Carrying manipulator

Abstract

The utility model provides a carrying manipulator, which relates to the technical field of semiconductors, and comprises a manipulator main body and an adsorption assembly, an air channel is formed in the manipulator body, and a mounting groove is concavely formed in an operation face on one side of the manipulator body. The adsorption assembly comprises a suction cup and a pressing block, a pressing groove is concavely formed in the outer side face of the suction cup, the suction cup is sleeved with the pressing block, the pressing block extends into the pressing groove, the pressing block is installed in the installation groove, a limiting cavity is formed between the pressing block and the groove bottom of the installation groove, and one end of the suction cup is pressed by the pressing block to be located in the limiting cavity and communicates with the air channel; and the other end protrudes out of the operation surface and forms an adsorption surface. The carrying mechanical arm is simple in structure, the adsorption assembly can be independently replaced after the suction cup is abraded, the use cost is reduced, the carrying mechanical arm can be used for warped cry face wafers, warped smiling face wafers, conventional wafers and the like, and the cost performance is higher.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially to a carrying manipulator. BACKGROUND

[0002] With the processing of semiconductor, various stresses are generated on the wafer surface, which causes the wafer to warp in the process. The conventional ceramic arm can only adsorb the wafer without warping, and the contact type Bernoulli arm can adsorb the wafer with small warping and large warping. However, the contact type Bernoulli arm has a high cost, and the manufacturers that only produce small warping wafers also use the Bernoulli manipulator to adsorb the wafers, which will cause the waste of the function of the Bernoulli manipulator and low cost performance.

[0003] Therefore, how to provide a carrying manipulator capable of adsorbing small warping wafers is one of the technical problems to be solved by those skilled in the art. SUMMARY

[0004] The utility model discloses a kind of carrying manipulators, its structure is simple, suction cup abrasion can be individually replaced to adsorption component, reduce use cost, can be used to warping cry face wafer, warping smile face wafer, conventional wafer etc., cost performance is higher.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] The utility model provides a kind of carrying manipulator, including manipulator main body and adsorption component;

[0007] The manipulator main body is equipped with air passage, and the operating surface of one side of the manipulator main body is recessed with mounting groove;

[0008] The adsorption component includes suction cup and pressing block, the outer side of the suction cup is recessed with pressure joint groove, the pressing block is sleeved on the outside of the suction cup and extends into the pressure joint groove, the pressing block is installed in the mounting groove and forms limit cavity between the groove bottom of the mounting groove, one end of the suction cup is limited in the limit cavity under the pressure of the pressing block and is communicated with the air passage, and the other end protrudes from the operating surface and forms adsorption surface.

[0009] Further, the mounting groove includes first groove body and second groove body, the first groove body is opened in the operating surface, the second groove body is opened in the groove bottom of the first groove body, the pressing block is pressed on the groove bottom of the first groove body and extends into the second groove body, and the limit cavity is formed between the pressing block and the groove bottom of the second groove body.

[0010] Further, the first groove body is waist-shaped.

[0011] Further, the length of the first slot in the length direction of the first slot is greater than the length of the pressing block in the length direction of the first slot, and / or the width of the first slot in the width direction of the first slot is greater than the width of the pressing block in the width direction of the first slot.

[0012] Further, the suction disc comprises a pressing portion and a suction portion connected with the pressing portion, the suction portion is connected with the pressing portion and forms the pressing slot between the pressing portion and the suction portion, the pressing portion is positioned in the limiting cavity under the pressing of the pressing block, and the side of the suction portion away from the pressing block is provided with the suction surface and is provided with the suction channel connected with the air channel.

[0013] Further, the surface edge of the pressing portion pressed by the pressing block is provided with a limiting protrusion, the protruding direction of the limiting protrusion is perpendicular to the operation surface, and the surface of the pressing portion for pressing the pressing portion is provided with a limiting groove for accommodating the limiting protrusion.

[0014] Further, the suction portion comprises a horn-shaped suction head, the suction head comprises a first suction section and a second suction section connected in sequence in the direction gradually away from the operation surface, and the hardness of the second suction section is less than that of the first suction section.

[0015] Further, the suction assembly and the mounting slot are configured as a plurality of suction assemblies and mounting slots, respectively, and each pressing block in the suction assembly is installed in each mounting slot in one-to-one correspondence.

[0016] Further, the position of at least one pressing block relative to the mounting slot is adjustable.

[0017] Further, the air channel comprises a main air channel and a plurality of branch air channels, one end of the main air channel is used for being connected with a gas pump, the other end of the main air channel is connected with the plurality of branch air channels, the flow area of the main air channel gradually increases in the direction gradually close to each branch air channel, and each suction disc in the suction assembly is selectively connected with the main air channel and the branch air channel.

[0018] The carrying manipulator provided by the utility model can produce the following beneficial effects:

[0019] In the carrying manipulator, the pressing block is arranged outside the suction disc and extends into the pressing slot of the outer side surface of the suction disc, the pressing block and the mounting slot form the limiting cavity, the pressing block can press one end of the suction disc in the limiting cavity, and the limiting of the suction disc is realized. In use, the air channel is connected with the suction channel formed in the suction disc to form a negative pressure channel and can be connected with an external negative pressure device, so that the negative pressure device is used for pumping to form a negative pressure between the suction surface and the back surface of the wafer to be adsorbed, thereby facilitating the adsorption of the wafer. In addition, when the suction disc is worn, the pressing block can be removed to replace the suction assembly alone.

[0020] Compared with the prior art, the carrying manipulator provided by the utility model has simple structure and low cost, can realize stable positioning of the suction cup, is convenient for replacing the adsorption assembly alone after the suction cup is worn, reduces use cost, can be used for warped smile face wafers, warped frown face wafers, conventional wafers and the like, and has higher cost performance. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the drawings required to be used in the specific embodiments or the prior art description will be briefly introduced as follows, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0022] Figure 1 It is a top view of the carrying manipulator provided by the utility model embodiment;

[0023] Figure 2 It is a sectional view of A-A of Figure 1

[0024] Figure 3 It is a partial enlarged view at B of Figure 2

[0025] Figure 4 It is a three-dimensional structure schematic view of the manipulator main body provided by the utility model embodiment;

[0026] Figure 5 It is a sectional view of C-C of Figure 1

[0027] Figure 6 It is a partial enlarged view at D of Figure 5

[0028] Figure 7 It is a three-dimensional structure schematic view of the suction cup provided by the utility model embodiment;

[0029] Figure 8 It is a three-dimensional structure schematic view of the pressing block provided by the utility model embodiment;

[0030] Figure 9 It is a three-dimensional structure schematic view of another suction cup provided by the utility model embodiment;

[0031] Figure 10 It is a side view of the carrying manipulator provided by the utility model embodiment;

[0032] Figure 11 It is a sectional view of D-D of Figure 10 ​​​​a cross-sectional view of E-E of FIG.

[0033] Figure 12 A three-dimensional structure schematic diagram of the carrying mechanical hand is provided for the embodiments of the utility model.

[0034] Icon: 1 - mechanical hand main body;11 - air channel;111 - main air channel;112 - branch air channel;12 - operation surface;13 - installation slot;131 - first slot body;132 - second slot body;14 - support body;141 - connecting hole;15 - first plate body;16 - second plate body;2 - suction cup;21 - crimping slot;22 - crimping part;23 - adsorption part;231 - first adsorption section;232 - second adsorption section;24 - limit protrusion;3 - pressing block;31 - limit slot. DETAILED DESCRIPTION

[0035] The technical scheme of the utility model will be described below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0036] In the description of the utility model, it needs to be explained that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, a particular orientation and operation, therefore, it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0037] In the description of the utility model, it needs to be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected;It can be mechanical connection, or electrical connection;It can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0038] The specific embodiments of the utility model will be described in detail below in conjunction with the drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the utility model, and are not used to limit the utility model.

[0039] The utility model discloses a first aspect embodiment is in providing a kind of handling manipulator, as shown in Figures 1 to 3 Including manipulator main body 1 and suction assembly;

[0040] Mechanical hand main body 1 is equipped with air passage 11, and the operating surface 12 of one side of mechanical hand main body 1 is recessed with mounting groove 13;

[0041] Suction assembly includes suction cup 2 and pressing block 3, and the outer side of suction cup 2 is recessed with crimping groove 21, and pressing block 3 is sleeved on the outside of suction cup 2 and extends into crimping groove 21, and pressing block 3 is installed in mounting groove 13 and forms limiting cavity between the groove bottom of mounting groove 13, one end of suction cup 2 is limited in limiting cavity under the pressure of pressing block 3 and is communicated with air passage 11, and the other end protrudes from operating surface 12 and forms suction surface.

[0042] The following is taken as wafer for example to carry out specific description:

[0043] The handling manipulator provided in the above embodiment, as shown in Figure 3 Pressing block 3 is sleeved on the outside of suction cup 2 and extends into crimping groove 21 of the outer side of suction cup 2, and pressing block 3 forms limiting cavity between the connection with mounting groove 13 and mounting groove 13, and one end of suction cup 2 is pressed in limiting cavity by pressing block 3, to realize the limiting of suction cup 2.In addition, suction cup 2 forms hollow suction passage, and when suction cup 2 is fixed on mechanical hand main body 1 by pressing block 3, suction passage is through with air passage 11, so external negative pressure equipment can be communicated with air passage 11 and suction passage, and suction is carried out by using external negative pressure equipment, to form negative pressure between suction surface and the back of wafer to be adsorbed, so that wafer is adsorbed, and the suction surface of suction cup 2 is completely attached to the back of wafer, to facilitate the handling operation of wafer;In addition, when suction cup 2 is worn, the operator can also remove pressing block 3 to replace suction assembly alone.

[0044] Therefore, the handling manipulator provided in the above embodiment is simple in structure and low in cost, can not only realize the stable connection of suction cup 2 and mechanical hand main body 1, but also facilitate the replacement of suction assembly alone when suction cup 2 is worn, reduce the use cost, and can be used for warped smiley wafer, warped laughing face wafer, conventional wafer and the like, and has higher cost performance.

[0045] In optional implementation, as shown in Figure 3 Mounting groove 13 includes first groove body 131 and second groove body 132, first groove body 131 is opened in operating surface 12, second groove body 132 is opened in the groove bottom of first groove body 131, pressing block 3 is pressed in the groove bottom of first groove body 131 and extends into second groove body 132, and limiting cavity is formed between pressing block 3 and the groove bottom of second groove body 132, and the groove bottom of second groove body 132 can be opened with through hole communicated with air passage 11, and suction cup 2 is communicated with air passage 11 through the through hole.

[0046] The mounting groove 13 provided by the above embodiment comprises a first groove body 131 and a second groove body 132, and a stepped surface is formed between the first groove body 131 and the second groove body 132. The stepped surface can increase the contact area between the pressing block 3 and the mounting groove 13, which is conducive to avoiding the external air from entering the air passage 11 from the gap between the pressing block 3 and the mounting groove 13, and achieving a better sealing effect.

[0047] The shape of the first groove body 131 can be rectangular, waist-shaped or circular, etc.

[0048] In the preferred embodiment, as shown in Figure 4 the first groove body 131 is waist-shaped.

[0049] In the alternative embodiment, the length of the first groove body 131 along its length direction is greater than the length of the pressing block 3 in the length direction of the first groove body 131, and / or the width of the first groove body 131 along its width direction is greater than the width of the pressing block 3 in the width direction of the first groove body 131.

[0050] In the above embodiment, the preliminary positioning of the pressing block 3 relative to the position of the mechanical hand main body 1 can be achieved by the cooperation of the pressing block 3 and the second groove body 132. After the preliminary positioning, the pressing block 3 can be connected with the mechanical hand main body 1 through screws or other connecting members, or can be adhered in the first groove body 131 through a glue body. At this time, the second groove body 132 can be configured as a circular shape, and the end of the pressing block 3 extending into the second groove body 132 is matched with the shape of the second groove body 132.

[0051] Alternatively, the position of the pressing block 3 relative to the first groove body 131 and the second groove body 132 can also be configured to be adjustable. At this time, the size of the second groove body 132 along the adjustment direction is greater than the size of the end of the pressing block 3 extending into the second groove body 132 in the above direction. For example, when the adjustment direction extends along the length direction of the first groove body 131, the pressing block 3 can adjust its position relative to the mechanical hand main body 1 along the length direction of the first groove body 131, and after the adjustment is completed, the pressing block 3 is fixed on the mechanical hand main body 1. When the adjustment direction extends along the width direction of the first groove body 131, the pressing block 3 can adjust its position relative to the mechanical hand main body 1 along the width direction of the first groove body 131, and after the adjustment is completed, the pressing block 3 is fixed on the mechanical hand main body 1. The above setting mode can adjust the position of the pressing block 3 relative to the mechanical hand main body 1, and thus can be adapted to wafers of different sizes.

[0052] When the adsorption assembly is configured as a plurality of adsorption assemblies, the position of at least one pressing block 3 relative to the mounting groove 13 is adjustable.

[0053] As shown in Figure 4As shown, when the first groove body 131 is in a waist shape, a connecting hole 141 can be formed in the groove bottom of the first groove body 131 and penetrate the mechanical hand main body 1, and a connecting member such as a screw can penetrate the connecting hole 141 and be locked on the pressing block 3, so as to realize the connection of the pressing block 3 and the mechanical hand main body 1.

[0054] In an optional embodiment, as shown in the figure, Figures 4 to 6 As shown, the suction cup 2 comprises a pressing portion 22 and a suction portion 23 connected with the pressing portion 22, the suction portion 23 is connected with the pressing portion 22 and forms a pressing groove 21 between the pressing portion 22, the pressing portion 22 is limited in the limiting cavity under the pressing of the pressing block 3, the side of the suction portion 23 away from the pressing block 3 forms a suction surface, and the suction portion 23 is provided with a suction channel connected with the air channel 11, the suction surface of the suction portion 23 is used to be attached with the back surface of the wafer to be sucked, and the suction surface and the wafer are sucked by negative pressure.

[0055] In the above embodiment, since the pressing portion 22 is limited in the limiting cavity under the pressing of the pressing block 3, the stable connection of the suction cup 2 and the mechanical hand main body 1 can be realized, and the stable suction of the wafer by the suction portion 23 is guaranteed.

[0056] When the pressing block 3 is adhered in the mounting groove 13 by the colloid and needs to be replaced, the user can pull out the suction portion 23, the pulling-out force is applied to the pressing block 3 by the suction portion 23 through the pressing portion 22, the pressing block 3 and the first groove body 131 are disassembled, and the replacement of the suction assembly is facilitated.

[0057] In an optional embodiment, as shown in the figure, Figures 6 to 8 As shown, the surface edge of the pressing portion 22 pressed by the pressing block 3 is provided with a limiting protrusion 24, the protruding direction of the limiting protrusion 24 is perpendicular to the operation surface 12, and the surface of the pressing block 3 pressed against the pressing portion 22 is recessed with a limiting groove 31 for accommodating the limiting protrusion 24.

[0058] In the above embodiment, the position of the suction cup 2 relative to the pressing block 3 can be more stably limited by the clamping of the limiting protrusion 24 and the limiting groove 31, the contact area between the suction cup 2 and the pressing block 3 is increased, and the air outside the suction cup 2 and the pressing block 3 is prevented from entering the air channel 11. When the pressing block 3 is adhered in the mounting groove 13 by the colloid, the cooperation of the limiting protrusion 24 and the limiting groove 31 can make the connection between the suction cup 2 and the pressing block 3 more firm, and the user can pull out the suction portion 23 to disassemble the pressing block 3.

[0059] In an optional embodiment, the adsorption part 23 comprises a horn-shaped adsorption head, and the adsorption head can be made of conductive silicone rubber, which can withstand high temperature of 300℃, low temperature of -60℃, and static electricity (resistance value of 10-5-10-9), and the hardness of the adsorption head at different positions can be configured to be equal, and the hardness is Shore 35±5, which will not scratch the wafer and generate friction to prevent displacement of the wafer during transportation.

[0060] Optionally, as shown in Figure 9 the adsorption head comprises a first adsorption section 231 and a second adsorption section 232 connected in sequence in a direction gradually away from the operation surface 12, and the hardness of the second adsorption section 232 is less than that of the first adsorption section 231.

[0061] The above arrangement can make the second adsorption section 232 of the adsorption head contacting the wafer more flexible, which will not scratch the wafer, and at the same time, the hardness of the first adsorption section 231 is greater than that of the second adsorption section 232, which ensures that the adsorption head has good support.

[0062] In an optional embodiment, the adsorption assembly and the mounting groove 13 are configured to be multiple, for example, the adsorption assembly and the mounting groove 13 are configured to be two, three, four or even more, and the pressing block 3 in each adsorption assembly is one-to-one corresponding to each mounting groove 13.

[0063] Multiple adsorption assemblies can adsorb different positions of the wafer, thereby ensuring stable transportation of the wafer.

[0064] Specifically, as shown in Figure 1 the adsorption assembly and the mounting groove 13 are configured to be three, and the adsorption heads of the three adsorption assemblies are connected in sequence to form an isosceles triangle, which can stably adsorb the wafer and avoid setting more adsorption assemblies to cause large cost of the robot.

[0065] In an optional embodiment, as shown in Figure 10 and Figure 11 the air passage 11 comprises a main air passage 111 and multiple branch air passages 112, one end of the main air passage 111 is used to communicate with an air pump of a negative pressure device, the other end of the main air passage 111 communicates with the multiple branch air passages 112, and the adsorption head of each adsorption assembly selectively communicates with the main air passage 111 and the branch air passage 112.

[0066] The above embodiment can enable the transportation robot to adsorb the wafer by one air pump through multiple adsorption heads.

[0067] Specifically, when the adsorption assembly is configured as three, the air passage 11 comprises one main air passage 111 and two branch air passages 112, the suction cups 2 in one adsorption assembly are communicated with the intersection of the main air passage 111 and the branch air passages 112, and the suction cups 2 in the other two adsorption assemblies are respectively communicated with the two branch air passages 112.

[0068] In optional embodiments, as shown in Figure 11 The flow area of the main air passage 111 gradually increases along the direction gradually approaching the branch air passages 112, so as to facilitate the air in the branch air passages 112 to quickly enter the main air passage 111 after confluence.

[0069] In addition, as shown in Figure 11 The support body 14 can be arranged in the main air passage 111 and the branch air passages 112, the support body 14 is provided with a connecting hole 141, a connecting member such as a screw can be locked on the pressing block 3 through the connecting hole 141, the connection of the pressing block 3 and the mechanical hand body 1 is realized, and the periphery of the connecting member is avoided from being directly communicated with the air passage 11.

[0070] In order to facilitate the forming of the air passage 11, as shown in Figure 12 The mechanical hand body 1 comprises a first plate body 15 and a second plate body 16, the first plate body 15 is provided with the operation face 12, and the second plate body 16 is buckled on the side of the first plate body 15 away from the operation face 12 and forms the air passage 11 with the first plate body 15.

[0071] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A transfer robot characterized by comprising: The robot hand body (1) is internally provided with an air passage (11), and an operating surface (12) on one side of the robot hand body (1) is concavely provided with a mounting groove (13). The robot hand body (1) is internally provided with an air passage (11), and an operating surface (12) on one side of the robot hand body (1) is concavely provided with a mounting groove (13). The suction assembly comprises a suction disc (2) and a pressing block (3), the outer side of the suction disc (2) is concavely provided with a pressing groove (21), the pressing block (3) is sleeved on the outside of the suction disc (2) and extends into the pressing groove (21), the pressing block (3) is installed in the mounting groove (13) and forms a limiting cavity with the groove bottom of the mounting groove (13), one end of the suction disc (2) is limited in the limiting cavity under the pressing of the pressing block (3) and is in communication with the air passage (11), and the other end protrudes from the operating surface (12) and is formed with a suction surface.

2. The handling robot according to claim 1, characterized in that The mounting groove (13) comprises a first groove body (131) and a second groove body (132), the first groove body (131) is opened on the operating surface (12), and the second groove body (132) is opened on the groove bottom of the first groove body (131); the pressing block (3) is pressed on the groove bottom of the first groove body (131) and extends into the second groove body (132); and the pressing block (3) and the groove bottom of the second groove body (132) form the limiting cavity.

3. The handling robot according to claim 2, characterized in that The first groove body (131) is in a waist shape.

4. The handling robot according to claim 3, characterized in that The length dimension of the first groove body (131) along the length direction thereof is greater than the length dimension of the pressing block (3) in the length direction of the first groove body (131), and / or the width dimension of the first groove body (131) along the width direction thereof is greater than the width dimension of the pressing block (3) in the width direction of the first groove body (131).

5. The handling robot of claim 1, wherein, The suction disc (2) comprises a pressing portion (22) and a suction portion (23) connected with the pressing portion (22), the suction portion (23) is connected with the pressing portion (22) and forms the pressing groove (21) with the pressing portion (22), the pressing portion (22) is limited in the limiting cavity under the pressing of the pressing block (3), and the side, away from the pressing block (3), of the suction portion (23) forms the suction surface and is provided with a suction passage in communication with the air passage (11).

6. The handling robot of claim 5, wherein, The surface edge, on which the pressing block (3) is pressed, of the pressing portion (22) is convexly provided with a limiting protrusion (24), the convex direction of the limiting protrusion (24) is perpendicular to the operating surface (12), and the surface, on which the pressing block (3) is pressed, of the pressing portion (22) is concavely provided with a limiting groove (31) for accommodating the limiting protrusion (24).

7. The handling robot of claim 5, wherein, The suction portion (23) comprises a horn-shaped suction head, the suction head comprises a first suction segment (231) and a second suction segment (232) connected in sequence in a direction gradually away from the operating surface (12), and the hardness of the second suction segment (232) is less than that of the first suction segment (231).

8. The handling robot according to any one of claims 1 to 7, characterized in that The suction assembly and the mounting groove (13) are both configured as a plurality of, and the pressing block (3) in each of the suction assemblies is installed in each of the mounting grooves (13) one by one.

9. The handling robot according to claim 8, characterized in that The position of at least one of the briquettes (3) relative to the mounting slot (13) is adjustable.

10. The handling robot of claim 8, wherein, The air passage (11) comprises a main air passage (111) and a plurality of branch air passages (112), one end of the main air passage (111) is used for communicating with an air pump, the other end of the main air passage (111) communicates with the plurality of branch air passages (112), the flow area of the main air passage (111) gradually increases along the direction gradually close to each branch air passage (112), and the suction disc (2) in each adsorption assembly selectively communicates with the main air passage (111) and the branch air passage (112).

Images