Packaging mold

Abstract

The utility model provides a packaging die which comprises an upper die and a lower die. Each of the upper mold and the lower mold comprises an annular area, a packaging area located on the inner side of the annular area, an uncovering area located on the outer side of the annular area and a buffering area, the buffering areas are located on the inner side of the annular area and between the packaging area and the uncovering area, and the two buffering areas are locally heat-sealed; the two annular areas are subjected to heat sealing so that the two packaging areas can define a packaging space. According to the packaging mold, the buffer area can buffer the uncovering force when the two annular areas are uncovered, so that the stress of the packaging area is reduced, meanwhile, the buffer area can prevent juice from splashing out, the probability that the juice is splashed out when the packaging mold is uncovered is reduced, and the experience feeling of a user is improved.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, and in particular to a packaging mold. Background Technology

[0002] Currently, quail eggs are packaged in a teardrop shape, sealed by heat sealing with an upper and lower film with a heat seal strength of 5 N to 7 N. Opening the packaging involves peeling off the two layers: holding one end of the upper film and the other end of the lower film with both hands, and gently peeling them apart in opposite directions to remove the quail eggs. However, in existing quail egg packaging, the product is rich in juice, and the juice can easily splash out when opened, sometimes getting onto clothing and affecting the user experience. Utility Model Content

[0003] Therefore, it is necessary to provide a packaging mold to address the problem that when quail egg packaging is opened in the existing technology, the juice inside the product is rich in juice and is easily squeezed out, sometimes splashing onto clothes and affecting the user experience.

[0004] The technical solution is as follows:

[0005] On one hand, a packaging mold is provided, including an upper mold and a lower mold. The upper mold and the lower mold each include an annular region, a packaging region located inside the annular region, an opening region located outside the annular region, and a buffer region. The buffer region is located inside the annular region and between the packaging region and the opening region. The two buffer regions are partially heat-sealed, and the two annular regions are heat-sealed, so that the two packaging regions enclose a packaging space.

[0006] In the packaging mold described above, during use, the user grasps the opening areas on the upper mold and the lower mold with both hands and applies opening forces in opposite directions. When the two annular areas are opened, the buffer area cushions the opening force, reducing the force on the packaging area. The buffer area also prevents juice from splashing out, thus reducing the probability of juice splashing when the packaging mold is opened and improving the user experience.

[0007] The technical solution will be further explained below:

[0008] In one embodiment, the uncovered area is located on one side of the annular region.

[0009] In one embodiment, the intersection line between the uncovered area and the annular area is a first circular arc.

[0010] In one embodiment, the exposed area intersects with the two adjacent sides of the annular area to form an intersection point, and the exposed area intersects with the annular area to form an intersection line, the length between the intersection point and the intersection line being 12.5 mm to 13 mm.

[0011] In one embodiment, one side of the packaging area, the buffer area, one side of the annular area, and the opening area are connected in sequence, and the other side of the packaging area is connected to the other side of the annular area.

[0012] In one embodiment, the annular region extends along the direction of the closed-loop arc.

[0013] In one embodiment, the buffer area is provided with at least one heat-sealing part, and the heat-sealing parts are spaced apart, with each heat-sealing part on two buffer areas corresponding to a heat-sealing part.

[0014] In one embodiment, the buffer area is symmetrically arranged about the first axis, and each of the heat-sealing parts is arranged sequentially at intervals along the direction of the second arc, with the center of the second arc located on the first axis.

[0015] In one embodiment, each of the heat-sealed portions on the buffer area is symmetrically arranged about the first axis.

[0016] In one embodiment, the heat-sealing portion is circular, and the diameter of the heat-sealing portion is 2 mm to 2.5 mm. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a packaging mold according to one embodiment.

[0020] Explanation of reference numerals in the attached figures:

[0021] 10. Packaging mold; 100. Upper mold; 110. Annular area; 120. Packaging area; 130. Unpacking area; 131. First arc; 140. Buffer area; 141. Heat sealing part; 200. Lower mold; 21. Second arc; 22. First axis; 30. Quail egg. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] like Figure 1 As shown, in one embodiment, a packaging mold 10 is provided, including an upper mold 100 and a lower mold 200. Both the upper mold 100 and the lower mold 200 include an annular region 110, a packaging region 120 located inside the annular region 110, a peeling region 130 located outside the annular region 110, and a buffer region 140 located inside the annular region 110 and between the packaging region 120 and the peeling region 130. The two buffer regions 140 are partially heat-sealed. The two annular regions 110 are heat-sealed so that the two packaging regions 120 enclose a packaging space.

[0024] In the above embodiment, when using the packaging mold 10, both hands grasp the opening area 130 on the upper mold 100 and the opening area 130 on the lower mold 200 respectively, and apply opening force in opposite directions. When the two annular areas 110 are opened, the buffer area 140 can buffer the opening force, reducing the force on the packaging area 120. At the same time, the buffer area 140 can also prevent juice from splashing out, thereby reducing the probability of juice splashing when the packaging mold 10 is opened, and improving the user experience.

[0025] In this embodiment, the shape and size of the upper mold 100 are the same as those of the lower mold 200. In other embodiments, the shape and size of the upper mold 100 may be different from those of the lower mold 200.

[0026] The packaging mold 10 can be used to package quail eggs 30, braised eggs, or other foods with juice. This application uses the application of the packaging mold 10 to package quail eggs 30 as an example for detailed description, and should not be construed as a limitation of this application. Specifically, in this embodiment, the packaging space is ellipsoidal. The inner contour dimension of the inner sidewall of the packaging space is slightly larger than the outer contour dimension of the quail egg 30. Both the upper mold 100 and the lower mold 200 are integral structures and can be formed by thermoforming.

[0027] like Figure 1 As shown, the opening area 130 is further located on one side of the annular area 110. Thus, the opening area 130 is located on the outside of the annular area 110, so that the buffer area 140 only needs to be located on one side of the packaging area 120, thereby reducing the overall area of ​​the upper mold 100 and the lower mold 200 and reducing the cost of the packaging mold 10.

[0028] Specifically, in this embodiment, one side of the packaging area 120, the buffer area 140, one side of the annular area 110, and the opening area 130 are connected in sequence, and the other side of the packaging area 120 is connected to the other side of the annular area 110.

[0029] In other embodiments, the opening area 130 and the buffer area 140 may both be arranged in a ring shape, with the inner side of the opening area 130 intersecting the outer side of the ring area 110, the inner side of the ring area 110 intersecting the outer side of the buffer area 140, and the inner side of the buffer area 140 intersecting the edge of the packaging area 120.

[0030] like Figure 1 As shown, optionally, the intersection line of the revealing area 130 and the annular area 110 is a first arc line 131. In this way, by increasing the width of the revealing area 130, the area of ​​the revealing area 130 is increased, thereby increasing the gripping comfort of the revealing area 130 and improving the user experience.

[0031] like Figure 1 As shown, optionally, the two adjacent sides of the uncovered area 130 and the annular area 110 intersect to form an intersection point (e.g., Figure 1 As shown at point O), the exposed region 130 intersects with the annular region 110 to form an intersecting line. The length between the intersection point and the intersecting line (as shown in the figure) Figure 1 The length (as shown in A) is 12.5mm to 13mm. In this way, by increasing the length of the opening area 130, the area of ​​the opening area 130 is increased, thereby increasing the gripping comfort of the opening area 130 and improving the user experience.

[0032] The width and length of the uncovered area 130 can be flexibly adjusted according to actual usage needs.

[0033] like Figure 1 As shown, in one embodiment, the annular region 110 extends along a closed-loop arc. Thus, when the two annular regions 110 are opened, the opening force can be evenly distributed and gradually applied, avoiding splashing of juice due to a sudden increase in force, thereby improving the user experience.

[0034] In this specific embodiment, the closed-loop arc is formed by a smooth transition between multiple circular arc segments. The heat-sealing width of the annular region 110 is 5 mm.

[0035] like Figure 1 As shown, in one embodiment, the buffer area 140 is provided with at least one heat-sealing part 141, and the heat-sealing parts 141 are spaced apart, with each heat-sealing part 141 on the two buffer areas 140 corresponding to each other for heat sealing. In this way, the heat-sealing parts 141 are spaced apart and corresponding to each other for heat sealing, ensuring that the buffer area 140 can play a buffering role while also being easily opened, thus improving the user experience.

[0036] The heat-sealing portions 141 can be arranged in a linear array, a curved array, a rectangular array, or other shaped arrays. The heat-sealing portions 141 can be circular, square, triangular, elliptical, or other shapes. The size and number of the heat-sealing portions 141 can be flexibly adjusted according to actual usage needs. For example, the heat-sealing portions 141 can be circular, with a diameter of 2mm to 2.5mm.

[0037] like Figure 1 As shown, the buffer area 140 is further symmetrically arranged about the first axis 22, and each heat-sealing part 141 is arranged sequentially at intervals along the direction of the second arc 21, the center of the second arc 21 being located on the first axis 22. In this way, each heat-sealing part 141 is more evenly distributed on the buffer area 140, ensuring that the buffer area 140 can evenly buffer the opening force and prevent juice from splashing out, thereby improving the reliability of the packaging mold 10.

[0038] It should be noted that the buffer area 140 is formed by the first arc-shaped line segment of the inner edge of the annular area 110 and the second arc-shaped line segment of the outer edge of the packaging area 120. Specifically, in this embodiment, the opening area 130, the annular area 110, and the packaging area 120 are all symmetrically arranged about the first axis 22 on both sides of the first axis 22.

[0039] Specifically, in this embodiment, the annular region 110 is located on both sides of the first axis 22 and is correspondingly connected to the packaging region 120 located on both sides of the first axis 22.

[0040] like Figure 1As shown, optionally, the heat-sealing portions 141 on the buffer area 140 are symmetrically arranged about the first axis 22.

[0041] Specifically, in this embodiment, the buffer region 140 is symmetrically arranged about the first axis 22. Five heat-sealing portions 141 are provided on the buffer region 140, and these five heat-sealing portions 141 are evenly spaced along the direction of the second arc 21. The center of the second arc 21 is located on the first axis 22. The five heat-sealing portions 141 are symmetrically arranged about the first axis 22. Each of the five heat-sealing portions 141 is circular, and each heat-sealing portion 141 has a diameter of 2mm. The opening region 130 is located on one side of the annular region 110. The intersection line between the opening region 130 and the annular region 110 is the first arc 131. The adjacent sides of the opening region 130 and the annular region 110 intersect to form an intersection point, and the intersection of the opening region 130 and the annular region 110 forms an intersection line, the length between which is 12.5mm. The annular region 110 extends along the direction of the closed-loop arc. Thus, when using the packaging mold 10 in this embodiment, both hands grasp the opening area 130 on the upper mold 100 and the opening area 130 on the lower mold 200 respectively, and apply opening force in opposite directions. When the two annular areas 110 are opened, the five heat-sealing parts 141 can buffer the opening force, reducing the force on the packaging area 120. At the same time, the five heat-sealing parts 141 can also prevent juice from splashing out, thereby reducing the probability of juice splashing out when the packaging mold 10 is opened, and improving the user experience.

[0042] Through testing and summarizing the results of tests on quail egg packaging in the prior art and the packaging mold 10 in this embodiment, it was found that the proportion of juice splashing out when quail egg packaging in the prior art was randomly opened by hand was as high as 30% or more, while the proportion of juice splashing out when packaging mold 10 in this application was randomly opened by hand was less than 1%.

[0043] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0044] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0046] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0048] It should also be understood that, in interpreting the connection or positional relationships of components, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A packaging mold, characterized in that, The device includes an upper mold and a lower mold. Both the upper mold and the lower mold include an annular area, a packaging area located inside the annular area, an opening area located outside the annular area, and a buffer area. The buffer area is located inside the annular area and between the packaging area and the opening area. The two buffer areas are partially heat-sealed, and the two annular areas are heat-sealed, so that the two packaging areas enclose a packaging space.

2. The packaging mold according to claim 1, characterized in that, The exposed area is located on one side of the annular area.

3. The packaging mold according to claim 2, characterized in that, The intersection line between the exposed area and the annular area is the first circular arc.

4. The packaging mold according to claim 2, characterized in that, The exposed area and the two adjacent sides of the annular area intersect to form an intersection point, and the exposed area and the annular area intersect to form an intersection line. The length between the intersection point and the intersection line is 12.5 mm to 13 mm.

5. The packaging mold according to claim 2, characterized in that, One side of the packaging area, the buffer area, one side of the annular area, and the opening area are connected in sequence, and the other side of the packaging area is connected to the other side of the annular area.

6. The packaging mold according to claim 1, characterized in that, The annular region extends along the closed-loop arc direction.

7. The packaging mold according to any one of claims 1 to 6, characterized in that, The buffer area is provided with at least one heat-sealing part, and the heat-sealing parts are spaced apart, with each heat-sealing part on the two buffer areas corresponding to each other for heat sealing.

8. The packaging mold according to claim 7, characterized in that, The buffer area is symmetrically arranged about the first axis, and each of the heat-sealing parts is arranged at intervals along the direction of the second arc, with the center of the second arc located on the first axis.

9. The packaging mold according to claim 8, characterized in that, Each of the heat-sealing portions on the buffer area is symmetrically arranged about the first axis.

10. The packaging mold according to claim 7, characterized in that, The heat-sealing part is circular, and the diameter of the heat-sealing part is 2mm to 2.5mm.

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