Adhesive tape cutting-off equipment for lead frame

Abstract

The utility model discloses an adhesive tape cutting device of a lead frame, which relates to the technical field of lead frame production and comprises a machine table, a machine frame is arranged on one side of the machine table, and a discharging device for discharging the lead frame is arranged in the machine frame. A flattening structure for flattening the lead frame is arranged at the position, located at the output end of the discharging device, above the rack, a tape pasting die is arranged on the machine table, a stamping part for stamping and cutting an adhesive tape is arranged in the tape pasting die, the tape pasting die is further provided with a heating assembly for heating the lead frame, and the lead frame can be heated through the heating assembly. And the adhesive tape is softened due to the temperature of the lead frame when being in contact with the lead frame, so that the adhesive tape can be stably attached to the lead frame.

Description

TECHNICAL FIELD

[0001] The utility model relates to lead frame production technical field especially relates to a lead frame's equipment of pasting and cutting off. BACKGROUND

[0002] Lead frame as the chip carrier of integrated circuit is a kind of key structural member that the electrical connection of chip internal circuit lead-out end and external lead is realized by bonding material, forms electrical circuit, lead frame will need to be pasted after being produced, but the current pasting and cutting off equipment in the process of pasting tape to lead frame, need to use mould to stamping cut to tape again and be pasted to lead frame, but mould is pasted to tape to lead frame, it is easy to appear not to be pasted tightly because of pasting time is too short, cause the loosening and deviation of pasting position. UTILITY MODEL CONTENTS

[0003] The utility model aims at providing a kind of technical scheme that tape will not appear deviation and loosening after being pasted by mould to overcome the above-mentioned situation deficiency.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of lead frame's equipment of pasting and cutting off, including machine table, one side of the machine table is equipped with rack, the inside of the rack is provided with the material feeding device of sending lead frame, the position of the rack top is equipped with the flattening structure of flattening lead frame in the material feeding device output end, detachably connect on the machine table for tape pasting to the lead frame of material feeding device output on the tape mould, the stamping piece for stamping cutting tape is equipped in the tape mould, the machine table top is also equipped with the feeding device for tape pasting mould to supply tape, the machine table is equipped with the stamping table for the lead frame of stamping cutting off completed pasting, the machine table is equipped with the feeding mechanism for driving lead frame to move, the feeding mechanism includes the deviation detection device for detecting lead frame deviation.

[0005] As a further scheme of the utility model: the flattening structure includes a plurality of pedestals on the rack, the movable plate for flattening lead frame is equipped above the pedestal, a plurality of lower flattening convex rollers are arranged at intervals in the middle of the pedestal, a plurality of upper flattening convex rollers are arranged at intervals in the middle of the movable plate, the flattening gap that lead frame is flattened when passing through is formed between the lower flattening convex roller and the upper flattening convex roller, a plurality of the lower flattening convex rollers and a plurality of upper flattening convex rollers are arranged in dislocation, the upper of the movable plate is equipped with the adjusting structure for adjusting the spacing between movable plate and pedestal.

[0006] As a further scheme of the utility model: the adjusting structure includes guide rod on the pedestal, one end of the guide rod is inserted and protrudes from the movable plate and is coupled with the pressing block by screw thread, the lower of the pressing block and the movable plate abut, the guide rod is sleeved with spring at the position between pedestal and movable plate.

[0007] As a further scheme of the utility model: the stamping part includes cutting plate and stamping head matched with cutting plate, cutting area is set on cutting plate, the inside of stamping head is set with adsorption hole for adsorbing adhesive tape of stamping head, one side of cutting plate is equipped with adhesive tape supply channel for conveying adhesive tape to cutting area, adhesive tape supply channel is multiple, adhesive tape supply channel is distributed on the outer circumferential side of cutting plate, heating assembly is also equipped in the tape sticking die, heating assembly includes lower pressing block and heating piece for heating lower pressing block below lower pressing block, lead frame is placed on lower pressing block.

[0008] As a further scheme of the utility model: the feeding device includes placing adhesive tape and feeding disc for sending out adhesive tape and winding disc for winding adhesive tape protective film, the feeding device also includes feeding machine for sending adhesive tape in feeding disc into tape sticking die outside tape sticking die, the feeding machine includes first motor, one side of first motor is driven with rotating shaft, the feeding machine also includes horizontal plate, horizontal plate is located at one side of rotating shaft, and top surface is parallel with top end of rotating shaft, the inside of horizontal plate is equipped with movable stopper.

[0009] As a further scheme of the utility model: the stamping table includes upper stamping table and lower stamping table, the upper stamping table is equipped with tool assembly and stamping block for stamping lead frame, the tool assembly includes tool cylinder and tool, the tool cylinder is used to push out the tool to cut off lead frame.

[0010] As a further scheme of the utility model: the offset detection device is optical fiber sensor, the optical fiber sensor realizes the detection of offset by detecting the position of hole on lead frame.

[0011] As a further scheme of the utility model: the feeding mechanism includes pressing cylinder and power device for providing power for lead frame conveying, the power device includes motor and power guide wheel, the pressing cylinder is equipped with pressing guide wheel, the pressing guide wheel is used to clamp and fix lead frame with power guide wheel when lead frame pauses conveying.

[0012] As a further scheme of the utility model: the feeding mechanism includes two oppositely arranged feeding guide plates for limiting lead frame deviation, two groups of feeding guide wheels are arranged on the side wall of feeding guide plate, lead guide gap is formed between the two groups of feeding guide wheels, and the lead guide gap is used for guiding lead frame.

[0013] As a further scheme of the utility model: the machine table is provided with CCD detection station above for detecting lead frame with completed tape sticking, and the machine table is provided with pressing station above for reinforcing the adhesion between lead frame and adhesive tape.

[0014] Compared with the prior art, the beneficial effects of the technical scheme are that the lead frame can be heated by the heating assembly, so that the adhesive tape can be softened due to the temperature of the lead frame when the adhesive tape contacts the lead frame, and the adhesive tape can be stably attached to the lead frame;

[0015] The curved lead frame delivered by the feeding device can be flattened by the flattening structure, so that the adhesive tape will not deviate when being attached to the lead frame;

[0016] The stamping part can make the adhesive tape contact the lead frame, and the adhesive tape can be cut by stamping, so that waste material is not generated, and the adhesive tape can be attached to the lead frame without being attached to the stamping part;

[0017] Meanwhile, the feeding device can automatically supply the adhesive tape to the adhesive tape attaching mold, and can also automatically separate the RT adhesive tape body and the adhesive tape protective film, so that the protective film on the RT adhesive tape does not need to be separated manually, and the adhesive tape attaching efficiency of the adhesive tape attaching mold on the lead frame is improved;

[0018] Furthermore, the offset detection device arranged on the feeding structure can detect the offset amount of the lead frame, and can alarm when the lead frame does not meet the requirements, so that the quality of the cut lead frame is better, and the production efficiency is higher.

[0019] The additional aspects and advantages of the present application will be partially given in the following description, and some will become apparent from the following description or will be understood by those skilled in the art through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0021] Figure 1 is the overall structure of the present application;

[0022] Figure 2 is a schematic view of the machine table structure of the present application;

[0023] Figure 3 is a schematic view of the adhesive tape attaching mold structure of the present application;

[0024] Figure 4 is a schematic view of the upper half of the adhesive tape attaching mold of the present application;

[0025] Figure 5 isFigure 5 side view schematic diagram of the utility model;

[0026] Figure 6 is the stamping part structure schematic diagram of the utility model;

[0027] Figure 7 is the cutting plate structure schematic diagram of the utility model;

[0028] Figure 8 is the rack structure schematic diagram of the utility model Figure 1 ;

[0029] Figure 9 is the rack structure schematic diagram of the utility model Figure 2 ;

[0030] Figure 10 is the flattening structure front view schematic diagram of the utility model;

[0031] Figure 11 is the feeding device structure schematic Figure 1 ;

[0032] Figure 12 is the feeding device structure schematic Figure 2 ;

[0033] Figure 13 is the feeding device front view schematic diagram of the utility model;

[0034] Figure 14 is the stamping table structure schematic diagram of the utility model;

[0035] Figure 15 is the stamping table structure front view schematic diagram of the utility model;

[0036] Figure 16 is Figure 14 the local structure enlarged schematic diagram of A in the utility model;

[0037] The corresponding label in the drawing is explained as follows:

[0038] 1, machine table; 11, tape sticking mold; 111, stamping part; 112, cutting plate; 113, stamping head; 114, cutting area; 115, adsorption hole; 116, adhesive tape supply channel; 117, heating assembly; 118, lower pressing block; 119, heating part; 2, supply device; 21, supply disc; 22, winding disc; 23, feeder; 24, first motor; 25, rotating shaft; 26, flat plate; 27, stop block; 3, base plate; 4, stamping table; 41, feeding mechanism; 411, pressing air pipe; 412, power device; 413, second motor; 414, power guide wheel; 415, pressing guide wheel; 416, feeding guide plate; 417, feeding guide wheel; 418, material guiding gap; 42, offset detection device; 43, upper stamping table; 44, lower stamping table; 45, driving device; 451, driving motor; 452, eccentric wheel; 453, bottom plate; 5, rack; 51, material placing device; 52, flattening structure; 521, base; 522, movable plate; 523, lower pressing convex roller; 524, upper pressing convex roller; 525, adjusting structure; 526, guide rod; 527, pressing block; 528, spring. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] Please refer to Figures 1-16The utility model provides a kind of lead frame tape cutting device, including machine table 1, one side of machine table 1 is equipped with rack 5, the inside of rack 5 is provided with the material feeding device 51 of lead frame sending, the position of material feeding device 51 output end is equipped with the flattening structure 52 of flattening lead frame above rack 5, detachably connect on machine table 1 for the tape die 11 of tape being adhered to the lead frame of material feeding device 51 output, tape die 11 is equipped with the punch 111 of stamping and cutting tape in it, machine table 1 top is also equipped with the feeding device 2 for tape die 11 supply tape, machine table 1 is equipped with the punch table 4 for the lead frame of stamping cutting completed tape, machine table 1 is equipped with the feeding mechanism 41 for driving lead frame movement, and feeding mechanism 41 includes the offset detection device 42 for detecting lead frame offset amount, the curved lead frame sent out by flattening structure can be flattened, so that lead frame does not appear tape offset when adhering, and punch can let tape contact lead frame, stamping and cutting tape, so that waste does not appear, and it can be guaranteed that tape can be adhered on lead frame, and not adhere on punch, simultaneously, by feeding device, tape can be automatically supplied for tape die, and RT tape body and tape protective film are also automatically separated, without manual separation of protective film on RT tape, to speed up the adhering efficiency of lead frame to tape die, and by using offset detection device on feeding structure, offset device can detect the offset amount of lead frame, and alarm is carried out on lead frame not meeting, so that the quality of cut lead frame is better, and production efficiency is higher.

[0041] In some embodiments: the flattening structure 52 includes a plurality of bases 521 on the rack 5, a movable plate 522 above the base 521 for flattening the lead frame, a plurality of lower flattening convex rollers 523 are arranged in the middle of the base 521, a plurality of upper flattening convex rollers 524 are arranged in the middle of the movable plate 522, a flattening gap is formed between the lower flattening convex rollers 523 and the upper flattening convex rollers 524, through which the lead frame is flattened, the plurality of lower flattening convex rollers 523 and the plurality of upper flattening convex rollers 524 are arranged in a staggered manner, an adjusting structure 525 is arranged above the movable plate 522 for adjusting the distance between the movable plate 522 and the base 521, the adjusting structure 525 includes a guide rod 526 arranged on the base 521, one end of the guide rod 526 penetrates the movable plate 522 and is coupled with a pressing block 527 through threads, the pressing block 527 is in abutment with the movable plate 522 below, a spring 528 is sleeved on the guide rod 526 between the base 521 and the movable plate 522, the staggered arrangement between the lower flattening convex rollers 523 and the upper flattening convex rollers 524 can flatten the curved lead frame, and the threads between the guide rod 526 and the pressing block 527 can adjust the distance between the movable plate 522 and the base 521, so that the lower flattening convex rollers 523 and the upper flattening convex rollers 524 can flatten lead frames of different thicknesses;

[0042] Specific flattening process is that the lead frame passes through the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 when moving, and the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 matches the thickness of the lead frame, so that the curved lead frame can be flattened, and when facing a lead frame with a thinner thickness, the pressing block 527 can be rotated forward, so that the pressing block 527 moves towards the base 521, and the pressing block 527 moves together with the movable plate 522 when moving, so that the distance between the pressing block 527 and the base 521 is reduced, so that the distance between the lower flattening convex roller 523 and the upper flattening convex roller 524 is reduced, and the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 matches the thickness of the lead frame, so that the flattening effect is achieved, and when facing a thicker lead frame, the pressing block 527 is rotated in the opposite direction, so that the pressing block 527 releases the pressure on the movable plate 522, so that the spring 528 can recover, and the spring 528 recovers and pushes the movable plate 522 below the pressing block 527, so that the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 is increased, so as to adapt to the thickness of the lead frame.

[0043] In some embodiments: the tape sticking mold 11 includes an upper mold and a lower mold, the stamping part 111 is located in the upper mold, and the heating assembly 117 is located in the lower mold, the stamping part 111 includes a cutting plate 112 and a stamping head 113 matched with the cutting plate 112, the cutting plate 112 is provided with a cutting area 114, the stamping head 113 is provided with an adsorption hole 115 for adsorbing the adhesive tape inside the stamping head 113, one side of the cutting plate 112 is provided with an adhesive tape feeding channel 116 for feeding the adhesive tape to the cutting area 114, the adhesive tape feeding channel 116 is in multiple groups, and the adhesive tape feeding channel 116 is distributed on the outer circumferential side of the cutting plate 112. The tape sticking mold 11 is also provided with a heating assembly 117, and the heating assembly 117 includes a lower pressing block 118 and a heating part 119 arranged below the lower pressing block 118 to heat the lower pressing block 118, and the lead frame is placed on the lower pressing block 118. The cooperation between the stamping head 113 and the cutting area 114 ensures that the stamping head 113 will not produce waste when cutting the adhesive tape, and the waste collection process does not need to be considered, and the cooperation between the lower pressing block 118 and the heating part 119 can heat the lead frame, so that the adhesive tape is softened after contacting the lead frame, and the effect of sticking the tape is ensured.

[0044] Specific cutting tape process is: the adhesive tape through the adhesive tape feeding channel 116 to the cutting area 131, through the cylinder let the upper die of the tape die 11 start to move, the stamping part of the tape die 11 will move together with the stamping head 113, the stamping head 113 will pass through the cutting area 114 when moving, so as to cut the adhesive tape in the cutting area 114, while the stamping head 113 starts to move, the external vacuum pump will start to work, the external vacuum pump will make the bottom end of the stamping head 113 in vacuum state through the adsorption hole 115 after starting to work, so as to adsorb the cut adhesive tape on the bottom end of the stamping head 113, so that the adhesive tape on the bottom end of the stamping head 113 will not appear position deviation in the moving process of the stamping head 113, while the upper die of the tape die 11 starts to move, the heating element 119 in the lower die of the tape die 11 will start to heat, the heating element 119 will transfer heat to the lead frame through the pressing block 118 after heating, so that the adhesive tape on the stamping head 113 will be heated and softened when contacting the lead frame, so as to ensure that the adhesive tape can be well attached to the lead frame

[0045] In some embodiments: the feeding device 2 includes a feeding disc 21 for placing and sending the adhesive tape and a winding disc 22 for winding the protective film of the adhesive tape, and the feeding device 2 further includes a feeder 23 located outside the tape die 11 for sending the adhesive tape in the feeding disc 21 into the tape die 11, the feeder 23 includes a first motor 24, one side of the first motor 24 is driven with a rotating shaft 25, the feeder 23 further includes a flat plate 26, the flat plate 26 is located on one side of the rotating shaft 25, and the top surface is parallel to the top end of the rotating shaft 25, the flat plate 26 is internally provided with a movable stop block 27, the cooperation between the feeding disc 21 and the winding disc 22 can collect the protective film in the adhesive tape while supplying the adhesive tape, so as to reduce the step of tearing off the protective film when supplying the adhesive tape;

[0046] Specific supply tape process is: start the first motor 24, the first motor 24 is started and drives the rotating shaft 25 to rotate, the rotating shaft 25 rotates and the tape is combined with the rotating shaft 25 and is sent to the direction of the tape die 11, while the rotating shaft 25 rotates, the feeding disc 21 also starts to rotate, the feeding disc 21 rotates and the tape inside the tape die 11 path direction is transported, the tape is transported to the position of the rotating shaft 25 first through the area of the flat plate 26, the stop block 27 on the flat plate 26 can ensure that the tape does not deviate from the path during transportation, at the same time, because the stop block 27 is movably arranged, the spacing between the stop block 27 can be adjusted, so that the tape of different widths can be adapted, and when the tape enters the inside of the tape die 11, the tape die 11 is started, so that the tape is sheared, at the same time, the feeding disc 21 and the winding disc 22 are connected by belt transmission, so that the winding disc 22 also rotates when the feeding disc 21 rotates, and the tape in the feeding disc 21 is separated from the protective film, the protective film is wound in the winding disc 22, so that the tape can be sent into the tape die 11 when the feeding disc 21 feeds, and the protective film is collected by the winding disc 22, which is convenient for recycling.

[0047] In some embodiments: the punching table 4 includes an upper punching table 43 and a lower punching table 44, the upper punching table 43 is provided with a tool assembly 431 and a punching block 432 for punching the lead frame, the tool assembly 431 includes a tool cylinder and a tool, the tool cylinder is used to push out the tool to cut off the lead frame, the lower surface of the lower punching table 44 is provided with a driving device 45, the driving device 45 includes a driving motor 451, the driving motor 451 is connected with an eccentric wheel 452, the lower surface of the eccentric wheel 452 is provided with a bottom plate 453, the bottom plate 453 is connected with the upper punching table 43 through guide columns, the eccentric wheel 452 drives the bottom plate 453 to make the upper punching table 43 move relatively close to the lower punching table 44;

[0048] Specific cutting process is: when the driving motor 451 is started, the eccentric wheel 452 connected with the driving motor 451 makes the bottom plate 453 move downward and then makes the upper punching table 43 move close to the lower punching table 44, the upper punching table 43 and the lower punching table 44 cooperate with each other to make the punching table 43 punch the lead frame, the tool cylinder is used to push out the tool to cut off the lead frame, when the punching table 43 punches the lead frame and needs to be cut off, the tool cylinder pushes out the tool, the upper punching table 43 moves close to the lower punching table 44, so that the tool can cut off the lead frame.

[0049] In some embodiments: in order to enable the system to detect the offset of the lead frame, the offset detection device 42 is an optical fiber sensor, which detects the offset by detecting the position of the hole on the lead frame, and can emit fine infrared rays to more accurately detect the offset of the hole on the lead frame. When the offset is too large, the system will stop and alarm, waiting for the worker to handle, which can effectively solve the problem of uneven production quality of the lead frame.

[0050] In some embodiments: the feeding mechanism 41 includes a pressing cylinder 411 and a power device 412 for providing power for lead frame conveying, the power device 412 includes a second motor 413 and a power guide wheel 414, the pressing cylinder 411 is provided with a pressing guide wheel 415 for clamping and fixing the lead frame with the power guide wheel 414 when the lead frame is temporarily stopped conveying, the feeding mechanism 41 includes two oppositely arranged feeding guide plates 416 for limiting the offset of the lead frame, and the side walls of the feeding guide plates 416 are provided with two groups of feeding guide wheels 417, and a material guiding gap 418 is formed between the two groups of feeding guide wheels 417 for guiding the lead frame.

[0051] Specific conveying process: the lead frame is conveyed to the stamping table 4 by the feeding mechanism, and needs to be temporarily stopped for stamping when stamping is needed. In order to prevent the lead frame from continuing to move forward due to inertia during the temporary stop, the power device 412 is temporarily stopped at the same time, and the pressing cylinder 411 is pressed down to cooperate with the power guide wheel 414 to clamp the lead frame and prevent it from continuing to move. The two oppositely arranged feeding guide plates 416 can limit the offset of the lead frame, and the material guiding gap 418 formed by the feeding guide wheels 417 on the feeding guide plates 416 can guide the lead frame into the stamping table 4, which can reduce the friction between the lead frame and the plate and prevent the lead frame from being easily worn.

[0052] In some embodiments: the machine table 1 is provided with a CCD detection station 12 above for detecting the lead frame with the tape attached, the machine table 1 is provided with a pressing station 13 above for reinforcing the attachment between the lead frame and the tape, the machine table 1 is provided with a substrate 3 above, and the substrate 3 and the machine table 1 can move relative to each other. The supply device 2 is movably connected to the substrate 3 and can move relative to each other.

[0053] It is apparent for a person skilled in the art that the present application is not restricted to the details of the above exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary only, and not limiting, the scope of the present application being defined by the appended claims rather than the above description, and all changes coming within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A lead frame taping and cutting device, characterized in that: The machine table (1) is provided with a rack (5) on one side, the inside of the rack (5) is provided with a feeding device (51) for feeding lead frame, the rack (5) is provided with a flattening structure (52) for flattening lead frame above the feeding device (51) output end, the machine table (1) is provided with a tape sticking mold (11), the tape sticking mold (11) is provided with a punching part (111) for punching and cutting tape, the tape sticking mold (11) is provided with a heating assembly (117) for heating lead frame.

2. The apparatus according to claim 1, wherein The flattening structure (52) includes a plurality of bases (521) on the rack (5), a movable plate (522) above the base (521) for flattening lead frame, a plurality of lower flattening convex rollers (523) are arranged in the middle of the base (521), a plurality of upper flattening convex rollers (524) are arranged in the middle of the movable plate (522), the lower flattening convex rollers (523) and the upper flattening convex rollers (524) form a flattening gap through which the lead frame is flattened, the plurality of lower flattening convex rollers (523) and the plurality of upper flattening convex rollers (524) are arranged in staggered manner, the upper side of the movable plate (522) is provided with an adjusting structure (525) for adjusting the distance between the movable plate (522) and the base (521).

3. The apparatus according to claim 2, wherein The adjusting structure (525) includes a guide rod (526) on the base (521), one end of the guide rod (526) penetrates the movable plate (522) and is coupled with a pressing block (527) through threads, the lower side of the pressing block (527) abuts against the movable plate (522), the guide rod (526) is sleeved with a spring (528) at the position between the base (521) and the movable plate (522).

4. The apparatus according to claim 1, wherein The punching part (111) includes a cutting plate (112) and a punching head (113) matched with the cutting plate (112), the cutting plate (112) is provided with a cutting area (114), the inside of the punching head (113) is provided with an adsorption hole (115) for adsorbing tape, one side of the cutting plate (112) is provided with a tape feeding channel (116) for feeding tape to the cutting area (114), the tape feeding channel (116) is a plurality of groups, the tape feeding channel (116) is distributed on the outer circumferential side of the cutting plate (112), the heating assembly (117) includes a lower pressing block (118) and a heating part (119) below the lower pressing block (118) for heating the lower pressing block (118), the lead frame is placed on the lower pressing block (118).

5. The apparatus according to claim 1, wherein The machine table (1) is further provided with a feeding device (2) for supplying adhesive tape to the adhesive tape die (11), the feeding device (2) comprises a feeding disc (21) for placing and sending adhesive tape and a winding disc (22) for winding adhesive tape protective film, the feeding device (2) further comprises a feeder (23) located outside the adhesive tape die (11) for sending the adhesive tape in the feeding disc (21) into the adhesive tape die (11), the feeder (23) comprises a first motor (24), one side of the first motor (24) is driven with a rotating shaft (25), the feeder (23) further comprises a horizontal placing plate (26), the horizontal placing plate (26) is located at one side of the rotating shaft (25) and the top surface is parallel to the top end of the rotating shaft (25), the horizontal placing plate (26) is internally provided with a movable stop block (27).

6. The apparatus according to claim 1, wherein The machine table (1) is provided with a punching table (4) for punching and cutting the lead frame of the completed adhesive tape, the punching table (4) comprises an upper punching table (43) and a lower punching table (44), the upper punching table (43) is provided with a tool assembly (431) and a punching block (432) for punching the lead frame, the tool assembly (431) comprises a tool air cylinder and a tool, the tool air cylinder is used for pushing out the tool to cut the lead frame.

7. The apparatus according to claim 1, wherein The machine table (1) is provided with a feeding mechanism (41) for driving the movement of the lead frame, the feeding mechanism (41) comprises an offset detection device (42) for detecting the offset amount of the lead frame, the offset detection device (42) is an optical fiber sensor, the optical fiber sensor realizes the detection of the offset amount by detecting the position of the hole on the lead frame.

8. The apparatus according to claim 7, wherein The feeding mechanism (41) comprises a pressing air cylinder (411) and a power device (412) for providing power for the lead frame conveying, the power device (412) comprises a second motor (413) and a power guide wheel (414), the pressing air cylinder (411) is provided with a pressing guide wheel (415), the pressing guide wheel (415) is used for clamping and fixing the lead frame with the power guide wheel (414) when the lead frame pauses conveying.

9. The apparatus according to claim 8, wherein The feeding mechanism (41) comprises two oppositely arranged feeding guide plates (416) for limiting the deviation of the lead frame, the feeding guide plates (416) are provided with two groups of feeding guide wheels (417) on the side walls, a feeding gap (418) is formed between the two groups of feeding guide wheels (417), and the feeding gap (418) is used for guiding the lead frame.

10. The apparatus according to claim 6, wherein The lower surface of the lower punching table (44) is provided with a driving device (45), the driving device (45) comprises a driving motor (451), the driving motor (451) is connected with an eccentric wheel (452), the lower surface of the eccentric wheel (452) is provided with a bottom plate (453), the bottom plate (453) is connected with the upper punching table (43) through guide columns, and the eccentric wheel (452) drives the bottom plate (453) to make the upper punching table (43) relatively move close to the lower punching table (44).

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