Integrated circuit testing device applied to different temperature environments
By leveraging the simulation capabilities of integrated circuit testing devices under different temperature environments, the problem of significant discrepancies between test results and actual conditions in existing technologies has been solved, resulting in more accurate test results and a more efficient testing process.
Patent Information
- Application Number
- CN202422785201.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Existing integrated circuit test devices have insufficient simulation capabilities under different temperature environments, resulting in large differences between test results and actual working environments, and are unable to effectively reflect problems with integrated circuit products.
An integrated circuit testing device was designed, comprising components such as a test fixture, a lifting device, a test connection PCB, a pressure acquisition device, a data transmission board, a temperature control furnace, and a contact resistance acquisition instrument. This device can simulate the actual application scenarios of integrated circuit products under different temperature environments and reflect product problems through pressure acquisition and temperature control.
It enables comprehensive simulation of integrated circuit products under different temperature environments, improves the accuracy and reliability of testing, ensures the normal progress of testing projects, and shortens testing time and economic costs.
Smart Images
Figure CN223461668U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of integrated circuit testing devices, and particularly relates to an integrated circuit testing device applied to different temperature environments. BACKGROUND
[0002] In the integrated circuit testing socket fixture industry, the testing devices provided by manufacturers usually only include some universal test items, and there is a large difference between the testing scheme and the actual working environment of the tested integrated circuit product, so that the test environment of the integrated circuit product is different from the real working environment of the integrated circuit product, the test product is not sufficient, and the problems of the integrated circuit product cannot be reflected in the test. Therefore, the integrated circuit design companies and integrated circuit testing factories have abnormal situations, which leads to uncontrollable test project plan and causes losses.
[0003] Therefore, the integrated circuit testing device in the prior art needs to be improved. CONTENT OF THE UTILITY MODEL
[0004] The utility model mainly aims at the above problems, and provides an integrated circuit testing device applied to different temperature environments, which aims at solving the technical problems in the background art.
[0005] In order to achieve the above purpose, the utility model provides an integrated circuit testing device applied to different temperature environments, which comprises:
[0006] A test fixture is provided with a connecting part for electrically connecting one end surface of an integrated circuit product;
[0007] A lifting device is arranged above the test fixture; and a first adapter plate is arranged on the power output end of the lifting device;
[0008] A test connection PCB is installed on the first adapter plate; the test connection PCB is provided with a variable test piece corresponding to the other end surface connecting end point of the connecting part of the integrated circuit product; and the test connection PCB is used for electrically connecting a test host computer and an external power supply;
[0009] A pressure acquisition device is provided with a pressure acquisition sensor arranged in the test connection PCB;
[0010] A data transmission plate is connected with the test fixture; and the data transmission plate is used for electrically connecting a test host computer, an external power supply and a parameter indicating instrument;
[0011] A temperature control furnace is connected with the data transmission plate; and the temperature control furnace is used for outputting a predetermined temperature adjusted.
[0012] Further, a contact resistance collector is electrically connected with the test connection PCB.
[0013] Further, the variability test piece is a tin ball or a tin block.
[0014] Further, the variability test piece is a gold-plated PAD.
[0015] Further, a second adapter plate is provided, and the data transmission plate is connected with the temperature control furnace through the second adapter plate.
[0016] Further, the lifting device comprises a servo motor and a screw nut seat group installed on the power output shaft of the servo motor; the first adapter plate is connected with the screw nut seat.
[0017] Further, a guide device is provided, which is connected with the first adapter plate and the second adapter plate, and is used for guiding the movement of the test fixture driven by the lifting device.
[0018] Further, the guide device comprises a guide rod and a guide sleeve, the guide sleeve is installed on the first adapter plate, and the guide rod is installed on the second adapter plate; the guide rod slides through the guide sleeve.
[0019] Further, the temperature control furnace is provided with a humidity controller, which is used for outputting a predetermined humidity to the test fixture.
[0020] Further, a support base is provided, which is installed below the temperature control furnace.
[0021] Compared with the prior art, the integrated circuit testing device applied to different temperature environments provided by the present application can more comprehensively simulate the environment of the integrated circuit product applied to the electronic product, so as to reflect the problems existing in the integrated circuit product from the test, and promote the normal implementation of the test project plan. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a structure schematic view of the integrated circuit testing device applied to different temperature environments.
[0023] The reference signs shown in the figure are as follows: 1, test fixture; 2, lifting device; 3, first adapter plate; 4, test connection PCB; 5, variability test piece; 6, data transmission plate; 7, temperature control furnace; 8, pressure collection sensor; 9, contact resistance collector; 10, second adapter plate; 1101, guide rod; 1102, guide sleeve; 12, support base; 13, connecting plate. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application. It can be understood that the drawings are only provided for reference and illustration, and are not used to limit the present application. The connection relationship shown in the drawings is only for clear description, and does not limit the connection mode.
[0025] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or a middle component can exist at the same time. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art to which the present application belongs. It should also be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected, or it can be the communication between two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application.
[0026] It should also be noted that in the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0027] Please refer to Figure 1 The embodiment provides an integrated circuit testing device applied to different temperature environments, which comprises:
[0028] A test fixture 1 is provided with a connecting part (not shown) for electrically connecting one end face of an integrated circuit product;
[0029] The connecting part can be realized by using the prior art, which is used for clamping and positioning the integrated circuit product and electrically connecting the connecting end point of one end face of the integrated circuit product.
[0030] Lifting device 2, which is provided above the test fixture 1; the power output end of the lifting device 2 is provided with a first adapter plate 3;
[0031] Test connection PCB 4, which is installed on the first adapter plate 3; the test connection PCB 4 is provided with variability test pieces 5 corresponding to the connection end points of the other end surface of the integrated circuit product in the connection part; the test connection PCB 4 is used to be electrically connected with a test host computer (not shown), an external power supply (not shown);
[0032] Pressure acquisition device (not shown), which is provided with a pressure acquisition sensor 8 built in the test connection PCB 4;
[0033] Data transmission board 6, which is connected with the test fixture 1; and the data transmission board 6 is used to be electrically connected with a test host computer (not shown), an external power supply (not shown), and a parameter indicating instrument (not shown);
[0034] Temperature control furnace 7, which is connected with the data transmission board 6; the temperature control furnace 7 is used to output a regulated predetermined temperature.
[0035] When the lifting device 2 drives the first adapter plate 3 and the test connection PCB 4 to move away from the test fixture 1, the operator can take out the tested integrated circuit product from the connection part, or install the integrated circuit product to be tested to the connection part.
[0036] The integrated circuit product to be tested is installed to the connection part, and the connection end points of one end surface of the integrated circuit product are electrically connected with the contact points on the connection part for power supply and data transmission acquisition;
[0037] The lifting device 2 drives the first adapter plate 3 and the test connection PCB 4 to move close to the test fixture 1, first completing the electrical connection of the variability test pieces 5 on the test connection PCB 4 with the connection end points of the other end surface of the integrated circuit product in the connection part, and then the lifting device 2 continues to press the integrated circuit product to be tested downward according to the pressure data collected by the pressure acquisition sensor 8 of the pressure acquisition device, until the pressure reaches a preset value. By setting the pressure acquisition device in cooperation with the lifting device 2, the mechanical structure reliability of the integrated circuit product can be tested.
[0038] The temperature control furnace 7 outputs a regulated predetermined temperature, the data transmission board 6 and the test connection PCB 4 transmit power to the tested integrated circuit product, the test signal data of the test host computer to the integrated circuit product is transmitted to the tested integrated circuit product, and the parameter indicating instrument connected with the data transmission board 6 collects and displays the corresponding index of the tested integrated circuit product.
[0039] The temperature control furnace 7 outputs a regulated predetermined temperature, which can be room temperature, low temperature, or high temperature. The room temperature can be room temperature, the low temperature can be -28℃ to 10℃, and the high temperature can be 75℃ to 150℃.
[0040] The test fixture 1 is not directly connected to the temperature control furnace 7, but is indirectly connected to the temperature control furnace 7 in the form of being connected to the data transmission board 6. In this way, multiple models of test fixtures 1 are provided, each of which is fixedly provided with an electrical connector corresponding to the data transmission board 6, and is divided into models and size specifications, and the connection part is set to correspond to the corresponding integrated circuit product to be tested. Similarly, the test connection PCB 4 is installed on the first adapter plate 3, which facilitates the replacement of different models of test connection PCBs 4, so that the test device can be used for testing different integrated circuit products.
[0041] The variability test piece 5 presents different states under different temperature control furnace 7 output temperature environments, and the variability test piece 5 presents different states, which further affects the integrated circuit product to be tested, for example, the connection stability between the integrated circuit product to be tested and the test connection PCB 4, the power-on resistance, and the structural change of the variability test piece 5, which causes the connection between the connection end points of the integrated circuit product to be tested and the connection end points to occur.
[0042] In this way, the integrated circuit product to be tested can be more realistically simulated through the test device, for example, the integrated circuit product is subjected to excessive pressure, which can be determined through the test device that the integrated circuit product can still maintain normal processing and operation when subjected to a maximum pressure.
[0043] In addition, the processing and operation of the integrated circuit product to be tested in the test device during the test process is generally only to test whether it is normal, and cannot fully exert its performance as applied to electronic equipment, cannot make it run full load, and the temperature of the self-generated function rises to high temperature; the temperature control furnace 7 can adjust the output high temperature to simulate a high temperature environment, so as to test whether the integrated circuit product works normally in the high temperature environment. The temperature control furnace 7 can also simulate a low temperature environment to test the integrated circuit product in a high-latitude outdoor temperature environment in winter.
[0044] In summary, the test device can more comprehensively simulate the application of the integrated circuit product to the electronic product compared with the prior art, and further reflect the problems existing in the integrated circuit product from the test, and promote the normal progress of the test project plan.
[0045] Please refer to Figure 1 , which comprises a contact resistance acquisition instrument 9 electrically connected with the test connection PCB 4.
[0046] Through the contact resistance acquisition instrument 9, the connection end point resistance of the integrated circuit product electrically connected with the variability test piece 5 can be tested. Because the metal conductor has different resistances in different temperature environments, and the resistance changes with the change of the variability test piece 5, thereby affecting the current transmission, the electric signal data transmission and the power supply stability, and the limit temperature environment that can be set for the integrated circuit product can be measured, and whether the selection of the connection end point material and the setting of the area need to be redesigned is reflected.
[0047] In some embodiments, the variability test piece 5 is a tin ball or a tin block.
[0048] The tin ball or the tin block corresponds to the connection end point of the integrated circuit product, is planted into the test connection PCB 4, and can test whether the connection end point of the integrated circuit product can contact the tin ball or the tin block to achieve electrical connection. Whether the connection end point is tinned or tinned to a certain extent, whether the molten tin flows, causes the electrical connection between the connection end points of the integrated circuit product under test and the connection end points, and thus causes the integrated circuit product to burn out or the test connection PCB 4 and the test fixture 1 to burn out. The highest temperature that can be tolerated is explored to avoid subsequent test abnormalities and application to electronic products to avoid abnormalities.
[0049] In some embodiments, by selecting the variability test piece 5 as a gold-plated PAD, whether the connection end point of the integrated circuit product can contact the gold-plated PAD to achieve electrical connection can be tested, and the stability of other environmental indicators when changes occur can be tested.
[0050] The tin ball or the tin block implanted into the test connection PCB 4 and the gold-plated PAD should also be applied to integrated circuit products of different packaging structures.
[0051] Please refer to Figure 1 , which comprises a second adapter plate 10, and the data transmission plate 6 is connected with the temperature control furnace 7 through the second adapter plate 10.
[0052] Because the data transmission plate 6 may be damaged during the test process and needs to be replaced, or when testing different types of integrated circuit products, the data transmission plate 6 needs to be replaced, so the second adapter plate 10 is arranged between the data transmission plate 6 and the temperature control furnace 7 to avoid damage to the connection position on the temperature control furnace 7 due to frequent disassembly and assembly of the data transmission plate 6.
[0053] Please refer to Figure 1 , the lifting device 2 comprises a servo motor and a screw nut seat group mounted on the power output shaft of the servo motor; the first adapter plate 3 is connected with the nut seat.
[0054] In some embodiments, the lifting device 2 further comprises a connecting plate 13, the nut seat is a long shaft sleeve structure, the connecting plate 13 is connected with the end of the sleeve, and then the first adapter plate 3 is installed to the connecting plate 13 to realize the connection with the nut seat.
[0055] By selecting a servo motor, control accuracy can be obtained, the motor power output shaft rotation angle output accuracy effect, output stroke accuracy; and the screw nut seat group, after outputting the predetermined stroke, has good self-locking property, which can ensure the constant output of the predetermined pressure.
[0056] Please refer to Figure 1 , including a guide device, the guide device is connected with the first adapter plate 3 and the second adapter plate 10, and is used for guiding the movement of the test fixture 1 driven by the lifting device 2.
[0057] In some embodiments, the guide device comprises a guide rod 1101 and a guide sleeve 1102, the guide sleeve 1102 is installed on the first adapter plate 3, and the guide rod 1101 is installed on the second adapter plate 10; the guide rod 1101 slides through the guide sleeve 1102.
[0058] Through the guide device, the test fixture 1 can be guided to move by the lifting device 2, and the connection accuracy of the test connection PCB 4, the variability test piece 5 and the connection end point of the measured integrated circuit product is improved.
[0059] Please refer to Figure 1 , the temperature control furnace 7 is provided with a humidity controller (not shown), which is used for outputting predetermined humidity to the test fixture 1.
[0060] The humidity controller can be realized by using the existing technology, which provides air with a set humidity to the test area, so as to realize the required humidity environment for testing the integrated circuit product.
[0061] Please refer to Figure 1 , comprising a supporting base 12, the supporting base 12 is installed below the temperature control furnace 7.
[0062] Preferably, the guide rod 1101 is not installed on the second adapter plate 10, but is installed on the supporting base 12.
[0063] In summary, the test device is suitable for testing the quality and reliability of the test fixture product under various complex temperatures, different humidity, different chip packaging, and provides safety guarantee for the product testing of users, and has excellent quality. It greatly shortens the test plan time and test economic cost of users, provides high economic value for the industry, and brings considerable benefits.
[0064] In the specification and claims of this application, the words "comprise", "comprising", "include", "including" and the like are to be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense, that is to say, in the sense of "including, but not limited to".
[0065] Some features of the present application are described in different embodiments for the sake of clarity, however, these features can also be combined in a single embodiment. Conversely, some features of the present application are described in a single embodiment for the sake of brevity, however, these features can also be implemented individually or in any suitable combination in different embodiments.
[0066] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An integrated circuit testing device applied to different temperature environments, characterized in that, include: A test fixture, the test fixture having a connection portion for electrically connecting to one end surface of an integrated circuit product; A lifting device, the lifting device is arranged above the test fixture; a first adapter plate is provided at the power output end of the lifting device; A test connection PCB, mounted on the first adapter board; the test connection PCB is provided with a variable test piece corresponding to the connection end point of the other end surface of the integrated circuit product in the connection portion; the test connection PCB is used to electrically connect to a test host computer and an external power supply; A pressure acquisition device, wherein the pressure acquisition device is provided with a pressure acquisition sensor built into the test connection PCB; A data transmission board, the data transmission board is connected to the test fixture; and the data transmission board is used to be electrically connected to the test host computer, the external power supply, and the parameter indicating instrument; A temperature control furnace is connected to the data transmission board; the temperature control furnace is used to output a regulated predetermined temperature.
2. The integrated circuit testing device applied to different temperature environments according to claim 1, wherein, A contact resistance collector is included, and the contact resistance collector is electrically connected to the test connection PCB.
3. The integrated circuit testing device applied to different temperature environments according to claim 1, wherein, The variability test piece is a solder ball or a solder block.
4. The integrated circuit testing device applied to different temperature environments according to claim 1, wherein, The variability test piece is a gold-plated PAD.
5. The integrated circuit testing device applied to different temperature environments according to claim 1, wherein, A second adapter plate is included, and the data transmission plate is connected to the temperature control furnace through the second adapter plate.
6. The integrated circuit testing device applied to different temperature environments according to claim 1, wherein, The lifting device includes a servo motor and a screw nut seat assembly installed on the power output shaft of the servo motor; the first adapter plate is connected to the nut seat.
7. The integrated circuit testing device applied to different temperature environments according to claim 5, wherein, A guide device is included, which is connected to the first adapter plate and the second adapter plate and is used to guide the lifting device to drive the test fixture to move.
8. The integrated circuit testing device applied to different temperature environments according to claim 7, wherein, The guide device includes a guide rod and a guide sleeve. The guide sleeve is installed on the first adapter plate, and the guide rod is installed on the second adapter plate. The guide rod slides through the guide sleeve.
9. The integrated circuit testing device applied to different temperature environments according to claim 1, wherein, The temperature control furnace is equipped with a humidity controller, and the humidity controller is used to output a predetermined humidity to the test fixture.
10. The integrated circuit testing device for use in different temperature environments according to claim 1, wherein, It comprises a supporting base, which is installed below the temperature regulating furnace.