove 303, the reserved groove 304 and the silica gel wire 305. The groove 301 is provided at the top end of the base 1, and the limiting inner lining 302 is installed in the groove 301. The limiting groove 303 is uniformly provided in the limiting inner lining 302, the reserved groove 304 is provided at the bottom end of the cover plate 2, and the silica gel wire 305 is uniformly provided in the reserved groove 304. The limiting inner lining 302 is silica gel, the limiting groove 303 is distributed at equal intervals in the limiting inner lining 302, the silica gel wire 305 is distributed at equal intervals in the reserved groove 304, and the handle 5 is slidingly connected in the sliding groove 4.

[0027] In order to avoid the damage of the semiconductor chip caused by collision in the process of transferring, the semiconductor chip is placed in the limiting groove 303, and the chip is limited. The groove 301 is made of silica gel, which is soft and not easy to damage the chip. When the cover plate 2 is installed on the top of the base 1, the silica gel line 305 in the reserved groove 304 plays a role in extruding and limiting the chip. The extrusion force of the silica gel line 305 is small, so it is not easy to damage the chip, thereby greatly increasing the functionality of the device.

[0028] Referring to Figure 1 、 Figure 2 、 Figure 4 and Figure 5 , the bottom end of the base 1 is provided with a sliding groove 4, the inside of the sliding groove 4 is provided with a handle 5, the bottom end of the cover plate 2 is fixed with a positioning structure 6, the positioning structure 6 includes a connecting rod 601, a protrusion 602, a guide groove 603, an internal groove 604, a clamping block 605 and a reset spring 606, the connecting rod 601 is uniformly fixed on the bottom end of the cover plate 2, the bottom end of the connecting rod 601 is fixed with the protrusion 602, the guide groove 603 is uniformly provided on the top end of the base 1, the inside of the guide groove 603 is provided with the internal groove 604, the inside of the internal groove 604 is provided with the clamping block 605, one side of the clamping block 605 is fixed with the reset spring 606, the connecting rod 601 is distributed at equal intervals on the bottom end of the cover plate 2, the guide groove 603 is distributed at equal intervals on the top end of the base 1, the clamping block 605 is extended to the outside of the base 1, the reset spring 606 is fixedly connected to one side of the internal groove 604 away from the clamping block 605, the clamping block 605 is arranged on the top end of the protrusion 602, and the connecting rod 601 and the clamping block 605 form a clamping structure through the protrusion 602.

[0029] In the process of transferring the chip, the base 1 and the cover plate 2 need to be positioned, so as to prevent the chip from falling off. The connecting rod 601 of the bottom end of the cover plate 2 is inserted into the inside of the guide groove 603, so that the cover plate 2 moves above the base 1, and the protrusion 602 at the bottom end of the connecting rod 601 extrudes the clamping block 605 into the inside of the internal groove 604. When it moves below the clamping block 605, the clamping block 605 moves above the protrusion 602 through the elastic force of the reset spring 606, thereby limiting it, so as to install and position the base 1 and the cover plate 2. When disassembling, pull the clamping block 605 away from the top end of the protrusion 602, thereby greatly increasing the functionality of the device.

[0030] Although the utility model has been explained in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A compound semiconductor chip body transfer tray, comprising a base (1) and a cover plate (2); Its characteristics are: A cover plate (2) is provided at the top of the base (1), and a storage structure (3) is provided at the top of the base (1); A slide groove (4) is provided at the bottom end of the base (1), a handle (5) is provided inside the slide groove (4), and a positioning structure (6) is fixed at the bottom end of the cover plate (2); The positioning structure (6) comprises a connecting rod (601), a protrusion (602), a guide groove (603), a built-in groove (604), a clamping block (605) and a reset spring (606); the connecting rod (601) is evenly fixed to the bottom end of the cover plate (2); the bottom end of the connecting rod (601) is fixed with a protrusion (602); the guiding groove (603) is evenly opened at the top end of the base (1); the base (1) is provided with a built-in groove (604) on one side of the guiding groove (603); the built-in groove (604) is provided with a clamping block (605); and the reset spring (606) is fixed on one side of the clamping block (605).

2. The compound semiconductor chip body transfer tray according to claim 1, characterized in that: The storage structure (3) comprises a groove (301), a limiting lining (302), a limiting groove (303), a reserved groove (304) and a silicone wire (305); the groove (301) is opened at the top of the base (1); the limiting lining (302) is installed inside the groove (301); the limiting grooves (303) are evenly opened inside the limiting lining (302); the reserved groove (304) is opened at the bottom of the cover plate (2); and the silicone wire (305) is evenly arranged inside the reserved groove (304).

3. The compound semiconductor chip body transfer tray according to claim 2, characterized in that: The limiting lining (302) is made of silica gel, and the limiting grooves (303) are distributed at equal intervals inside the limiting lining (302).

4. The compound semiconductor chip body transfer tray according to claim 2, characterized in that: The silicone wires (305) are distributed at equal intervals inside the reserved groove (304), and the handle (5) is slidably connected inside the sliding groove (4).

5. The compound semiconductor chip body transfer tray according to claim 1, characterized in that: The connecting rods (601) are distributed at equal intervals on the bottom end of the cover plate (2), and the guide grooves (603) are distributed at equal intervals on the top end of the base (1).

6. The compound semiconductor chip body transfer tray according to claim 1, characterized in that: One side of the clamping block (605) extends to the outside of the base (1), and the side of the return spring (606) away from the clamping block (605) is fixedly connected to one side inside the built-in groove (604).

7. The compound semiconductor chip body transfer tray according to claim 1, characterized in that: One side of the clamping block (605) is arranged at the top end of the protrusion (602), and the connecting rod (601) and the clamping block (605) form a clamping structure through the protrusion (602).

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