Wafer rounding tool

Abstract

The utility model discloses a wafer rounding tool which comprises a clamping seat, end covers are fixedly installed at the two ends of the clamping seat respectively, a pressing seat is movably installed in the clamping seat, a rubber pad is fixed to the surface of the pressing seat in an adhesive mode, a plurality of sets of wafer bodies are evenly covered on the surface of the rubber pad, and the wafer bodies are arranged in the clamping seat. And a stud is movably mounted on the surface of the pressing seat. According to the wafer rounding tool, the wafer body and the rounding groove are oppositely arranged, the chamfering shaft is driven by the mechanical arm mounting shaft and the mechanical arm to rotate and move to the position close to the wafer body, finally, corner angles of the wafer body are subjected to rounding work through the rounding groove, and a large number of wafer bodies can be subjected to rounding work at a time; the fillet processing time of a large amount of wafer bodies is greatly reduced; therefore, the production speed of the wafer body is remarkably improved, the delivery cycle of products can be greatly shortened for enterprises with large-scale production requirements, and the rapid requirement of the market for the products is met.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing, specifically a wafer rounding tool. Background Technology

[0002] During the manufacturing, processing, and use of wafers, they are subjected to various mechanical stresses, such as during handling, installation, and packaging. If the wafer edges are right angles, these stresses tend to concentrate at the right angles, making the wafer more prone to cracking or even breakage. After rounding the corners, the stress can be distributed more evenly at the wafer edges, reducing the degree of stress concentration and thus improving the mechanical strength and reliability of the wafer. For example, when wafers are packaged, they are subjected to certain pressures and impacts. Wafers with rounded corners can better withstand these external forces, reducing the risk of damage caused by stress concentration.

[0003] The wafer rounding fixture has the following drawbacks when in use: it can only round the corners of one wafer at a time. The rounding of a single wafer takes a certain amount of time. When only one wafer can be processed at a time, the rounding of a large number of wafers will take a long time. For example, for wafers in mass production, it may take several days or even longer to complete the rounding of all wafers, which seriously affects the production schedule. Utility Model Content

[0004] The purpose of this invention is to provide a wafer rounding tool to solve the defects mentioned in the background art.

[0005] To achieve the above objectives, a wafer rounding fixture is provided, including a clamping base. Both ends of the clamping base are fixedly mounted with end caps, and a clamping seat is movably mounted inside the clamping base. A rubber pad is adhered and fixed to the surface of the clamping seat, and multiple wafer bodies are evenly covered on the surface of the rubber pad. A stud is movably mounted on the surface of the clamping seat and screwed into a screw hole on the end cap. A drive seat is fixedly mounted at the end of the stud away from the clamping seat. A chamfering shaft is provided on one side of the clamping base, and a robot arm mounting shaft is fixedly mounted at the bottom of the chamfering shaft.

[0006] Preferably, the clamping seat is a cylindrical structure made of metal, and the pressing seat and rubber pad inside the clamping seat are rectangular, while the pressing seat has a lateral movement structure inside the clamping seat.

[0007] Preferably, guide blocks are fixedly installed on both sides of the clamping seat, and guide grooves are provided on both sides of the clamping seat. The guide grooves are adapted to the size of the guide blocks, and the two sets of guide blocks are slidably disposed inside the two sets of guide grooves respectively.

[0008] Preferably, a spacer is provided between the wafer bodies, and multiple sets of rounded corner grooves are uniformly formed on the surface of the chamfer shaft, with the distance between two adjacent sets of rounded corner grooves being consistent.

[0009] Preferably, the distance between the wafer bodies is equal to the distance between the rounded corner grooves, and the wafer bodies and the rounded corner grooves are arranged opposite to each other.

[0010] Preferably, the height of the rounded corner groove is greater than the thickness of the wafer body, and the rounding shaft is rotated by the robot mounting shaft and the robot driven to round the edges of the wafer body through the rounded corner groove.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model arranges the wafer body and the rounded corner groove opposite each other. The rounded corner shaft is driven to rotate and move to a position close to the wafer body by the robot mounting shaft and the robot. Finally, the rounded corner groove is used to round the corners of the wafer body. A large number of wafer bodies can be rounded at once, which greatly reduces the rounded corner processing time of a large number of wafer bodies. This significantly improves the production speed of wafer bodies. For enterprises with large-scale production needs, this can greatly shorten the product delivery cycle and meet the market's rapid demand for products. Attached Figure Description

[0012] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0013] Figure 2 for Figure 1 A bottom view;

[0014] Figure 3 for Figure 1 Top view;

[0015] Figure 4 This is a schematic diagram of the clamping seat structure.

[0016] The following are the labels in the diagram: 1. End cap; 2. Stud; 3. Drive seat; 4. Clamping seat; 5. Rubber pad; 6. Clamping seat; 7. Guide block; 8. Guide groove; 9. Wafer body; 10. Gasket; 11. Chamfering shaft; 12. Rounded corner groove; 13. Robot arm mounting shaft. Detailed Implementation

[0017] Please see Figure 1-4This utility model provides a wafer rounding tooling, including a clamping base 6, with end caps 1 fixedly installed at both ends of the clamping base 6, and a clamping base 4 movably installed inside the clamping base 6. At the same time, a rubber pad 5 is bonded and fixed to the surface of the clamping base 4, and multiple wafer bodies 9 are evenly covered on the surface of the rubber pad 5. A stud 2 is movably installed on the surface of the clamping base 4, and the stud 2 is screwed into the screw hole installed on the end cap 1. At the same time, a drive base 3 is fixedly installed at the end of the stud 2 away from the clamping base 4. A chamfering shaft 11 is provided on one side of the clamping base 6, and a robot arm mounting shaft 13 is fixedly installed at the bottom of the chamfering shaft 11.

[0018] Working principle: In operation, multiple wafer bodies 9 are first placed inside the clamping seat 6. Then, the tool-driven rotating seat 3 rotates the stud 2. Since the stud 2 is screwed into the screw hole on the end cap 1, the clamping seat 4 moves upward and clamps and fixes the multiple wafer bodies 9 using rubber pads 5. Wafer bodies 9 are isolated from each other by gaskets 10. Simultaneously, the wafer bodies 9 and the chamfering grooves 12 are positioned opposite each other. The chamfering shaft 11 is rotated and moved close to the wafer bodies 9 by the robot mounting shaft 13 and the robot drive. Finally, the chamfering grooves 12 round the edges of the wafer bodies 9. A large number of wafer bodies 9 can be rounded at once, significantly reducing the rounding processing time and thus significantly increasing the production speed of the wafer bodies 9. For companies with large-scale production needs, this can greatly shorten the product delivery cycle and meet the market's rapid product demand.

[0019] The clamping seat 6 is a cylindrical structure made of metal, and the pressing seat 4 and rubber pad 5 inside the clamping seat 6 are rectangular. At the same time, the pressing seat 4 has a lateral movement structure inside the clamping seat 6.

[0020] In a preferred embodiment, guide blocks 7 are fixedly installed on both sides of the clamping seat 4, and guide grooves 8 are provided on both sides of the clamping seat 6. The guide grooves 8 are adapted to the size of the guide blocks 7, and the two sets of guide blocks 7 are slidably disposed inside the two sets of guide grooves 8 respectively.

[0021] A spacer 10 is provided between the wafer body 9 and the wafer body 9, and multiple sets of rounded corner grooves 12 are evenly opened on the surface of the chamfer shaft 11, and the distance between two adjacent sets of rounded corner grooves 12 is the same.

[0022] In a preferred embodiment, the distance between the wafer body 9 and the wafer body 9 is equal to the distance between the rounded corner groove 12 and the rounded corner groove 12, and the wafer body 9 and the rounded corner groove 12 are arranged opposite to each other.

[0023] The height of the rounded corner groove 12 is greater than the thickness of the wafer body 9, and the chamfering shaft 11 is rotated by the robot mounting shaft 13 and the robot driven to round the corners of the wafer body 9 through the rounded corner groove 12.

Claims

1. A wafer rounding fixture, comprising a clamping base (6), characterized in that: Both ends of the clamping seat (6) are fixedly installed with end caps (1), and a clamping seat (4) is movably installed inside the clamping seat (6). At the same time, a rubber pad (5) is bonded and fixed to the surface of the clamping seat (4), and multiple sets of wafer bodies (9) are evenly covered on the surface of the rubber pad (5). A stud (2) is movably installed on the surface of the clamping seat (4), and the stud (2) is screwed into the screw hole installed on the end cap (1). At the same time, a drive seat (3) is fixedly installed at the end of the stud (2) away from the clamping seat (4). A chamfering shaft (11) is provided on one side of the clamping seat (6), and a robot arm mounting shaft (13) is fixedly installed at the bottom of the chamfering shaft (11).

2. The wafer rounding fixture according to claim 1, characterized in that: The clamping seat (6) is a cylindrical structure made of metal, and the pressing seat (4) and rubber pad (5) inside the clamping seat (6) are rectangular. At the same time, the pressing seat (4) is a transverse movement structure inside the clamping seat (6).

3. The wafer rounding fixture according to claim 2, characterized in that: Guide blocks (7) are fixedly installed on both sides of the clamping seat (4), and guide grooves (8) are opened on both sides of the clamping seat (6). At the same time, the guide grooves (8) and the guide blocks (7) are matched in size, and the two sets of guide blocks (7) are slidably arranged inside the two sets of guide grooves (8).

4. The wafer rounding fixture according to claim 1, characterized in that: A spacer (10) is provided between the wafer body (9) and the surface of the chamfer shaft (11) is uniformly provided with multiple sets of rounded corner grooves (12), and the distance between two adjacent sets of rounded corner grooves (12) is consistent.

5. A wafer rounding fixture according to claim 4, characterized in that: The distance between the wafer body (9) and the wafer body (9) is equal to the distance between the rounded corner groove (12) and the rounded corner groove (12), and the wafer body (9) and the rounded corner groove (12) are arranged opposite to each other.

6. A wafer rounding fixture according to claim 5, characterized in that: The height of the rounded corner groove (12) is greater than the thickness of the wafer body (9), and the chamfering shaft (11) is rotated by the robot mounting shaft (13) and the robot drive and rounds the corners of the wafer body (9) through the rounded corner groove (12).

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