Glue pouring device for high-frequency test Socket
By using a potting device to form an insulating layer and perform secondary hole processing in the IC test socket, the problem of signal transmission quality degradation was solved, and signal integrity and low latency effects were achieved in high-frequency testing.
Patent Information
- Application Number
- CN202422678686.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-04
AI Technical Summary
Existing IC test socket designs suffer from high self-inductance and mutual capacitance issues, leading to a decline in signal transmission quality and failing to meet the requirements of high-frequency testing.
A high-frequency test socket potting device is used. An insulating layer is formed by setting a potting groove, an air vent, and a positioning pin between the top plate and the bottom plate. Secondary machining holes are then performed to ensure good insulation and avoid signal distortion and delay.
The signal transmission quality of high-frequency test sockets is improved, signal distortion and delay problems are avoided, and signal integrity is ensured.
Smart Images
Figure CN223454530U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor detection, and particularly relates to glue filling device for high-frequency test Socket. BACKGROUND
[0002] With the extreme development of wireless communication technology to the microwave field, the test frequency is as high as 35GHz, which also puts forward higher frequency range requirements for the test Socket (the test Socket is a test socket, which is used for testing chips or checking whether the chips are qualified). At present, IC packaging pads and pitches are getting smaller and smaller, which also requires the test Socket to have fine contact points to adapt to smaller packaging sizes. In a high-speed digital communication system, a data rate of 10GB / s becomes normal, and the test Socket needs to maintain the integrity of the signal to avoid signal distortion and time delay problems.
[0003] The existing IC test Socket design often has high self-inductance and mutual capacitance contacts, which may cause unexpected decline in overall circuit performance. New contact technology needs to be developed to provide better signal transmission quality. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing glue filling device for high-frequency test Socket, which provides better signal transmission quality and avoids signal distortion and time delay problems.
[0005] In order to achieve the above purpose, the utility model adopts the technical scheme of glue filling device for high-frequency test Socket, which comprises a top plate and a bottom plate, the upper side of the top plate is provided with a glue filling groove, the glue filling groove is used for placing high-frequency test Socket, the lower side of the top plate is provided with an exhaust groove, and the bottom side of the top plate is connected with the upper side of the bottom plate.
[0006] As a preferred technical scheme of the utility model, the top plate is fixed with the bottom plate through four screws.
[0007] As a preferred technical scheme of the utility model, two positioning pins are arranged between the top plate and the bottom plate.
[0008] As a preferred technical scheme of the utility model, the number of exhaust grooves is multiple.
[0009] As a preferred technical scheme of the utility model, the shape of the top plate is quadrilateral, the number of exhaust grooves is eight, and the eight exhaust grooves are respectively arranged from the four edges of the top plate.
[0010] The utility model discloses a high -frequency test socket is filled with glue device, can carry out filling glue to high -frequency test socket, forms insulating layer in its surface and hole, after high -frequency test socket carries out secondary processing hole, ensures that each hole for connecting test probe carries out test has good insulating property, ensures that the mutual influence will not be caused because of poor insulating property, realizes providing better signal transmission quality, thereby avoids signal distortion and time delay problem. BRIEF DESCRIPTION OF DRAWINGS
[0011] The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this utility model, illustrate embodiments of the utility model and serve to explain the utility model, and do not constitute improper limitations on the utility model. In the drawings:
[0012] Figure 1 It is the structure schematic diagram of the upper guard plate in the high -frequency test socket filled with glue device of the utility model;
[0013] Figure 2 It is the exploded view of the upper guard plate in the high -frequency test socket filled with glue device of the utility model.
[0014] In the drawing, 1. top plate, 2. high -frequency test socket, 3. screw, 4. positioning pin, 5. bottom plate, 6. exhaust groove. DETAILED DESCRIPTION
[0015] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and can not be understood as limiting the utility model.
[0016] In the description of the utility model, if the first, the second is described for the purpose of distinguishing technical features, can not be understood as indicating or suggesting relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.
[0017] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installing, connecting should be understood broadly, and the skilled in the art can determine the specific meaning of the above words in the utility model according to the specific content of technical scheme.
[0018] As Figure 1As shown, the utility model discloses a high -frequency test socket is with filling glue device, including top plate 1 and bottom plate 5, the upside of top plate 1 is provided with filling glue groove, and filling glue groove is used for placing high -frequency test socket 2, and the downside of top plate 1 is provided with with exhaust groove 6, and the bottom side of top plate 1 is connected together with the upside of bottom plate 5. Top plate 1 is fixed together with bottom plate 5 through four screws 3.
[0019] Combining Figure 2 Two positioning pins 4 are arranged between top plate 1 and bottom plate 5. The shape of top plate 1 is quadrilateral, and the number of exhaust grooves 6 is eight, and the eight exhaust grooves 6 are respectively extended from the four edges of top plate 1.
[0020] The utility model discloses high -frequency test socket fills glue before preparation and is assembled together with mainboard 1, and the assembly method is: positioning pin 4 is first loaded into top plate 1, then bottom plate 5 is loaded together with top plate 1 (before assembling bottom plate 5, a layer of release agent needs to be applied on it to facilitate separation after filling glue is completed), and finally fixed screw 4.
[0021] The utility model discloses high -frequency test socket filling glue process flow introduction.
[0022] First step: assembly.
[0023] After top plate 1 and bottom plate 5 are assembled, high -frequency test socket 2 is placed in the filling glue groove on top plate 1;
[0024] Second step: filling glue.
[0025] Step 1: the high -frequency test socket of the utility model is placed into the oven and preheated, the temperature is set to 80 degrees, and the time is set to 1 hour;
[0026] Step 2: the high -frequency test socket of the utility model is taken out, and the glue (epoxy resin glue, black) is pointed into the filling glue groove area on top plate 1 using a manual dispensing machine, and the dispensing amount is controlled to be 2g±0.2g;
[0027] Step 3: the high -frequency test socket of the utility model is taken out, and the glue (epoxy resin glue, black) is pointed into the filling glue groove area on top plate 1 using a manual dispensing machine, and the dispensing amount is controlled to be 2g±0.2g;
[0028] Step 4: the high -frequency test socket of the utility model is placed into the curing oven, the temperature is set to 150 degrees, and the baking time is 1 hour;
[0029] The high-frequency test socket mainboard obtained by the method can be processed by secondary punching, and the holes equipped with probes can play the role of insulation, avoid signal distortion and time delay problems.
[0030] Therefore, compared with the prior art, the glue filling device for high-frequency test socket can implement glue filling on the high-frequency test socket, form an insulation layer on the surface and in the holes, and then perform secondary processing holes on the high-frequency test socket, so that good insulation is ensured between each hole for connecting test probes for testing, mutual influence caused by poor insulation is avoided, better signal transmission quality is achieved, signal distortion and time delay problems are avoided.
[0031] The above description shows and describes several preferred embodiments of the utility model, but as previously described, it should be understood that the utility model is not limited to the forms disclosed herein, should not be considered as excluding other embodiments, and can be used in various other combinations, modifications and environments, and can be modified by the above teaching or related technical or knowledge within the scope of the utility model concept described herein. The modification and change made by the person skilled in the art without departing from the spirit and scope of the utility model shall be within the protection scope of the claims attached to the utility model.
Claims
1. A glue filling device for high frequency test socket, characterized in that, It comprises a top plate (1) and a bottom plate (5), the upper side of the top plate (1) is provided with a glue pouring groove for placing a high-frequency test socket (2), the lower side of the top plate (1) is provided with an exhaust groove (6), and the bottom side of the top plate (1) is connected with the upper side of the bottom plate (5).
2. The glue filling device for high-frequency test socket according to claim 1, wherein The top plate (1) is fixed with the bottom plate (5) through four screws (3).
3. The glue filling device for high-frequency test socket according to claim 2, characterized in that, Two positioning pins (4) are arranged between the top plate (1) and the bottom plate (5).
4. The glue filling device for high-frequency test socket according to claim 3, characterized in that, The number of the exhaust grooves (6) is multiple.
5. The glue filling device for high-frequency test socket according to claim 4, wherein The shape of the top plate (1) is quadrilateral, the number of the exhaust grooves (6) is eight, and the eight exhaust grooves (6) are arranged in four groups and extend from four edges of the top plate (1) respectively.