Infrared transmitting and receiving integrated LED device and infrared intelligent induction lamp

Abstract

The utility model discloses an infrared transmitting and receiving integrated LED device and an infrared intelligent induction lamp. The infrared transmitting and receiving integrated LED device comprises a support, an infrared transmitting module, an LED module, an infrared receiving module and a pin assembly. The support comprises a bowl cup and two partition plates, a containing space is formed in the bowl cup, the two partition plates are arranged in the containing space in a spaced mode, the containing space is divided by the two partition plates to form a first containing position, a second containing position and a third containing position, and the infrared emission module, the LED module and the infrared receiving module are arranged in the first containing position, the second containing position and the third containing position respectively. Therefore, the infrared emission module, the LED module and the infrared emission module are compactly arranged. The infrared emission module, the LED module and the infrared receiving module are electrically connected with the pin assembly, and the pin assembly extends to the bottom of the support along the side wall of the support.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared LED technical field, specifically, relate to an infrared emission receiving integrated LED device. BACKGROUND

[0002] The infrared intelligent induction lamp is widely used in the market, has the advantages such as energy saving, safety, beautiful, long life, and is welcomed by market consumers.The working principle of the infrared intelligent induction lamp is that the infrared receiving head emits infrared rays, when someone enters the switch induction range, the infrared rays are reflected by the obstacle, the photosensitive receiving tube or the infrared receiving tube receives the reflected infrared rays, and the light signal is converted into an electric signal, and the electric signal controls the load to open the lighting, the person does not leave and is active, the switch is continuously turned on, and the lamp is always bright, after the person leaves, the switch automatically delays to close the lighting, the person reaches the lamp, and the person leaves the lamp to extinguish, is close and convenient, safe and energy-saving.

[0003] The three most core components in the infrared intelligent induction lamp are an infrared emitting lamp, an infrared receiving lamp and an LED white light lamp bead, and the operation of the lighting lamp is completed by the cooperation of the three lamp beads and the PCB circuit.The scheme of connecting the three components separately can meet some conventional applications, but it increases the use area of the PCB board, so the PCB board needs to be designed larger, resulting in a larger finished product, and some requirements of small PCB lamp plate size cannot use this scheme, and each lamp bead needs to be SMTed once during processing, so that the processing technology is complicated. UTILITARIAN CONTENT

[0004] In view of the deficiencies of the prior art, an infrared emission receiving integrated LED device and an infrared intelligent induction lamp are provided.

[0005] To achieve the above purpose, the utility model provides an infrared emission receiving integrated LED device, which comprises a bracket, an infrared emission module, an LED module, an infrared receiving module and a pin assembly, the bracket comprises a bowl cup and two partition plates, the bowl cup has an accommodation space, the two partition plates are arranged in the accommodation space, the accommodation space is separated by the two partition plates to form a first accommodation site, a second accommodation site and a third accommodation site, the infrared emission module, the LED module and the infrared receiving module are arranged in the first accommodation site, the second accommodation site and the third accommodation site respectively, and the infrared emission module, the LED module and the infrared receiving module are electrically connected with the pin assembly, and the pin assembly extends to the bottom of the bracket along the side wall of the bracket.

[0006] According to an embodiment of the utility model, the infrared emission module comprises an infrared emission tube, the infrared emission tube is arranged in the first accommodation site, and the infrared emission tube is electrically connected with the pin assembly.

[0007] According to an embodiment of the present application, the LED module comprises an LED wafer, the LED wafer is arranged in the second accommodating position, and the LED wafer is electrically connected with the pin assembly.

[0008] According to an embodiment of the present application, the infrared receiving module comprises an infrared receiving tube, the infrared receiving tube is arranged in the third accommodating position, and the infrared receiving tube is electrically connected with the pin assembly.

[0009] According to an embodiment of the present application, the infrared receiving module comprises an infrared receiving tube, the infrared receiving tube is arranged in the third accommodating position, and the infrared receiving tube is electrically connected with the pin assembly.

[0010] According to an embodiment of the present application, the infrared receiving module comprises an infrared receiving tube, the infrared receiving tube is arranged in the third accommodating position, and the infrared receiving tube is electrically connected with the pin assembly.

[0011] According to an embodiment of the present application, the infrared receiving module comprises an infrared receiving tube, the infrared receiving tube is arranged in the third accommodating position, and the infrared receiving tube is electrically connected with the pin assembly.

[0012] According to an embodiment of the present application, the bowl cup comprises a frame body and a cup body, the cup body is arranged on the surface of the frame body, the cup body is provided with a cup opening, and the cup opening and the frame body form an accommodating space; and the pin assembly is connected to the frame body.

[0013] According to an embodiment of the present application, the inner diameter of the cup body gradually decreases along the direction of the cup opening close to the frame body.

[0014] The present application also provides an infrared intelligent induction lamp comprising the above infrared emission-reception integrated LED device.

[0015] The present application has the beneficial effects that the bowl cup in the bracket is divided to form the first accommodating position, the second accommodating position and the third accommodating position, the infrared emission module, the LED module and the infrared receiving module are arranged in the first accommodating position, the second accommodating position and the third accommodating position respectively, the infrared emission module, the LED module and the infrared receiving module do not affect each other, the infrared emission module, the LED module and the infrared receiving module are integrated in one bracket, the infrared emission module, the LED module and the infrared receiving module are compactly arranged, the size of the infrared emission-reception integrated LED device is effectively reduced, and the infrared emission-reception integrated LED device is conveniently connected with the externally connected PCB. BRIEF DESCRIPTION OF DRAWINGS

[0016] The drawings described herein are used to provide further understanding of the present application, constitute a part of the present application, the schematic embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application.

[0017] Figure 1A front view of the infrared emission-reception integrated LED device in the embodiment;

[0018] Figure 2 A sectional view of the bracket in the embodiment;

[0019] Figure 3 A bottom view of the infrared emission-reception integrated LED device in the embodiment.

[0020] Reference numerals

[0021] 1-bracket; 10-circuit layer; 11-bowl cup; 110-containing space; 111-first containing site; 112-second containing site; 113-third containing site; 114-stand body; 115-cup body; 1150-cup mouth; 12-baffle; 2-infrared emission module; 21-infrared emission tube; 3-LED module; 31-LED wafer; 4-infrared reception module; 41-infrared reception tube; 5-pin assembly. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described below with reference to the drawings. Many practical details will be described in the following description for the purpose of making the present application clear. However, it should be understood that these practical details are not used to limit the present application. That is, in some embodiments of the present application, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0023] In addition, the descriptions such as "first", "second", etc. in the present application are only for the purpose of description, and do not mean to particularly indicate the order or sequence, nor to limit the present application. They are merely used to distinguish the components or operations described by the same technical terms, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but must be based on the realization of ordinary skilled in the art. When the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor is it within the protection scope required by the present application.

[0024] Please refer to Figures 1-3 , Figure 1 A front view of the infrared emission-reception integrated LED device, Figure 2 A sectional view of the bracket, Figure 3The bottom view of the infrared emission-reception integrated LED device is shown. The embodiment provides an infrared emission-reception integrated LED device, which includes a bracket 1, an infrared emission module 2, an LED module 3, an infrared reception module 4, and a pin assembly 5. The bracket 1 includes a bowl cup 11 and two partitions 12. The bowl cup 11 has a containing space 110 for containing the infrared emission module 2, the LED module 3, and the infrared reception module 4. Further, the two partitions 12 are arranged in the containing space 110 of the bowl cup 11, so that the containing space 110 is divided into a first containing position 111, a second containing position 112, and a third containing position 113. The first containing position 111, the second containing position 112, and the third containing position 113 are used to contain the infrared emission module 2, the LED module 3, and the infrared reception module 4, respectively. The first containing position 111 and the second containing position 112 are separated by one partition 12, and the second containing position 112 and the third containing position 113 are separated by another partition 12, so that the infrared emission module 2, the LED module 3, and the infrared reception module 4 do not interfere with each other. The pin assembly 5 is electrically connected to the infrared emission module 2, the LED module 3, and the infrared reception module 4, and is used to electrically connect the infrared emission-reception integrated LED device to an external PCB board. The pin assembly 5 extends to the bottom of the bracket 1 along the side wall of the bracket 1, so that it is convenient to connect to the external PCB board.

[0025] During use of the infrared emission-reception integrated LED device, the pin assembly 5 is soldered to the external PCB board. The infrared emission module 2, the LED module 3, and the infrared reception module 4 control the on-off of the pin assembly 5 through the PCB board to control the operation of the infrared emission module 2, the LED module 3, and the infrared reception module 4.

[0026] In this way, the infrared emission module 2, the LED module 3, and the infrared reception module 4 are integrated in the bowl cup 11, and the infrared emission module 2, the LED module 3, and the infrared reception module 4 are separated from each other by the partitions 12, so that the infrared emission-reception integrated LED device integrates the functions of infrared emission, infrared reception, and light emission into one. Compared with the conventional scheme of connecting the infrared emission lamp, the LED white light lamp bead, and the infrared emission lamp bead to the PCB board respectively, the scheme of the present application packages the infrared emission module 2, the LED module 3, and the infrared reception module 4 as one component, so that the distance between the infrared emission module 2, the LED module 3, and the infrared reception module 4 is compact, effectively reducing the size of the component and the occupied area of the PCB board, which can be applied to smaller PCB boards and can be applied to more different use scenarios. At the same time, the cost of materials for manufacturing the infrared emission-reception integrated LED device is effectively reduced. Furthermore, after being integrated into one component, only one SMT is required when connected to the PCB board, which effectively simplifies the installation steps and facilitates connection to the external PCB board.

[0027] The pin assembly 5 is arranged on opposite sides of the bracket 1, and extends along the side of the bracket 1 and is bent at the bottom of the bracket 1, so as to be connected with the external PCB.

[0028] Further, the bowl cup 11 comprises a frame body 114 and a cup body 115. The cup body 115 is connected to the surface of the frame body 114, and the cup body 115 is provided with a cup opening 1150, and the cup opening 1150 and the frame body 114 form a containing space 110. The circuit layer 10 is arranged on the side of the frame body 114 connected with the cup body 115, and the pin assembly 5 is connected with the frame body 114.

[0029] Further, the inner diameter of the cup body 115 gradually decreases in the direction of the cup opening 1150 close to the frame body 114. In this way, the cup body 115 is bowl-shaped. The light emitted by the infrared receiving module 4, the LED module 3 and the infrared emitting module 2 arranged in the containing space 110 can be concentrated by the cup body 115.

[0030] Further, the infrared emitting module 2 comprises an infrared emitting tube 21, which is arranged in the first containing position 111 and electrically connected with the circuit layer 10.

[0031] The LED module 3 comprises an LED wafer 31, which is arranged in the second containing position 112 and electrically connected with the circuit layer 10.

[0032] The infrared receiving module 4 comprises an infrared receiving tube 41, which is arranged in the third containing position 113 and electrically connected with the circuit layer 10.

[0033] In addition, a transparent adhesive layer is arranged in the first containing position 111 and covers the infrared emitting module 2. The transparent adhesive layer is used to increase the refractive index of the infrared emitting module 2. After the infrared light emitted by the infrared emitting module 2 is refracted by the transparent adhesive layer, the emission distance of the infrared light is farther.

[0034] A fluorescent powder adhesive layer is arranged in the second containing position 112 and covers the LED module 3. The fluorescent powder adhesive layer is used to brighten the LED module 3. After the light emitted by the LED module 3 passes through the fluorescent powder adhesive layer, the light will be brighter, so as to improve the light-emitting efficiency. And by changing the color of the fluorescent powder, the light color of the LED module 3 can be adjusted. In this way, in actual production, different colors of fluorescent powder adhesive layers can be replaced according to different needs, so as to change the light color of the LED module 3.

[0035] Further, the black filter adhesive layer is arranged in the third accommodating position 113 and covers the infrared receiving module 4. The black filter adhesive layer is used for filtering light to exclude light waves of other wave bands and shield other light interference, so as to better receive the infrared light sent from outside.

[0036] In summary, by separating the bowl cup 11 in the bracket 1 to form the first accommodating position 111, the second accommodating position 112 and the third accommodating position 113, the infrared emitting module 2, the LED module 3 and the infrared receiving module 4 are arranged in the first accommodating position 111, the second accommodating position 112 and the third accommodating position 113 respectively, so that the infrared emitting module 2, the LED module 3 and the infrared receiving module 4 do not affect each other, and the infrared emitting module 2, the LED module 3 and the infrared receiving module 4 are integrated in the bracket 1, so that the infrared emitting module 2, the LED module 3 and the infrared receiving module 4 are arranged compactly, the size of the infrared emitting and receiving integrated LED device is effectively reduced, and the connection with the external PCB is facilitated.

[0037] The above merely describes the embodiments of the present application and is not used to limit the present application. The present application can be variously changed and modified by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims

1. An infrared emission-reception integrated LED device, characterized by, It includes: Support (1), infrared emission module (2), LED module (3), infrared receiving module (4) and pin assembly (5); the support (1) includes bowl cup (11) and two partition plates (12), the bowl cup (11) has containing space (110) in it, two partition plates (12) are arranged in the containing space (110), the containing space (110) is spaced apart by two partition plates (12) and forms first containing site (111), second containing site (112) and third containing site (113), the infrared emission module (2), the LED module (3) and the infrared receiving module (4) are arranged in the first containing site (111), the second containing site (112) and the third containing site (113) respectively, and the infrared emission module (2), the LED module (3) and the infrared receiving module (4) are electrically connected with the pin assembly (5) respectively, the pin assembly (5) extends to the bottom of the support (1) along the side wall of the support (1).

2. The infrared transmit-receive integrated LED device of claim 1, wherein, The infrared emission module (2) includes infrared emission tube (21), the infrared emission tube (21) is arranged in the first containing site (111), and the infrared emission tube (21) is electrically connected with the pin assembly (5).

3. The infrared transmit-receive integrated LED device of claim 1, wherein, The LED module (3) includes LED wafer (31), the LED wafer (31) is arranged in the second containing site (112), and the LED wafer (31) is electrically connected with the pin assembly (5).

4. The infrared transmit-receive integrated LED device of claim 1, wherein, The infrared receiving module (4) includes infrared receiving tube (41), the infrared receiving tube (41) is arranged in the third containing site (113), and the infrared receiving tube (41) is electrically connected with the pin assembly (5).

5. The infrared transmit-receive integrated LED device of claim 1, wherein, It also includes a transparent adhesive layer, the transparent adhesive layer is arranged in the first containing site (111), and the transparent adhesive layer covers the infrared emission module (2).

6. The infrared transmit-receive integrated LED device of claim 1, wherein, It also includes a fluorescent powder adhesive layer, the fluorescent powder adhesive layer is arranged in the second containing site (112), and the fluorescent powder adhesive layer covers the LED module (3).

7. The infrared transmit-receive integrated LED device of claim 1, wherein, It also includes a black filter adhesive layer, the black filter adhesive layer is arranged in the third containing site (113), and the black filter adhesive layer covers the infrared receiving module (4).

8. The infrared transmit-receive integrated LED device of claim 1, wherein, The bowl cup (11) includes frame body (114) and cup body (115), the cup body (115) is arranged on the surface of the frame body (114), the cup body (115) is provided with cup mouth (1150), and the cup mouth (1150) and the frame body (114) form the containing space (110); the pin assembly (5) is connected to the frame body (114).

9. The infrared transmit-receive integrated LED device of claim 8, wherein, In the direction of the cup mouth (1150) close to the frame body (114), the inner diameter of the cup body (115) gradually decreases.

10. An infrared intelligent sensing lamp, characterized in that, It includes the infrared emission receiving integrated LED device of any one of claims 1-9.

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