End cup for high-temperature liquid phase epitaxy equipment

Abstract

The utility model discloses an end cup for high-temperature liquid phase epitaxy equipment, which comprises an end cup body, the end cup body is composed of a first flange body, a connecting cavity and a second flange body which are connected in sequence, the first flange body is arranged at the A end of the end cup body, a first sealing port with a double-sealing-ring structure is arranged on the first flange body, and a second sealing port with a double-sealing-ring structure is arranged on the second flange body. The first flange body is located at the end A of the end cup body, the first sealing port is used as an end cover negative pressure sealing port, the second flange body is located at the end B of the end cup body, a second sealing port of a double-sealing-ring structure is formed in the second flange body, and the second sealing port is used as a reaction chamber negative pressure sealing port of high-temperature liquid phase epitaxy equipment; and internal water channels are arranged in the first flange body and the second flange body so as to realize double-end water cooling of the end cup body. The high-temperature liquid phase epitaxy end cup has the advantages of being compact in structure, high in stability, beneficial to improving a temperature process window and the like, and overcomes the defect that an existing conventional end cup cannot meet the process requirement of high-temperature liquid phase epitaxy equipment due to the insufficient cooling effect, and then restricts development of high-quality and high-performance infrared devices.

Description

TECHNICAL FIELD

[0001] The utility model relates to liquid phase epitaxy equipment technical field, specifically related to a kind of end cup for high-temperature liquid phase epitaxy equipment. BACKGROUND

[0002] Liquid phase epitaxy furnace is used for infrared focal plane device epitaxial film special growth process, suitable for liquid phase epitaxy equipment and matching process technology of infrared device surface growth process, and plays an important role in infrared device.

[0003] Liquid phase epitaxy process needs to be carried out in controlled atmosphere, to ensure that high temperature, specific liquid compound conditions, equipment vacuum tightness is good, to produce high-quality epitaxial layer thin film material.

[0004] The highest working temperature of conventional liquid phase epitaxy equipment is 700 DEG C, and the highest working temperature of high-temperature liquid phase epitaxy equipment is about 900 DEG C. The process temperature of the equipment is improved, and the environmental temperature of the equipment is greatly improved. The sealing of the equipment port and the environment are greatly affected.

[0005] In the liquid phase epitaxy process, toxic and harmful compound materials such as tellurium cadmium mercury and gallium arsenide are used for epitaxial growth process, so the air tightness in the reaction cavity is required. INVENTION CONTENTS

[0006] The utility model solves the technical problem of prior art, and provides an end cup for high-temperature liquid phase epitaxy equipment, which is compact in structure, high in stability and conducive to improving the temperature process window.

[0007] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0008] An end cup for high-temperature liquid phase epitaxy equipment, comprising an end cup body, the end cup body is composed of a first flange body, a connecting cavity and a second flange body connected in sequence, wherein the first flange body is located at the A end of the end cup body, and a first sealing port with double sealing ring structure is provided on the first flange body, the first sealing port is used as the negative pressure sealing port of the end cover, the second flange body is located at the B end of the end cup body, and a second sealing port with double sealing ring structure is provided on the second flange body, the second sealing port is used as the negative pressure sealing port of the reaction chamber of the high-temperature liquid phase epitaxy equipment; internal waterways are respectively arranged in the first flange body and the second flange body to realize double-end water cooling of the end cup body.

[0009] As a further improvement of the utility model, a welding column is arranged in the internal waterway.

[0010] As a further improvement of the utility model, an A-end cooling water inlet and outlet interface is arranged on the first flange body and communicated with the internal waterway.

[0011] As a further improvement of the utility model, the first flange body is provided with a through A end negative pressure air extraction interface, and the A end negative pressure air extraction interface is located between the double sealing rings.

[0012] As a further improvement of the utility model, the first flange body is provided with a tail exhaust interface, and the tail gas generated in the reaction chamber of the high-temperature liquid phase epitaxy equipment is discharged through the tail exhaust interface.

[0013] As a further improvement of the utility model, the second flange body is provided with a B end cooling water inlet and outlet interface in communication with the internal water channel.

[0014] As a further improvement of the utility model, the second flange body is provided with a B end negative pressure air extraction interface, and the B end negative pressure air extraction interface is located between the double sealing rings.

[0015] As a further improvement of the utility model, the connecting cavity side is provided with a molecular pump interface.

[0016] As a further improvement of the utility model, the molecular pump interface is provided with a vacuum detection interface.

[0017] As a further improvement of the utility model, the connecting cavity side is provided with an air inlet interface.

[0018] Compared with the prior art, the utility model has the advantages that:

[0019] The end cup for the high-temperature liquid phase epitaxy equipment of the utility model improves the cooling effect of the two ends of the end cup by arranging the flange body at the two ends of the end cup body and arranging the internal water channel in the flange body of the two ends, reduces the environmental temperature rise caused by high temperature, widens the equipment temperature process window, and ensures the safety of the equipment; at the same time, the flange end of the two ends of the end cup is provided with a sealing port of a double sealing ring structure, the sealing property of the equipment reaction chamber is ensured, the risk of leakage of toxic and harmless gas is effectively reduced, and the overall performance of the equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the overall structure principle schematic view of the end cup in the embodiment of the utility model;

[0021] Figure 2 It is the waterway structure principle schematic view of the end cup inside in the embodiment of the utility model;

[0022] Figure 3 It is the cross section structure principle schematic view of the end cup in the embodiment of the utility model;

[0023] Figure 4 It is Figure 3 The structure principle schematic view of the C place in the embodiment of the utility model;

[0024] Legend: 1, B end cooling water in and out interface; 2, A end cooling water in and out interface; 3, B end negative pressure air extraction interface; 4, A end negative pressure air extraction interface; 5, Molecular pump interface; 6, Vacuum detection interface; 7, Inlet interface; 8, Tail exhaust interface; 11, Internal waterway; 12, Welding column; 13, First sealing port; 14, Second sealing port; 15, A end cooling water channel; 16, B end cooling water channel; 17, Fixed ring; 18, Air duct ring; 100, End cup body; 101, First flange body; 102, Connecting cavity; 103, Second flange body. DETAILED DESCRIPTION

[0025] The utility model will be further described below in combination with the drawings and specific preferred embodiments, but it is not limited to the protection scope of the utility model.

[0026] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "side", "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0027] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features, so that the features with "first" and "second" can explicitly or implicitly include one or more features, and in the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0028] Embodiments

[0029] As Figure 1 , Figure 2 and Figure 3As shown, the end cup for high-temperature liquid phase epitaxial equipment of the utility model, including end cup body 100, end cup body 100 is by sequentially connected first flange body 101, connecting cavity 102 and second flange body 103 is composed, first flange body 101 and second flange body 103 have similar structure setting. Wherein, first flange body 101 is at the A end of end cup body 100, and first flange body 101 is equipped with the first sealing port 13 of double sealing ring structure. The first sealing port 13 is used as the negative pressure sealing port of end cover, and the end cover here is equivalent to the cover plate arranged in the furnace mouth of high-temperature liquid phase epitaxial equipment, and the reaction cavity in high-temperature liquid phase epitaxial equipment is isolated from the outside through the end cup, and the second flange body 103 is at the B end of end cup body 100, and the second flange body 103 is equipped with the second sealing port 14 of double sealing ring structure, and the second sealing port 14 is used as the negative pressure sealing port of the reaction chamber of high-temperature liquid phase epitaxial equipment. First flange body 101 and second flange body 103 are respectively provided with internal waterway 11 to realize double-end water cooling of end cup body 100, and then the performance stability of epitaxial equipment is ensured.

[0030] In the embodiment, the flange body is arranged at both ends of the end cup body 100, and the internal waterway 11 is arranged in the flange body at both ends, thereby improving the cooling effect of both ends of the end cup, reducing the environmental temperature rise caused by high temperature, ensuring the gas temperature environment atmosphere in the equipment, widening the equipment temperature process window, prolonging the service life and maintenance time of the sealing element of the reaction chamber of the equipment, and ensuring the safety of the equipment. At the same time, the sealing port of double sealing ring structure is arranged at the flange end of both ends of the end cup, the sealing property and vacuum degree of the reaction chamber of the equipment are ensured, the risk of leakage of toxic and harmless gas is effectively reduced, the epitaxial growth efficiency is improved, and the production cost is reduced.

[0031] As shown in Figure 2 The internal waterway 11 is provided with a plurality of welding columns 12, and the welding columns 12 provide support to avoid deformation and failure of the internal waterway 11 when the water pressure is too large.

[0032] As shown in Figure 1 The first flange body 101 is provided with an A-end cooling water inlet and outlet interface 2 in communication with the internal waterway 11 to realize the inlet and outlet of the cooling water in the internal waterway 11, and then the A-end cooling of the end cup is realized.

[0033] As shown in Figure 3 And Figure 4 The first flange body 101 is provided with an A-end negative pressure air extraction interface 4 penetrating through, and the A-end negative pressure air extraction interface 4 is located between the double sealing rings. The fixed ring 17 is arranged between the double sealing rings, and the air duct ring 18 is arranged in the fixed ring 17. The A-end negative pressure air extraction interface 4 is connected with the air duct ring 18 and the vacuum pump respectively, when the vacuum pump works, the negative pressure is uniformly distributed on the first flange body 101, the vacuum adsorption is reliable, and good and stable sealing property is provided.

[0034] As shown in Figure 1 The first flange body 101 is provided with a tail gas outlet 8. The tail gas generated in the reaction chamber of the high-temperature liquid phase epitaxy device is discharged through the tail gas outlet 8.

[0035] As shown in Figure 1 The second flange body 103 is provided with a B-end cooling water inlet and outlet interface 1 which is in communication with the internal water channel 11, so as to realize the cooling water inlet and outlet of the internal water channel 11, and further realize the B-end cooling of the end cup.

[0036] Further, the second flange body 103 is provided with a B-end negative pressure air extraction interface 3 which is located between the double sealing rings. By arranging a sealing ring fixing ring with an air duct ring between the double sealing rings, and by connecting the air duct ring and the vacuum pump through the B-end negative pressure air extraction interface 3, when the vacuum pump works, the negative pressure is uniformly distributed on the second flange body 103, the vacuum adsorption is reliable, and good stable sealing performance is provided. In the embodiment, by arranging the flange body with the air duct and the water channel at both ends of the end cup, sealing and cooling are realized at both ends of the end cup, and the stability and safety of the high-temperature liquid phase epitaxy device are ensured.

[0037] As shown in Figure 1 The side of the connecting cavity 102 is provided with a molecular pump interface 5. The molecular pump 5 is used to provide the required high vacuum working condition in the reaction chamber. Further, the molecular pump interface 5 is provided with a vacuum detection interface 6, which is used to detect the vacuum degree in the end cup.

[0038] As shown in Figure 1 The side of the connecting cavity 102 is provided with a gas inlet interface 7. The inert gas such as argon or nitrogen is introduced into the reaction chamber of the high-temperature liquid phase device through the gas inlet interface 7, so as to realize the purging and protection of the inert gas in the process before, during and after the reaction.

[0039] The working principle of the end cup in the embodiment is as follows:

[0040] The first flange body 101 and the second flange body 103 at both ends of the end cup are water-cooled flange structures which can provide negative pressure. The negative pressure is generated by connecting the B-end negative pressure air extraction interface 3 and the A-end negative pressure air extraction interface 4 at both ends of the end cup with the diaphragm vacuum pump. When the diaphragm vacuum pump works, the negative pressure is generated through the air duct ring on the sealing ring fixing ring, which ensures the sealing reliability of the flange connection. At the same time, the water channel is arranged in the flange. When the cooling water passes through the flange, the heat is taken away, which plays a cooling role, and meets the transition connection between the furnace mouth and the reaction chamber under the high-temperature condition of the device.

[0041] The above merely is preferred implementation manner of the present application, the protection scope of the present application is not only limited to the above examples, and belongs to the technical scheme under the idea of the present application all belongs to the protection scope of the present application. It should be pointed out that, for ordinary skilled person in the art, under the premise of not departing from the principle of the present application, some improvements and decorations, these improvements and decorations should also be considered as the protection scope of the present application.

Claims

1. An end cup for a high temperature liquid phase epitaxy apparatus, characterized by, The utility model relates to a high-temperature liquid phase epitaxy equipment end cup body, including end cup body (100), the end cup body (100) is by first flange body (101) connected gradually, connecting cavity (102) and second flange body (103) are composed, wherein, first flange body (101) is at the A end of end cup body (100), and first flange body (101) is equipped with the first sealing port (13) of double sealing ring structure, the first sealing port (13) is used as end cover negative pressure sealing port, second flange body (103) is at the B end of end cup body (100), and second flange body (103) is equipped with the second sealing port (14) of double sealing ring structure, and the second sealing port (14) is used as the negative pressure sealing port of reaction chamber of high-temperature liquid phase epitaxy equipment, first flange body (101) and second flange body (103) are equipped with internal waterway (11) respectively, to realize end cup body (100) both ends water cooling.

2. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 1, wherein, The internal waterway (11) is equipped with a welding column (12).

3. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 2, wherein, The first flange body (101) is equipped with an A-end cooling water inlet and outlet interface (2) in communication with the internal waterway (11).

4. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 3, wherein, The first flange body (101) is equipped with an A-end negative pressure air extraction interface (4) penetrating through, and the A-end negative pressure air extraction interface (4) is located between the double sealing rings.

5. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 4, wherein, The first flange body (101) is equipped with a tail exhaust interface (8), and the tail gas generated in the reaction chamber of the high-temperature liquid phase epitaxy equipment is discharged through the tail exhaust interface (8).

6. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 2, wherein The second flange body (103) is equipped with a B-end cooling water inlet and outlet interface (1) in communication with the internal waterway (11).

7. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 6, wherein The second flange body (103) is equipped with a B-end negative pressure air extraction interface (3), and the B-end negative pressure air extraction interface (3) is located between the double sealing rings.

8. An end cup for a high temperature liquid phase epitaxy apparatus according to any one of claims 1 to 7, wherein The connecting cavity (102) is equipped with a molecular pump interface (5) on the side.

9. An end cup for a high temperature liquid phase epitaxy apparatus as defined in claim 8, wherein, The molecular pump interface (5) is equipped with a vacuum detection interface (6).

10. An end cup for a high temperature liquid phase epitaxy apparatus according to any one of claims 1 to 7, wherein The connecting cavity (102) is equipped with an air inlet interface (7) on the side.

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