Processing apparatus for forming surface acoustic wave resonator device

Abstract

A processing device for forming a surface acoustic wave resonator comprises a dry etching cavity and a loading cavity, the dry etching cavity is used for etching an interdigital material layer to form an interdigital electrode, and the loading cavity is used for loading a material to be subjected to dry etching and unloading the material subjected to dry etching; the cleaning device comprises a cleaning water tank and a glove box arranged on the cleaning water tank, the glove box and the cleaning water tank can be switched between a communication state and an isolation state, the cleaning water tank is used for cleaning the etched interdigital electrode, the glove box is connected with the loading cavity, and the glove box is connected with the loading cavity. The humidity in the glove box is smaller than the humidity of the atmosphere. According to the device, the post-corrosion speed of the interdigital electrode metal is reduced, and the yield is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a kind of processing device for forming acoustic surface wave resonator. BACKGROUND

[0002] In the production process of semiconductor chip, the pattern transfer of metal interconnection line is realized by using etching process or lift-off process.

[0003] The interdigital transducer (IDT) of filter chip is often prepared by using the metal with relatively active properties (including but not limited to Al / AlCu). In the process of etching the metal of interdigital transducer, the by-products generated in the existing etching process are prone to react with the external atmosphere, causing corrosion of the interdigital transducer.

[0004] Therefore, it is urgent to improve the yield problem of interdigital transducer. UTILITY MODEL CONTENT

[0005] The technical problem solved by the utility model is to provide a processing device for forming acoustic surface wave resonator, to improve the yield of interdigital transducer.

[0006] To solve the above technical problem, the utility model embodiment provides a processing device for forming acoustic surface wave resonator, comprising: a dry etching cavity and a loading cavity, the dry etching cavity is used for etching interdigital material layer to form interdigital electrode, and the loading cavity is used for loading material to be dry etched and unloading material after dry etching is completed; a cleaning device, the cleaning device comprises: a cleaning tank and a glove box arranged on the cleaning tank, the glove box and the cleaning tank can be switched between communication state and isolation state, the cleaning tank is used for cleaning etched interdigital electrode, the glove box is connected with the loading cavity, and the humidity in the glove box is less than that of atmosphere.

[0007] Optionally, the oxygen concentration in the glove box is less than that in the atmosphere.

[0008] Optionally, the oxygen concentration in the glove box is less than 10%.

[0009] Optionally, the dew point in the glove box is less than -20 degrees.

[0010] Optionally, the glove box comprises: a box body, the box body comprises opposite front and back surfaces, opposite top and bottom surfaces, and opposite first and second side surfaces; a glove operating hole is arranged on the front surface of the box body, and a glove is sealingly connected with the glove operating hole.

[0011] Optionally, the glove box further comprises a sliding cover arranged on the bottom surface of the box body, the sliding cover being slidable towards the front or the back to realize the connection and isolation between the glove box and the cleaning sink.

[0012] Optionally, the back surface of the glove box is connected with the loading cavity, and the glove box further comprises a transfer cavity door arranged on the back surface of the box body, the transfer cavity door being openable and closable to realize the connection and isolation between the glove box and the loading cavity.

[0013] Optionally, the glove box further comprises a material taking cavity door arranged on the first side surface of the box body, the material taking cavity door being openable and closable, the material taking cavity door being used to take out the material in the glove box when the material taking cavity door is opened, and the material taking cavity door being used to form a closed operation space together with the glove and the box body when the material taking cavity door is closed.

[0014] Optionally, the glove box further comprises an air inlet valve and an air outlet valve arranged on the second side surface of the box body, the air outlet valve being close to the cleaning sink, and the air inlet valve being away from the cleaning sink, the air inlet valve being used to be connected with an external air path to fill the glove box with a filling gas.

[0015] Optionally, the processing device further comprises a vacuum pump connected with the air outlet valve and used to extract the filling gas in the glove box.

[0016] Optionally, the filling gas comprises nitrogen, argon or helium.

[0017] Optionally, the glove box further comprises a dew point analysis interface arranged on the top surface of the box body, the dew point analysis interface being used to be connected with a dew point analyzer to monitor the humidity in the glove box.

[0018] Optionally, the glove box further comprises an oxygen analysis interface arranged on the top surface of the box body, the oxygen analysis interface being used to be connected with an oxygen analyzer to monitor the oxygen concentration in the glove box.

[0019] Optionally, the processing device further comprises a water inlet valve arranged on the side wall of the cleaning sink, the water inlet valve being used to be connected with an external water supply device to inject cleaning liquid into the cleaning sink; and a water outlet valve arranged on the bottom of the cleaning sink, the water outlet valve being used to discharge the cleaning liquid in the cleaning sink to replace the cleaning liquid in the cleaning sink.

[0020] Optionally, the processing device further comprises a transfer cavity, the dry etching cavity and the loading cavity being connected with the transfer cavity respectively, the transfer cavity being used to transfer the material between the dry etching cavity and the loading cavity.

[0021] Compared with the prior art, the technical scheme of the embodiment of the utility model has the following beneficial effects:

[0022] The glove box is connected with the loading cavity, humidity in the glove box is less than that of atmosphere, the speed of post-corrosion of the interdigital electrode metal can be reduced, the time of post-corrosion exceeding the standard can be prolonged, thus the cleaning of the material to be cleaned can be completed within the time range of post-corrosion exceeding the standard, and the yield is improved.

[0023] Further, the oxygen concentration in the glove box is less than that in the atmosphere, the oxygen concentration in the glove box is small, the speed of post-corrosion of the interdigital electrode metal can be further reduced, the time of post-corrosion exceeding the standard can be prolonged, thus the cleaning of the material to be cleaned can be completed within the time range of post-corrosion exceeding the standard, and the yield is improved.

[0024] Further, the dew point in the glove box is less than-20 degrees. After the material is taken out from the etching machine, it is transferred to the cleaning sink through the glove box, and does not contact the external atmospheric environment throughout the process. The dew point in the glove box is low, and the material is transferred in the glove box, which can effectively alleviate the post-corrosion phenomenon of the interdigital electrode metal. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic view of a plurality of processing cavities in the processing device of the utility model embodiment;

[0026] Figures 2 to 7 is a structural schematic view of each perspective view of the cleaning device in the processing device of the utility model embodiment. DETAILED DESCRIPTION

[0027] As described in the background, the yield problem of the interdigital transducer device needs to be improved urgently.

[0028] Specifically, the piezoelectric substrate used by the filter SAW and TC-SAW includes lithium tantalate (LT) or lithium niobate (LN), and a discharge effect occurs when the temperature changes. This effect causes part of the residual dry etching gas chlorine ions to accumulate on the product surface after the dry etching machine etches the material of the interdigital electrode, causing serious post-corrosion of the product in the atmosphere. Therefore, after the product is taken out from the machine, a water washing step is performed to remove the chlorine ions.

[0029] Currently, after the dry etching machine completes the etching of the aluminum interdigital electrode material, a water washing action is performed. Since the entire process of the metal etching machine is under vacuum conditions, the product needs to be inflated to atmospheric pressure before being taken out for water washing. Since the etching of the aluminum interdigital electrode is performed by chlorine ions, the chlorine ions will form an acidic liquid with water vapor and oxygen in the atmosphere after being taken out, which will etch the aluminum interdigital electrode and cause post-corrosion. Therefore, water washing needs to be performed immediately to remove the excess chlorine ions on the surface of the etched product.

[0030] After etching the interdigital electrode material, residual chloride ions on the substrate surface react with water in the air when removed from the vacuum chamber and released into the atmosphere, leading to severe post-corrosion of the aluminum interdigital electrodes. Strictly controlling the operation time (Q-time) can partially reduce post-corrosion, but this does not meet mass production requirements. Operators vary in their techniques, leading to varying efficiency. Relying solely on individual operator control makes post-corrosion difficult to manage.

[0031] In order to solve the above problems, the utility model provides a processing device for forming a surface acoustic wave resonator device. The glove box is connected to the loading chamber. The humidity in the glove box is lower than the humidity of the atmosphere, which can reduce the post-corrosion rate of the interdigital electrode metal and extend the time when the post-corrosion exceeds the standard. Therefore, the cleaning of the material to be cleaned can be completed within the time range of the post-corrosion exceeding the standard, thereby improving the yield.

[0032] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0033] Figure 1 It is a schematic structural diagram of multiple processing chambers in a processing device according to an embodiment of the present utility model; Figures 2 to 7 It is a structural schematic diagram of various perspectives of the cleaning device in the processing device of an embodiment of the utility model.

[0034] Please refer to Figures 1 to 7 , a processing device for forming a surface acoustic wave resonator device, comprising:

[0035] Multiple processing chambers and loading chambers 102, the processing chambers including: a dry etching chamber 101, the dry etching chamber 101 is used to etch the interdigitated material layer to form interdigitated electrodes; the loading chamber 102 is used to load the material to be dry-etched and unload the material after the dry etching is completed;

[0036] A cleaning device includes: a cleaning water tank 130 and a glove box 120 arranged on the cleaning water tank 130. The glove box 120 and the cleaning water tank 130 can be switched between a connected state and an isolated state. The cleaning water tank 130 is used to clean the interdigital electrodes after etching. The glove box 120 is connected to the loading chamber 102. The humidity in the glove box 120 is lower than the humidity of the atmosphere.

[0037] The processing device, the glove box 120 is connected to the loading chamber 102, and the humidity in the glove box 120 is lower than the humidity of the atmosphere, which can reduce the post-corrosion rate of the interdigital electrode metal and extend the time when the post-corrosion exceeds the standard. Therefore, the cleaning of the material to be cleaned can be completed within the time range of the post-corrosion exceeding the standard, thereby improving the yield.

[0038] Please continue to refer to Figures 2 to 7 , Figure 2 is a side view of a first side of the cleaning device, Figure 3 is a side view of a second side of the cleaning device, Figure 4 is a top view of the cleaning device, Figure 5 is a bottom view of the cleaning device, Figure 6 is a front view of the cleaning device, Figure 7 is a back view of the cleaning device.

[0039] In the embodiment, the glove box 120 comprises a box body comprising opposite front and back faces, opposite top and bottom faces, and opposite first and second side faces.

[0040] In the embodiment, the glove box 120 comprises a glove operating hole 121 arranged on the front face of the box body and a glove 122 sealingly connected with the glove operating hole 121, the glove 122 extending into the box body, and the glove 122 and the box body forming a sealed operating space.

[0041] The glove 122 is made of rubber. The glove 122 is sealingly connected with the glove operating hole 121 and extends into the box body. An operator can put his hand into the glove 122 from the glove operating hole 121 and operate in the glove box 120 while wearing the glove 122.

[0042] In the embodiment, the glove box 120 further comprises a sliding cover 123 arranged on the bottom face S4 of the box body, the sliding cover 123 being slidable towards the front face or the back face to realize communication and isolation between the glove box 120 and the cleaning tank 130.

[0043] The sliding cover 123 can also be used to place materials to be cleaned and cleaned materials.

[0044] The operations that an operator can perform while putting his hand into the glove box 120 from the glove operating hole 121 and wearing the glove 122 include: the operator slides the sliding cover 123 to realize communication between the glove box 120 and the cleaning tank 130, the operator can place materials to be cleaned in the cleaning tank 130 for cleaning, or the operator can take cleaned materials out of the cleaning tank 130 and place them on the sliding cover 123; or the operator slides the sliding cover 123 to realize isolation between the glove box 120 and the cleaning tank 130, so as to transfer materials to be cleaned from the loading cavity 102 to the glove box 120.

[0045] In the embodiment, the back face of the glove box 120 is connected with the loading cavity 102.

[0046] In the embodiment, the glove box 120 further comprises a transfer cavity door 124 arranged on the back of the box body, the transfer cavity door 124 is openable and closable to realize the communication and isolation between the glove box 120 and the loading cavity 102.

[0047] Specifically, the transfer cavity door 124 is used to transfer the material to be cleaned from the loading cavity 102 to the glove box 120 when the transfer cavity door 124 is opened, and the transfer cavity door 124 is used to form a closed operation space with the glove 122 and the box body when the transfer cavity door 124 is closed.

[0048] In the embodiment, the glove box 120 further comprises a material taking cavity door 125 arranged on the first side S1 of the box body, the material taking cavity door 125 is openable and closable, the material taking cavity door 125 is used to take out the material in the glove box 120 when the material taking cavity door 125 is opened, and the material taking cavity door 125 is used to form a closed operation space with the glove 122 and the box body when the material taking cavity door 125 is closed.

[0049] The material taking cavity door 125 is used to take out the material in the glove box 120 when the material taking cavity door 125 is opened, and the material can be the material to be cleaned and the cleaned material.

[0050] In the embodiment, the glove box 120 further comprises an air inlet valve 126 and an air outlet valve 127 arranged on the second side S2 of the box body, the air outlet valve 127 is close to the cleaning water tank 130, the air inlet valve 126 is away from the cleaning water tank 130, and the air inlet valve 126 is used to connect with the external air path to fill the filling gas into the glove box 120.

[0051] The filling gas is filled into the glove box 120 to control the humidity and oxygen content in the glove box 120.

[0052] In the embodiment, the filling gas comprises nitrogen. Nitrogen is the most abundant gas in the atmosphere, and filling nitrogen into the glove box 120 facilitates the comparison of the humidity and oxygen content in the glove box 120 and outside the glove box 120.

[0053] In other embodiments, the filling gas comprises argon, helium, etc.

[0054] In the embodiment, the processing device further comprises a vacuum pump 140 connected with the air outlet valve 127, which is used to extract the filling gas in the glove box 120 to control the humidity and oxygen content in the glove box 120.

[0055] In the embodiment, the glove box 120 further comprises a dew point analysis interface 128 arranged on the top surface top of the box body, the dew point analysis interface 128 is used to connect with a dew point analyzer to monitor the humidity in the glove box 120.

[0056] The dew point analyzer monitors the humidity in the glove box 120 to ensure that the humidity in the glove box 120 is kept within a constant range, and that the humidity in the glove box 120 is less than the humidity in the atmosphere.

[0057] In this embodiment, the dew point in the glove box 120 is less than -20 degrees.

[0058] In this embodiment, the glove box 120 further comprises an oxygen analysis interface 129 disposed on the top surface top of the box, which is used to connect with an oxygen analyzer to monitor the oxygen concentration in the glove box 120.

[0059] In this embodiment, the oxygen concentration in the glove box 120 is less than the oxygen concentration in the atmosphere.

[0060] The oxygen analyzer monitors the oxygen concentration in the glove box 120 to compare with the oxygen concentration in the atmosphere, to ensure that the oxygen concentration in the glove box 120 is less than the oxygen concentration in the atmosphere.

[0061] In this embodiment, the oxygen concentration in the glove box 120 is less than 10%.

[0062] The oxygen concentration in the glove box 120 is less than the oxygen concentration in the atmosphere, and the lower oxygen concentration in the glove box 120 can further reduce the post-corrosion rate of the interdigital electrode metal and extend the time of post-corrosion exceeding the standard, so that the cleaning of the to-be-cleaned material can be completed within the time range of post-corrosion exceeding the standard, thereby improving the yield.

[0063] Specifically, after the glove box is filled with high-purity single filling gas, the originally atmospheric gas (mainly to reduce the oxygen concentration) is occupied, and the proportion of the remaining gas is automatically reduced, so that the oxygen concentration in the glove box can be controlled by filling and extracting the filling gas.

[0064] In other embodiments, only one of the oxygen analysis interface and the dew point analysis interface can be provided.

[0065] In this embodiment, the processing device further comprises a water inlet valve 131 disposed on the side wall of the cleaning sink 130, which is used to connect with an external water supply device to inject cleaning liquid into the cleaning sink 130; and a water outlet valve 132 disposed on the bottom of the cleaning sink 130, which is used to discharge the cleaning liquid in the cleaning sink 130 to replace the cleaning liquid in the cleaning sink 130.

[0066] Please continue to refer to Figure 1In the embodiment, the processing device further comprises a transfer cavity 110, the plurality of processing cavities and the loading cavity 102 are connected to the transfer cavity 110, and the transfer cavity 110 is used for transferring materials between the processing cavities and the loading cavity 102.

[0067] The transfer cavity 110 is a vacuum cavity; the dry etching cavity 101 is a vacuum cavity; and the loading cavity 102 is a vacuum cavity.

[0068] The dry etching cavity 101 is used for performing a dry etching process. In the embodiment, the etching gas of the dry etching process comprises chlorine.

[0069] After the dry etching cavity 101 forms the interdigital electrode by etching the interdigital material layer, the material is transferred to the transfer cavity 110, then transferred to the loading cavity 102 through the transfer cavity 110, and then transferred to the glove box 120 through the loading cavity 102, and finally transferred to the cleaning sink 130. The dew point in the glove box 120 is less than -20 degrees. After the material is etched, it is transferred to the glove box 120, and then transferred and washed in the glove box 120. The material is not exposed to the external atmosphere from the etching machine to the cleaning sink 130, which can effectively alleviate the post-corrosion of the interdigital electrode metal.

[0070] In addition, the oxygen concentration in the glove box 120 is less than that in the atmosphere, and the humidity in the glove box 120 is less than that in the atmosphere. The humidity and oxygen concentration in the glove box 120 are low, which can reduce the reaction degree of the residual ions on the surface of the material after etching and water in the air. Therefore, the material can be transferred to the cleaning sink 130 through the non-vacuum glove box 120, which can greatly reduce the post-corrosion rate of the interdigital electrode metal, prolong the time of exceeding the post-corrosion standard, and thus the cleaning of the material to be cleaned can be completed within the time range of exceeding the post-corrosion standard, thereby improving the yield.

[0071] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be limited to the range defined by the claims.

Claims

1. A processing apparatus for forming a surface acoustic wave resonator device, characterized by, The application relates to a processing device for processing a material layer, and relates to a processing device for processing a material layer. The processing device comprises a dry etching cavity and a loading cavity, the dry etching cavity is used for etching a material layer to form a finger electrode, and the loading cavity is used for loading a material to be dry etched and unloading the material after dry etching. The processing device further comprises a cleaning device, the cleaning device comprises a cleaning tank and a glove box arranged on the cleaning tank, the glove box and the cleaning tank can be switched between a communication state and an isolation state, the cleaning tank is used for cleaning the finger electrode after etching, the glove box is connected with the loading cavity, and the humidity in the glove box is lower than that in the atmosphere.

2. The processing device of claim 1, wherein, The oxygen concentration in the glove box is lower than that in the atmosphere.

3. The processing device of claim 2, wherein, The oxygen concentration in the glove box is less than 10%.

4. The processing device of claim 1, wherein, The dew point in the glove box is less than -20 degrees.

5. The processing device of claim 1, wherein, The glove box comprises a box body, the box body comprises opposite front and back surfaces, opposite top and bottom surfaces and opposite first and second side surfaces, a glove operation hole is arranged on the front surface of the box body, and a glove is sealingly connected with the glove operation hole.

6. The processing device of claim 5, wherein, The glove box further comprises a sliding cover arranged on the bottom surface of the box body, the sliding cover can slide towards the front surface or the back surface to realize communication and isolation between the glove box and the cleaning tank.

7. The processing device of claim 5, wherein, The back surface of the glove box is connected with the loading cavity, the glove box further comprises a transmission cavity door arranged on the back surface of the box body, the transmission cavity door can be opened and closed to realize communication and isolation between the glove box and the loading cavity.

8. The processing device of claim 5, wherein, The glove box further comprises a material taking door arranged on the first side surface of the box body, the material taking door can be opened and closed, the material taking door can be used to take out the material in the glove box when the material taking door is opened, and the material taking door, the glove and the box body can form a closed operation space when the material taking door is closed.

9. The processing device of claim 5, wherein, The glove box further comprises an air inlet valve and an air outlet valve arranged on the second side surface of the box body, the air outlet valve is close to the cleaning tank, the air inlet valve is away from the cleaning tank, and the air inlet valve is used to be connected with an external air path to fill a filling gas into the glove box.

10. The processing device of claim 9, wherein, The processing device further comprises a vacuum pump connected with the air outlet valve and used to extract the filling gas in the glove box.

11. The processing device of claim 9, wherein, The filling gas comprises nitrogen, argon or helium.

12. The processing device of claim 5, wherein, The glove box further comprises a dew point analysis interface arranged on the top surface of the box body, the dew point analysis interface is used to be connected with a dew point analyzer to monitor the humidity in the glove box.

13. The processing device of claim 5, wherein, The glove box further comprises an oxygen analysis interface arranged on the top surface of the box body, the oxygen analysis interface is used to be connected with an oxygen analyzer to monitor the oxygen concentration in the glove box.

14. The processing device of claim 1, wherein, The processing device further comprises a water inlet valve arranged on the side wall of the cleaning tank, the water inlet valve is used to be connected with an external water supply device to inject a cleaning liquid into the cleaning tank, and the processing device further comprises a water outlet valve arranged on the bottom of the cleaning tank, the water outlet valve is used to discharge the cleaning liquid in the cleaning tank to replace the cleaning liquid in the cleaning tank.

15. The processing device of claim 1, wherein, The processing device further comprises a transmission cavity, the dry etching cavity and the loading cavity are connected with the transmission cavity, and the transmission cavity is used to transfer the material between the dry etching cavity and the loading cavity.

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