Closed semiconductor refrigerator

Abstract

The utility model provides a closed semiconductor refrigerator, which relates to the technical field of semiconductor devices, and comprises a cooling fin, a refrigeration sheet and an evaporation sheet, the top of the cooling fin is provided with a sealing groove, the two sides of the back surface in the sealing groove are provided with lead-out holes in a penetrating manner, the refrigeration sheet is mounted in the sealing groove, and the evaporation sheet is mounted in the sealing groove. A heat insulation groove is formed in the periphery of the sealing groove and located on the top of the cooling fin in a surrounding mode, heat insulation cotton is arranged in the heat insulation groove in a surrounding mode, and the evaporation piece is installed on the top of the heat insulation cotton and the refrigeration piece.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor device technical field especially relates to a closed type semiconductor refrigeration device. BACKGROUND

[0002] The semiconductor refrigeration device is composed of a semiconductor refrigeration assembly formed by serially connecting electric couple arms (i.e. Peltier elements), a heat dissipation device assembled at the hot end of the refrigeration assembly and a cold transfer device assembled at the cold end of the refrigeration assembly.

[0003] The structure of the semiconductor refrigeration assembly currently used comprises a refrigeration sheet composed of a hot end substrate, a hot end flow guide plate, an electric couple arm, a cold end flow guide plate and a cold end substrate; the refrigeration sheet is generally adhered to the heat dissipation sheet by a heat-conducting silicone grease, and heat insulation cotton is placed around the refrigeration sheet, and then an evaporation sheet is placed on the other side of the refrigeration sheet, that is, the cold and hot end substrates of the refrigeration sheet are in contact with the contact surfaces of the cold transfer and heat dissipation devices, and the refrigeration sheet can conduct cold quantity out through the evaporation sheet after being electrified; however, during assembly, the refrigeration sheet is sandwiched between the heat dissipation sheet and the evaporation sheet, and the heat dissipation sheet and the evaporation sheet are fixedly connected by bolts, and the refrigeration sheet sandwiched in the middle is damaged due to different forces applied by the rotating bolts during rotation of the bolts, which leads to shortening of the service life and even damage of the refrigeration sheet and inability to use, therefore, the utility model provides a closed type semiconductor refrigeration device. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a closed type semiconductor refrigeration device to solve the problems in the background art.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A closed type semiconductor refrigeration device comprises a heat dissipation sheet, a refrigeration sheet and an evaporation sheet, a sealing groove is formed in the top of the heat dissipation sheet, lead-out holes are formed in the back of the sealing groove on both sides, the refrigeration sheet is installed in the sealing groove, a heat insulation groove is formed around the top of the heat dissipation sheet outside the sealing groove, heat insulation cotton is arranged around the heat insulation groove, and the evaporation sheet is installed on the top of the heat insulation cotton and the refrigeration sheet.

[0007] As a preferred scheme of the utility model, thread grooves are formed in the bottom of the heat insulation groove on all sides.

[0008] As a preferred scheme of the utility model, a plurality of through holes are formed in the top of the evaporation sheet and the heat insulation cotton on all sides.

[0009] The technical effect of the further scheme is that the bolt is used to pass through the through hole on the evaporation sheet and the through hole on the heat insulation cotton, and is screwed with the threaded groove in the heat insulation groove, so that the evaporation sheet is fixed and installed.

[0010] As the preferred scheme of the utility model, one side of the bottom of the refrigeration sheet is a hot end base plate, and one side of the top is a cold end base plate.

[0011] As the preferred scheme of the utility model, the refrigeration sheet is bonded with the heat dissipation sheet and the evaporation sheet through the heat-conducting silicone grease.

[0012] The technical effect of the further scheme is that the refrigeration sheet generates a large amount of heat during work, and the heat is conducted away through the surface of the heat sink by bonding the hot end base plate on one side of the refrigeration sheet with the surface of the heat sink, so that the refrigeration sheet is cooled; similarly, the cold end base plate on the other side of the refrigeration sheet is connected with the evaporation sheet to transfer cold to the outside for refrigeration.

[0013] As the preferred scheme of the utility model, the bottom of the heat dissipation sheet is provided with a first fan.

[0014] The technical effect of the further scheme is that the heat dissipation sheet is blown by the first fan to accelerate the heat dissipation speed, so that the refrigeration sheet is quickly cooled to maintain normal work.

[0015] As the preferred scheme of the utility model, the top of the evaporation sheet is provided with a second fan.

[0016] The technical effect of the further scheme is that the cold end base plate on the other side of the refrigeration sheet is connected with the evaporation sheet to transfer cold to the outside, and the cold air is conducted away by the rotation of the second fan for refrigeration.

[0017] Compared with the prior art, the utility model has the beneficial effects that:

[0018] In the utility model, the refrigeration sheet is installed in the sealing groove, the wiring end on the refrigeration sheet is led out from the leading-out hole and extends from the bottom of the heat dissipation sheet, so that the refrigeration sheet can be connected to the power supply for work, the heat insulation groove is opened around the top of the heat dissipation sheet outside the sealing groove, the heat insulation cotton is arranged around the heat insulation groove, the evaporation sheet is installed on the top of the heat insulation cotton and the refrigeration sheet, the heat insulation cotton separates the evaporation sheet from the heat dissipation sheet to reduce the contact between them and affect the cold and heat conduction rate of them, and meanwhile, when the evaporation sheet is installed, the sealing groove, the heat insulation groove and the heat insulation cotton are used in cooperation to avoid damage to the refrigeration sheet during the tightening of the fastening bolt, so that the service life of the refrigeration sheet is not shortened. BRIEF DESCRIPTION OF DRAWINGS

[0019] Fig. 1 The utility model provides a whole structure schematic diagram of a closed type semiconductor refrigeration device.

[0020] Fig. 2 The overall structure of the closed type semiconductor refrigeration device is shown in the exploded view.

[0021] Fig. 3 The overall structure of the closed type semiconductor refrigeration device is shown in the exploded view.

[0022] Legend: 1, heat dissipation fin; 101, sealing groove; 102, lead-out hole; 103, heat insulation groove; 2, refrigeration fin; 3, evaporation fin; 4, heat insulation cotton; 5, threaded groove; 6, through hole; 7, first fan; 701, second fan. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0024] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related description, and several embodiments of the present application are given. However, the present application can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0027] Embodiment 1

[0028] As Figs. 1-3As shown, the utility model provides a technical scheme: a closed type semiconductor refrigeration device, including fin 1, refrigeration piece 2 and evaporation piece 3, the top of fin 1 is provided with sealed groove 101, the both sides of the back of sealed groove 101 are provided with lead-out hole 102, refrigeration piece 2 is installed in sealed groove 101, by installing refrigeration piece 2 in sealed groove 101, the wiring end on refrigeration piece 2 is led out from lead-out hole 102, extends from the bottom of fin 1, so that subsequent refrigeration piece 2 is connected to power supply and works, the periphery of sealed groove 101 and the top of fin 1 are provided with heat insulation groove 103, heat insulation cotton 4 is arranged in heat insulation groove 103, evaporation piece 3 is installed on heat insulation cotton 4 and the top of refrigeration piece 2, heat insulation cotton 4 separates evaporation piece 3 from fin 1, reduces the contact of both, influences the cold and hot conduction rate of both, simultaneously, when installing evaporation piece 3, also avoid the damage of refrigeration piece 2 when fastening bolt.

[0029] Example 2

[0030] As Figs. 1-3 shown, a closed type semiconductor refrigeration device, the bottom of heat insulation groove 103 is provided with threaded groove 5, the top of evaporation piece 3 and heat insulation cotton 4 is provided with a plurality of through holes 6, bolt is used to pass through the through hole 6 on evaporation piece 3 and heat insulation cotton 4, and is screw connected with the threaded groove 5 in heat insulation groove 103, so as to install and fix evaporation piece 3, one side of the bottom of refrigeration piece 2 is hot end base plate, and one side of the top is cold end base plate, refrigeration piece 2 is adhered with fin 1 and evaporation piece 3 through heat-conducting silicone grease, when refrigeration piece 2 works, a large amount of heat is radiated, the hot end base plate of one side of refrigeration piece 2 is adhered with the surface of radiator, and the heat on refrigeration piece 2 is conducted away through the radiator to radiate heat, in the same way, the cold end base plate of the other side of refrigeration piece 2 is connected with evaporation piece 3, and the cold quantity is transmitted to carry out refrigeration, the bottom of fin 1 is provided with first fan 7, the first fan 7 works to blow fin 1, speeds up the radiating speed, rapidly cools refrigeration piece 2, keeps refrigeration piece 2 to work normally, the top of evaporation piece 3 is provided with second fan 701, the cold end base plate of the other side of refrigeration piece 2 is connected with evaporation piece 3, and the cold quantity is transmitted to carry out refrigeration, and the cold air is conducted away through the rotation of second fan 701 to carry out refrigeration.

[0031] The utility model discloses a working procedure: when using a closed type semiconductor refrigeration device, including fin 1, refrigeration piece 2 and evaporation piece 3, the top of fin 1 is provided with sealed groove 101, and the both sides of the back of sealed groove 101 are provided with lead-out hole 102, and refrigeration piece 2 is installed in sealed groove 101, and the wiring end on refrigeration piece 2 is led out from lead-out hole 102, and extends from the bottom of fin 1, so that refrigeration piece 2 is connected to the power supply for working, and heat insulation groove 103 is provided around the top of fin 1, and heat insulation cotton 4 is arranged around heat insulation groove 103, and evaporation piece 3 is installed on the top of heat insulation cotton 4 and refrigeration piece 2, and heat insulation cotton 4 separates evaporation piece 3 from fin 1, reduces the contact between them, and influences the cold and hot conduction rate of both, and at the same time, when installing evaporation piece 3, it also avoids that the fastening bolt causes damage to refrigeration piece 2, and threaded groove 5 is formed around the bottom of heat insulation groove 103, and a plurality of through holes 6 are formed around the top of evaporation piece 3 and heat insulation cotton 4, and the bolt is threaded through the through hole 6 on evaporation piece 3 and heat insulation cotton 4 and is screwed with the threaded groove 5 in heat insulation groove 103, so as to install and fix evaporation piece 3, one side of the bottom of refrigeration piece 2 is a hot end base plate, and one side of the top is a cold end base plate, and refrigeration piece 2 is bonded with fin 1 and evaporation piece 3 through heat-conducting silicone grease, and when refrigeration piece 2 works, a large amount of heat is radiated, and the hot end base plate on one side of refrigeration piece 2 is bonded with the surface of the radiator, and the heat on refrigeration piece 2 is conducted away through the radiator to radiate heat; similarly, the cold end base plate on the other side of refrigeration piece 2 is connected with evaporation piece 3, and the cold quantity is transferred away to refrigerate, and the bottom of fin 1 is provided with first fan 7, and the first fan 7 works to blow fin 1, so as to accelerate the heat dissipation speed, rapidly cool refrigeration piece 2, keep refrigeration piece 2 working normally, and the top of evaporation piece 3 is provided with second fan 701, the cold end base plate on the other side of refrigeration piece 2 is connected with evaporation piece 3, the cold quantity is transferred away, the second fan 701 rotates to conduct the cold air away to refrigerate.

[0032] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A hermetic semiconductor refrigerator comprising a heat sink (1), a refrigeration plate (2) and an evaporation plate (3), characterized in that: The fin (1) is provided with a sealing groove (101) on the top, a lead-out hole (102) is formed through the back surface on both sides of the sealing groove (101), the refrigeration fin (2) is installed in the sealing groove (101), a heat insulation groove (103) is formed around the sealing groove (101) on the top of the fin (1), the heat insulation groove (103) is provided with heat insulation cotton (4) around the inside, and the evaporation fin (3) is installed on the top of the heat insulation cotton (4) and the refrigeration fin (2).

2. A hermetic semiconductor refrigerator according to claim 1, characterized in that: Threaded grooves (5) are formed around the bottom of the heat insulation groove (103).

3. A hermetic semiconductor refrigerator according to claim 1, wherein: A plurality of through holes (6) are formed around the top of the evaporation fin (3) and the heat insulation cotton (4).

4. A hermetic semiconductor refrigerator according to claim 1, wherein: One side of the bottom of the refrigeration fin (2) is a hot end base plate, and one side of the top is a cold end base plate.

5. A hermetic semiconductor refrigerator according to claim 1, wherein: The refrigeration fin (2) is bonded with the fin (1) and the evaporation fin (3) through heat-conducting silicone grease.

6. A hermetic semiconductor refrigerator according to claim 1, characterized in that: The fin (1) is provided with a first fan (7) on the bottom.

7. A hermetic semiconductor refrigerator according to claim 1, wherein: The evaporation fin (3) is provided with a second fan (701) on the top.

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