Server multi-chip single-layer board operation device

By introducing a protective plate, heat dissipation fins and precise positioning structure into the server's multi-chip single-layer board computing device, the device's safety and heat dissipation issues are resolved, achieving more stable and secure chip clamping.

CN223461820UActive Publication Date: 2025-10-21北京久译科技有限公司
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Patent Information

Application Number
CN202422867331.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-25
Publication Date
2025-10-21
Estimated Expiration
2034-11-25

AI Technical Summary

Technical Problem

Existing server multi-chip single-layer board computing devices lack necessary protective measures, resulting in reduced safety. At the same time, the heat dissipation is poor and the coordination between the spring and the support rod has limitations, which affects the clamping effect.

Method used

The chip is protected and cooled by a combination of a protective plate, heat dissipation fins, fixing screws, a rotating ring and a fixing rod, combined with a structure of a rectangular block, annular adjustment plate, guide rod, limit plate and shock-absorbing pad, to achieve precise positioning and secure clamping of the chip.

Benefits of technology

It significantly improves the chip's security and heat dissipation effect, simplifies the clamping process, and improves operational stability and safety.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223461820U_ABST
    Figure CN223461820U_ABST
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Abstract

The utility model relates to the technical field of integrated circuit boards, in particular to a server multi-chip single-layer board arithmetic device which comprises a single-layer PLC board, the top of the single-layer PLC board is electrically connected with a chip body, the top of the single-layer PLC board is fixedly connected with a fixing rod, the outer surface of the fixing rod is rotatably connected with a rotating ring, the side face of the rotating ring is fixedly connected with a connecting board, and the connecting board is fixedly connected with a connecting rod. The side face of the connecting plate is fixedly connected with a protection plate, the bottom of the protection plate is fixedly connected with heat dissipation fins, the protection plate is located over the chip body, the heat dissipation fins abut against the chip body, and the side face of the protection plate is fixedly connected with a positioning plate. And the protection plate is connected with the rotating ring of the fixed rod and can rotate to the upper part of the chip body, so that the chip is protected, and the safety of the chip is remarkably improved. In addition, the heat dissipation fins at the bottom of the protection plate are in close contact with the chip body, so that heat dissipation of the chip is effectively promoted.
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Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit board technical field, concretely is a kind of server multi-chip single-layer board operation device. BACKGROUND

[0002] Integrated circuit board is a carrier of loading integrated circuit. But often say integrated circuit board also takes integrated circuit, integrated circuit board is mainly composed of silica gel, so it is generally green, product performance is effectively improved, multiple components are all gathered together, a function corresponds to a circuit, and a function is concentrated into an integrated circuit, so in future application, what function can be applied to corresponding integrated circuit, so as to greatly facilitate application.

[0003] Prior art, such as: CN214586883U a kind of server multi-chip single-layer board operation device, the device does not involve part is same as prior art or can be realized by prior art, the utility model will chip be fixed on single-layer PCB, need not to carry out spot welding operation to chip, it is convenient to operate, and oxide will not be produced, when replacing chip each time, need not to clean up oxide remaining on single-layer PCB and chip.

[0004] But the device still has certain deficiency in the process of using, the chip of the device is installed on the top of single-layer PLC board, lacks necessary protective measures, which reduces its safety. In addition, when the chip operates or works with other components, heat dissipation measures must be taken to prevent heat accumulation, so as to affect its running state. In the process of clamping the chip using clamping plate, there is certain limitation in the cooperation of spring and supporting rod. Once the spring is fatigued, it will directly affect the clamping effect. Utility model content

[0005] The utility model aims at providing a kind of server multi-chip single-layer board operation device, to solve the chip of the device in the background art described above is installed on the top of single-layer PLC board, lacks necessary protective measures, which reduces its safety. In addition, when the chip operates or works with other components, heat dissipation measures must be taken to prevent heat accumulation, so as to affect its running state. In the process of clamping the chip using clamping plate, there is certain limitation in the cooperation of spring and supporting rod. Once the spring is fatigued, it will directly affect the clamping effect.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] The utility model provides a kind of server multi-chip single-layer board computing device, including single-layer PLC board, the top of the single-layer PLC board is electrically connected with chip body, the top of the single-layer PLC board is fixedly connected with fixed rod, the outer surface of the fixed rod is rotatably connected with rotating ring, the side of the rotating ring is fixedly connected with connecting plate, the side of the connecting plate is fixedly connected with protection plate, the bottom of the protection plate is fixedly connected with radiating fin, the protection plate is directly above chip body, the radiating fin is in abutment with chip body, the side of the protection plate is fixedly connected with positioning plate.

[0008] As the preferred scheme of the utility model, the top of the single-layer PLC board is fixedly connected with rectangular block, the side of the rectangular block is provided with annular adjusting plate, the side of the annular adjusting plate is fixedly connected with guide rod, the guide rod penetrates rectangular block and is threadedly connected with rectangular block.

[0009] As the preferred scheme of the utility model, the end of the guide rod is fixedly connected with limiting plate, the side of the limiting plate is fixedly connected with shock pad, the shock pad is in abutment with chip body.

[0010] As the preferred scheme of the utility model, the top of the positioning plate is provided with fixed screw, the fixed screw penetrates positioning plate and extends into single-layer PLC board, and the fixed screw is threadedly connected with positioning plate.

[0011] As the preferred scheme of the utility model, the top of the fixed rod is threadedly connected with fixed sheet, and the fixed sheet is located at the top of the rotating ring.

[0012] As the preferred scheme of the utility model, the guide rod is provided with four, and the four guide rods are respectively located at the side corner of chip body.

[0013] As the preferred scheme of the utility model, the area of the protection plate is greater than the area of chip body, and the material of the protection plate is brass.

[0014] As the preferred scheme of the utility model, the fixed screw is provided with two, and the two fixed screws are identical in size.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] 1、In the utility model, the protection plate is connected with the rotating ring of the fixed rod, can be rotated to the upper side of the chip body, so as to realize the protection of the chip, and the safety is improved significantly. In addition, the radiating fin at the bottom of the protection plate is in close contact with the chip body, which effectively promotes the heat dissipation of the chip. By using the fixed screw, the position of the protection plate can be ensured stable, and the use convenience is further enhanced.

[0017] 2、The utility model discloses a rectangular block, the cooperation and use of annular adjusting board, guide rod, limit board and shock pad, through rotating annular adjusting board, the position of mobile guide rod can be adjusted easily, thereby making limit board can accurately position chip body. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is whole structure schematic diagram of the utility model;

[0019] Figure 2 It is protective plate dismounting structure schematic diagram of the utility model;

[0020] Figure 3 It is chip body structure schematic diagram of the utility model;

[0021] Figure 4 It is guide rod side surface structure schematic diagram of the utility model.

[0022] In the drawing: 1, single layer PLC board;2, protective plate;3, guide rod;4, fixed link;5, rotating ring;6, connecting plate;7, fixed sheet;8, positioning plate;9, fixed screw;10, heat dissipation fin;11, chip body;12, rectangular block;13, annular adjusting board;14, limit board;15, shock pad. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the embodiments of the utility model, obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the range of protection of the utility model.

[0024] Embodiment, please see Figures 1-4 The utility model provides a technical scheme:

[0025] The utility model provides a kind of server multi-chip single-layer board computing device, including single-layer PLC board 1, the top of single-layer PLC board 1 is electrically connected with chip body 11, the top of single-layer PLC board 1 is fixedly connected with fixed rod 4, the outer surface of fixed rod 4 is rotatably connected with rotating ring 5, the side of rotating ring 5 is fixedly connected with connecting plate 6, the side of connecting plate 6 is fixedly connected with protection plate 2, the bottom of protection plate 2 is fixedly connected with cooling fin 10, protection plate 2 is directly above chip body 11, cooling fin 10 is in abutment with chip body 11, the side of protection plate 2 is fixedly connected with positioning plate 8, the top of positioning plate 8 is provided with fixed screw 9, fixed screw 9 penetrates positioning plate 8 and extends into single-layer PLC board 1, and fixed screw 9 is threadedly connected with positioning plate 8, the top of fixed rod 4 is threadedly connected with fixed sheet 7, and fixed sheet 7 is located at the top of rotating ring 5, the area of protection plate 2 is greater than the area of chip body 11, the material of protection plate 2 is brass, two fixed screws 9 are provided, and the two fixed screws 9 are identical in size.

[0026] Wherein, the protection plate 2 is fixed on the top of the chip body 11, which improves the safety of the chip body 11, and the cooling fin 10 at the bottom of the protection plate 2 is in abutment with the chip body 11, thereby cooling the chip body 11.

[0027] In this embodiment, according to Figure 1 、 Figure 2 、 Figure 3 And Figure 4 It is shown that the top of the single-layer PLC board 1 is fixedly connected with a rectangular block 12, the side of the rectangular block 12 is provided with an annular adjusting plate 13, the side of the annular adjusting plate 13 is fixedly connected with a guide rod 3, the guide rod 3 penetrates the rectangular block 12 and is threadedly connected with the rectangular block 12, the distal end of the guide rod 3 is fixedly connected with a limiting plate 14, the side of the limiting plate 14 is fixedly connected with a shock pad 15, the shock pad 15 is in abutment with the chip body 11, the guide rod 3 is provided with four, and the four guide rods 3 are respectively located at the side corners of the chip body 11,

[0028] Wherein, by twisting the annular adjusting plate 13, the position of the guide rod 3 can be moved, and the limiting plate 14 can limit the chip body 11, the shock pad 15 can protect the corners of the chip body 11, the chip body 11 can be clamped conveniently, and the stability and safety are improved.

[0029] The utility model discloses a work flow: using the server multi-chip single-layer board operation device of this scheme design is in working, first check whether the device is normal use, install chip body 11 on the top of single-layer PLC board 1, then rotate the protection plate 2 and place it on the top of chip body 11, and the extension of fixed screw 9 is in single-layer PLC board 1, and then the protection plate 2 is fixed on the top of chip body 11, improve the security of chip body 11, wherein the heat dissipation fin 10 of protection plate 2 bottom and chip body 11 abut, and then the chip body 11 can be heat dissipation, after taking out fixed screw 9, take out fixed piece 7 again, so that the protection plate 2 can be disassembled, and then improve the practicality, and the position of movable guide rod 3 is convenient for moving annular adjusting plate 13, and then limiting plate 14 is located to chip body 11, and shock pad 15 can protect the corner of chip body 11, and then not only convenient for clamping chip body 11, also improve stability and security.

[0030] Although the embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A server multi-chip single-layer board computing device comprising a single-layer PLC board (1), characterized in that: The top of the single-layer PLC board (1) is electrically connected with a chip body (11), the top of the single-layer PLC board (1) is fixedly connected with a fixed rod (4), the outer surface of the fixed rod (4) is rotatably connected with a rotating ring (5), the side surface of the rotating ring (5) is fixedly connected with a connecting plate (6), the side surface of the connecting plate (6) is fixedly connected with a protective plate (2), the bottom of the protective plate (2) is fixedly connected with a heat dissipation fin (10), the protective plate (2) is located directly above the chip body (11), the heat dissipation fin (10) is in abutment with the chip body (11), and the side surface of the protective plate (2) is fixedly connected with a positioning plate (8).

2. The server multi-chip single-layer board computing device of claim 1, wherein: The top of the single-layer PLC board (1) is fixedly connected with a rectangular block (12), the side surface of the rectangular block (12) is provided with an annular adjusting plate (13), the side surface of the annular adjusting plate (13) is fixedly connected with a guide rod (3), and the guide rod (3) penetrates through the rectangular block (12) and is in threaded connection with the rectangular block (12).

3. The server multi-chip single-layer board computing device of claim 2, wherein: The end of the guide rod (3) is fixedly connected with a limiting plate (14), the side surface of the limiting plate (14) is fixedly connected with a shock pad (15), and the shock pad (15) is in abutment with the chip body (11).

4. The server multi-chip single-layer board computing device of claim 1, wherein: The top of the positioning plate (8) is provided with a fixed screw (9), the fixed screw (9) penetrates through the positioning plate (8) and extends into the single-layer PLC board (1), and the fixed screw (9) is in threaded connection with the positioning plate (8).

5. The server multi-chip single-layer board computing device of claim 1, wherein: The top of the fixed rod (4) is in threaded connection with a fixed sheet (7), and the fixed sheet (7) is located at the top of the rotating ring (5).

6. The server multi-chip single-layer board computing device of claim 2, wherein: The guide rod (3) is provided with four guide rods (3), and the four guide rods (3) are located at the side corners of the chip body (11) respectively.

7. The server multi-chip single-layer board computing device of claim 1, wherein: The area of the protective plate (2) is greater than that of the chip body (11), and the material of the protective plate (2) is brass.

8. The server multi-chip single-layer board computing device of claim 4, wherein: The fixed screw (9) is provided with two fixed screws (9), and the two fixed screws (9) are of the same size.

Citation Information

Patent Citations

  • Server multi-chip single-layer board operation device

    CN214586883U