Bone conduction earphone loudspeaker structure

Abstract

The utility model discloses a bone conduction earphone loudspeaker structure, which comprises a conduction surface cover, a support, a vibrating reed, a voice coil, a PCB (printed circuit board), U iron, a washer and a magnet, the support is arranged at one end of the conduction surface cover, the support is provided with a cavity, the PCB, the voice coil, the washer, the magnet and the U iron are sequentially arranged on the cavity, the vibrating reed is a titanium vibrating reed, the vibrating reed is arranged between the conduction surface cover and the support, and the vibrating reed and the U iron are in contact positioning; thus, through the design that the vibrating reed is made of a metal material, and the vibrating reed is arranged between the bracket and the conduction surface cover, the structural firmness and the anti-falling effect of the bone conduction loudspeaker on the earphone are improved, and the stability when the bone conduction loudspeaker drives the earphone shell to vibrate so as to conduct sound waves to the inner ear is ensured; the sound conduction of the bone conduction earphone is clearer, so that the use experience of a user is improved, the usability is good, and the application range is wide.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field technology of bone conduction loudspeaker, especially a bone conduction earphone loudspeaker structure. BACKGROUND

[0002] At present, bone conduction is a sound conduction mode, that is, converting sound into mechanical vibration of different frequencies, transmitting sound waves through the human skull, bone labyrinth, inner ear lymph, cochlea and auditory center; compared with the classic sound conduction mode of producing sound waves through the diaphragm, bone conduction saves many steps of sound wave transmission, can realize clear sound restoration in noisy environment and sound waves will not affect others because of diffusion in air.

[0003] Generally, the bone conduction earphone generally includes an earphone shell, a bone conduction loudspeaker and an audio output circuit arranged in the earphone shell, the audio output circuit outputs an electric signal to the bone conduction loudspeaker, so that the bone conduction loudspeaker vibrates adaptively according to the received electric signal and drives the earphone shell to vibrate; since the earphone shell directly contacts the ear canal, the earphone shell can drive the bone to vibrate and transmit sound waves to the inner ear through the vibration of the bone; however, the structural firmness and drop resistance of the existing bone conduction loudspeaker are poor, which causes unstable problems when the bone conduction loudspeaker drives the earphone shell to vibrate to transmit sound waves to the inner ear, resulting in unclear sound conduction and reducing the user experience effect, and the application range is small.

[0004] Therefore, it is necessary to study a new technical scheme to solve the above problems. UTILITY MODEL CONTENT

[0005] Therefore, the utility model mainly aims at the defects of the prior art, and provides a bone conduction earphone loudspeaker structure, which adopts a metal material for the design of the vibration piece, and the vibration piece is arranged between the bracket and the conductive surface cover, which is conducive to improving the structural firmness and drop resistance of the bone conduction loudspeaker on the earphone, ensuring the stability of the bone conduction loudspeaker when driving the earphone shell to vibrate to transmit sound waves to the inner ear, facilitating clearer sound conduction of the bone conduction earphone, improving the user experience, having good usability, and having a wide application range.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A bone conduction earphone loudspeaker structure includes a conductive surface cover, a bracket, a vibration piece, a voice coil, a PCB board, a U iron, a Hua Si and a magnet; wherein: the bracket is arranged at one end of the conductive surface cover, the bracket has a cavity, the PCB board, the voice coil, the Hua Si, the magnet and the U iron are arranged on the cavity in sequence, the vibration piece is a metal vibration piece, the vibration piece is arranged between the conductive surface cover and the bracket, and the vibration piece is in contact with the U iron.

[0008] As a preferred solution, the conductive surface cover has a first protrusion extending towards the bracket, and the vibrating plate is arranged between the first protrusion and the bracket.

[0009] As a preferred solution, the first protrusion is provided with a first mounting step, the lower end edge of the vibrating plate is arranged on the first mounting step, the lower end of the bracket is provided with a second protrusion arranged towards the first mounting step, the lower end of the second protrusion is arranged on the upper end edge of the vibrating plate, and the lower end of the bracket is matched with the upper end of the first protrusion.

[0010] As a preferred solution, the U-shaped iron has a concave cavity with an open upper end, the Hu Si and the magnet are arranged in the concave cavity, the lower end of the U-shaped iron is provided with a third protrusion for connecting with the vibrating plate, the lower end of the concave cavity is communicated with the third protrusion, and the lower end of the third protrusion is arranged on the upper end of the vibrating plate.

[0011] As a preferred solution, the upper end of the bracket is provided with a second mounting step, and the lower end edge of the PCB board is limited on the second mounting step.

[0012] As a preferred solution, the lower end of the PCB board is provided with a protrusion extending downwards, and the inner annular surface of the upper end of the voice coil is limited on the outer annular surface of the protrusion.

[0013] As a preferred solution, the vibrating plate is arranged on the conductive surface cover by gluing.

[0014] As a preferred solution, the vibrating plate is a titanium metal vibrating plate, or the vibrating plate is a stainless steel vibrating plate.

[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects, specifically speaking, from the above technical scheme, it mainly adopts the design of metal material vibrating plate, and the vibrating plate is arranged between the bracket and the conductive surface cover, which is beneficial to improve the structural firmness and anti-falling effect of the bone conduction speaker on the earphone, ensures the stability when the bone conduction speaker drives the earphone shell to vibrate to conduct sound waves to the inner ear, is beneficial to clearer sound conduction of the bone conduction earphone, thereby improves the use experience of users, has good usability, and has wide application range.

[0016] In addition, the first mounting step is arranged to facilitate the mounting and positioning of the vibrating plate on the conductive surface cover, and the second protrusion is arranged to facilitate the assembly and positioning between the bracket and the conductive surface cover, which is simple to operate and convenient to assemble, and the protrusion is arranged to facilitate the positioning and connection of the voice coil on the PCB board.

[0017] In order to more clearly illustrate the structural features and effects of the utility model, the utility model will be described in detail below in combination with the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a sectional view of the embodiment of the present application.

[0019] BRIEF DESCRIPTION OF DRAWINGS:

[0020] 11, conduction surface cover 111, first protrusion

[0021] 112, first mounting step 113, second mounting step

[0022] 12, support 121, chamber

[0023] 122, second protrusion 13, vibrating plate

[0024] 14, voice coil 15, PCB board

[0025] 151, protrusion 16, U iron

[0026] 161, concave cavity 162, third protrusion

[0027] 17, magnet 18, magnet. DETAILED DESCRIPTION

[0028] Please refer to Figure 1 , which shows the specific structure of the embodiment of the present application.

[0029] A bone conduction earphone speaker structure, comprising a conduction surface cover 11, a support 12, a vibrating plate 13, a voice coil 14, a PCB board 15, a U iron 16, a magnet 17 and a magnet 18, wherein:

[0030] The support 12 is arranged at one end of the conduction surface cover 11, the support 12 has a chamber 121, the PCB board 15, the voice coil 14, the magnet 17, the magnet 18 and the U iron 16 are arranged on the chamber 121 in turn, the vibrating plate 13 is a metal vibrating plate, the vibrating plate 13 is arranged between the conduction surface cover 11 and the support 12, the vibrating plate 13 is in contact with the U iron 16; preferably, the vibrating plate is a titanium metal vibrating plate, or the vibrating plate is a stainless steel vibrating plate, in this way, by using metal material for the vibrating plate, the vibrating plate is arranged between the support and the conduction surface cover, which is conducive to improving the structural firmness and drop resistance of the bone conduction speaker on the earphone, ensuring the stability of the bone conduction speaker driving the earphone shell to vibrate to conduct sound waves to the inner ear, which is conducive to clearer sound conduction of the bone conduction earphone, at the same time, the vibrating plate is made of titanium metal or stainless steel, which has better structural strength and anti-deformation effect, further improving the structural firmness and drop resistance of the bone conduction speaker on the earphone, ensuring the use stability of the product, thereby improving the user's use experience, good usability and wide application range.

[0031] Specifically, the conducting surface cover 11 has a first protruding part 111 extending towards the support, the vibrating plate 13 is arranged between the first protruding part 111 and the support 12, the first protruding part 111 is provided with a first mounting step 112, the lower end edge of the vibrating plate 13 is arranged on the first mounting step 112, the lower end of the support 12 has a second protruding part 121 arranged towards the first mounting step, the lower end of the second protruding part 121 is arranged on the upper end edge of the vibrating plate 13, and the lower end of the support 12 is positioned with the upper end of the first protruding part 111; preferably, the vibrating plate 13 is arranged on the conducting surface cover 11 by gluing;

[0032] In addition, the U-shaped iron 16 has a concave cavity 161 with an open upper end, the Halsinger 17 and the magnet 18 are arranged in the concave cavity 161, the lower end of the U-shaped iron 16 is provided with a third protruding part 162 for connecting with the vibrating plate, the lower end of the concave cavity 161 is communicated with the third protruding part 162, and the lower end of the third protruding part 162 is arranged on the upper end of the vibrating plate 13; in this way, the first mounting step is arranged to facilitate the mounting and positioning of the vibrating plate on the conducting surface cover, and the second protruding part is arranged to facilitate the assembly and positioning between the support and the conducting surface cover, which is simple to operate and convenient to assemble.

[0033] In addition, the upper end of the support 12 is provided with a second mounting step 122, the lower end edge of the PCB 15 is limited on the second mounting step 122, and meanwhile, the lower end of the PCB 15 is provided with a protrusion 151 extending downwards, and the inner annular surface of the upper end of the voice coil 14 is limited on the outer annular surface of the protrusion 151; in this way, the second mounting step is arranged to facilitate the assembly and positioning of the PCB on the support, and meanwhile, the protrusion is arranged to facilitate the positioning and connection of the voice coil on the PCB.

[0034] The design focus of the utility model lies in that mainly through the design that the vibrating plate is made of metal material, the vibrating plate is arranged between the support and the conducting surface cover, which is favorable for improving the structural firmness and anti-falling effect of the bone conduction speaker on the earphone, ensuring the stability when the bone conduction speaker drives the earphone shell to vibrate to conduct sound waves to the inner ear, being favorable for clearer sound conduction of the bone conduction earphone, thereby improving the use experience of users, being good in usability, and being wide in application range;

[0035] In addition, the first mounting step is arranged to facilitate the mounting and positioning of the vibrating plate on the conducting surface cover, the second protruding part is arranged to facilitate the assembly and positioning between the support and the conducting surface cover, which is simple to operate and convenient to assemble, and meanwhile, the protrusion is arranged to facilitate the positioning and connection of the voice coil on the PCB.

[0036] The above merely describes the preferred embodiment of the present application, and is not intended to limit the technical scope of the present application in any way. Any slight modification, equivalent change, and modification made according to the technical essence of the present application shall still fall within the scope of the technical scheme of the present application.

Claims

1. A bone conduction earphone speaker structure, characterized in that: The application relates to a loudspeaker, which comprises a conducting surface cover, a support, a vibrating plate, a voice coil, a PCB board, a U-shaped iron, a magnet and a Hua Si; wherein the support is arranged at one end of the conducting surface cover, the support has a cavity, the PCB board, the voice coil, the Hua Si, the magnet and the U-shaped iron are sequentially arranged on the cavity, the vibrating plate is a metal vibrating plate, the vibrating plate is arranged between the conducting surface cover and the support, and the vibrating plate is in contact with the U-shaped iron.

2. A bone conduction earphone speaker structure according to claim 1, characterized in that: The conducting surface cover has a first protruding part which extends towards the support, and the vibrating plate is arranged between the first protruding part and the support.

3. A bone conduction earphone speaker structure according to claim 2, characterized in that: A first mounting step is arranged on the first protruding part, the lower end edge of the vibrating plate is arranged on the first mounting step, the lower end of the support has a second protruding part which is arranged towards the first mounting step, the lower end of the second protruding part is arranged on the upper end edge of the vibrating plate, and the lower end of the support is matched with the upper end of the first protruding part.

4. The bone conduction earphone speaker structure according to claim 1, characterized in that: The U-shaped iron has a concave cavity with an open upper end, the Hua Si and the magnet are arranged in the concave cavity, the lower end of the U-shaped iron is provided with a third protruding part which is used for connecting with the vibrating plate, the lower end of the concave cavity is communicated with the third protruding part, and the lower end of the third protruding part is arranged on the upper end of the vibrating plate.

5. The bone conduction earphone loudspeaker structure according to claim 1, characterized in that: The upper end of the support is provided with a second mounting step, and the lower end edge of the PCB board is limited on the second mounting step.

6. The bone conduction earphone loudspeaker structure according to claim 1, characterized in that: The lower end of the PCB board is provided with a protrusion which extends downwards, and the inner ring surface of the upper end of the voice coil is limited on the outer ring surface of the protrusion.

7. The bone conduction earphone loudspeaker structure according to claim 1, characterized in that: The vibrating plate is arranged on the conducting surface cover by means of gluing.

8. The bone conduction earphone speaker structure according to claim 1, characterized in that: The vibrating plate is a titanium metal vibrating plate, or the vibrating plate is a stainless steel vibrating plate.

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