Device for improving contact rate of anisotropic conductive sheet and pin
By installing an identification camera on the robotic arm to identify and adjust the alignment indentation position on the blue-stamping film, the problem of poor contact under traditional correction methods is solved, and a high contact rate and low defective rate between the anisotropic conductive sheet and the pins are achieved.
Patent Information
- Application Number
- CN202422579627.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-10-24
AI Technical Summary
Traditional ACF pad calibration methods result in poor contact between the anisotropic conductive pad and the pins, resulting in wasted parts and processes. Existing technologies make it difficult to detect defects in the cube state.
A robotic arm with X and Y direction movement and an identification camera are used to preliminarily identify and scan the alignment indentation position on the blue-stamping film through the identification camera, and adjust the material position to ensure accurate docking of the conductive pins and reduce the contact failure rate.
The contact rate between the anisotropic conductive sheet and the pins is improved, the contact failure rate is reduced, and the cost of parts and processes is saved.
Smart Images

Figure CN223456006U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the module manufacturing industry technical field, concretely is a device that improves the contact rate of anisotropic conductive sheet and pin. BACKGROUND
[0002] Current people's requirements of mobile phone photograph are increasingly improved, so after the production and assembly of mobile phone camera module are completed, the camera module manufacturer will carry out various functional detection to the module, and the technology develops to today, the mobile phone camera module has changed from the fixed focus module into today's zoom module & periscopic zoom module, the function of chip is more and more complex, and relevant spare parts are more and more, if all are assembled into module state and then test the defect, will cause the waste of spare parts and process, if the defect can be detected in cube state, will save part of expense.
[0003] The traditional ACF Pad correction mode is blue film pressing, the product pad point and socket pin offset direction are determined through the blue film pressing mode, the compensation position of mechanical hand is compensated, after compensation, there is some offset after the product is pressed down, leading to higher poor contact. INVENTION CONTENTS
[0004] To solve the defects in the prior art, the utility model provides a device that improves the contact rate of anisotropic conductive sheet and pin.
[0005] To solve the above technical problem, the utility model provides the following technical scheme:
[0006] The utility model discloses a device that improves the contact rate of anisotropic conductive sheet and pin, including the mechanical arm with X, Y direction movement, and the movement end of mechanical arm is installed with the positioning plate, be equipped with the identification camera on the positioning plate,
[0007] After the identification camera identifies the position of the alignment indentation on the blue film, the mechanical arm drives the identification camera to move slightly in X, Y direction, and scans the position of the alignment indentation.
[0008] As a preferred technical scheme of the utility model, the mechanical arm includes the X axle electric slide rail that sets up in X direction, the sliding end of X axle electric slide rail is equipped with the mounting bracket, and the mounting bracket is equipped with the Y axle electric slide rail along Y direction, and the positioning plate is installed at the sliding end of Y axle electric slide rail.
[0009] As a preferred technical scheme of the utility model, the X axle electric slide rail is equipped with the X axle distance sensor for detecting the moving distance of X axle electric slide rail, and the Y axle electric slide rail is equipped with the Y axle distance sensor for detecting the moving distance of Y axle electric slide rail.
[0010] As a preferred technical solution of the present invention, the X-axis distance sensor and the Y-axis distance sensor are both photoelectric sensors.
[0011] As a preferred technical solution of the present invention, the robotic arm drives the recognition camera to move 40-60 microns in the front and back rows and left and right in the X and Y directions.
[0012] As a preferred technical solution of the present invention, after the recognition camera scans, the position of the alignment indentation scanned by the recognition camera is located at the center, and the position of the alignment indentation is optimal at this time.
[0013] As a preferred technical solution of the present invention, a suction nozzle is further provided on the positioning plate, and the suction nozzle is used to absorb and transport the material.
[0014] As a preferred technical solution of the present invention, the positioning plate is provided with a first linear electric guide rail for driving the suction nozzle to move up and down.
[0015] As a preferred technical solution of the present invention, two groups of positioning plates are provided, and each positioning plate is provided with an identification camera and a suction nozzle.
[0016] As a preferred technical solution of the present invention, the suction nozzle is driven by a robotic arm to move the material 50 microns in the X and Y directions, front and back, left and right, and then placed into the carrier.
[0017] The beneficial effects of the utility model are:
[0018] 1. This device for improving the contact rate between the anisotropic conductive sheet and the pin uses an identification camera to preliminarily identify the position of the alignment indentation on the blue-stamped film. The identification camera then scans the position of the alignment indentation on the blue-stamped film in the X and Y directions, and performs a four-square format scan by moving the front and back rows 40-60 microns left and right in the X and Y directions until the scanned alignment indentation is located in the center. At this time, the position of the alignment indentation is optimal, thereby obtaining the accurate position of the alignment indentation. Subsequently, the alignment indentation is conveniently and accurately docked with the conductive pin, thereby ensuring a high contact rate after docking. In this way, the position of the material can be adjusted according to the position of the alignment indentation being located in the center, so that the conductive pins of the material can be accurately docked, thereby reducing the poor contact rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0020] Figure 1It is a structure schematic view of the device for improving the contact rate of the anisotropic conductive sheet and the pin.
[0021] Figure 2 It is a scanning direction schematic view of the identification equipment of the device for improving the contact rate of the anisotropic conductive sheet and the pin.
[0022] Figure 3 It is a scanning coordinate system diagram of the device for improving the contact rate of the anisotropic conductive sheet and the pin.
[0023] Figure 4 It is a promoting state diagram of the device for improving the contact rate of the anisotropic conductive sheet and the pin.
[0024] Figure 5 It is a left-right movement schematic view of the device for improving the contact rate of the anisotropic conductive sheet and the pin.
[0025] Figure 6 It is an up-down movement schematic view of the device for improving the contact rate of the anisotropic conductive sheet and the pin.
[0026] In the figure: 1, mechanical arm; 101, X-axis electric sliding rail; 102, mounting frame; 103, Y-axis electric sliding rail; 2, positioning plate; 3, identification camera; 4, suction nozzle. DETAILED DESCRIPTION
[0027] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, and it should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application.
[0028] Embodiment: as shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 indicated, the device for improving the contact rate of the anisotropic conductive sheet and the pin, including the mechanical arm 1 with X, Y direction movement, and the movement end of the mechanical arm 1 is provided with the positioning plate 2, the positioning plate 2 is equipped with the identification camera 3,
[0029] After the recognition camera 3 identifies the position of the alignment indentation on the blueing film, the robotic arm 1 drives the recognition camera 3 to move slightly in the X and Y directions to scan the position of the alignment indentation. The recognition camera 3 is used to preliminarily identify the position of the alignment indentation on the blueing film, and then the recognition camera scans the position of the alignment indentation on the blueing film in the X and Y directions, performing a four-square format scan by moving the front and back rows 40-60 microns left and right in the X and Y directions until the scanned alignment indentation is located in the center. At this time, the alignment indentation is located at the best position, thereby obtaining the accurate position of the alignment indentation. Then, it is conveniently and accurately docked with the conductive pin in the subsequent process, thereby ensuring a high contact rate after docking. In this way, the position of the material can be adjusted according to the position of the alignment indentation being located in the center, so that the conductive pins of the material can be accurately docked, thereby reducing the contact failure rate.
[0030] The robot arm 1 includes an X-axis electric slide 101 arranged in the X direction, a mounting bracket 102 is provided at the sliding end of the X-axis electric slide 101, and a Y-axis electric slide 103 arranged in the Y direction is provided on the mounting bracket. The positioning plate 2 is mounted on the sliding end of the Y-axis electric slide 103. This allows multiple free ends to move, making position adjustment convenient.
[0031] The X-axis electric slide 101 is equipped with an X-axis distance sensor for detecting the travel distance of the X-axis electric slide 101, and the Y-axis electric slide 103 is equipped with a Y-axis distance sensor for detecting the travel distance of the Y-axis electric slide. Both the X-axis distance sensor and the Y-axis distance sensor are photoelectric sensors. This facilitates accurate alignment of the camera's travel distance and facilitates scanning motion control.
[0032] The robotic arm 1 drives the recognition camera 3 to scan and move in the X and Y directions by 40-60 microns in the front and back rows and left and right, so as to perform fine movement scanning, thereby making the scanned position more accurate.
[0033] After scanning, the recognition camera 3 is positioned until the alignment mark scanned by the recognition camera 3 is centered. The alignment mark is then optimally positioned. The positioning plate 2 is also provided with a suction nozzle 4 for suctioning and transporting the material carrier. The positioning plate 2 is provided with a first linear electric guide rail 5 for moving the suction nozzle 4 up and down. This facilitates control of the suction nozzle 4's extension and retraction, and facilitates loading and position adjustment of the carrier.
[0034] There are two groups of positioning plates 2, and each positioning plate is provided with a recognition camera 3 and a suction nozzle 4.
[0035] The robotic arm 1 drives the material in the suction nozzle 4 to move 50 microns in the X and Y directions, and puts it into the carrier, so as to adjust the position of the carrier carrying the test piece and facilitate subsequent position docking.
[0036] Working principle: The position of the alignment indentation on the blue-stamped film is preliminarily identified by the identification camera 3, and then the identification camera performs position scanning on the alignment indentation on the blue-stamped film in the X and Y directions, and performs a 40-60 micron scanning movement in the front and back rows and left and right in the X and Y directions to perform a four-square format scan until the scanned alignment indentation is located in the center. At this time, the position of the alignment indentation is optimal, so as to obtain the accurate position of the alignment indentation, and then conveniently and accurately dock with the conductive pin in the subsequent process, thereby ensuring a high contact rate after docking. In this way, the position of the material can be adjusted according to the position of the alignment indentation in the center, so that the conductive pins of the material can be accurately docked, thereby reducing the poor contact rate.
[0037] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A device for improving the contact rate between an anisotropic conductive sheet and a pin, characterized by: Including the mechanical arm (1) with in X, Y direction movement, and the movement end of the mechanical arm (1) is installed with the positioning plate (2), the positioning plate (2) is equipped with identification camera (3), After the identification camera (3) identifies the position of the alignment indentation on the blue film, the mechanical arm (1) drives the identification camera (3) to move slightly in X, Y direction, and scans the position of the alignment indentation; The mechanical arm (1) includes X direction setting X shaft electric sliding rail (101), the sliding end of the X shaft electric sliding rail (101) is equipped with mounting bracket (102), and the mounting bracket is equipped with Y direction setting Y shaft electric sliding rail (103), and the positioning plate (2) is installed in the sliding end of Y shaft electric sliding rail (103).
2. The apparatus of claim 1, wherein the apparatus is configured to increase the contact ratio of the anisotropic conductive sheet to the pin. The X shaft electric sliding rail (101) is equipped with X shaft distance sensor for detecting the movement distance of X shaft electric sliding rail (101), and the Y shaft electric sliding rail (103) is equipped with Y shaft distance sensor for detecting the movement distance of Y shaft electric sliding rail.
3. The apparatus of claim 2, wherein the apparatus further comprises a plurality of protrusions on the contact surface of the contactor. The X shaft distance sensor and Y shaft distance sensor are both photoelectric sensors.
4. The apparatus of claim 3, wherein the apparatus further comprises a plurality of protrusions formed on the surface of the substrate. The mechanical arm (1) drives the identification camera (3) to move forward and backward in X, Y direction by 40-60 microns.
5. The apparatus of claim 4, wherein the apparatus further comprises a plurality of protrusions on the contact surface of the contactor. After the identification camera (3) scans, until the position of the alignment indentation scanned by the identification camera (3) is in the center, then the position of the alignment indentation is optimal.
6. The apparatus of claim 1, wherein the apparatus is configured to increase the contact ratio of the anisotropic conductive sheet to the pin. The positioning plate (2) is also equipped with suction nozzle (4), and the suction nozzle (4) is used for adsorbing and transporting material carrier.
7. The apparatus of claim 6, wherein the apparatus further comprises a plurality of protrusions on the contact surface of the contactor. The positioning plate (2) is equipped with first linear electric guide rail (5) for driving the suction nozzle (4) to move up and down.
8. The apparatus of claim 7, wherein the apparatus further comprises a plurality of protrusions on the contact surface of the contactor. The positioning plate (2) is equipped with two groups, and each positioning plate is equipped with identification camera (3) and suction nozzle (4).
9. The apparatus of claim 7, wherein the apparatus further comprises a plurality of protrusions on the contact surface of the contactor. The suction nozzle (4) is driven by the mechanical arm (1) to move the material in X, Y direction by 50 microns, and is put into the carrier.