Semiconductor device pin positioning and bending mechanism
By designing a combination of movable base, fixed clamp, movable clamp, screw and electric actuator, the problems of device wobbling and poor flexibility in the existing device are solved, and the precise positioning and efficient bending of semiconductor device pins are achieved.
Patent Information
- Application Number
- CN202422931938.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Existing semiconductor pin bending equipment is prone to device wobbling or misalignment during operation, affecting bending accuracy and consistency. It also lacks flexibility and cannot adapt to different sizes and types of semiconductor devices, thus reducing production efficiency.
A semiconductor device pin positioning and bending mechanism is designed, including a movable seat, a fixed clamping plate, a movable clamping plate, a screw, a threaded plate, and an electric push rod. Through the cooperation of the threaded drive and the electric push rod, the movable clamping plate can be moved and its position adjusted, ensuring stable clamping and precise positioning of the semiconductor device.
It improves the precision and efficiency of needle bending, reduces the difficulty of operation and human error, enhances the flexibility of the device, and adapts to diverse production tasks.
Smart Images
Figure CN223476180U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor device pin bending technology, specifically a semiconductor device pin positioning and bending mechanism. Background Technology
[0002] The main purpose of bending the pins of semiconductor devices is to adapt to the circuit board layout, ensuring that the pins can be accurately and firmly inserted and fixed in the holes of the circuit board, thereby improving the reliability and stability of the connection. At the same time, specific bending standards and precautions are followed to ensure the overall performance and long-term reliability of the semiconductor devices.
[0003] Existing devices for bending semiconductor pins, while effectively securing semiconductor devices during operation, are prone to movement or misalignment during bending. This not only affects bending accuracy and consistency but also significantly reduces production efficiency. Furthermore, these devices lack flexibility and cannot adapt to semiconductor devices of different sizes and types, causing considerable inconvenience for operators when facing diverse production tasks. Therefore, we propose a semiconductor device pin positioning and bending mechanism. Utility Model Content
[0004] The purpose of this invention is to provide a semiconductor device pin positioning and bending mechanism to solve the problems mentioned in the background art regarding existing devices for bending semiconductor pins. These devices are designed to effectively fix semiconductor devices during operation, but this can lead to the devices easily shaking or misaligning during bending. This not only affects the bending accuracy and consistency but also greatly reduces production efficiency. Furthermore, these devices have poor flexibility and cannot adapt to semiconductor devices of different sizes and types, making it very inconvenient for operators when facing diverse production tasks.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor device pin positioning and bending mechanism, comprising a base, a movable seat disposed at the center of the upper end of the base, a fixed clamping plate fixedly installed on one side of the inner wall of the movable seat, a movable clamping plate disposed on the other side of the inner wall of the movable seat, a transmission groove formed on one side of the top of the inner wall of the movable seat, a screw disposed inside the transmission groove, an adjusting knob disposed at the top of one side of the movable seat, a threaded plate threadedly connected to one side of the surface of the screw, a support fixedly installed on one side of the top of the base, a side plate fixedly installed on one side of the base, a first electric push rod fixedly installed at the center of one side of the side plate, a bracket fixedly installed on one side of the upper end of the base, a second electric push rod fixedly installed on one side of the bottom of the bracket, and a bending head disposed at the lower end of the second electric push rod.
[0006] Compared with the prior art, the beneficial effects of this utility model are:
[0007] This semiconductor device pin positioning and bending mechanism, through the design of a movable seat, a fixed clamping plate, a screw, a threaded plate, an adjustment knob, and a first electric push rod, allows the screw to rotate when the adjustment knob is turned. The screw, through the threaded transmission between the screw and the threaded plate, causes the movable clamping plate to move smoothly under the guidance of the transmission groove. This allows for flexible adjustment of the distance between the movable and fixed clamping plates according to the actual size of the semiconductor device, easily clamping and fixing the device between them. This process is not only accurate in positioning and easy to operate, but also greatly improves the stability and reliability of clamping. Simultaneously, by controlling the extension and retraction of the first electric push rod, the movable seat can be driven to move horizontally on the base. This design allows the pin body to be moved to the appropriate position according to actual needs, facilitating precise adjustment and positioning of the bending points on the pin body by the operator. This highly flexible operation method not only improves the efficiency and accuracy of bending work, but also greatly reduces the difficulty of operation and human error, providing strong technical support for the pin bending process of semiconductor devices. Attached Figure Description
[0008] Figure 1 This is a schematic diagram of the structure of this utility model;
[0009] Figure 2 This is a three-dimensional view of the fixing clamp of this utility model;
[0010] Figure 3 This is a three-dimensional structural view of the movable clamp of this utility model;
[0011] Figure 4 This is the main view of the structure of this utility model.
[0012] In the diagram: 1. Base; 2. Movable seat; 3. Fixed clamping plate; 4. Movable clamping plate; 5. Transmission groove; 6. Screw; 7. Threaded plate; 8. Adjustment knob; 9. Sponge layer; 10. Groove; 11. First slide groove; 12. First slider; 13. Second slide groove; 14. Second slider; 15. Support; 16. Semiconductor body; 17. Needle body; 18. Side plate; 19. First electric actuator; 20. Bracket; 21. Second electric actuator; 22. Bending head. Detailed Implementation
[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0014] Please see Figure 1-4 This utility model provides a technical solution: a semiconductor device pin positioning and bending mechanism, including a base 1, a movable seat 2 is provided at the center of the upper end of the base 1, a fixed clamping plate 3 is fixedly installed on one side of the inner wall of the movable seat 2, a movable clamping plate 4 is provided on the other side of the inner wall of the movable seat 2, a transmission groove 5 is opened on one side of the top of the inner wall of the movable seat 2, a screw 6 is provided inside the transmission groove 5, an adjustment knob 8 is provided at the top of one side of the movable seat 2, a threaded plate 7 is threadedly connected to one side of the surface of the screw 6, a support 15 is fixedly installed at one side of the top of the base 1, a side plate 18 is fixedly installed on one side of the base 1, a first electric push rod 19 is fixedly installed at the center of one side of the side plate 18, a bracket 20 is fixedly installed on one side of the upper end of the base 1, a second electric push rod 21 is fixedly installed on one side of the bottom of the bracket 20, and a bending head 22 is provided at the lower end of the second electric push rod 21.
[0015] One end of the screw 6 is movably connected to a bearing fixedly installed on one side of the inner wall of the transmission groove 5, and the other end of the screw 6 extends through to the outside of the movable seat 2 and is fixedly connected to the center of one side of the adjusting knob 8. By manually rotating the adjusting knob 8, the screw 6 can be easily driven to rotate in the transmission groove 5, providing a power source for the subsequent movement of the movable clamping plate 4.
[0016] The lower end of the threaded plate 7 extends through the outside of the transmission groove 5 and is fixedly connected to the top of the movable clamping plate 4. When the screw 6 rotates, the threaded plate 7 will move along the axial direction of the screw 6 through the thread transmission principle, thereby driving the movable clamping plate 4 to move synchronously, realizing the clamping or release of the semiconductor device.
[0017] Both the fixed clamping plate 3 and the movable clamping plate 4 are L-shaped structures and are symmetrically arranged. A groove 10 is provided at the bottom of the front surface of the fixed clamping plate 3. A semiconductor body 16 is disposed between the fixed clamping plate 3 and the movable clamping plate 4. A sponge layer 9 is glued to the opposite side of the fixed clamping plate 3 and the movable clamping plate 4. The outer wall of the semiconductor body 16 is in contact with the surfaces of the two sponge layers 9 respectively. A needle-shaped body 17 is fixedly connected to one side of the semiconductor body 16. One end of the needle-shaped body 17 extends through the outside of the groove 10, and the lower end of the needle-shaped body 17 contacts the top of the support 15. The L-shaped structure can provide stable support and clamping force. At the same time, the design of the groove 10 facilitates the insertion and extension of the needle-shaped body 17, ensuring the accuracy of the bending operation. The function of the sponge layer 9 is to provide cushioning and protection to prevent damage to the semiconductor body 16 during clamping and to increase the stability of clamping.
[0018] The movable seat 2 has a first slide groove 11 on one side of the bottom. The movable clamp 4 has a first slider 12 fixedly connected to the center of the bottom. The bottom of the first slider 12 extends into the interior of the first slide groove 11 and slides in connection with the inner wall of the first slide groove 11, ensuring the stability and smoothness of the movable clamp 4 during movement and avoiding deviation or jamming.
[0019] A second slide groove 13 is provided at the center of the top of the base 1. A second slider 14 is fixedly connected to the center of the bottom of the movable seat 2. The bottom of the second slider 14 extends into the interior of the second slide groove 13 and slides in connection with the inner wall of the second slide groove 13, so that the movable seat 2 can move smoothly on the base 1, providing the necessary flexibility for subsequent pin positioning and bending operations.
[0020] One side of the first electric actuator 19 extends to the outside of the side plate 18. The first electric actuator 19 is fixedly connected to a first telescopic shaft through its output end on one side. One end of the first telescopic shaft is fixedly connected to one side of the movable seat 2. By controlling the telescopic movement of the first electric actuator 19, the movable seat 2 can be driven to move horizontally on the base 1, thereby adjusting the position of the semiconductor device and facilitating subsequent bending operations. The second electric actuator 21 is fixedly connected to a second telescopic shaft through its bottom output end. The bottom of the second telescopic shaft is fixedly connected to the top of the bending head 22. By controlling the telescopic movement of the second electric actuator 21, the bending head 22 can be driven to move up and down to perform precise bending operations on the needle body 17, realizing an automated and efficient production process.
[0021] First, place the semiconductor device to be bent between the fixed clamping plate 3 and the movable clamping plate 4, ensuring that the outer wall of the semiconductor body 16 is in close contact with the surfaces of the two sponge layers 9. Simultaneously, one end of the needle body 17 extends through the outside of the groove 10 and is placed on top of the support 15. Then, manually rotate the adjusting knob 8 to drive the screw 6 to rotate within the transmission groove 5. Due to the threaded connection between the screw 6 and the threaded plate 7, when the screw 6 rotates, the threaded plate 7 will move along the axial direction of the screw 6, thereby causing the movable clamping plate 4 to move smoothly under the guidance of the first sliding groove 11 and the first slider 12, until it, together with the fixed clamping plate 3, clamps and fixes the semiconductor device. Next, through... By controlling the extension and retraction of the first electric actuator 19, the movable seat 2 is driven to move horizontally on the base 1 through the sliding connection of the second slide groove 13 and the second slider 14, thereby adjusting the position of the semiconductor device and ensuring that the part of the needle tube body 17 to be bent is aligned with the bending head 22. Finally, by controlling the extension and retraction of the second electric actuator 21, the bending head 22 is driven to move up and down to perform a precise bending operation on the needle tube body 17. During the bending process, the extension and retraction speed and force of the second electric actuator 21 can be adjusted as needed to achieve bending requirements of different angles and shapes. The entire operation process is automated and efficient, greatly improving production efficiency and product quality.
[0022] In summary, this semiconductor device pin positioning and bending mechanism, through the design of the movable seat 2, fixed clamping plate 3, movable clamping plate 4, screw 6, threaded plate 7, adjusting knob 8, and first electric push rod 19, allows the screw 6 to rotate when the adjusting knob 8 is turned. This, in turn, through the threaded transmission between the screw 6 and the threaded plate 7, causes the movable clamping plate 4 to move smoothly under the guidance of the transmission groove 5. This allows for flexible adjustment of the distance between the movable clamping plate 4 and the fixed clamping plate 3 according to the actual size of the semiconductor device, easily clamping and fixing the semiconductor device between them. This process not only ensures accurate positioning but also... The operation is simple and greatly improves the stability and reliability of clamping. At the same time, by controlling the extension and retraction of the first electric push rod 19, the movable seat 2 can be driven to move horizontally on the base 1. This design allows the pin body 17 to be moved to a suitable position according to actual needs, so that the operator can make precise adjustments and positioning of the bending part on the pin body 17. This highly flexible operation method not only improves the efficiency and accuracy of bending work, but also greatly reduces the difficulty of operation and human error, providing strong technical support for the pin bending processing of semiconductor devices.
[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0024] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor device pin positioning and bending mechanism, comprising a base (1), characterized in that: A movable seat (2) is provided at the center of the upper end of the base (1). A fixed clamping plate (3) is fixedly installed on one side of the inner wall of the movable seat (2), and a movable clamping plate (4) is provided on the other side of the inner wall of the movable seat (2). A transmission groove (5) is opened on one side of the top of the inner wall of the movable seat (2). A screw (6) is provided inside the transmission groove (5). An adjusting knob (8) is provided at the top of one side of the movable seat (2). A screw (6) is screwed on one side of the surface of the screw (6). The base (1) is connected to a threaded plate (7). A support (15) is fixedly installed on one side of the top of the base (1). A side plate (18) is fixedly installed on one side of the base (1). A first electric actuator (19) is fixedly installed at the center of one side of the side plate (18). A bracket (20) is fixedly installed on one side of the upper end of the base (1). A second electric actuator (21) is fixedly installed on one side of the bottom of the bracket (20). A bending head (22) is provided at the lower end of the second electric actuator (21).
2. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that: One end of the screw (6) is movably connected to a bearing fixedly installed on one side of the inner wall of the transmission groove (5), and the other end of the screw (6) extends through to the outside of the movable seat (2) and is fixedly connected to the center of one side of the adjusting knob (8).
3. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that: The lower end of the threaded plate (7) extends through the outside of the transmission groove (5) and is fixedly connected to the top of the movable clamping plate (4).
4. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that: Both the fixed clamp (3) and the movable clamp (4) are L-shaped structures and are symmetrically arranged. A groove (10) is provided at the bottom of the front surface of the fixed clamp (3). A semiconductor body (16) is provided between the fixed clamp (3) and the movable clamp (4). A sponge layer (9) is glued to the opposite side of the fixed clamp (3) and the movable clamp (4) respectively. The outer wall of the semiconductor body (16) is in contact with the surface of the two sponge layers (9). A needle-shaped body (17) is fixedly connected to one side of the semiconductor body (16). One end of the needle-shaped body (17) extends through the outside of the groove (10), and the lower end of the needle-shaped body (17) is in contact with the top of the support (15).
5. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that: The movable seat (2) has a first sliding groove (11) on one side of its bottom. The movable clamp (4) has a first slider (12) fixedly connected to the center of its bottom. The bottom of the first slider (12) extends into the interior of the first sliding groove (11) and slides in connection with the inner wall of the first sliding groove (11).
6. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that: The base (1) has a second slide groove (13) at the center of the top, and the movable seat (2) has a second slider (14) fixedly connected to the center of the bottom. The bottom of the second slider (14) extends into the interior of the second slide groove (13) and slides in connection with the inner wall of the second slide groove (13).
7. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that: One side of the first electric actuator (19) extends to the outside of the side plate (18). The first electric actuator (19) is fixedly connected to a first telescopic shaft through its output end on one side. One end of the first telescopic shaft is fixedly connected to one side of the movable seat (2). The second electric actuator (21) is fixedly connected to a second telescopic shaft through its bottom output end. The bottom of the second telescopic shaft is fixedly connected to the top of the bending head (22).