Ultrathin camera module

Abstract

The utility model discloses an ultrathin camera module, which comprises a PCB (printed circuit board), and a hollow layer is arranged in the PCB. The sensing chip is arranged in the hollow layer, and the bottom of the sensing chip is flush with the lower surface of the PCB; the shielding covers are installed on the two sides of the PCB. The lens is installed on the upper surface of the PCB, and the two sides of the lens are connected with the two shielding covers respectively. The two reinforcing supports are distributed along the two side faces of the PCB respectively, the face, opposite to the PCB, of each reinforcing support is provided with gum, and the reinforcing supports extend upwards and then are connected with the lens and the PCB through the gum so that the PCB and the lens can be integrally fixed. According to the utility model, the chip is additionally arranged in the hollow layer of the PCB, the overall thickness of the product is small, and the mounting brackets which combine the PCB and the lens into a whole are additionally arranged on the two sides of the PCB, so that the overall strength of the product is high, the possibility that the sensing chip in the module is damaged and the sensing chip is broken can be effectively prevented, and the reliability of the product is improved. Therefore, mass production can be achieved, the reliability and reliability of products are overcome, the yield is improved, and actual requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of camera technology, in particular to an ultra-thin camera module. Background Art

[0002] With the continuous advancement of technology, the trend toward thinner and lighter laptops is becoming increasingly evident. As a key component, laptop cameras often face challenges with traditional camera PCB designs due to their thickness, making them difficult to fully adapt to evolving needs. In this context, innovative ultra-thin camera PCB designs can effectively reduce the Z-axis height, perfectly aligning with the overall ultra-thin design of the laptop and enhancing product competitiveness, moving towards a thinner and lighter design.

[0003] like Figure 1 As shown, the prior art adopts a groove design for PCB1, bonds the sensing chip 2 in the groove of PCB1, and then performs the wire bonding operation of gold wire 3 and assembles the lens 1. The total height of the assembled module is the height from the bottom of PCB1 to the surface of lens 1. The total height determines the thickness of the sensing chip, the thickness of the PCB, and the height from the surface of the lens to the surface of the sensing chip.

[0004] However, in actual applications, it was found that although such a structure can reduce the overall height of the camera module, due to the hollowing out of PCB1, the overall strength of the camera module is low, the product is easy to break, and the sensing chip is easily damaged, resulting in a low yield rate and unable to meet actual needs. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art and to provide an ultra-thin camera module with a thin overall structure, high product strength and high yield.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an ultra-thin camera module, comprising:

[0007] A PCB having a hollow layer therein;

[0008] A sensing chip is disposed in the hollow layer, and a bottom of the sensing chip is flush with the lower surface of the PCB;

[0009] Shielding covers are installed on both sides of the PCB to shield electronic components on the PCB;

[0010] A lens is mounted on the upper surface of the PCB, and two sides of the lens are respectively connected to the two shielding covers;

[0011] The two reinforcing supports are respectively distributed along two side surfaces of the PCB, and one surface of the reinforcing support relative to the PCB is provided with a back adhesive, and the reinforcing support is connected with the lens and the PCB through the back adhesive after extending upward, so as to integrally fix the PCB and the lens.

[0012] Further, the material of the reinforcing support is steel.

[0013] Further, the lower surface of the lens is installed on the upper surface of the PCB through AA fixing glue.

[0014] Further, the sensing chip is fixed in four directions in the hollow layer of the PCB through two X-direction glues and two Y-direction glues.

[0015] Further, the two ends of the lens are respectively fixedly connected with the two shielding covers through bonding glue.

[0016] Further, the reinforcing support is connected with the PCB, the AA fixing glue and the lens.

[0017] Due to the use of the above technical scheme, the present application has the following advantages compared with the prior art:

[0018] The ultrathin camera module of the present application adds a chip in the hollow layer of the PCB, the overall thickness of the product is thin, and the mounting support that combines the PCB and the lens into one body is additionally arranged on both sides of the PCB, so that the overall strength of the product is high, the possibility of damage and cracking of the sensing chip in the module can be effectively prevented, and the problems of product reliability, reliability, yield improvement and the like can be overcome, so that the actual production requirements are better met. BRIEF DESCRIPTION OF DRAWINGS

[0019] The technical scheme of the present application will be further described below with reference to the drawings:

[0020] Figure 1 It is a structural schematic view of the covering film structure in the prior art;

[0021] Figure 2 It is a structural schematic view of one embodiment of the present application;

[0022] Figure 3 It is a structural schematic view of one embodiment of the present application; Figure 2 It is a sectional view of A-A;

[0023] Figure 4 It is a sectional view of B-B; Figure 2 It is a sectional view of B-B;

[0024] Wherein: 1, PCB; 2, sensing chip; 3, gold wire; 4, lens; 5, shield cover; 6, AA fixing glue; 7, X direction glue; 8, Y direction glue; 9, glass; 10, reinforcing bracket; 11, adhesive. DETAILED DESCRIPTION

[0025] In order to make the person skilled in the art better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.

[0026] The utility model provides a kind of ultra-thin camera module to solve the problem of low yield rate of product caused by the structure of hollow PCB after sensing chip is placed by using hollow PCB in prior art.

[0027] For the convenience of understanding, the specific process in the embodiments of the present application will be described below, please refer to Figures 2 to 4 The utility model discloses a kind of ultra-thin camera module, including PCB1, sensing chip 2, shield cover 5, lens 4 and reinforcing bracket 5;The PCB1 has hollow layer inside;The sensing chip 2 is installed in the hollow layer, and the bottom of the sensing chip 2 is flush with the lower surface of the PCB1;The shield cover 5 is installed in the two sides of the PCB1, to shield electronic components on PCB1;The lens 4 is installed on the upper surface of the PCB1, and the two sides of the lens 4 are connected with two shield covers 5 respectively;Two reinforcing brackets 5 are distributed along the two side surfaces of the PCB1 respectively, and one side of the reinforcing bracket 5 relative to PCB1 has back glue, the reinforcing bracket 5 is connected with the lens 4 and PCB1 by back glue after extending upwards, to fix the PCB1 and lens 4 integrally.

[0028] Further, in the embodiment, the material of the reinforcing bracket 5 is steel, of course, other materials can also be used, as long as the overall strength of the product can be improved.

[0029] Further, the lower surface of the lens 4 is installed on the upper surface of the PCB by AA fixing glue 6, so that the lens 4 and the PCB1 are stably connected.

[0030] Further, the sensing chip 2 is fixed by two X-direction glues 7 and two Y-direction glues 8 in the hollowed layer of the PCB, so that the sensing chip 2 is stably arranged in the hollowed layer of the PCB 1, and meanwhile, the lower surface of the sensing chip 2 is ensured to be flush with the lower surface of the PCB 1, so that the flatness of the chip 2 is ensured.

[0031] Further, the two ends of the lens 4 are fixedly connected with the two shielding covers 5 through the bonding glue 11, since the shielding cover 5 is arranged on the PCB, after the lens 4 is connected with the shielding cover 5, the lens 4 is also connected with the PCB 1, so that the bending resistance of the camera module is further increased, and the strength is high.

[0032] Based on Figure 4 As shown in the embodiment, the reinforcing support 5 is in a strip shape, is arranged on the two sides of the PCB 1, and the reinforcing support 10 is connected with the PCB 1, the AA fixing glue 6 and the lens 4 through the back glue, so that the PCB and the lens 4 are firmly connected, and the overall strength and the bending resistance of the product are increased through the reinforcing support 5.

[0033] In the specific installation, firstly, the PCB 1 is combined with the bottom film of the carrier plate to ensure the flatness; then the glue is drawn on the two short sides of the PCB 1 in the Y direction and close to the inner frame of the PCB 1, then the sensing chip 2 is suspended in the hollow center of the PCB, and the Y-direction glue 8 is adhered to the two side walls of the sensing chip 2. Then the WB wire drawing process is carried out, then the glue is drawn on the long side of the sensing chip 2 in the X direction, so that the X-direction glue 7 is combined with the sensing chip 5 and is fixedly sealed, so that the chip 2 is fixed in the hollow layer of the PCB 1. Then the bonding glue 11 is drawn on the surface of the PCB, so that the two sides of the lens 4 are connected with the shielding layer.

[0034] Then the camera module is fixed on the corresponding position of the jig placed stably, the mounting support 5 is sucked by the vacuum, and is gently attached to the side of the PCB. After being placed, the mounting support 5 is slightly pressed, so that the lens, the PCB and the mounting support 5 are combined into an integral whole, so that the strength and the bending resistance of the overall camera module are increased.

[0035] In conclusion, the ultrathin camera module has the mounting support arranged on the two sides of the PCB, so that the PCB and the lens are combined into an integral whole, the overall strength of the product is high, the possibility that the sensing chip in the camera module is damaged and the sensing chip is broken is effectively prevented, the problems of the product reliability, the dependability and the yield are overcome, and the actual needs of production are better met.

[0036] The above-described embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An ultra-thin camera module, characterized in that, The application relates to a PCB (1) with a hollow layer, a sensing chip (2) arranged in the hollow layer and a bottom of the sensing chip (2) flush with a lower surface of the PCB (1), shielding covers (5) mounted on both sides of the PCB (1) to shield electronic components on the PCB (1), a lens (4) mounted on an upper surface of the PCB (1) and connected with two shielding covers (5) respectively, and reinforcing supports (10) distributed along two side surfaces of the PCB (1) and connected with the lens (4) and the PCB (1) through back adhesive after extending upwards to integrally fix the PCB (1) and the lens (4). The reinforcing supports (10) are made of steel. The lower surface of the lens (4) is mounted on the upper surface of the PCB (1) through AA fixing adhesive (6). The sensing chip (2) is fixed around in the hollow layer of the PCB (1) through two X-direction adhesives (7) and two Y-direction adhesives (8). The two ends of the lens (4) are fixedly connected with the two shielding covers (5) through bonding adhesive (11) respectively. The reinforcing supports (10) are connected with the PCB (1), the AA fixing adhesive (6) and the lens (4). 2.The ultra-thin camera module of claim 1, wherein: ​ 3.The ultra-thin camera module of claim 1, wherein: ​ 4.The ultra-thin camera module of claim 1, wherein: ​ 5.The ultra-thin camera module of claim 1, wherein: ​ 6.The ultra-thin camera module of claim 3, wherein: ​

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