Supporting platform for data center, container and data center

Abstract

The embodiment of the utility model provides a supporting platform for a data center, a container and the data center, the supporting platform comprises a frame structure and a supporting plate, the frame structure comprises a plurality of first supporting beams extending in the first direction and a plurality of second supporting beams extending in the second direction, a plurality of second supporting beams are connected between every two adjacent first supporting beams. The supporting plate is connected to the top of the frame structure, a bearing surface is defined by the upper side surface of the supporting plate, and the bearing surface is used for bearing at least one of a computing assembly, a power distribution cabinet and cooling equipment of the data center. Thus, the calculation assembly can be integrated on one supporting platform conveniently, or the calculation assembly, the power distribution cabinet and the cooling equipment can be integrated on one supporting platform conveniently, an integrated data center is formed, and transportation and delivery are facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computing devices, and particularly relates to a support platform for a data center, a container and the data center. BACKGROUND

[0002] A data center is usually arranged with multiple computing devices, a cooling module for cooling the computing devices and a power distribution module for supplying power to the computing devices. Before delivery, the modules are independent of each other, and need to be packaged and transported separately, which is relatively high in transportation cost. Moreover, after delivery, the placement positions of the modules need to be adjusted to match the site, and then the modules are assembled and tested, which leads to a relatively long deployment period. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the present application provide a support platform for a data center, a container and the data center, so as to solve or alleviate one or more technical problems in the prior art.

[0004] As an aspect of the embodiments of the present application, the embodiments of the present application provide a support platform for a data center, comprising:

[0005] A frame structure comprising a plurality of first support beams extending along a first direction and a plurality of second support beams extending along a second direction, a plurality of second support beams being connected between any two adjacent first support beams, and the first direction intersecting the second direction;

[0006] A support plate connected to a top of the frame structure, an upper side surface of the support plate defining a bearing surface, and the bearing surface being used for bearing at least one of a computing assembly, a power distribution cabinet and a cooling device of the data center.

[0007] In an embodiment, at least part of the second support beams are distributed in a staggered manner in the second direction.

[0008] In an embodiment, the support plate comprises a plurality of plate bodies arranged in a spliced manner, and each plate body is connected to the frame structure by a corresponding fastener.

[0009] In an embodiment, a gap is defined between any two adjacent plate bodies, and the gap is used for guiding a liquid on the bearing surface to an underside of the support plate.

[0010] In an embodiment, the gap has a width of 0.5 to 2 mm.

[0011] In an embodiment, an upper surface of the plate body is formed with a plurality of protruding structures distributed at intervals.

[0012] In an embodiment, the plurality of protruding structures comprises a plurality of first protruding structures and a plurality of second protruding structures, the first protruding structures intersect the second protruding structures in the extension direction of the horizontal plane, and the first protruding structures and the second protruding structures are alternately arranged in the second direction.

[0013] In an embodiment, the thickness of the plate body is 2-4 mm.

[0014] In an embodiment, the frame structure has a first region and a second region arranged in the first direction, the support plate covers the first region, and the support plate is used to support the power distribution cabinet and the plurality of computing assemblies.

[0015] The support platform further comprises a rack body arranged in the second region and extending upward from the second region, an inner portion of the rack body is used to accommodate a liquid storage module of the cooling device, and an upper portion of the rack body is used to support a heat exchange module of the cooling device.

[0016] In an embodiment, the size of the first region in the first direction is greater than the size of the second region in the first direction.

[0017] In an embodiment, the cooling device comprises a first pipe group and a second pipe group, the first pipe group is connected with a first heat exchange flow path of the heat exchange module, and the second pipe group is connected with a second heat exchange flow path of the heat exchange module.

[0018] The second region comprises three sub-regions arranged in the second direction, a horizontal projection of the rack body is located in a middle sub-region, and a bottom end of the rack body is connected with the middle sub-region, and horizontal projections of at least part of pipe sections of the first pipe group and the second pipe group are respectively located in two side sub-regions.

[0019] In an embodiment, the support platform further comprises two third support beams respectively connected to opposite sides of the frame structure in the second direction and extending in the first direction.

[0020] The support plate covers the top of the two third support beams and the frame structure, and the support plate has two vertical portions extending downward on opposite sides in the second direction, and the two vertical portions are respectively located on opposite sides of the two third support beams in the second direction.

[0021] In an embodiment, the support platform further comprises a plurality of footings arranged on the third support beams at intervals in the first direction.

[0022] The footing comprises a base and a screw rod connected to the base and extending vertically through a bottom wall of the third support beam, and the screw rod is used to cooperate with a nut to level the support platform.

[0023] In an embodiment, the vertical cross sections of the first support beam, the second support beam and the third support beam are all I-shaped or rectangular.

[0024] As another aspect of the embodiments of the present application, the embodiments of the present application provide a container, comprising: a box body, an accommodating cavity being defined inside the box body, the accommodating cavity being configured to accommodate the support platform of any one of the preceding embodiments.

[0025] In an embodiment, the box body comprises a frame, the frame being upwardly protruded at a side of the box body in the second direction;

[0026] The support platform is spaced apart from the frame at a side of the frame adjacent to the frame in the second direction to form a groove for draining liquid.

[0027] In an embodiment, the frame is formed with a plurality of liquid draining holes, the plurality of liquid draining holes being spaced apart in the first direction.

[0028] As another aspect of the embodiments of the present application, the embodiments of the present application provide a data center, comprising:

[0029] The support platform of any one of the preceding embodiments and the container of any one of the preceding embodiments;

[0030] The power distribution cabinet and the plurality of computing assemblies are sequentially arranged along the first direction and supported on the support plate of the support platform; the computing assembly comprises a cabinet and a plurality of computing devices, the plurality of computing devices being vertically arranged inside the cabinet.

[0031] In an embodiment, the data center further comprises: a cooling device, arranged at the second region of the support platform, the cooling device being configured to cool the computing devices of the plurality of computing assemblies.

[0032] The support platform for a data center according to the embodiments of the present application arranges at least one of a computing assembly, a power distribution cabinet and a cooling device on the support platform, facilitating transportation and deployment.

[0033] The above summary is intended to illustrate the present application and is not intended to be limiting thereof. Further aspects, embodiments and features of the present application will be readily apparent from the following detailed description and the accompanying drawings, and will be readily apparent to those skilled in the art. BRIEF DESCRIPTION OF DRAWINGS

[0034] In the drawings, like reference numerals are used to represent similar or identical elements throughout the several views. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the application. It should be understood that the drawings are merely depictions of some embodiments of the present application and should not be construed as limiting the scope of the present application.

[0035] FIG. 1A A perspective structural schematic diagram of a support platform according to an embodiment of the present application is shown;

[0036] FIG. 1B Fig. 7 shows a structural schematic diagram of a support platform according to an embodiment of the present application;

[0037] FIG. 2A Fig. 8 shows a structural schematic diagram of a support platform according to an embodiment of the present application from another perspective;

[0038] FIG. 2B Fig. 9 shows a structural schematic diagram of a support platform according to an embodiment of the present application from another perspective;

[0039] FIG. 3A Fig. 10 shows a schematic diagram of a cooling principle of a data center according to an embodiment of the present application;

[0040] FIG. 3B Fig. 11 shows a structural schematic diagram of a data center according to an embodiment of the present application.

[0041] Legend of signs:

[0042] 400 - support platform, 410 - frame structure, 410a - first area, 410b - second area, 410b1 - sub-area, 411 - first support beam, 412 - second support beam, 413 - third support beam, 420 - support plate, 421 - plate body, 422 - gap, 423 - protruding structure, 4231 - first protrusion, 4232 - second protrusion, 424 - vertical part, 430 - frame body, 431 - vertical frame, 432 - horizontal frame, 440 - footing, 441 - base, 442 - screw rod;

[0043] 1000 - computing assembly, 100 - cabinet, 200 - cooling device, 10 - heat exchange module, 10a - first heat exchange flow path, 10b - second heat exchange flow path, 210 - medium flow path, 215 - cooling pipeline, 230 - computing device;

[0044] 20 - first pipeline group, 21 - first liquid supply pipeline, 211 - first liquid supply sub-pipeline, 212 - second liquid supply sub-pipeline, 213 - liquid inlet pipeline, 22 - first liquid return pipeline, 221 - first liquid return section, 226 - liquid outlet pipeline, 30 - second pipeline group, 31 - second liquid supply pipeline, 32 - second liquid return pipeline;

[0045] 40 - first power device, 50 - second power device, 60 - first pressure stabilizing tank, 70 - second pressure stabilizing tank, 80 - first liquid storage tank, 90 - second liquid storage tank;

[0046] 300 - top frame, 500 - cold source device, 600 - power distribution cabinet, 700 - box body, 701 - frame, 702 - liquid discharge hole;

[0047] L1 - first direction, L2 - second direction. DETAILED DESCRIPTION

[0048] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0049] FIG. 1A Fig. 1 shows a perspective structural schematic view of a support platform 400 according to an embodiment of the present application, FIG. 1B Fig. 2 shows an exploded structural schematic view of the support platform 400 according to an embodiment of the present application, FIG. 2A Fig. 3 shows a structural schematic view of the support platform 400 according to an embodiment of the present application from one perspective, FIG. 2B Fig. 4 shows a structural schematic view of the support platform 400 according to an embodiment of the present application from another perspective.

[0050] With reference to FIGS. 1A-2B The support platform 400 for data center of the present embodiment comprises a frame structure 410 and a support plate 420, the frame structure 410 comprises a plurality of first support beams 411 extending along a first direction L1 and a plurality of second support beams 412 extending along a second direction L2, and a plurality of second support beams 412 are connected between two adjacent first support beams 411; the support plate 420 is connected to the top of the frame structure 410, and the upper side surface of the support plate 420 defines a bearing surface for bearing at least one of a computing assembly, a power distribution cabinet and a cooling device of the data center. In this way, the computing assembly can be integrated in one support platform 400 or the computing assembly, the power distribution cabinet and the cooling device can be integrated in one support platform 400, forming an integrated data center, which is convenient for transportation and delivery.

[0051] In some examples, the first direction L1 and the second direction L2 are two horizontal directions perpendicular to each other.

[0052] In some examples, the first support beam 411 and the second support beam 412 are fixedly connected by welding.

[0053] In other examples, the first support beam 411 and the second support beam 412 are fixedly connected by fasteners.

[0054] It should be noted that the above is only for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the first support beam 411 and the second support beam 412 can also have other modes, such as riveting, bolt connection or buckle connection, etc., to realize the fixed connection between the first support beam 411 and the second support beam 412, and is not limited thereto.

[0055] Exemplarily, the first support beam 411 and the second support beam 412 can be made of metal, and the first support beam 411 and the second support beam 412 can be in regular shapes.

[0056] In some examples, the first support beam 411 and the second support beam 412 can be made of steel, and the first support beam 411 and the second support beam 412 can be in I-shaped cross sections.

[0057] In other examples, the first support beam 411 and the second support beam 412 can be made of aluminum alloy, and the first support beam 411 and the second support beam 412 can be in rectangular cross sections.

[0058] It should be noted that the shapes and materials of the first support beam 411 and the second support beam 412 are not limited to the above examples, and the cross-sectional shapes of the first support beam 411 and the second support beam 412 can also be H-shaped, T-shaped, C-shaped, circular, Z-shaped, etc., and the materials of the first support beam 411 and the second support beam 412 can also be copper, carbon steel, alloy steel, etc., or other composite materials with high strength and supportability, etc., and are not limited thereto.

[0059] Exemplarily, the plurality of second support beams 412 distributed in the second direction L2 and connected between two adjacent first support beams 411 can be distributed relatively and / or staggered. FIG. 1B As shown, at least part of the second support beams 412 are staggered in the second direction L2 to optimize load distribution, avoid local stress concentration, and improve the structural stability and rigidity of the support platform 400.

[0060] Exemplarily, the support plate 420 includes a plurality of plate bodies 421 arranged in a spliced manner.

[0061] In some examples, each plate body 421 is connected to the frame structure 410 by a corresponding fastener. Exemplarily, the relative positions of the support plate 420, the first support beam 411 and / or the second support beam 412 of the frame structure 410 form screw holes, and the support plate 420 is fixed to the frame structure 410 by sequentially passing through the screw holes of the plate body 421 and the first support beam 411 and / or the second support beam 412.

[0062] In other examples, the plate body 421 is fixedly connected to the frame structure 410 by welding. Exemplarily, the plate body 421 is fixedly connected to the first support beam 411 and / or the second support beam 412 of the frame structure 410 by welding.

[0063] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the plate body 421 and the frame structure 410 can also have other various modes, such as riveting, bolt connection or buckle connection, etc., which can realize the fixed connection between the plate body 421 and the frame structure 410. Here, it is only an example, and the connection mode of the plate body 421 and the frame structure 410 is not limited to this.

[0064] For example, the support platform 400 of the embodiment increases the defensive design of discharging liquid. Specifically, a gap 422 is defined between two adjacent plate bodies 421, and the gap 422 is used to guide the liquid on the bearing surface to the lower side of the support plate 420, so as to avoid the liquid from depositing on the support plate 420.

[0065] It can be understood that the liquid of the embodiment refers to a cooling medium for cooling the computing device in the computing assembly and / or a heat exchange medium for cooling the cooling medium by heat exchange. For example, the cooling medium and the heat exchange medium can be selected from fluid media with good heat conduction performance and stability, such as cooling water, refrigerant, etc., which are not limited in the embodiment.

[0066] For example, the width of the gap 422 between the two adjacent plate bodies 421 can be 0.5-2 mm, such as 0.5 mm, 0.8 mm, 1 mm, 1.5 mm or 2 mm, etc. The gap 422 with such a size can ensure smooth discharge of the liquid while almost not affecting the support strength and rigidity of the support platform 400.

[0067] For example, the thickness of the plate body 421 can be 2-4 mm, which can ensure the structural strength of the support plate 420 and control the overall weight of the support plate 420.

[0068] In one embodiment, the upper surface of the plate body 421 is formed with spaced-apart protruding structures 423, which are used for anti-skid, so as to avoid the staff from slipping when stepping on the support plate 420, and the protruding structures 423 can also improve the structural strength and toughness of the support plate 420.

[0069] For example, the plurality of protruding structures 423 are uniformly distributed on the overall upper surface of the plate body 421.

[0070] In one embodiment, the plurality of protruding structures 423 include a plurality of first protrusions 4231 and a plurality of second protrusions 4232, the first protrusions 4231 and the second protrusions 4232 intersect in the extension direction of the horizontal plane, and the first protrusions 4231 and the second protrusions 4232 are alternately distributed in the second direction L2, so as to increase the anti-skid effect and the structural strength of the support plate 420.

[0071] AsFIG. 1A As shown, the extending direction of the first protrusions 4231 is substantially perpendicular to the extending direction of the second protrusions 4232, the plate body 421 has multiple rows of the first protrusions 4231 and multiple rows of the second protrusions 4232 in the second direction L2, each row of the first protrusions 4231 includes multiple first protrusions 4231 spaced apart in the first direction L1, each row of the second protrusions 4232 includes multiple second protrusions 4232 spaced apart in the first direction L1, and each row of the first protrusions 4231 and each row of the second protrusions 4232 are alternately arranged in the second direction L2.

[0072] In one embodiment, the frame structure 410 has a first region 410a and a second region 410b arranged in the first direction L1, the support plate 420 covers the first region 410a, and the support plate 420 is used to support the power distribution cabinet and the multiple computing assemblies. The support platform 400 further includes a rack body 430 arranged in the second region 410b and extending upward from the second region 410b, the interior of the rack body 430 is used to accommodate the liquid storage module of the cooling device, and the upper portion of the rack body 430 is used to support the heat exchange module of the cooling device. In this way, the power distribution cabinet, the multiple computing assemblies, and the liquid storage module and the heat exchange module of the cooling device are integrated by one support platform 400 to form an integrated data center, facilitating large-scale transportation and delivery, and reducing the maintenance cost of the data center.

[0073] The support platform 400 of the embodiment provides arrangement positions for the power distribution cabinet and the multiple computing assemblies through the first region 410a and the support plate 420 covering the first region 410a, and provides arrangement positions for the cooling device through the second region 410b, and the power distribution cabinet and the cooling device are physically isolated by the multiple computing assemblies to increase the distance therebetween, thereby improving the overall reliability of the data center.

[0074] In addition, due to the frame structure of the second region 410b, the leakage of the cooling device can be discharged to the outside of the support platform 400 through the second region 410b, and will not be deposited on the support platform 400, and will not flow to the support plate 420 in the first region 410a from the second region 410b, thereby avoiding the problem of the power distribution cabinet contacting the leaked liquid.

[0075] In addition, the support platform 400 lifts the power distribution cabinet and does not contact the placement surface of the data center, which can avoid the problem that the leakage of the cooling device may cause the placement surface to be wet and affect the power distribution cabinet; the support platform 400 can also guide the leakage of the cooling device to the outside of the support platform 400, completely isolating water and electricity, and further improving the safety of the data center.

[0076] Furthermore, the support platform 400 integrates the power distribution cabinet, the computing assembly and the cooling device, ensures that the water and electricity can be completely isolated, improves the integration of the data center, effectively utilizes the vertical and horizontal space, reduces the physical floor area, facilitates the overall transportation and delivery, simplifies the monitoring and management process, facilitates the operation and maintenance of the operation and maintenance personnel, and further reduces the distance and time of power and signal transmission, improves the response speed of the data center, and improves the overall reliability of the data center.

[0077] In some examples, the frame structure 410 is welded to the first region 210.

[0078] In other examples, the frame structure 410 can be connected to the first region 410a by fasteners, rivets, bolt connections or buckle connections, etc. Here, the connection mode of the frame structure 410 and the frame structure 410 is only illustrative and is not limited thereto.

[0079] For example, the frame structure 410 includes a vertical frame 431 and a horizontal frame 432, the bottom end of the vertical frame 431 is connected to the first region 210, and the horizontal frame 432 is connected to the top end of the vertical frame 431.

[0080] In some examples, the size of the first region 410a in the first direction L1 is greater than the size of the second region 410b in the first direction L1. It can be understood that the power distribution cabinet and the plurality of computing assemblies occupy a larger size in the first direction L1, and the first region 410a provides sufficient bearing space for the power distribution cabinet and the plurality of computing assemblies.

[0081] In some examples, the size of the first region 410a in the second direction L2 is substantially equal to the size of the second region 410b in the second direction L2.

[0082] It should be noted that the size of the first region 410a and the second region 410b can be flexibly set according to actual conditions to provide bearing space for the computing assembly, the power distribution cabinet and the cooling device, and ensure that the computing assembly, the power distribution cabinet and the cooling device are distributed in different regions on the support platform 400.

[0083] In one embodiment, the cooling device includes a first pipe group and a second pipe group, the first pipe group is connected with the first heat exchange flow path of the heat exchange module, and the second pipe group is connected with the second heat exchange flow path of the heat exchange module; wherein the second region 410b includes three sub-regions 410b1 arranged in the second direction L2; the orthographic projection of the frame structure 410 in the horizontal plane is located in the middle sub-region 410b1, and the bottom end of the frame structure 410 is connected with the middle sub-region 410b1; the orthographic projection of at least part of the pipe segments of the first pipe group and the second pipe group in the horizontal plane is respectively located in the two sub-regions 410b1 on the two sides.

[0084] As described above, the three sub-regions 410b1 of the second region 410b provide arrangement spaces for the first pipe group and the second pipe group of the cooling device, and the rack 430 above the middle sub-region 410b1 provides a support structure for the liquid storage module and the heat exchange module of the cooling device, so that the positions of the components in the cooling device are more concentrated, the space occupation of the cooling device is reduced, and the overall size of the data center is controlled.

[0085] In an embodiment, the frame structure 410 is connected with two third support beams 413 on opposite sides in the second direction L2, and the third support beams 413 extend along the first direction L1. The support plate 420 covers the top of the two third support beams 413 and the frame structure 410, and the support plate 420 has two vertical portions 424 extending downward on opposite sides in the second direction L2, and the two vertical portions 424 are respectively located on opposite sides of the two third support beams 413 in the second direction L2. In this embodiment, the support plate 420 is supported by the frame structure 410 in the middle and the two third support beams 413 on the sides, which improves the support strength. In addition, the two vertical portions 424 on opposite sides of the support plate 420 in the second direction L2 can play a positioning role in the assembly of the support plate 420 and the frame structure 410, which facilitates the placement of the support plate 420.

[0086] In some examples, the support plate 420 is fixedly connected with the third support beam 413 by welding.

[0087] In other examples, the support plate 420 is fixedly connected with the third support beam 413 by fasteners.

[0088] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the support plate 420 and the third support beam 413 can also have other various modes, such as riveting, bolt connection or buckle connection, etc., and is not limited thereto.

[0089] In an embodiment, the third support beam 413 can be provided with a plurality of footings 440 arranged at intervals along the first direction L1, and the footing 440 includes a base 441 and a screw rod 442 connected to the base 441 and extending vertically through the bottom wall of the third support beam 413, and the screw rod 442 is used to cooperate with a nut to level the support platform 400. In this way, the influence of the unevenness of the surface to be placed, such as the ground or the bottom wall of the container, on the stability of the support platform 400 can be overcome, and the overall stability of the support platform 400 is ensured.

[0090] For example, the bottom of the base 441 is provided with a rubber pad to increase friction and prevent sliding.

[0091] In some examples, the third support beam 413 is fixedly connected with the first support beam 411 of the frame structure 410 by welding.

[0092] In other examples, the third support beam 413 is fixedly connected with the first support beam 411 by fasteners.

[0093] It should be noted that the above is only for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the third support beam 413 and the first support beam 411 can also have other various modes, such as riveting, bolt connection or buckle connection, etc., as long as the fixed connection between the third support beam 413 and the first support beam 411 can be achieved, and is not limited thereto.

[0094] Exemplarily, the third support beam 413 has a regular shape, and the material of the third support beam 413 is metal.

[0095] In some examples, the vertical cross section of the third support beam 413 is an I-shaped section, and the material of the third support beam 413 can be steel.

[0096] In other examples, the vertical cross section of the third support beam 413 can be a rectangular section, and the material of the third support beam 413 can be an aluminum alloy.

[0097] It should be noted that the shape and material of the third support beam 413 are not limited to the above examples, and the cross-sectional shape thereof can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, and the material thereof can also be copper, carbon steel, alloy steel, etc., or other composite materials having high strength and supportability, etc., and is not limited thereto.

[0098] FIG. 3A Fig. 2 shows a schematic diagram of the cooling principle of a data center according to an embodiment of the present application, FIG. 3B Fig. 3 shows a schematic diagram of the structure of a data center according to an embodiment of the present application.

[0099] As FIG. 3B shown, the present embodiment also provides a container, which comprises a box body 700 having an accommodating cavity defined therein and a support platform 400 according to any of the above embodiments, so as to facilitate transportation, deployment and delivery.

[0100] In some examples, the support platform 400 can be directly placed in the interior of the box body 700. In order to ensure the stability of the support platform 400 during the container handling process, the interior dimension of the box body 700 can be matched with the dimension of the support platform 400 to prevent movement thereof; or a buffer protection layer can be additionally arranged between the support platform 400 and the box body 700 to provide additional protection against movement.

[0101] In some examples, the support platform 400 can be fixed to the inside of the box 700. For example, the support platform 400 can be fixed to the bottom wall of the box 700 by fasteners. In this way, the support platform 400 is not only reinforced, but also significantly improves its stability during transportation.

[0102] It should be noted that the above is only an example and does not constitute a limitation on the present application.

[0103] As can be understood by those skilled in the art, the support platform 400 can also be arranged in other ways relative to the box 700. For example, a non-slip pad can be added to the bottom of the box 700, or a shock pad or shock absorber can be used to isolate the support platform 400 from the box 700 to reduce the vibration and impact generated by the box 700 during transportation. In addition, clamps or buckles can be provided inside the box 700, or the support platform 400 can be fixed by magnetic attraction or vacuum suction. Here, only examples are given, and the arrangement of the support platform 400 relative to the box 700 is not limited to the above examples.

[0104] In one embodiment, the box 700 includes a frame 701 that is upwardly protruding on one side of the bottom of the box 700 in the second direction L2. The support platform 400 is arranged adjacent to the frame 701 in the second direction L2 and spaced apart from the frame 701 to form a groove for draining liquid. That is, when the support platform 400 is arranged on the bottom of the box 700, it needs to maintain a certain distance from the frame of the box 700 to reserve a channel for liquid drainage, so as to facilitate the timely drainage of liquid.

[0105] The frame 701 can be formed with a plurality of liquid drainage holes 702 spaced apart in the first direction L1. The liquid in the groove is drained out of the box 700 through the liquid drainage holes 702 to avoid water accumulation on the bottom of the box 700.

[0106] For example, there are two liquid drainage holes 702. The two liquid drainage holes 702 can jointly form a forklift hole to facilitate the transportation of the container by a forklift.

[0107] For example, the support platform 400 is arranged on the bottom of the box 700. FIG. 3A For example, the support platform 400 is arranged on the bottom of the box 700. 3BAs shown, the embodiment also provides a data center, which comprises the support platform 400 of any of the foregoing embodiments and the container of any of the foregoing embodiments and the power distribution cabinet 600 and the plurality of computing assemblies 1000. The power distribution cabinet 600 and the plurality of computing assemblies 1000 are sequentially arranged along the first direction L1 and supported on the support plate 420 of the support platform 400; the computing assembly 1000 comprises the cabinet 100 and the plurality of computing devices 230, and the plurality of computing devices 230 are vertically arranged in the interior of the cabinet 100. In this way, the container-type data center is formed, which is convenient for transportation, deployment and delivery. In addition, compared with the traditional data center, the construction and maintenance cost of the container-type data center is lower, and the container-type data center can be pre-assembled and tested, and only needs to be simply connected with power supply and network on site to put into use, thereby saving time.

[0108] In an embodiment, the cabinet 100 has a first accommodating space and a second accommodating space arranged in the first direction L1, the plurality of computing devices 230 are vertically arranged in the first accommodating space, and the computing assembly 1000 comprises a plurality of power distribution units (not shown), which are vertically arranged in the second accommodating space.

[0109] The power distribution unit is connected with the power distribution cabinet 600 through a power supply cable, and the power distribution unit is connected with the computing devices 230 in the cabinet 100 to improve the convenience of power supply of the computing devices 230.

[0110] The top of the cabinet 100 can be provided with a top connecting plate, which is arranged on one side of the top of the cabinet body 110 in the first direction L1 and used for connecting with an adjacent cabinet 100 arranged in the first direction L1. That is, the adjacent two cabinets 100 arranged in the first direction L1 can be connected together through the top connecting plate, so as to facilitate the construction of the plurality of cabinets 100 arranged in sequence and connected together, thereby forming a stable integrated plurality of cabinets 100, which is convenient for transportation and delivery.

[0111] For example, the top connecting plate can be arranged on the edge of the top of the cabinet body 110 in the first direction L1, the top connecting plate has a connecting hole, the top of the adjacent other cabinet 100 has another connecting hole corresponding to the connecting hole, and the adjacent two cabinets 100 are connected through a fastener sequentially penetrating the connecting hole and the other connecting hole.

[0112] The cabinet 100 can be connected with the support platform 400 through a bottom connecting plate, the bottom connecting plate is downwardly and obliquely extended from the outside of the bottom of the cabinet body 110 in the second direction L2 to form a stable triangular bottom connecting plate, thereby improving the stability of the connection between the cabinet 100 and the support platform 400. It can be understood that the bottom connecting plate is formed with a connecting hole connected with the cabinet 100 and a connecting hole connected with the support platform 400, and the fastener penetrating the corresponding connecting holes is used to respectively fix the bottom connecting plate with the cabinet 100 and the support platform.

[0113] Exemplarily, the bottom of the cabinet 100 is provided with a bottom connecting plate on each outer side in the second direction L2, so as to improve the stability of the connection between the cabinet 100 and the support platform 400.

[0114] Referring to FIG. 3A The computing assembly 1000 further comprises a medium flow path 210 corresponding to the plurality of computing devices 230, and the medium flow path 210 is used for flowing cooling medium through the plurality of computing devices 230. Specifically, the medium flow path 210 can comprise a cooling pipe 215, an inlet liquid distribution pipe 150 and a return liquid distribution pipe 140. The cooling pipe 215 is arranged inside the computing device 230 and is in heat conduction contact with the heat generating components of the computing device 230, so as to cool the heat generating components.

[0115] Exemplarily, the cooling pipe 215 can be attached to or embedded in the key heat generating components of the computing device 230, such as the central processing unit, the graphics processing unit, the memory module and other heat generating electronic elements.

[0116] The inlet liquid distribution pipe 150 and the return liquid distribution pipe 140 are arranged on one side of the cabinet 100. The inlet liquid distribution pipe 150 has an inlet liquid port and a plurality of liquid delivery ports. The inlet liquid port is connected with the liquid supply outlet of the first pipe group 20, and the plurality of liquid delivery ports are in one-to-one correspondence with the cooling pipes 215 of the plurality of computing devices 230 and are respectively connected with the input ends of the cooling pipes 215 of the plurality of computing devices 230. The return liquid distribution pipe 140 has a plurality of return liquid ports and an outlet liquid port. The plurality of return liquid ports are in one-to-one correspondence with the cooling pipes 215 of the plurality of computing devices 230 and are respectively connected with the output ends of the cooling pipes 215 of the plurality of computing devices 230, and the outlet liquid port is connected with the return liquid inlet of the first pipe group 20.

[0117] In the computing assembly 1000 of the embodiment, the cabinet 100 not only bears the plurality of computing devices 230, but also cools the plurality of computing devices 230. The structure is compact and occupies less space, so as to facilitate maintenance and reduce cost. Moreover, the inlet liquid distribution pipe 150 and the return liquid distribution pipe 140 are used to realize liquid distribution and return distribution to the plurality of computing devices 230, so as to reduce the number of components of the computing assembly 1000 and simplify the overall structure of the cabinet 100. Moreover, it is convenient for centralized management, which is conducive to more effectively controlling temperature and reducing energy consumption.

[0118] Exemplarily, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are vertically arranged on a side of the cabinet 100 adjacent to the first pipeline group 20 in the second direction L2, and the plurality of liquid supply ports and the plurality of liquid return ports are vertically and spacedly arranged. On the one hand, the liquid inlet of the liquid inlet distribution pipeline 150 and the liquid outlet of the liquid return distribution pipeline 140 are respectively connected with the liquid supply outlet of the first pipeline group 20 and the liquid return inlet of the first pipeline group 20; on the other hand, the arrangement direction of each liquid supply port and the arrangement direction of each liquid return port are consistent with the arrangement direction of each computing device 230, so as to facilitate the connection between each liquid supply port, each liquid return port and the cooling pipeline 215 inside each computing device 230.

[0119] In an embodiment, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are respectively projected on two sides of the projection of the plurality of computing devices 230 in the vertical plane; the plurality of liquid supply ports and the plurality of liquid return ports are distributed in the first direction L1, and the plurality of liquid supply ports are adjacent to one side of the plurality of computing devices 230 in the first direction L1, and the plurality of liquid return ports are adjacent to the other side of the plurality of computing devices 230 in the first direction L1. In this way, the arrangement of the liquid supply hose between each liquid supply port and the input end of each cooling pipeline 215 and the arrangement of the liquid return hose between each liquid return port and the output end of each cooling pipeline 215 can be simplified, so as to shorten the length of the liquid supply hose and the liquid return hose.

[0120] In an embodiment, the liquid inlet is formed on a side of the liquid inlet distribution pipeline 150 adjacent to the first pipeline group 20 in the second direction L2 and adjacent to the top end of the liquid inlet distribution pipeline 150; and the liquid outlet is formed on a side of the liquid return distribution pipeline 140 adjacent to the first pipeline group 20 in the second direction L2 and adjacent to the top end of the liquid return distribution pipeline 140. In this way, the distance between the liquid inlet of the liquid inlet distribution pipeline 150 and the liquid outlet of the liquid return distribution pipeline 140 and the first pipeline group 20 is shortened, so as to facilitate the connection between the liquid inlet and the liquid supply inlet of the first pipeline group 20 and the connection between the liquid outlet and the liquid return inlet of the first pipeline group 20.

[0121] The cooling device 200 of the data center can be arranged in the second area 410b of the support platform 400, so as to facilitate the heat dissipation of each computing device 230, greatly reduce the space occupation of the data center, facilitate the maintenance of the data center, and reduce the construction cost and maintenance cost of the data center.

[0122] Exemplarily, the cooling device 200 comprises a liquid storage module and a heat exchange module 10, the inside of the rack body 430 is used for accommodating the liquid storage module, and the upper part of the rack body 430 is used for supporting the heat exchange module 10.

[0123] Exemplarily, the cooling device 200 further comprises a first pipe group 20 and a second pipe group 30, the first pipe group 20 is connected with the first heat exchange flow path 10a of the heat exchange module 10, and the second pipe group 30 is connected with the second heat exchange flow path 10b of the heat exchange module 10; the second area 410b comprises three sub-areas 410b1 arranged in the second direction L2; the orthographic projection of the rack body 430 in the horizontal plane is located in the middle sub-area 410b1, and the bottom end of the rack body 430 is connected with the middle sub-area 410b1; at least part of the first pipe group 20 and the second pipe group 30 are respectively located in the two sub-areas 410b1 on the two sides in the orthographic projection in the horizontal plane.

[0124] The first pipe group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the plurality of computing assemblies 1000, for conveying the low-temperature cooling medium cooled by the heat exchange module 10 to the medium flow path 210 of the computing assembly 1000, and conveying the high-temperature cooling medium flowing through the computing assembly 1000 from the medium flow path 210 of the computing assembly 1000 back to the heat exchange module 10, so as to realize the circulation of the cooling medium between the heat exchange module 10 and the medium flow path 210 of the computing assembly 1000, thereby realizing the circulating cooling of the computing device 230 of the computing assembly 1000.

[0125] The second pipe group 30 is connected between the heat exchange module 10 and the cold source device 500, for conveying the heat exchange medium heated by absorbing the heat of the cooling medium in the heat exchange module 10 to the cold source device 500, and conveying the heat exchange medium cooled by the cold source device 500 back to the heat exchange module 10, so as to realize the circulation of the heat exchange medium between the heat exchange module 10 and the cold source device 500, thereby realizing the circulating cooling of the cooling medium.

[0126] The first heat exchange flow path 10a can be used for the cooling medium to flow, and the second heat exchange flow path 10b can be used for the heat exchange medium to flow, and the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium.

[0127] The first pipe group 20 can comprise a first liquid supply pipe 21 and a first liquid return pipe 22. The first liquid supply pipe 21 can be connected with the output end of the first heat exchange flow path 10a, and the first liquid supply pipe 21 can be connected with the liquid inlet of the medium flow path 210 of the computing assembly 1000; the first liquid return pipe 22 can be connected with the input end of the first heat exchange flow path 10a, and the first liquid return pipe 22 can be connected with the liquid outlet of the medium flow path 210 of the computing assembly 1000.

[0128] The second pipeline group 30 can include a second liquid supply pipeline 31 and a second liquid return pipeline 32; the second liquid supply pipeline 31 can be connected with the input end of the second heat exchange flow path 10b, and the second liquid supply pipeline 31 can be connected with the medium output end of the cold source device 500; the second liquid return pipeline 32 can be connected with the output end of the second heat exchange flow path 10b, and the second liquid return pipeline 32 can be connected with the medium return end of the cold source device 500; wherein the first pipeline group 20 and the second pipeline group 30 can be respectively arranged on opposite sides of the heat exchange module 10. On the one hand, it is beneficial to improve the convenience of the pipeline connection of the cooling device 200, the computing assembly 1000 and the cold source device 500, and on the other hand, it can make full use of the space on both sides of the heat exchange module 10, so that the first pipeline group 20 and the second pipeline group 30 do not interfere with each other, and the space utilization can be improved, thereby improving the structural compactness of the data center.

[0129] In an embodiment, the cooling device 200 can further include a first power device 40 and a second power device 50, the first power device 40 being in communication with the first pipeline group 20 for providing power to the flow of the cooling medium; the second power device 50 being in communication with the second pipeline group 30 for providing power to the flow of the heat exchange medium.

[0130] For example, the first power device 40 and the second power device 50 can be fluid power pumps for pushing the cooling medium to flow in the pipeline. The first power device 40 and the second power device 50 can be respectively arranged in two sub-regions on both sides of the support platform 400.

[0131] The liquid storage module of the cooling device 200 can include a first liquid storage tank 80 and a second liquid storage tank 90, the first liquid storage tank 80 being in communication with the first pipeline group 20, the first liquid storage tank 80 being used to contain the cooling medium for supplementing the cooling medium to the first pipeline group 20. The second liquid storage tank 90 is in communication with the second pipeline group 30, and the second liquid storage tank 90 is used to contain the cooling medium for supplementing the heat exchange medium to the second pipeline group 30.

[0132] The first liquid storage tank 80 and the second liquid storage tank 90 can be arranged inside the frame body 430 of the support platform 400 and arranged side by side and adjacent in the second direction L2. That is, the first liquid storage tank 80 and the second liquid storage tank 90 are both located below the heat exchange module 10, so as to make full use of the space below the heat exchange module 10, and reduce the space occupation of the first liquid storage tank 80 and the second liquid storage tank 90 in the horizontal direction, thereby further improving the structural compactness of the cooling device 200.

[0133] In an embodiment, the cooling device 200 further comprises a first pressure stabilizing tank 60 and a second pressure stabilizing tank 70. The first pressure stabilizing tank 60 is in communication with the first pipe group 20 for stabilizing the pressure of the first pipe group 20. The second pressure stabilizing tank 70 is in communication with the second pipe group 30 for stabilizing the pressure of the second pipe group 30. When the pressure in the cooling medium circulation system of the cooling device 200 is too high, the excess cooling medium in the first pipe group 20 will enter the first pressure stabilizing tank 60; when the pressure in the system is too low, the cooling medium in the first pressure stabilizing tank 60 will flow back to the system to keep the pressure stable. In this way, the stability, reliability and heat exchange efficiency of the cooling device 200 are improved. Similarly, when the pressure in the heat exchange medium circulation system of the cooling device 200 is too high or too low, the second pressure stabilizing tank 70 is adjusted to keep the pressure stable.

[0134] The first pressure stabilizing tank 60 and the second pressure stabilizing tank 70 can be arranged inside the frame of the support platform 400, fixed in the middle sub-area of the support platform 400, and arranged side by side and adjacent in the second direction L2, so that the space below the heat exchange module 10 can be further utilized, and the structural compactness of the cooling device 200 is improved, and the space occupation of the cooling device 200 in the horizontal direction is reduced.

[0135] In an embodiment, the first liquid supply pipe 21 can comprise a first liquid supply sub-pipe 211 and a second liquid supply sub-pipe 212 connected in series. The first liquid supply sub-pipe 211 and the second liquid supply sub-pipe 212 can extend along the first direction L1, respectively, and arranged side by side and spaced apart in the second direction L2. The first liquid supply sub-pipe 211 has a liquid supply inlet at one end adjacent to the heat exchange module 10, and the liquid supply inlet is connected to the output end of the first heat exchange flow path 10a. The second liquid supply sub-pipe 212 is connected to the first liquid supply sub-pipe 211 at one end away from the heat exchange module 10, and the second liquid supply sub-pipe 212 has a liquid supply outlet connected to the liquid inlet of the medium flow path 210. The first liquid return pipe 22 can comprise a first liquid return section 221 extending along the first direction L1. The first liquid return section 221 can be provided with a liquid return inlet connected to the liquid outlet of the medium flow path 210.

[0136] In the present embodiment, two liquid supply sub-pipes are arranged side by side and spaced apart. On the one hand, the flow rate of the medium can be evenly distributed, avoiding a single pipe bearing too high a flow rate and pressure, thereby reducing the pressure loss of fluid flow and reducing the local resistance of fluid when entering and leaving the pipe. On the other hand, by independently arranging each liquid supply sub-pipe, the thermal interference of cooling fluid between the pipes can be reduced, and the overall heat exchange efficiency of the cooling device 200 is improved.

[0137] In an embodiment, the second liquid supply sub-pipe 212 can be provided with a plurality of liquid supply outlets, which can be arranged along the first direction L1 and correspond to the liquid inlet of the medium flow path 210 of the plurality of computing assemblies 1000 one by one. Each liquid supply outlet can be in communication with the liquid inlet of the medium flow path 210 of the corresponding computing assembly 1000.

[0138] For example, each liquid supply outlet can be connected to the liquid inlet of the medium flow path 210 of the corresponding computing assembly 1000 through a liquid inlet pipe 213. The liquid supply outlet can be formed in the bottom of the wall of the second liquid supply sub-pipe 212. That is, the plurality of liquid supply outlets of the second liquid supply sub-pipe 212 are connected to the liquid inlets of the liquid supply distribution pipes 150 of the plurality of computing assemblies 1000 one by one.

[0139] In an embodiment, the first liquid return section 221 can be provided with a plurality of liquid return inlets, which can be arranged along the first direction L1 and correspond to the liquid outlet of the medium flow path 210 of the plurality of computing assemblies 1000 one by one. Each liquid return inlet can be connected to the liquid outlet of the medium flow path 210 of the corresponding computing assembly 1000. That is, the plurality of liquid return inlets of the first liquid return section 221 are connected to the liquid outlets of the liquid return distribution pipes 140 of the plurality of computing assemblies 1000 one by one.

[0140] For example, each liquid return inlet can be connected to the liquid outlet of the medium flow path 210 of the corresponding computing assembly 1000 through a liquid outlet pipe 226. The high-temperature cooling medium in the medium flow path 210 of each computing assembly 1000 enters the first liquid return pipe 22 through the liquid return inlet, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipe 22.

[0141] In some examples, at least one of the liquid inlet pipe 213 and the liquid outlet pipe 226 is a flexible pipe to accommodate space constraints and facilitate installation and disassembly.

[0142] In other examples, at least one of the liquid inlet pipe 213 and the liquid outlet pipe 226 is a rigid pipe to improve the structural strength of the pipe.

[0143] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the flexible pipe used in the liquid inlet pipe 213 and the liquid outlet pipe 226 can be a plastic pipe, a corrugated pipe, or other pipe that can be bent and has elasticity. The rigid pipe can be a copper pipe, an aluminum pipe, a stainless steel pipe, or other metal pipe that has a large hardness, or a plastic pipe that has a strong hardness and support, or a rigid pipe made of plastic, metal, or composite material that has a certain hardness and bending ability.

[0144] The material of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is not limited to the above examples, and can be any combination of the above materials, such as a combination of soft and hard pipelines, all soft pipelines, or all hard pipelines, and the like.

[0145] According to the above embodiment, by arranging multiple liquid return inlets in the first direction L1, the return flow path of the cooling medium is uniformly distributed, and the space utilization is optimized. Meanwhile, the modular design of the corresponding liquid supply outlet and liquid return inlet of the computing assembly 1000 helps the overall expansion and maintenance of the cooling device 200. When it is necessary to increase or reduce the computing assembly 1000, only the positions and quantities of the corresponding liquid supply outlet and liquid return inlet need to be adjusted, thereby improving the flexibility and maintenance efficiency of the cooling device 200.

[0146] Exemplarily, the ends of the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 away from the heat exchange module 10 are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 in the second direction L2, so as to fully utilize the space between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212.

[0147] In an embodiment, the first liquid return pipeline 22 further comprises a second liquid return section and a third liquid return section connected thereto, and the second liquid return section and the third liquid return section respectively extend in the vertical direction. The end of the first liquid return section away from the heat exchange module 10 is closed, and the end of the first liquid return section 221 adjacent to the heat exchange module 10 is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path 10a.

[0148] Exemplarily, the second liquid return section and the third liquid return section are located in the sub-area 410b1 on the side adjacent to the first liquid supply pipeline 21, and the upper space of the support platform 400 is fully utilized, and the connection between the third liquid return section and the input end of the first heat exchange flow path 10a of the heat exchange module 10 is facilitated.

[0149] In an embodiment, the second liquid supply pipeline 31 and the second liquid return pipeline 32 are located in a sub-area 410b1 on the side away from the first liquid supply pipeline 21 of the support platform 400, i.e., the second liquid supply pipeline 31 and the second liquid return pipeline 32 of the second pipeline group 30 are distributed on the opposite side of the first pipeline group 20 in the first direction L1. Thus, the pipelines of the cooling device 200 are further concentrated, and the structural compactness of the cooling device 200 is improved.

[0150] AsFIG. 3B As shown, the data center can further include a top frame 300 fixed to the top of the plurality of computing assemblies 1000, the top frame 300 can include a plurality of cross beams respectively extending along the first direction L1 and arranged side by side and spaced apart in the second direction L2, and a plurality of longitudinal beams extending along the second direction L2 so as to intersect the cross beams; wherein the plurality of longitudinal beams are fixedly connected between two adjacent cross beams; and part of the pipe segments of the first pipe group 20 can be supported by the plurality of longitudinal beams. In this way, the top of the plurality of computing assemblies 1000 is fixed, avoiding the situation that the computing assemblies 1000 shake and collide with each other during transportation of the data center.

[0151] In addition, by arranging the longitudinal beams intersecting and connected with the cross beams, the stability of the top frame 300 is improved, and at the same time, a support and fixing structure is provided for part of the pipe segments of the first pipe group 20 of the cooling device 200, which not only facilitates the connection between the first pipe group 20 and the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 of the computing assembly 1000, but also eliminates the need for additional fixing structure to fix the first pipe group 20, which is conducive to improving the compactness of the structure and the space utilization.

[0152] In some examples, the longitudinal beams and the cross beams can be fixedly connected by clamping, welding, or the like.

[0153] In other examples, the longitudinal beams and the cross beams can be connected by fasteners, rivets, latches, or the like. Here, the connection mode of the longitudinal beams and the cross beams is only illustrative and is not limited thereto.

[0154] In an embodiment, the first liquid supply sub-pipe 211, the second liquid supply sub-pipe 212, and the first liquid return section 221 of the first pipe group 20 can be supported by the plurality of longitudinal beams of the top frame 300, and the first liquid return section 221 is arranged between the first liquid supply sub-pipe 211 and the second liquid supply sub-pipe 212. In this way, part of the pipe segments of the first pipe group 20 are concentrated on the top frame 300, improving the compactness of the arrangement of the first pipe group 20 and the computing assembly 1000, facilitating the connection of the liquid supply outlet of the first pipe group 20 and the liquid inlet of the liquid inlet distribution pipe 150 of the computing assembly 1000, and facilitating the connection of the liquid return inlet of the first pipe group 20 and the liquid outlet of the liquid return distribution pipe 140 of the computing assembly 1000.

[0155] In an embodiment, the plurality of beams includes a first beam and a second beam, and the first beam and the second beam are fixedly connected to the top of the at least one computing assembly 1000. The longitudinal beam includes a first section and a second section, the first section is connected between the first beam and the second beam, and the second section is located on a side of the second beam away from the first beam and extends to the outside of the computing assembly 1000 in the second direction L2, wherein the second section supports the first liquid supply sub-pipe 211, the second liquid supply sub-pipe 212, and the first liquid return section 221 of the first pipe group 20.

[0156] In the embodiment, the second section of the longitudinal beam extends from the top of the computing assembly 1000 to the outside of the computing assembly 1000 in the second direction L2, so that the first liquid supply sub-pipe 211, the second liquid supply sub-pipe 212, and the first liquid return section 221 supported by the second section 322 are located on the outside of the computing assembly 1000 in the second direction L2, instead of directly above the top of the computing assembly 1000, so that when the first pipe group 20 leaks, the liquid will drip to the outside of the computing assembly 1000, instead of the top of the computing assembly 1000, thereby avoiding affecting the computing assembly 1000; moreover, the first pipe group 20 is located on the outside of the computing assembly 1000 in the second direction, thereby reserving a reasonable space for the arrangement of the connecting pipes between the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 of the computing assembly 1000 and the first pipe group 20, and facilitating the connection between the pipes.

[0157] For example, the projection of the first section of the longitudinal beam in the horizontal plane is within the projection of the computing assembly 1000 in the horizontal plane, and the projection of the second section of the longitudinal beam in the horizontal plane is outside the projection of the computing assembly 1000 in the horizontal plane, i.e., the second section is entirely located on the outside of the computing assembly 1000 in the second direction L2, so that the first liquid supply sub-pipe 211, the second liquid supply sub-pipe 212, and the first liquid return section 221 supported by the second section are all located on the outside of the computing assembly 1000 in the second direction L2, facilitating the connection between the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 of the computing assembly 1000 and the first pipe group 20, while completely avoiding the first pipe group 20 from the top of the computing assembly 1000, thereby avoiding affecting the computing assembly 1000 when the first pipe group 20 leaks, and improving the safety of the data center.

[0158] The number of longitudinal beams can be multiple, and the multiple longitudinal beams are one-to-one corresponding to the multiple computing assemblies 1000, and the longitudinal beams are located on the top of the corresponding computing assemblies 1000, that is, one longitudinal beam extending along the second direction L2 is arranged on the top of each computing assembly 1000, and correspondingly, the cross beams connect the multiple computing assemblies 1000. On the one hand, the load distribution on the longitudinal beams is optimized to avoid local stress concentration, and the structural stability and strength of the top frame 300 are improved to ensure that stable support is provided for the first pipeline group 20; on the other hand, the top of each computing assembly 1000 is limited by the longitudinal beams and the cross beams to improve the stability of the top connection of the multiple computing assemblies 1000.

[0159] In some examples, the shape and size of the box 700 can be set according to the corresponding standard container of the 40-foot specification, and the overall size is 12.192m*2.438m*2.438m. Thus, the pry block structure formed by integrating the power distribution cabinet 600, the multiple computing assemblies 1000, and the cooling equipment 200 on the support platform 400 is arranged behind the accommodating cavity of the box 700, and the data center can be directly transported by sea or other means such as land transportation, and does not need to be assembled again after transportation, thereby improving the convenience of transportation and delivery.

[0160] The above is only one specific example and does not constitute a limitation of the present application. Those skilled in the art can understand that the shape and size of the box 700 can be set arbitrarily according to actual conditions. In order to facilitate transportation, the shape and size of the box 700 can be set according to the corresponding standard container, for example, the same shape and size as the standard container of the 20-foot, 40-foot, or 45-foot specification, but not limited thereto.

[0161] The shape and size of the box 700 can also have other different designs, for example, a compact design can be used to make the internal shape and size of the box 700 close to the shape and size of the pry block structure, reducing excess space and avoiding movement of the pry block structure in the box 700; or a spare space design can be used to reserve a certain buffer space around the inside of the box 700 to facilitate the placement of fillers or buffer materials to provide additional protection. Here, only examples are given, and the shape and size of the box 700 are not limited to the foregoing examples.

[0162] In the description of the present application, it should be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "vertical", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0163] In addition, the terms "first", "second", etc. are used only for the purpose of description and do not imply or indicate relative importance or imply the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0164] In the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected" and the like can be electrically connected, and can also be communicated; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0165] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can include the first and second features in direct contact, or the first and second features not in direct contact but in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "under", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0166] The above disclosure provides many different implementations or examples to achieve the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of the specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to the same reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0167] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any skilled person in the art can easily think of various changes or replacements within the technical scope disclosed by the present application, which should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A support platform for a data center, characterized in that: include: A frame structure comprising a plurality of first support beams extending along a first direction and a plurality of second support beams extending along a second direction, wherein a plurality of the second support beams are connected between two adjacent first support beams; A support plate is connected to the top of the frame structure, and the upper surface of the support plate defines a bearing surface, which is used to bear at least one of the computing assembly, power distribution cabinet and cooling equipment of the data center.

2. The support platform according to claim 1, characterized in that: At least part of the second support beams are staggered in the second direction.

3. The support platform according to claim 1, characterized in that: The support plate includes a plurality of plates arranged in a spliced ​​relationship with each other, and each of the plates is connected to the frame structure via a corresponding fastener.

4. The support platform according to claim 3, characterized in that: A gap is defined between two adjacent plates, and the gap is used to guide the liquid on the bearing surface to the lower side of the support plate.

5. The support platform according to claim 4, characterized in that: The width of the gap is 0.5 to 2 mm.

6. The support platform according to claim 3, characterized in that: A plurality of convex structures distributed at intervals are formed on the upper surface of the plate.

7. The support platform according to claim 6, characterized in that: The plurality of protrusion structures include a plurality of first protrusions and a plurality of second protrusions, the first protrusions intersect with the second protrusions in an extension direction of a horizontal plane, and the first protrusions and the second protrusions are alternately distributed in the second direction.

8. The support platform according to claim 3, characterized in that: The thickness of the plate is 2-4 mm.

9. The support platform according to claim 1, characterized in that: The frame structure has a first area and a second area arranged in the first direction, the support plate covers the first area, and the support plate is used to support the power distribution cabinet and the plurality of computing assemblies; The support platform further includes a frame, which is arranged in the second area and extends upward from the second area. The interior of the frame is used to accommodate the liquid storage module of the cooling device, and the upper part of the frame is used to support the heat exchange module of the cooling device.

10. The support platform according to claim 9, characterized in that: A size of the first region in the first direction is greater than a size of the second region in the first direction.

11. The support platform according to claim 9, characterized in that: The cooling device includes a first pipeline group and a second pipeline group, the first pipeline group is connected to the first heat exchange flow path of the heat exchange module, and the second pipeline group is connected to the second heat exchange flow path of the heat exchange module; The second area includes three sub-areas arranged in the second direction; the orthographic projection of the frame in the horizontal plane is located in the middle sub-area, and the bottom end of the frame is connected to the middle sub-area; at least part of the pipe section of the first pipeline group and the orthographic projection of the second pipeline group in the horizontal plane are respectively located in the two sub-areas on both sides.

12. The support platform according to claim 1, characterized in that: Also includes: two third support beams, respectively connected to opposite sides of the frame structure in the second direction and extending along the first direction; The support plate covers the two third support beams and the top of the frame structure. The support plate has two vertical portions extending downward on opposite sides of the second direction. The two vertical portions are respectively located on opposite sides of the two third support beams in the second direction.

13. The support platform according to claim 12, characterized in that: It also includes a plurality of footings, wherein the plurality of footings are arranged at intervals along the first direction and are arranged on the third support beam; The foot comprises a base and a screw rod connected to the base and extending vertically through the bottom wall of the third support beam, wherein the screw rod is used to cooperate with a nut to level the support platform.

14. The support platform according to claim 12, characterized in that: The vertical cross-sections of the first support beam, the second support beam, and the third support beam are all I-shaped or rectangular.

15. A container, characterized in that: include: The box body defines an accommodating cavity therein, and the accommodating cavity is used to accommodate the support platform according to any one of claims 1 to 14.

16. The container according to claim 15, characterized in that The box body includes a frame, and the frame is protruded upward on one side of the bottom of the box body in the second direction; The support platform is spaced apart from the frame at a side adjacent to the frame in the second direction to form a groove for draining liquid.

17. The container according to claim 16, characterized in that The frame is formed with a plurality of drainage holes, and the plurality of drainage holes are distributed at intervals in the first direction.

18. A data center, characterized in that: include: The support platform according to any one of claims 1 to 14 and the container according to any one of claims 15 to 17; A power distribution cabinet and multiple computing assemblies, the power distribution cabinet and the multiple computing assemblies are arranged sequentially along a first direction and supported on the support plate of the support platform; the computing assembly includes a cabinet and multiple computing devices, the multiple computing devices are arranged vertically inside the cabinet.

19. The data center according to claim 18, wherein: Also includes: A cooling device is arranged in the second area of ​​the support platform, and is used to cool the computing devices of the plurality of computing assemblies.

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