Wafer fixing device for tackifying cavity of gluing machine

Abstract

The utility model discloses a gluing machine tackifying cavity wafer fixing device which comprises a cavity, clamp assemblies, a lifting assembly and a pipeline assembly, a containing cavity is arranged in the cavity, the clamp assemblies are arranged on the two side edges of the cavity, each clamp assembly comprises a support, a first air cylinder, a connecting plate and a clamping plate, the two supports are arranged on the opposite side edges of the cavity, and the lifting assembly is arranged on the clamping plate. The first air cylinder is arranged on the support and movably connected with the connecting plate, the connecting plate is connected with the clamping plate, one end of the clamping plate penetrates through the cavity and extends into the containing cavity, the lifting assembly is arranged on one side of the cavity, the pipeline assembly is arranged on the cavity and communicated with the containing cavity, and a wafer is arranged in the containing cavity and fixed through the clamping plate. When nitrogen is injected into the vacuum environment in the containing cavity for vacuum breaking, the wafer is affected by airflow, the position deviation situation does not occur any more, a robot can normally take and place the wafer, and normal operation of a machine table is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wafer auxiliary production technology, and in particular to a wafer fixing device for an adhesive coating machine's adhesion enhancement cavity. Background Art

[0002] In the semiconductor LED industry, the chip yellow light area coating machine uses an adhesion-enhancing cavity (to increase the adhesion of photoresist to the wafer surface). In the vacuum environment of the adhesion-enhancing cavity, HMDS (adhesive) is introduced to adhere to the wafer surface, forming a uniform thin film. After the operation is completed, nitrogen gas is introduced to break the vacuum, and then a robot removes it to complete the operation of this unit.

[0003] However, there is no device to fix the wafer in the cavity. When nitrogen is introduced to break the vacuum environment in the cavity, the wafer is affected by the airflow and its position often shifts. This affects the robot's normal wafer picking and placing, resulting in frequent wafer picking failures and affecting the normal operation of the machine. Utility Model Content

[0004] In view of the above situation, it is necessary to provide a wafer fixing device for the adhesive bonding cavity of an adhesive coating machine to address the problem of wafer fixing in the existing technology.

[0005] A wafer fixing device for an adhesive coating machine's adhesion-enhancing cavity includes a chamber, a clamping assembly, a lifting assembly, and a piping assembly. The chamber has a receiving cavity for accommodating the wafer. The clamping assembly is located on both sides of the chamber. Each clamping assembly includes a bracket, a first cylinder, a connecting plate, and a clamping plate. The two brackets are located on opposite sides of the chamber. The first cylinder is mounted on the bracket and movably connected to the connecting plate. The clamping plate is connected to the connecting plate, and one end of the clamping plate passes through the chamber and extends into the receiving cavity. The first cylinder drives the clamping plate closer to or further away from the wafer. The lifting assembly is located on one side of the chamber and changes the height of the wafer within the receiving cavity. The piping assembly is located on the chamber and communicates with the receiving cavity, connecting external gas, liquid adhesive, and a vacuum pump.

[0006] The beneficial effects of this utility model are:

[0007] The chamber is opened, and the wafer is placed on the lifting assembly. The lifting assembly lowers the wafer. When the wafer and the clamping plate are at the same horizontal height, the lifting assembly stops descending. The first cylinder drives the connecting plate to move the clamping plate, clamping the wafer from opposite sides. A vacuum pump creates a vacuum in the receiving chamber by drawing negative pressure. Then, liquid adhesive is sprayed onto the wafer surface through the air pipe assembly, and nitrogen gas is introduced into the receiving chamber through the air pipe assembly. After the nitrogen gas is introduced, the vacuum environment of the receiving chamber is changed, the chamber is opened, and the wafer is removed. The wafer is fixed in the receiving chamber by the clamping plate. When the vacuum environment in the receiving chamber is broken by the introduction of nitrogen gas, the wafer is affected by the airflow and no longer shifts in position. The robot can pick up and place wafers normally, ensuring normal operation of the machine.

[0008] Furthermore, the chamber includes a top cover and a chamber body, the top cover being movably connected to the chamber body, and the chamber body being recessed to form the receiving cavity.

[0009] Furthermore, the lifting assembly includes a second cylinder, a lifting plate, a plurality of support columns and a support plate. The second cylinder is connected to one end of the lifting plate. The lifting plate extends toward the bottom of the chamber body. A plurality of support columns are evenly distributed at the end of the lifting plate away from the second cylinder. One end of the plurality of support columns passes through the bottom of the chamber body and extends into the receiving cavity. The support plate is provided on the plurality of support columns.

[0010] Furthermore, the height of some of the support columns is less than the height of the receiving cavity.

[0011] Furthermore, the piping assembly includes a first pipe, a second pipe, and a third pipe spaced apart. The first pipe, the second pipe, and the third pipe are all disposed on the upper cover. The first pipe is connected to an external nitrogen interface, the second pipe is connected to an external liquid thickener interface, and the third pipe is connected to an external vacuum pump.

[0012] Furthermore, the length of the connecting plate is less than the length of the clamping plate.

[0013] Furthermore, the clamping plate is recessed at one end of the receiving cavity to form an arc-shaped portion, which is adapted to the wafer. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the opening structure of the top cover in the first embodiment of this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the first embodiment of the present utility model;

[0016] Figure 3 This is a schematic diagram of the lifting component structure according to the first embodiment of the present utility model.

[0017] Explanation of reference numerals in the attached drawings: 1. Chamber; 11. Chamber body; 111. Receiving cavity; 12. Top cover; 2. Clamp assembly; 21. Bracket; 22. First cylinder; 23. Connecting plate; 24. Clamping plate; 241. Arc-shaped part; 3. Lifting assembly; 31. Second cylinder; 32. Lifting plate; 33. Support column; 34. Support plate; 4. Piping assembly; 41. First pipeline; 42. Second pipeline; 43. Third pipeline. DETAILED DESCRIPTION

[0018] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0019] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. Furthermore, the various embodiments of the invention, the features within those embodiments, and the features of the embodiments may be freely combined without obvious conflict or contradiction.

[0021] A wafer fixing device for an adhesive coating machine's adhesion-enhancing cavity, such as Figure 1 As shown, it includes a chamber 1, a clamping assembly 2, a lifting assembly 3, and a piping assembly 4.

[0022] Specifically, such as Figures 1 to 3 As shown, the chamber 1 includes a chamber body 11 and a top cover 12. The top cover 12 is movably connected to the chamber body 11. The chamber body 11 is recessed to form a receiving cavity 121, which is used to receive a wafer.

[0023] Specifically, clamping assemblies 2 are provided on both sides of the chamber 1. The clamping assembly 2 includes a bracket 21, a first cylinder 22, a connecting plate 23, and a clamping plate 24. The bracket is located on opposite sides of the chamber 1. The first cylinder 22 is located on the bracket and is movably connected to the connecting plate 23. The clamping plate 24 is connected to the connecting plate 23. One end of the clamping plate 24 passes through the chamber 1 and extends into the receiving cavity 121. The end of the clamping plate 24 located in the receiving cavity 121 is concave to form an arc-shaped part 241. The arc-shaped part 241 is adapted to the wafer. The length of the connecting plate 23 is less than the length of the clamping plate 24. The first cylinder 22 is used to drive the connecting plate 23 to move the clamping plate 24 closer to or away from the wafer. When the two clamping plates 24 approach the wafer from opposite sides, the arc-shaped part 241 can completely surround the wafer and fix the wafer.

[0024] Specifically, the lifting assembly 3 is located on one side of the chamber 1. The lifting assembly 3 is used to change the height of the wafer in the receiving cavity 121. The lifting assembly 3 includes a second cylinder 31, a lifting plate 32, multiple support columns 33 and a support plate 34. The second cylinder 31 is connected to one end of the lifting plate 32. The lifting plate 32 extends towards the bottom of the chamber body 11. Multiple support columns 33 are evenly distributed at the end of the lifting plate 32 away from the second cylinder 31. One end of the multiple support columns 33 passes through the bottom of the chamber body 11 and extends into the receiving cavity 121. The support plate 34 is provided on the multiple support columns 33. The wafer is placed on the support plate. The second cylinder 31 drives the support plate 34 to descend, changing the relative height of the wafer to cooperate with the clamping plate 24 to fix the wafer. After the operation is completed, the second cylinder 41 drives the support plate 34 to rise and remove the wafer.

[0025] Specifically, the piping assembly 4 includes a first pipe 41, a second pipe 42, and a third pipe 43 spaced apart. The first pipe 41, the second pipe 42, and the third pipe 43 are all located on the upper cover 12 and are all connected to the receiving cavity 121. The first pipe 41 is connected to an external nitrogen interface (not shown), the second pipe 42 is connected to an external liquid thickener interface (not shown), and the third pipe 43 is connected to an external vacuum pump (not shown). Nitrogen gas is introduced into the receiving cavity 121 through the first pipe 41, which changes the vacuum environment of the receiving cavity 121. Liquid thickener is sprayed onto the wafer surface in the receiving cavity 121 through the second pipe 42, and the receiving cavity 121 is evacuated to a negative pressure to form a vacuum through the third pipe 43 connected to the vacuum pump.

[0026] In this invention, the upper cover 12 is opened, the wafer is placed on the support plate 34, and the upper cover 12 is closed. The second cylinder 31 drives the wafer to descend. When the wafer and the clamping plate 24 are at the same horizontal height, the second cylinder 31 stops descending. The first cylinder 22 drives the connecting plate 23 to move the clamping plate 24, clamping the wafer from opposite sides. A vacuum pump is connected through the third pipe 43 to create a vacuum in the receiving cavity 121. Then, liquid is sprayed onto the wafer surface in the receiving cavity 121 through the second pipe 42. The adhesive is applied, and then nitrogen gas is introduced into the receiving cavity 121 through the first pipeline 41. After the nitrogen gas is introduced, the vacuum environment of the receiving cavity 121 is changed. When the pressure of the receiving cavity 121 is greater than the normal gas pressure, the top cover 12 is opened, thereby removing the wafer from the support plate 34. The wafer is fixed in the receiving cavity 121 by the clamping plate 24. When the vacuum environment in the receiving cavity 121 is broken by the introduction of nitrogen gas, the wafer is affected by the airflow and no longer experiences positional displacement. The robot can pick up and place wafers normally, ensuring the normal operation of the machine.

[0027] It should be noted that spraying liquid tackifier onto the wafer surface in a vacuum environment is to prevent the release of gases that are harmful to the environment and human health during the process. Harmful gases are collected and treated centrally through the third pipeline 43.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0029] The embodiments described above are merely illustrative of the implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer fixing device for an adhesive coating machine's adhesion-enhancing cavity, characterized in that: The device includes a chamber, a clamping assembly, a lifting assembly, and a piping assembly. The chamber has a receiving cavity for accommodating a wafer. The clamping assembly is located on both sides of the chamber. Each clamping assembly includes a bracket, a first cylinder, a connecting plate, and a clamping plate. The two brackets are located on opposite sides of the chamber. The first cylinder is mounted on the bracket and movably connected to the connecting plate. The clamping plate is connected to the connecting plate, and one end of the clamping plate passes through the chamber and extends into the receiving cavity. The first cylinder drives the clamping plate closer to or further away from the wafer. The lifting assembly is located on one side of the chamber and changes the height of the wafer within the receiving cavity. The piping assembly is located on the chamber and communicates with the receiving cavity. The piping assembly connects to external gas, a liquid thickener, and a vacuum pump.

2. The wafer fixing device for the adhesive coating machine's adhesion-enhancing cavity according to claim 1, characterized in that: The chamber includes a top cover and a chamber body, the top cover being movably connected to the chamber body, and the chamber body being recessed to form the receiving cavity.

3. The adhesive coating machine bonding cavity wafer fixing device according to claim 2, characterized in that: The lifting assembly includes a second cylinder, a lifting plate, a plurality of support columns and a support plate. The second cylinder is connected to one end of the lifting plate. The lifting plate extends toward the bottom of the chamber body. A plurality of support columns are evenly distributed at the end of the lifting plate away from the second cylinder. One end of the plurality of support columns passes through the bottom of the chamber body and extends into the receiving cavity. The support plate is provided on the plurality of support columns.

4. The wafer fixing device for the adhesive coating machine's adhesion-enhancing cavity according to claim 3, characterized in that: The height of some of the support columns is less than the height of the receiving cavity.

5. The adhesive coating machine bonding cavity wafer fixing device according to claim 2, characterized in that: The piping assembly includes a first pipe, a second pipe, and a third pipe spaced apart. The first pipe, the second pipe, and the third pipe are all located on the upper cover. The first pipe is connected to an external nitrogen interface, the second pipe is connected to an external liquid thickener interface, and the third pipe is connected to an external vacuum pump.

6. The wafer fixing device for the adhesive coating machine's adhesion-enhancing cavity according to claim 1, characterized in that: The length of the connecting plate is less than the length of the clamping plate.

7. The adhesive coating machine bonding cavity wafer fixing device according to claim 1, characterized in that: The clamping plate is recessed at one end of the receiving cavity to form an arc-shaped portion, which is adapted to the wafer.

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