Semiconductor device shaping device

Abstract

The utility model provides a semiconductor device shaping device, and belongs to the field of semiconductors. A semiconductor device shaping device comprises a base, a reset plate is placed on the base, an electric push rod is fixedly installed on the base, a sliding seat is fixedly installed at the output end of the electric push rod, a motor is fixedly installed on the sliding seat, a threaded rod is fixedly installed at the output end of the motor, and two sliding assemblies are arranged on the threaded rod in a threaded fit mode. And a plurality of extrusion assemblies are arranged in the two sliding assemblies in a sliding fit mode, and each extrusion assembly comprises an extrusion strip arranged on the lower side of the extrusion assembly in a sliding fit mode. According to the utility model, through the arrangement of the motor, the two extrusion assemblies can be driven to slide, so that the sliding extrusion assemblies can carry out one-time pressing and shaping on two pins with different distances, and because the extrusion assemblies can carry out one-time pressing and shaping on two pins with different distances, the pressing and shaping efficiency is improved. Therefore, the device is more convenient to use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a semiconductor device shaping device. Background Technology

[0002] Pins, also called traces, are the wires that connect the internal circuitry of an integrated circuit to the external circuitry. All the pins together form the interface of the chip. The end of the lead is soldered to the pads on the printed circuit board to form a solder joint. After the integrated circuit is packaged, the pins need to be shaped.

[0003] In the prior art, such as the semiconductor component shaping device with patent number CN220426641U, the clearance grooves are spaced apart along the length of the support platform, and a lifting plate with several shaping plates movably connected to the bottom is set above the support platform. The semiconductor component shaping device of this utility model realizes the step-by-step shaping of the pins from the root to the head. However, the existing semiconductor component shaping device can only shape the pins on one side when in use, and it has the problem that it cannot shape the pins on both sides at the same time. Therefore, a semiconductor component shaping device is proposed. Utility Model Content

[0004] In view of this, the present invention aims to provide a semiconductor device shaping device to solve or alleviate the technical problems existing in the prior art. By installing a motor, two extrusion components can be driven to slide, so that the extrusion components after sliding can perform a single compression shaping between two pins at different distances. Because the extrusion components can perform a single compression shaping between two pins at different distances, the device is more convenient to use.

[0005] The technical solution of this utility model embodiment is implemented as follows:

[0006] A semiconductor device shaping device includes a base, on which a reset plate is placed and an electric push rod is fixedly mounted. A sliding seat is fixedly mounted on the output end of the electric push rod, and a motor is fixedly mounted on the sliding seat. A threaded rod is fixedly mounted on the output end of the motor. Two sliding components are threadedly engaged on the threaded rod. Multiple extrusion components are slidably engaged within each of the two sliding components. Each extrusion component includes an extrusion strip slidably engaged on the lower side of the extrusion component, two second guide rods fixedly mounted on the extrusion strip and passing through the sliding component, and two springs fixedly mounted between the sliding component and the extrusion strip.

[0007] Preferably, the lower surface of the base is provided with four support legs for supporting the base, and the base is provided with support protrusions located on the lower surface of the reset plate. The installation of the support protrusions facilitates the support of the device.

[0008] Preferably, the reset plate has multiple grooves corresponding to the pins, and a support frame is fixedly installed on the base. The output end of the electric push rod passes through the support frame, which has an inverted U-shaped structure. The installation of the support frame facilitates the fixation of the electric push rod.

[0009] Preferably, the sliding assembly includes a sliding frame and a fixed shell fixedly installed on the lower side of the sliding frame. A first guide rod passes through the two sliding frames. The two ends of the threaded rod are provided with two external threads that are respectively threaded to the two sliding frames. The installation of the threaded rod facilitates the sliding of the two sliding frames closer or further apart.

[0010] Preferably, the fixed shell has multiple circular holes, and the tops of multiple second guide rods are slidably fitted inside the multiple circular holes. Each of the multiple second guide rods has a limiting disc on its top. Multiple springs are respectively sleeved on the periphery of the multiple second guide rods. The installation of the second guide rods can guide the extrusion strip during the sliding process, thereby making the extrusion strip slide more smoothly.

[0011] Preferably, the extrusion strip near the root of the pin is located on the lower side of the extrusion strip away from the root of the pin, and the height of the multiple extrusion strips gradually increases with respect to the vertical plane of the center of the semiconductor. The installation of the extrusion strips can extrude and shape the pin of the semiconductor.

[0012] The present invention has the following advantages due to the adoption of the above technical solution:

[0013] I. This utility model, through the installation of a motor, can drive two extrusion components to slide, thereby enabling the extrusion components to perform a single pressing and shaping between two pins at different distances. Because the extrusion components can perform a single pressing and shaping between two pins at different distances, the use of this device is more convenient.

[0014] Second, by installing an electric push rod, this utility model can drive multiple extrusion components to gradually press and correct the pin, thereby making the pin less likely to break due to a single rapid correction.

[0015] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a bottom view of the structure of this utility model;

[0019] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0020] Figure 4 This is a structural diagram of the reset plate of this utility model.

[0021] Reference numerals: 1. Base; 2. Reset plate; 3. Electric push rod; 4. Sliding seat; 5. Motor; 6. Threaded rod; 7. Sliding assembly; 8. Extrusion assembly; 9. Extrusion bar; 10. Second guide rod; 11. Spring; 12. Support frame; 13. First guide rod; 14. Sliding frame; 15. Fixed shell. Detailed Implementation

[0022] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0023] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] like Figure 1-4 As shown, this utility model embodiment provides a semiconductor device shaping device, including: a base 1, a reset plate 2 placed on the base 1, an electric push rod 3 fixedly installed, a sliding seat 4 fixedly installed on the output end of the electric push rod 3, a motor 5 fixedly installed on the sliding seat 4, a threaded rod 6 fixedly installed on the output end of the motor 5, two sliding components 7 threadedly engaged on the threaded rod 6, and multiple extrusion components 8 slidably engaged within each of the two sliding components 7, each extrusion component 8 including an extrusion strip 9 slidably engaged on the lower side of the extrusion component 8, two second guide rods 10 fixedly installed on the extrusion strip 9 and passing through the sliding component 7, and two springs 11 fixedly installed between the sliding component 7 and the extrusion strip 9.

[0025] In this embodiment, specifically: the lower surface of the base 1 is provided with four support legs for supporting the base 1, and the base 1 is provided with a support protrusion located on the lower surface of the reset plate 2. The installation of the reset plate 2 facilitates the shaping of the semiconductor pins.

[0026] In this embodiment, specifically: the reset plate 2 has multiple grooves corresponding to the pins, the base 1 has a support frame 12 fixedly installed, the output end of the electric push rod 3 passes through the support frame 12, the support frame 12 has an inverted U-shaped structure, the grooves facilitate the accommodation of the pins, and facilitate the shaping of the semiconductor pins.

[0027] In this embodiment, specifically: the sliding assembly 7 includes a sliding frame 14 and a fixed shell 15 fixedly installed on the lower side of the sliding frame 14. The first guide rod 13 passes through the two sliding frames 14. The two ends of the threaded rod 6 are provided with two external threads that are respectively threaded to the two sliding frames 14. The installation of the first guide rod 13 facilitates the guidance of each sliding frame 14 during the sliding process, thereby making the sliding frame 14 slide more smoothly.

[0028] In this embodiment, specifically: the fixed shell 15 has multiple circular holes, the tops of multiple second guide rods 10 are slidably fitted inside the multiple circular holes, the tops of the multiple second guide rods 10 are provided with limiting discs, and multiple springs 11 are respectively sleeved on the periphery of the multiple second guide rods 10. The installation of the limiting discs makes it difficult for the second guide rods 10 to detach from the device when sliding.

[0029] In this embodiment, specifically: the extrusion strip 9 near the root of the pin is located on the lower side away from the root of the pin. The height of the multiple extrusion strips 9 gradually increases with respect to the vertical plane of the center of the semiconductor. The installation of the extrusion strips 9 facilitates the extrusion of the semiconductor pin into the groove, which facilitates the shaping of the semiconductor pin. When the extrusion strip 9 contacts the pin, the force applied by the spring 11 to the extrusion strip 9 is transmitted to the extrusion strip 9 and the pin. The sliding component 7 continues to slide downward, and the pressure of the spring 11 on the extrusion strip 9 and the pin increases. The extrusion strip 9 extrudes and shapes the pin, thereby forming a shape. When the top of the second guide rod 10 contacts the inner top wall of the fixed shell 15, the fixed shell 15 pushes the second guide rod 10 and the extrusion strip 9 to extrude and shape the pin.

[0030] When this utility model is in operation: when the two sliding components 7 in the device need to slide away from each other, the motor 5 is turned on. The turning on of the motor 5 drives the two sliding components 7 to slide away from each other. As the sliding components 7 slide away from each other, the pressing components 8 on the two sliding components 7 slide away from each other. At this time, the distance between the two pressing components 8 changes. Then, the reset plate 2 corresponding to the semiconductor is placed inside the base 1, and the semiconductor is placed on the reset plate 2. At this time, the two sliding components 7 slide closer or further away from each other, so that the two sliding components 7 can slide to the upper side of the two pins at different distances. Thus, the device can adapt to the pins of different types of semiconductor chips.

[0031] When the device needs to gradually shape the semiconductor pins, the electric push rod 3 is activated. The activation of the electric push rod 3 drives the sliding seat 4, motor 5, threaded rod 6, sliding assembly 7, and pressing assembly 8 to slide. At this time, the multiple pressing assemblies 8 gradually slide to press and shape the semiconductor pins. After being pressed, the pins enter the interior of the reset plate (2), and the multiple pressing assemblies 8 gradually come into contact with the semiconductor pins.

[0032] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A semiconductor device shaping apparatus, comprising a base (1), characterized in that: A reset plate (2) is placed on the base (1), and an electric push rod (3) is fixedly installed. A sliding seat (4) is fixedly installed on the output end of the electric push rod (3). A motor (5) is fixedly installed on the sliding seat (4). A threaded rod (6) is fixedly installed on the output end of the motor (5). Two sliding components (7) are threadedly fitted on the threaded rod (6). Multiple extrusion components (8) are slidably fitted inside both sliding components (7). Each extrusion component (8) includes an extrusion strip (9) slidably fitted on the lower side of the extrusion component (8), two second guide rods (10) fixedly installed on the extrusion strip (9) and passing through the sliding component (7), and two springs (11) fixedly installed between the sliding component (7) and the extrusion strip (9).

2. The semiconductor device shaping apparatus according to claim 1, characterized in that: The lower surface of the base (1) is provided with four support legs for supporting the base (1), and the base (1) is provided with a support protrusion located on the lower surface of the reset plate (2).

3. The semiconductor device shaping apparatus according to claim 2, characterized in that: The reset plate (2) has multiple grooves corresponding to the pins. A support frame (12) is fixedly installed on the base (1). The output end of the electric push rod (3) passes through the support frame (12). The support frame (12) is an inverted U-shaped structure.

4. The semiconductor device shaping apparatus according to claim 3, characterized in that: The sliding assembly (7) includes a sliding frame (14), a fixed shell (15) fixedly installed on the lower side of the sliding frame (14), a first guide rod (13) passing through the two sliding frames (14), and two external threads respectively provided at both ends of the threaded rod (6) to be threadedly engaged with the two sliding frames (14).

5. A semiconductor device shaping apparatus according to claim 4, characterized in that: The fixed shell (15) has multiple round holes, and the tops of multiple second guide rods (10) are slidably fitted inside the multiple round holes. Each of the multiple second guide rods (10) has a limiting disc on its top, and multiple springs (11) are respectively sleeved on the periphery of the multiple second guide rods (10).

6. A semiconductor device shaping apparatus according to claim 5, characterized in that: The extrusion strip (9) near the root of the pin is located on the lower side away from the root of the pin extrusion strip (9), and the height of the multiple extrusion strips (9) gradually increases with respect to the center vertical plane of the semiconductor.

Images