Novel ZIF connector

Abstract

The embodiment of the utility model belongs to the technical field of ZIF connectors. The utility model further relates to a novel ZIF connector which comprises a ZIF socket, the ZIF socket is provided with a plurality of FPC insertion grooves used for being connected with FPCs, and an FPC body is inserted in each FPC insertion groove so as to achieve connection between multiple modules in an electronic product and a mainboard. According to the invention, through the arrangement of the plurality of FPC insertion grooves, the simultaneous insertion of the plurality of FPC main bodies can be supported, the internal design of an electronic product is greatly simplified, the occupied space of the connector and the FPC on a mainboard is effectively reduced, the product design is more compact, the number of connectors and the complexity of FPC wiring are reduced, and the cost is reduced. Therefore, the material cost and the assembly cost in the production process are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to ZIF connector technical field, more specifically, relate to a novel ZIF connector. BACKGROUND

[0002] With the continuous progress of science and technology and the growing demand of consumers, modern consumer electronics is developing towards high integration and multi-function, in order to realize the diversification of product functions, multi-module design architecture is generally used in electronic products, this design method not only meets the needs of users to complex functions, also improves the flexibility and scalability of products, in multi-module design, each functional module, such as display module, touch module, NFC module, light sensing module, camera module, needs to be effectively connected to the mainboard to realize data transmission and control, the traditional connection mode is often limited by space layout and interface quantity, resulting in complex internal wiring of products, low space utilization, even increased manufacturing cost and difficulty, therefore, we improve, and propose a novel ZIF connector. SUMMARY

[0003] The utility model embodiment solves the technical problem that the traditional connection mode is often limited by space layout and interface quantity, resulting in complex internal wiring of products and low space utilization.

[0004] In order to solve the above technical problem, the utility model adopts the technical scheme as follows:

[0005] A novel ZIF connector, comprising: ZIF socket, the ZIF socket is provided with a plurality of FPC insertion slots for connecting FPC, and each FPC insertion slot is inserted with FPC body, to realize the connection between the internal multi-module of electronic product and mainboard.

[0006] As an improved mode of the utility model, a plurality of FPC insertion slots are located on both sides of the ZIF socket, to realize the insertion of a plurality of FPC bodies from both sides of the ZIF socket.

[0007] As an improved mode of the utility model, a plurality of FPC insertion slots are located on the same side of the ZIF socket, to realize the insertion of a plurality of FPC bodies from the same side of the ZIF socket.

[0008] As an improved mode of the utility model, a piano cover is arranged at each FPC insertion slot, and the piano cover is used for locking after the FPC body is inserted into the FPC insertion slot.

[0009] As an improved mode of the utility model, a plurality of metal pins are arranged between each FPC insertion slot and the ZIF socket, and a plurality of fixing pins are arranged around the bottom of the ZIF socket.

[0010] As an improved mode of the utility model, the ZIF socket is made of high-temperature-resistant material to adapt to the high-temperature environment inside the electronic product. In some high-performance electronic products, the heat generated during operation is relatively high. The ZIF socket made of high-temperature-resistant material such as polyimide can ensure the stability and reliability of the connector.

[0011] As an improved mode of the utility model, the surface of each FPC main body is covered with an oxidation-resistant coating to prolong its service life. The common oxidation-resistant coating can be a gold plating layer or a tin plating layer, which can effectively prevent the oxidation and corrosion of the FPC main body during long-term use.

[0012] As an improved mode of the utility model, a buffer pad is arranged at the connection between the ZIF socket and the FPC insertion slot to reduce the impact force during plugging. The buffer pad can be made of rubber material to reduce mechanical damage to the ZIF socket and the FPC main body during plugging.

[0013] As an improved mode of the utility model, the bottom of the ZIF socket is provided with a heat dissipation hole to enhance the heat dissipation performance of the connector. In high-power electronic products, good heat dissipation performance helps to prevent the connector from malfunctioning due to overheating.

[0014] As an improved mode of the utility model, the inner wall of the FPC insertion slot is provided with anti-slip texture to increase the stability of the FPC main body after insertion. The anti-slip texture can be a small protrusion or groove, which can effectively prevent the FPC main body from loosening in a vibrating environment.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] To solve the problem of complex internal wiring and low space utilization in the prior art due to the limitation of space layout and interface quantity, the application can support the simultaneous insertion of multiple FPC main bodies by setting multiple FPC insertion slots, greatly simplifying the internal design of the electronic product, effectively reducing the occupied space of the connector and FPC on the mainboard, making the product design more compact, reducing the complexity of the connector quantity and FPC wiring, thereby reducing the material cost and assembly cost in the production process. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The structure diagram of the FPC insertion slot of the novel ZIF connector provided by the application when located on both sides of the ZIF socket is shown in the following figure:

[0018] Figure 2 The new ZIF connector provided in this application Figure 1 Schematic diagram of the structure viewed from above;

[0019] Figure 3 This is a schematic diagram of the structure of the new ZIF connector provided by this application when the FPC insertion slot is located on the same side of the ZIF socket;

[0020] Figure 4 The new ZIF connector provided in this application Figure 3 Schematic diagram of the upward-looking structure.

[0021] Indicated in the figure:

[0022] 1. ZIF socket; 101. Metal pins; 102. Piano cover; 2. FPC insertion slot; 3. FPC body; 4. Fixed pins. DETAILED DESCRIPTION

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this utility model belongs; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. Reference to "embodiments" herein means that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the utility model. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] As described in the background technology, in a multi-module design, various functional modules, such as the display module, touch module, NFC module, light sensing module, camera module, etc., need to be effectively connected to the mainboard to realize data transmission and control. Traditional connection methods are often limited by spatial layout and the number of interfaces, resulting in complex internal wiring of the product, low space utilization, and even increased manufacturing costs and difficulty.

[0025] In order to solve this technical problem, the utility model provides a novel ZIF connector.

[0026] Specifically, please refer to Figures 1-4 , the new ZIF connector specifically includes:

[0027] The ZIF socket 1 is provided with a plurality of FPC insertion slots 2 for connecting FPCs, and an FPC body 3 is inserted into each FPC insertion slot 2 to achieve connection between multiple modules inside the electronic product and the mainboard.

[0028] The novel ZIF connector provided by the utility model can support simultaneous insertion of multiple FPC main bodies 3 through the multiple FPC insertion slots 2, greatly simplifies the internal design of the electronic product, effectively reduces the occupied space of the connector and the FPC on the mainboard, makes the product design more compact, reduces the complexity of the connector quantity and FPC wiring, thereby reducing the material cost and assembly cost in the production process.

[0029] In order to make the personnel in the technical field better understand the utility model scheme, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings.

[0030] It should be noted that the embodiments in the utility model and the features and technical solutions in the embodiments can be combined with each other without conflict.

[0031] It should be noted that: similar signs and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0032] Embodiment one of the novel ZIF connector

[0033] Please refer to Figures 1-4 The novel ZIF connector comprises a ZIF socket 1, multiple FPC insertion slots 2 for connecting FPC are arranged on the ZIF socket 1, and an FPC main body 3 is inserted into each FPC insertion slot 2 to realize the connection between multiple modules and the mainboard in the electronic product. The multiple FPC insertion slots 2 can support simultaneous insertion of multiple FPC main bodies 3, greatly simplifying the internal design of the electronic product, effectively reducing the occupied space of the connector and the FPC on the mainboard, making the product design more compact, reducing the complexity of the connector quantity and FPC wiring, thereby reducing the material cost and assembly cost in the production process.

[0034] Through the multiple FPC insertion slots 2 and the insertion of the FPC main body 3, efficient connection of multiple modules and the mainboard is realized, the integrated connection mode can ensure that the signal remains stable and has low loss in the transmission process, avoids signal attenuation and interference problems that may occur due to multiple separate connection points, at the same time, centralized management of multiple connection points greatly reduces the difficulty of troubleshooting and maintenance, improves the maintenance efficiency, because the dispersed connection components are reduced, the problems of heat generation and energy consumption increase caused by poor connection are also reduced, which helps to improve the overall performance and energy utilization efficiency of the electronic product.

[0035] Embodiment two of the novel ZIF connector

[0036] The utility model novel ZIF connector further, as Figures 1-2 As shown, multiple FPC insertion slots 2 are located on both sides of the ZIF socket 1, so that multiple FPC bodies 3 can be inserted from both sides of the ZIF socket 1. The FPC insertion slots 2 are distributed on both sides of the ZIF socket 1, which provides great flexibility for the design of electronic products. When the space layout is limited, it can better adapt to different circuit board shapes and sizes and make full use of the space. This double-sided insertion method makes the connector more balanced in force, reducing the risk of connector deformation or damage caused by excessive force on one side. Moreover, double-sided insertion also facilitates the classification and management of FPC bodies 3 with different functions, and can locate the problem more quickly and accurately during maintenance and replacement. In addition, it helps to disperse signal transmission lines, reduce mutual interference between signals, and improve the quality and stability of signal transmission.

[0037] Embodiment 3 of the new ZIF connector of the present utility model

[0038] The utility model novel ZIF connector further, as Figures 3-4 As shown, multiple FPC insertion slots 2 are all located on the same side of the ZIF socket 1, so that multiple FPC bodies 3 can be inserted from the same side of the ZIF socket 1. The design of multiple FPC insertion slots 2 being located on the same side has significant advantages in certain specific electronic products. For example, for areas with relatively narrow space but sufficient length, same-side insertion can save space to the greatest extent, allowing the product to achieve more functions within a limited space. This centralized layout makes wiring more regular and orderly, reduces line crossing and confusion, and facilitates line sorting and maintenance. During the production and assembly process, the operation of same-side insertion is simpler and more efficient, which can improve the work efficiency of the production line and reduce the error rate of manual operation. In addition, the distance between the FPC bodies 3 inserted on the same side is relatively close, which is conducive to the synchronous transmission and coordinated processing of signals, thereby improving the overall performance of the system.

[0039] Embodiment 4 of the new ZIF connector of the present utility model

[0040] The utility model novel ZIF connector further, as Figure 1 and Figure 3As shown, a piano cover 102 is arranged at each FPC insertion slot 2 for locking after the FPC body 3 is inserted into the FPC insertion slot 2. The piano cover 102 provides a reliable locking mechanism for the FPC body 3. During the use of electronic products, vibration and collision often occur. The piano cover 102 can effectively prevent the FPC body 3 from loosening or falling off due to these external forces, ensuring the continuity and stability of signal transmission, prolonging the service life of the connector, and improving the convenience and safety of use.

[0041] Further, as shown, a plurality of metal pins 101 are arranged between each FPC insertion slot 2 and the ZIF socket 1. The arrangement of a plurality of metal pins 101 greatly increases the contact area, helps to improve the efficiency and quality of signal transmission, reduces signal attenuation and distortion during transmission, and reduces energy loss due to resistance heating. Multiple metal pins 101 can also share current, reduce the load on individual pins, and reduce the risk of pin damage due to overload. In high-frequency signal transmission, more pins can provide better signal integrity, reduce signal reflection and crosstalk, and improve system stability and reliability. Figures 1-4

[0042] The ZIF socket 1 is made of a high-temperature-resistant material to adapt to the high-temperature environment inside electronic products. In some high-performance electronic products, the heat generated during operation is relatively high. The ZIF socket 1 made of a high-temperature-resistant material such as polyimide can ensure the stability and reliability of the connector. The use of high-temperature-resistant materials to make the ZIF socket 1 can maintain its physical and electrical properties stable in high-temperature environments. When electronic products are operated at high power for a long time, the internal temperature rises. If the connector cannot withstand high temperatures, it may deform, soften, and have reduced insulation performance, affecting signal transmission and the normal operation of the circuit. High-temperature-resistant materials can effectively avoid these problems, ensuring that the connector can still operate stably and reliably in harsh working conditions. This not only prolongs the service life of the connector, but also reduces the risk of the entire electronic product failing due to connector failure, improving the stability and reliability of the product.

[0043] Further, the ZIF socket 1 is made of a high-temperature-resistant material to adapt to the high-temperature environment inside electronic products. In some high-performance electronic products, the heat generated during operation is relatively high. The ZIF socket 1 made of a high-temperature-resistant material such as polyimide can ensure the stability and reliability of the connector. The use of high-temperature-resistant materials to make the ZIF socket 1 can maintain its physical and electrical properties stable in high-temperature environments. When electronic products are operated at high power for a long time, the internal temperature rises. If the connector cannot withstand high temperatures, it may deform, soften, and have reduced insulation performance, affecting signal transmission and the normal operation of the circuit. High-temperature-resistant materials can effectively avoid these problems, ensuring that the connector can still operate stably and reliably in harsh working conditions. This not only prolongs the service life of the connector, but also reduces the risk of the entire electronic product failing due to connector failure, improving the stability and reliability of the product. ​

[0044] Further, the surface of each FPC body 3 is covered with an anti-oxidation coating; to extend its service life, a common anti-oxidation coating can be a gold plating layer or a tin plating layer, which can effectively prevent the FPC body 3 from being oxidized and corroded during long-term use. The anti-oxidation coating on the surface of the FPC body 3 can form an effective protective barrier to prevent oxygen and moisture from contacting the metal surface, thereby delaying the process of oxidation and corrosion. This helps to maintain the good conductivity and signal transmission performance of the FPC body 3, avoiding problems such as increased resistance and signal attenuation caused by oxidation and corrosion. The gold plating layer or tin plating layer has good wear resistance, which can reduce the wear of the coating during plugging, further extending the protective effect of the coating. The presence of the anti-oxidation coating also improves the corrosion resistance of the FPC body 3, allowing it to work normally in harsh environments such as humidity and corrosive gases, expanding the application range and use scenarios of electronic products.

[0045] Further, a buffer pad is provided at the connection between the ZIF socket 1 and the FPC insertion slot 2 to reduce the impact force during plugging and unplugging. The buffer pad can be made of rubber, reducing mechanical damage to the ZIF socket 1 and the FPC body 3 during plugging. The buffer pad plays an important protective role during plugging and unplugging. When plugging or unplugging the FPC body 3, a certain impact force is often generated. Without a buffer pad, this impact force can cause wear, deformation or even rupture of the interface between the ZIF socket 1 and the FPC body 3. The rubber buffer pad has good elasticity and energy absorption characteristics, which can effectively absorb and disperse the impact force, reducing mechanical damage to the connector and the FPC body 3. This not only extends the service life of the connector and the FPC body 1, but also reduces the incidence of contact failure, signal interruption and other faults caused by plugging. At the same time, the buffer pad can also reduce the noise during plugging, improving the comfort of use.

[0046] Further, the bottom of the ZIF socket 1 is provided with a heat dissipation hole to enhance the heat dissipation performance of the connector. In high-power electronic products, good heat dissipation performance helps to prevent the connector from failing due to overheating. The presence of the heat dissipation hole greatly improves the heat dissipation efficiency of the connector. In high-power electronic products, the connector will generate a large amount of heat. If the heat cannot be dissipated in time, the heat will accumulate, causing the temperature to rise. High temperatures can cause the material properties of the connector to degrade, such as softening of plastic parts and oxidation of metal parts, thereby affecting the mechanical strength and electrical performance of the connector. The heat dissipation hole can promote air circulation, quickly removing heat and keeping the connector within a normal operating temperature range, ensuring its stable and reliable performance. Good heat dissipation performance can also lower the overall temperature of the electronic product, positively affecting the normal operation of other components and helping to improve the stability and reliability of the entire system.

[0047] Further, the inner wall of the FPC insertion slot 2 is provided with anti-skid texture to increase the stability after the FPC body 3 is inserted, the anti-skid texture can be a small protrusion or groove, which can effectively prevent the FPC body 3 from loosening in the environment such as vibration, in the process of running of the electronic product, it may be subjected to various vibrations and impacts, if there is no anti-skid texture, the FPC body 3 is easy to produce a small displacement in the insertion slot, resulting in poor contact or signal interruption, the anti-skid texture effectively prevents the occurrence of such displacement by increasing the friction, ensuring the continuity and stability of signal transmission, the small protrusion or groove can also increase the contact area, further improve the reliability of the connection, in the harsh working environment, such as high temperature, high humidity and strong vibration, etc., the anti-skid texture can ensure that the FPC body 3 always maintains a stable connection state, improves the anti-interference ability and reliability of the electronic product.

[0048] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments, the preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacement to part of the technical features. Any equivalent structure made by using the content of the present application specification and drawings, directly or indirectly applied in other related technical fields, is also within the patent protection scope of the present application.

Claims

1. A new ZIF connector, characterized in that: include: A ZIF socket (1) is provided with a plurality of FPC insertion slots (2) for connecting an FPC, and an FPC body (3) is inserted into each FPC insertion slot (2) to achieve connection between multiple modules inside an electronic product and a mainboard; The plurality of FPC insertion slots (2) are all located on the same side of the ZIF socket (1), so that the plurality of FPC bodies (3) can be inserted from the same side of the ZIF socket (1); a piano cover (102) is provided at each of the FPC insertion slots (2), and the piano cover (102) is used to lock the FPC body (3) after it is inserted into the FPC insertion slot (2).

2. The novel ZIF connector according to claim 1, characterized in that: A plurality of metal pins (101) are provided between each of the FPC insertion slots (2) and the ZIF socket (1); and fixed pins (4) are provided around the bottom of the ZIF socket (1).

3. The novel ZIF connector according to claim 1, characterized in that: The ZIF socket (1) is made of high-temperature resistant material.

4. The novel ZIF connector according to claim 1, characterized in that: The surface of each FPC body (3) is covered with an anti-oxidation coating.

5. The novel ZIF connector according to claim 1, characterized in that: A buffer pad is provided at the connection between the ZIF socket (1) and the FPC insertion slot (2).

6. The novel ZIF connector according to claim 1, characterized in that: The bottom of the ZIF socket (1) is provided with heat dissipation holes.

7. The novel ZIF connector according to claim 1, characterized in that: The inner wall of the FPC insertion slot (2) is provided with an anti-slip texture.

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