Radio frequency module compatible with multiple frequency bands

Abstract

A radio frequency module compatible with multiple frequency bands comprises a PCB, the PCB comprises a system-on-chip SOC and a signal receiving and transmitting main switch, the SOC is provided with a signal transmitting end and a signal receiving end, the SOC is connected to the signal receiving and transmitting main switch through a domestic frequency band compatible circuit and a foreign frequency band compatible circuit, and the signal receiving and transmitting main switch is connected with an antenna to control signal receiving and transmitting. Through the construction of the whole radio frequency architecture, the compatible design of frequency bands of different regions inside and outside the sea is completed, the area occupied by excessive large devices is saved in space, and the reusability of a PCB is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of radio frequency, and particularly relates to a radio frequency module compatible with multiple frequency bands. BACKGROUND

[0002] In recent years, with the popularization of 5G, the reduction of 2G / 3G frequency, and the rapid development of the Internet of Things industry, the Internet of Things devices are growing exponentially, and the market demand is continuously increasing. However, the overseas market is limited by factors such as region, population, and infrastructure, so that 2G networks still occupy a part of the market and demand based on their characteristics. Therefore, the domestic market mainly uses 4G or 5G, and the overseas market mainly uses 2G, 3G, and 4G. The two parties have different demands for products, resulting in differences in the system architecture of the radio frequency architecture hardware.

[0003] The application patent with the application publication number CN117674885A discloses a radio frequency architecture and an electronic device, and belongs to the technical field of radio frequency. The radio frequency architecture comprises: a radio frequency transceiver; a first power amplifier module, an input end of the first power amplifier module being connected with a first transmitting port of the radio frequency transceiver; a first antenna; a first transceiving filter, a first connecting end of the first transceiving filter being connected with a first output end of the first power amplifier module, and a second connecting end of the first transceiving filter being connected with the first antenna; a second power amplifier module, an input end of the second power amplifier module being connected with a second transmitting port of the radio frequency transceiver; a second antenna; and a multiplexer, the multiplexer being connected with a first output end of the second power amplifier module and the second antenna. In the ENDC mode, the radio frequency transceiver transmits 5G frequency band signals through a 4G radio frequency path and transmits 4G frequency band signals through a 5G radio frequency path. The 4G radio frequency path comprises the first power amplifier module, the first transceiving filter, and the first antenna. The 5G radio frequency path comprises the second power amplifier module, the multiplexer, and the second antenna. UTILITARIAN CONTENT

[0004] Because the required systems of products at home and abroad are different, the basic architecture of the products has great differences, that is, different PCB boards are designed according to the basic logic to meet the needs of different markets. If two architectures are to be compatible, parallel compatibility needs to be arranged on key devices. This scheme will occupy a large amount of PCB board space. Or, a high-cost scheme is directly used to compatible two architectures, that is, high-integration devices are used to replace different devices. In summary, in terms of cost, design, compatibility, and other aspects, different architectures will cause the non-reusability of the PCB substrate under the consideration of cost, that is, different PCB schemes and architecture schemes need to be designed to adapt to different markets.

[0005] To solve the above problems, the technical scheme provided by the application is: a radio frequency module compatible with multiple frequency bands, comprising a PCB, the PCB comprising a system on chip (SOC) and a signal transceiver main switch, the SOC being provided with a signal transmitting end and a signal receiving end, the SOC being connected to the signal transceiver main switch through a domestic frequency band compatible line and a foreign frequency band compatible line, and the signal transceiver main switch being connected to an antenna control signal transceiver.

[0006] As a further improvement of the utility model, the 4G frequency band signal of the domestic frequency band compatible line is amplified by the 3 / 4G power amplifier, the amplified intermediate frequency duplex signal enters the signal transceiver main switch for transceiving through the duplexer, and the time division duplex signal directly transceives through the signal transceiver main switch. A low-pass filter is arranged on the receiving link of the time division duplex signal.

[0007] As a further improvement of the utility model, after the 3 / 4G signal of the foreign frequency band compatible line is emitted from the signal transmitting end of the SOC, the signal is amplified by the 3 / 4G power amplifier, and the frequency division duplex signal enters the signal transceiver main switch for transceiving through the duplexer; after the 2G signal is emitted from the signal transmitting end of the SOC, the signal is amplified by the 2G power amplifier, and then transceived through the signal transceiver main switch, while the receiving is completed through the 2G / 4G compatible receiving link.

[0008] As a further improvement of the utility model, after the signal is emitted from the signal transmitting end, it passes through the same 3 / 4G power amplifier, and then is divided into the domestic frequency band compatible line and the foreign frequency band compatible line to enter the subsequent transmitting link.

[0009] As a further improvement of the utility model, in the domestic frequency band compatible line after the 3 / 4G power amplifier, the transmitting link of the time division duplex signal comprises parallel B34 / 39 frequency bands and B38 / 40 / 41 frequency bands, low-pass filters are arranged on the receiving links of the B34 / 39 frequency bands and the B38 / 40 / 41 frequency bands, and the signal enters the signal receiving end of the SOC after passing through the low-pass filters; the transmitting link of the frequency division duplex signal comprises parallel B1 frequency bands, B3 frequency bands, B5 frequency bands and B8 frequency bands, a duplexer is arranged on the transmitting link of the frequency division duplex signal, the frequency division duplex signal passes through the duplexer and then transceives through the same TRX link, and the duplexer is in communication with the signal receiving end to form a receiving link.

[0010] As a further improvement of the utility model, in the foreign frequency band compatible line after the 3 / 4G power amplifier, the transmitting link of the frequency division duplex signal comprises parallel B7 frequency bands, B20 frequency bands and B28 frequency bands, a duplexer is arranged on the transmitting link of the frequency division duplex signal, the frequency division duplex signal passes through the duplexer and then transceives through the same TRX link, and the duplexer is in communication with the signal receiving end to form a receiving link.

[0011] As a further improvement of the utility model, B7 frequency band and B34 / 39 frequency band share the same transmitting link, and a duplexer used by B7 frequency band is bridged on the transmitting link.

[0012] The utility model discloses the beneficial effect is: through the design of fusing multiple frequency bands and system, the compatible problem of the PCB radio frequency architecture of different needs of the market in and out of the country is solved again in the architecture level, through the building of overall radio frequency architecture, the compatible design of different regional frequency bands in and out of the country is completed, and the area of the occupation of too many large devices is saved in space, and the control of the cost of device material is completed through the device selection of the demand of different markets, and the reusability of the PCB board is increased, and the PCB design cost is reduced. DRAWINGS

[0013] Figure 1 It is the radio frequency architecture structure diagram of the utility model.

[0014] In the drawing, the solid line indicates the domestic frequency band compatible line, the dotted line indicates the foreign frequency band compatible line, TDD indicates time division duplex, FDD indicates frequency division duplex, PA indicates power amplifier, SOC indicates system on chip, LPF indicates low pass filter, DUP indicates duplexer, SW indicates signal transceiver master switch, SPXT indicates single pole X throw switch, TX indicates transmitting link, and RX indicates receiving link. PREFERRED EMBODIMENT

[0015] The utility model will be described in detail below in combination with the drawings and examples.

[0016] Example one, a kind of compatible radio frequency module of multiple frequency bands, as shown in Figure 1 The embodiment architecture design is on the PCB board, and specifically includes system on chip SOC, and the signal transmitting end is provided on SOC, and the signal transmitting end is divided into the signal transmitting line (TX LB, TX MB, TX HB) of three frequency bands of low frequency LB frequency band, middle frequency MB frequency band and high frequency HB frequency band, and the signal line of three frequency bands is connected to the same 3 / 4G power amplifier (4G PA / 3G PA), and then is connected to the signal transceiver master switch in the transmitting link of different frequency bands, and the signal transceiver master switch controls antenna transmission and reception signal, and the signal reception end is received to the signal receiving end of SOC chip via different receiving link after receiving signal.The signal receiving end is also divided into the signal receiving line (RX LB, RX MB, RX HB) of three frequency bands of low frequency LB frequency band, middle frequency MB frequency band and high frequency HB frequency band.

[0017] Specifically, in order to compatible 2G signal of overseas market, 2G signal transmitting link is also provided on SOC chip, and after 2G signal is sent from the signal transmitting end of SOC chip, the signal is amplified via 2G power amplifier, and then is sent through the signal transceiver master switch, and at the same time, the receiving is completed through 2G / 4G compatible receiving link.

[0018] Specifically, the signal amplified by the 3 / 4G power amplifier is divided into two paths of radio frequency architecture, including domestic frequency band compatible line and foreign frequency band compatible line. Specifically, the domestic frequency band compatible line includes parallel time division duplex B34 / 39 frequency band and B38 / 40 / 41 frequency band, and frequency division duplex B1 frequency band, B3 frequency band, B5 frequency band, and B8 frequency band.

[0019] Specifically, the B34 frequency band is commonly known as the 1.9GHz frequency band. This frequency band is often used in UMTS (Universal Mobile Telecommunications System) 3G networks and some 4G LTE networks. As one of the TDD frequency bands, B34 supports uplink and downlink transmission at different time points, thereby realizing bidirectional communication on the same frequency band. The B39 frequency band is commonly known as the 1.7GHz frequency band. This frequency band is widely used in LTE networks in some regions. Similar to B34, B39 also supports TDD technology, so that uplink and downlink transmission can be alternately performed on the same frequency band. In some cases, the B39 frequency band may face problems in signal coverage and speed, especially in areas with high user density or poor signal quality. However, this does not mean that the B39 frequency band itself has defects, but is affected by various factors, such as base station layout, device performance, and network optimization, etc. In the present embodiment, the B34 / 39 frequency band uses the same transceiver link, and the transmit link is directly connected to the signal transceiver master switch, and the signal transceiver master switch is connected to the RX MB signal receiving end of the SOC chip through the receive link. Among them, a low-pass filter LPF is arranged on the receive link, and after the signal passes through the low-pass filter LPF, it is connected to the RX MB signal receiving end through a single-pole double-throw switch SP2T.

[0020] Specifically, the range of B38 frequency band is usually 2570-2620MHz, also known as 2.6GHz frequency band. This frequency band is often used in UMTS (Universal Mobile Telecommunications System) and LTE networks, and is an important part of mobile communication networks. B38 frequency band supports global roaming function, enabling users to seamlessly access local networks when traveling internationally. B38 frequency band has high spectral efficiency and data transmission rate, which can meet the demand of modern mobile communication networks for high-speed data transmission. The range of B40 frequency band is usually 2300-2400MHz, also known as 2.3GHz frequency band. This frequency band is also widely used in UMTS and LTE networks, providing high-quality communication services for users. Similar to B38 frequency band, B40 frequency band also supports global roaming function. In the network planning of China Mobile, B40 frequency band is often used for indoor coverage to improve the coverage and quality of network signals inside buildings. The range of B41 frequency band is usually 2496-2690MHz, which is a relatively wide frequency band. B41 frequency band is widely used in LTE networks, and with the continuous development of 5G technology, it is also considered as one of the potential frequency bands for 5G networks. B41 frequency band has high data transmission rate and spectral efficiency, which can meet the demand of future mobile communication networks for high-speed data transmission and low latency. Since B41 frequency band has abundant spectrum resources, it has great potential in the development of future mobile communication technology. In this embodiment, B38 / 40 / 41 frequency bands use the same transceiver link, and the transmit link is directly connected to the signal transceiver master switch, which is further connected to the RX HB signal receiving end of the SOC chip through the receive link. Among them, a low-pass filter LPF is arranged on the receive link, and the signal passes through the low-pass filter LPF and is connected to the RX HB signal receiving end through a single-pole four-throw switch SP4T.

[0021] Specifically, the B1 band is one of the frequency bands defined by the 3GPP standard for Frequency Division Duplex (FDD) mode, with a specific uplink frequency band of 1920 MHz - 1980 MHz and a downlink frequency band of 2110 MHz - 2170 MHz. These frequency bands are used in UMTS (3G) and LTE (4G) communication systems to provide data transmission and voice communication services for mobile communication networks. B1 FDD supports multiple LTE bandwidth configurations, with common bandwidths including 1.4 MHz, 3 MHz, 5 MHz, 10 MHz, 15 MHz, and 20 MHz. The choice of bandwidth affects the data transmission rate and spectral efficiency of the communication system. FDD technology enables bidirectional communication by allocating different frequencies for the uplink and downlink. This technology can reduce interference between uplink and downlink signals and improve the utilization of spectral resources. The uplink and downlink of FDD are continuous in time, allowing simultaneous transmission and reception of signals, which reduces the feedback delay between uplink and downlink signals. Therefore, in this embodiment, the FDD signal has its own receive-transmit chain (TRX). The B1 TX transmit chain is equipped with a duplexer (DUP), and the B1 TX transmit chain is converted to the B1 TRX receive-transmit chain after passing through the duplexer (DUP). The B1 TRX is connected to the signal transceiver switch (SW SP10T). The received signal returns to the DUP from the B1 TRX and is transmitted to the single-pole four-throw switch (SP4T) through the B1 RX receive chain. The single-pole four-throw switch (SP4T) is connected to the RX HB signal receiving end of the SOC chip.

[0022] Specifically, the B3 band has a specific uplink frequency band of 1710 MHz - 1785 MHz and a downlink frequency band of 1805 MHz - 1880 MHz. These frequency bands are widely used in UMTS (3G) and LTE (4G) communication systems to provide data transmission and voice communication services for users. Compared to B1 FDD, B3 FDD has a narrower frequency range, but it still has widespread applications in some regions. At the same time, B3 FDD also has different technical characteristics and application scenarios compared to other frequency bands such as B7 FDD. In this embodiment, the B3 TX transmit chain is equipped with a duplexer (DUP), and the B3 TX transmit chain is converted to the B3 TRX receive-transmit chain after passing through the duplexer (DUP). The B3 TRX is connected to the signal transceiver switch (SW SP10T). The received signal returns to the DUP from the B3 TRX and is transmitted to the single-pole double-throw switch (SP2T) through the B3 RX receive chain. The single-pole double-throw switch (SP2T) is connected to the RX MB signal receiving end of the SOC chip.

[0023] Specifically, the B5 frequency band is specifically an uplink frequency band of 824 MHz - 849 MHz and a downlink frequency band of 869 MHz - 894 MHz. These frequency bands are widely used in mobile communication systems such as FDD-LTE (Long Term Evolution Frequency Division Duplex) to provide data transmission and voice communication services for users. In this embodiment, a duplexer DUP is arranged on the transmission link B5 TX of the B5 frequency band, and the transmission link B5 TX is converted into a receiving transmission link B5 TRX after passing through the duplexer DUP. The B5 TRX is connected with a signal transceiver switch SW SP10T. The receiving signal returns to the DUP from the B5 TRX and enters the receiving link B5 RX. The B5 frequency band signal of the domestic frequency band compatible line directly connects to the RX LB signal receiving end of the SOC chip after passing through the receiving link B5 RX. The B5 frequency band signal of the foreign frequency band compatible line connects to the RX LB signal receiving end of the SOC chip again through the LB RX SP4T single-pole four-throw switch after passing through the receiving link B5 RX.

[0024] Specifically, the uplink and downlink frequencies of the B8 frequency band are 2500-2570 MHz and 2620-2690 MHz, respectively. These frequency bands are widely used in LTE (Long Term Evolution) networks. In this embodiment, a duplexer DUP is arranged on the transmission link B8 TX of the B8 frequency band, and the transmission link B8 TX is converted into a receiving transmission link B8 TRX after passing through the duplexer DUP. The B8 TRX is connected with a signal transceiver switch SW SP10T. The receiving signal returns to the DUP from the B8 TRX and is transmitted to the RX ULB B8 RX signal receiving end of the SOC chip through the receiving link B8 RX.

[0025] Specifically, the foreign frequency band compatible line includes the B7 frequency band, the B20 frequency band, the B28 frequency band, and the 2G link.

[0026] Specifically, the B7 frequency band has an uplink frequency of 2500-2570 MHz and a downlink frequency of 2620-2690 MHz, and is mostly used for LTE services in foreign markets. In this embodiment, the B7 frequency band and the B34 / 39 share the same transmission link, and a duplexer DUP is bridged on the transmission link. The transmission link B7 TX is converted into a receiving transmission link B7 TRX after passing through the duplexer DUP. The receiving signal returns to the DUP and is transmitted to the single-pole four-throw switch SP4T through the receiving link B7 RX. The single-pole four-throw switch SP4T is connected to the RX HB signal receiving end of the SOC chip.

[0027] Specifically, the B20 frequency band is usually allocated around 800 MHz in Europe and other regions to provide FDD-LTE services. In the present embodiment, a duplexer DUP is arranged on the transmission link B20 TX of the B20 frequency band, and the transmission link B20 TX is converted into a reception link B20 TRX after passing through the duplexer DUP. The B20 TRX is connected to the signal transceiver master switch SW SP10T through an SP2T.

[0028] The uplink frequency range of the B28 frequency band is 703-748 MHz (which may be divided into 703-733 MHz of B28A and 718-748 MHz of B28B in some applications), and the downlink frequency range is 758-803 MHz (which may be divided into 758-788 MHz of B28A and 773-803 MHz of B28B). In the present embodiment, a duplexer DUP is arranged on the transmission link B28 TX of the B28 frequency band, and the transmission link B28 TX is converted into a reception link B28 TRX after passing through the duplexer DUP. The B28 TRX is connected to the signal transceiver master switch SW SP10T through an SP2T. The reception signal returns to the DUP and is transmitted to the SP RX SP4T through the reception link B28 RX, and then connected to the RX LB signal receiving end of the SOC chip.

[0029] Specifically, in the TRX link of each frequency band, the B20 TRX and the B28 TRX are connected to the signal transceiver master switch SW SP10T through a SP2T single-pole double-throw switch. In the RX link of each frequency band, the B3 RX and the B34 / 39 RX are connected to the RX MB signal receiving end of the SOC chip through a same SP2T single-pole double-throw switch; the B1 RX, the B7 RX, and the B38 / 40 / 41 RX share a SP4T single-pole four-throw switch and are connected to the RX HB signal receiving end of the SOC chip; the B5 RX, the B20 RX, and the B28 RX share a LB RX SP4T single-pole four-throw switch and are connected to the RX LB signal receiving end of the SOC chip.

[0030] The domestic market scheme is that after the signal is sent from the chip, the signal is amplified through the selected 4G PA, the FDD frequency band can enter the SW for transceiving through the DUP device, and the TDD frequency band can directly transceive through the SW device, so that the use of mainstream 4G frequency bands in the domestic market is met; while in the overseas market, after the 3 / 4G signal is sent from the chip, the signal is amplified through the selected 3 / 4G PA, the FDD frequency band can enter the SW for transceiving through the DUP device, and the TDD frequency band can directly transceive through the SW device, the 2G signal is sent from the chip, the signal is amplified through the selected 2G PA, and then the SW device is used for sending, while the 2G / 4G compatible receiving link is used for receiving, and when the domestic and overseas market scheme is compatible, the bypass selected scheme can be used for completing the conversion of necessary TDD / FDD frequency bands, so that the switching of different regional schemes is completed.

[0031] The embodiment completes the compatible design of different regional frequency bands in the domestic and overseas markets through the building of the overall radio frequency architecture, saves the area occupied by too many large devices in space, completes the control of the device material cost by selecting the devices according to the needs of different markets, increases the reusability of the PCB, and reduces the PCB design cost.

[0032] The above specific embodiments are only the preferred implementation of the present application, and do not limit the specific implementation structure and implementation range of the present application. In fact, some equivalent changes can be made according to the shape, structure and design purpose of the present application. Therefore, any equivalent changes made according to the shape, structure and design purpose of the present application should be included in the protection range of the present application, that is, these equivalent changes should be protected by the present application.

Claims

1. A multi-band compatible radio frequency module, characterized in that: It includes a PCB board, which includes a system-level chip SOC and a signal transceiver main switch. The SOC chip is provided with a signal transmitting end and a signal receiving end. The SOC chip is connected to the signal transceiver main switch through a domestic frequency band compatible line and a foreign frequency band compatible line. The signal transceiver main switch is connected to the antenna to control signal transmission and reception.

2. The multi-band compatible RF module according to claim 1, characterized in that: The 4G band signal of the domestic frequency band compatible line is amplified by the 3 / 4G power amplifier. The amplified signal intermediate frequency division duplex signal enters the signal transceiver main switch through the duplexer for transmission and reception, and the time division duplex signal is directly transmitted and received through the signal transceiver main switch.

3. The multi-band compatible radio frequency module according to claim 1 or 2, characterized in that: A low-pass filter is provided on the receiving link of the time division duplex signal.

4. The multi-band compatible RF module according to claim 1, wherein: In foreign frequency band compatible lines, the 3 / 4G signal is sent from the signal transmitter of the SOC chip, amplified by the 3 / 4G power amplifier, and the frequency division duplex signal enters the main signal transceiver switch through the duplexer for transmission and reception; the 2G signal is sent from the signal transmitter of the SOC chip, amplified by the 2G power amplifier, and then sent through the main signal transceiver switch, while at the same time being received through the 2G / 4G compatible receiving link.

5. The multi-band compatible radio frequency module according to claim 1, wherein: After the signal is sent from the signal transmitter, it passes through the same 3 / 4G power amplifier and is then divided into two paths: a domestic frequency band compatible line and a foreign frequency band compatible line, and enters the subsequent transmission link.

6. The multi-band compatible radio frequency module according to claim 5, characterized in that: In the domestic frequency band compatible line after the 3 / 4G power amplifier, the time division duplex signal transmission link includes the parallel B34 / 39 frequency bands and B38 / 40 / 41 frequency bands. The receiving links of the B34 / 39 frequency bands and B38 / 40 / 41 frequency bands are equipped with low-pass filters. After passing through the low-pass filters, the signals enter the signal receiving end of the SOC chip; the frequency division duplex signal transmission link includes the parallel B1 frequency band, B3 frequency band, B5 frequency band, and B8 frequency band. The frequency division duplex signal transmission link is equipped with a duplexer. After passing through the duplexer, the frequency division duplex signal is transmitted and received via the same TRX link. The duplexer is connected to the signal receiving end to form a receiving link.

7. The multi-band compatible radio frequency module according to claim 5, characterized in that: In the foreign frequency band compatible line after the 3 / 4G power amplifier, the frequency division duplex signal transmission link includes the parallel B7 band, B20 band, and B28 band. A duplexer is provided on the frequency division duplex signal transmission link. After passing through the duplexer, the frequency division duplex signal is transmitted and received via the same TRX link. The duplexer is connected to the signal receiving end to form a receiving link.

8. The multi-band compatible radio frequency module according to claim 7, characterized in that: The B7 band and the B34 / 39 band share the same transmission chain, which is bridged with the duplexer used by the B7 band.

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