Blue diaphragm turnover mechanism

Abstract

The utility model provides a blue diaphragm turnover mechanism which comprises a suction cup support, a turnover suction cup and a suction cup turnover motor, and the turnover suction cup is pivoted to the suction cup support and used for adsorbing a material piece; the sucking disc overturning motor is connected with the overturning sucking disc and can drive the overturning sucking disc to rotate to an initial station, a liquid draining station or an electroplating station; wherein the adsorption surfaces of the overturning suction cups are horizontal and face opposite directions when the overturning suction cups are located at the initial station and the electroplating station; at the liquid draining station, the adsorption surface of the overturning suction cup is inclined. The overturning mechanism adsorbs and overturns the material sheets in the electroplating process, manual participation is not needed, the action efficiency is high, and the material sheets cannot be polluted; the overturning sucking disc does not rigidly extrude the material sheet, the overturning sucking disc is regularly overhauled to ensure that the adsorption surface of the overturning sucking disc is flat, so that the stable fixation of the material sheet is ensured, the structural damage to the material sheet caused by structural deformation and manual misoperation is avoided, and the production yield is improved.

Description

Technical Field

[0001] This application belongs to the field of battery cell electroplating technology, and in particular relates to a blue film flipping mechanism. Background Technology

[0002] Metallization is a crucial step in solar cell production. Currently, the main metallization methods include screen printing and electroplating. Screen printing requires silver paste, which is costly, and the printing process requires sintering to form grid lines, making the process complex. Therefore, using electroplating technology to construct low-cost metal grid lines, reduce costs and increase efficiency, has become the mainstream development trend in the industry.

[0003] Before electroplating, the blue film usually needs to be cleaned and inspected to ensure that the surface to be plated is clean and undamaged. However, when using electroplating technology to construct grid lines, the industry typically uses a rack to suspend the blue film in the electroplating solution. The loading and unloading of the blue film on the rack is done manually, which is not only inefficient, but also causes contamination of the surface to be plated by the hands, and even easy to drop and break the film due to unstable holding. In addition, the rack needs to hold the blue film firmly, at least forming a semi-enclosed physical contact with the blue film. Deformation of the rack, hand tremors when loading and unloading the blue film, and other misoperations can all damage the structure of the blue film and the surface to be plated, reducing the production yield. Summary of the Invention

[0004] This application provides a blue film flipping mechanism to replace the traditional hanger for fixing the film, thereby reducing problems such as contamination and damage to the film during electroplating.

[0005] To solve at least one of the above-mentioned technical problems, the technical solution adopted in this application is: a blue film flipping mechanism, which includes: a suction cup bracket, a flipping suction cup and a suction cup flipping motor, wherein the flipping suction cup is pivotally connected to the suction cup bracket and is used to adsorb the film; the suction cup flipping motor is connected to the flipping suction cup and can drive the flipping suction cup to rotate to the initial station, the draining station or the electroplating station;

[0006] Wherein: at the initial station and the electroplating station, the adsorption surface of the flipping suction cup is horizontal and faces opposite directions; at the draining station, the adsorption surface of the flipping suction cup is inclined.

[0007] Preferably, the suction cup bracket is provided with a suction cup flipping shaft, which is parallel to a diagonal line of the flipping suction cup. One end of the shaft is connected to the flipping suction cup, and the other end is connected to the suction cup flipping motor through a transmission assembly.

[0008] Preferably, the output end of the suction cup flipping motor is provided with a series rod, and multiple sets of the transmission components are arranged in parallel on the series rod. The transmission components include a suction cup timing belt, a suction cup timing pulley, and a helical gear. A set of suction cup timing pulleys is provided at the top and bottom ends of the suction cup bracket and is driven by the suction cup timing belt. A set of helical gears is provided at the power input end of the suction cup timing pulley and on the series rod and meshes with it for transmission.

[0009] Preferably, the suction cup bracket and the photoelectric sensor are respectively configured on both sides of the connecting rod. The photoelectric sensor is connected to the suction cup flipping motor. A sensing disk is sleeved on the connecting rod. The sensing end of the photoelectric sensor is correspondingly arranged with the sensing disk. The sensing disk is provided with a sensing slot extending radially along the connecting rod. The sensing slot can rotate with the connecting rod to the sensing end of the photoelectric sensor.

[0010] Preferably, the non-adhesive surface of the flip suction cup is provided with a connecting claw, the connecting claw including a connecting arm and a plurality of connecting fingers, one end of the connecting arm is connected to the flip shaft of the suction cup, and the plurality of connecting fingers are fixed to the other end of the connecting arm and radiate outward to connect to the flip suction cup.

[0011] Preferably, the flip suction cup is provided with a guide wheel hole, which extends through the flip suction cup along the thickness direction of the flip suction cup.

[0012] Preferably, the flipping suction cup includes a housing, a cathode conductive plate, and an air extraction pipe. The housing is a groove-shaped structure with one end open. The cathode conductive plate is located at the open end of the housing and is sealed to the housing to form a negative pressure chamber. The negative pressure chamber is connected to the outside through the air extraction pipe and an adsorption through-hole located on the cathode conductive plate.

[0013] Preferably, the housing and the cathode conductive plate are connected by conductive bolts, and sealing gaskets are provided on the edge of the inner wall of the housing and at the penetration points of the conductive bolts; the housing is provided with a cathode energizing part, which is used to install cathode terminals.

[0014] Preferably, the outer periphery of the housing is provided with an air blowing chamber facing the same direction as its opening, and an air inlet pipe is connected to the air blowing chamber, which can supply air to the opening of the air blowing chamber.

[0015] Preferably, the outer periphery of the housing is provided with a plurality of mounting arms, and leveling bolts are provided on the mounting arms, the leveling bolts being movable along the thickness direction of the flip suction cup.

[0016] The beneficial effects of this application are as follows: the flipping mechanism is used to adsorb and flip the sheet in the electroplating process without manual intervention. It has high efficiency and will not contaminate the sheet. The flipping suction cup does not rigidly squeeze the sheet. Regular maintenance of the flipping suction cup ensures that its adsorption surface is flat. This can ensure stable fixation of the sheet while avoiding structural deformation and structural damage to the sheet caused by human error, thereby improving the production yield. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of an embodiment of the present utility model;

[0018] Figure 2 This is a partial structural diagram of an actual embodiment of the present utility model;

[0019] Figure 3 This is an appendix to the embodiments of this utility model. Figure 2 An enlarged view of the structure at point A in the middle;

[0020] Figure 4 These are top and bottom views of the flip suction cup in this embodiment of the utility model.

[0021] In the picture:

[0022] 1. Suction cup bracket;

[0023] 2. Tilting suction cup; 2-1. Housing; 2-11. Cathode energizing part; 2-2. Cathode conductive plate; 2-21. Adsorption through hole; 2-3. Conductive bolt; 2-4. Sealing gasket; 2-5. Air blowing chamber; 2-6. Mounting arm; 2-7. Leveling bolt; 2-8. Guide wheel hole;

[0024] 3. Extraction pipe;

[0025] 4. Air intake pipe;

[0026] 5. Suction cup tilting motor; 5-1 Servo motor; 5-2 Coupling; 5-3 Reducer;

[0027] 6. Suction cup flipping shaft;

[0028] 7. Connecting rod;

[0029] 8. Transmission components; 8-1. Suction cup timing belt; 8-2. Suction cup timing pulley; 8-3. Helical gear;

[0030] 9. Photoelectric sensor;

[0031] 10. Induction plate; 10-1. Induction slot;

[0032] 11. Limit plate;

[0033] 12. Connecting claw; 12-1. Connecting arm; 12-2. Connecting finger. Detailed Implementation

[0034] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0035] In the prior art, the material sheet (i.e. the blue film sheet to be electroplated) needs to be cleaned and inspected before electroplating. During the inspection, the surface of the material sheet to be plated faces upward, and the image is captured by a CCD camera located above it and transmitted to the detection system. After the material sheet passes the inspection, it is transferred to the electroplating area by a conventional material transfer mechanism (such as a conveyor belt, conveyor chain, etc.), with the surface to be plated facing upward and the non-plating surface facing downward.

[0036] Considering the above-mentioned actual working conditions, this embodiment provides a blue diaphragm flipping mechanism, as shown in the attached figure. Figure 1-4 Its structure includes: a suction cup bracket 1, a flip suction cup 2, and a suction cup flip motor 5. The suction cup bracket 1 is used to support the flip suction cup 2 and is pivotally connected to the flip suction cup 2. The flip suction cup 2 is used to adsorb the material sheet. The suction cup flip motor 5 is connected to the flip suction cup 2 and is used to drive the flip suction cup 2 to rotate to the initial station, the draining station, or the electroplating station. Wherein: at the initial station and the electroplating station, the adsorption surface of the flip suction cup 2 is horizontal and faces opposite directions; at the draining station, the adsorption surface of the flip suction cup 2 is inclined.

[0037] Specifically, in the initial station, the adsorption surface of the flip suction cup 2 is horizontal and facing upwards, and is smoothly connected to the front-end material transfer mechanism and the rear-end material transfer mechanism. The material sheet is directly pushed onto the adsorption surface of the flip suction cup 2 by the front-end material transfer mechanism. After the flip suction cup 2 adsorbs the material sheet, the suction cup flip motor 5 is activated, driving the flip suction cup 2 to rotate to the electroplating station. In the electroplating station, the adsorption surface of the flip suction cup 2 is horizontal and facing downwards to facilitate contact with the electroplating solution in the electroplating tank. After electroplating is completed, the suction cup flip motor 5 reverses its action, driving the flip suction cup 2 to rotate to the draining station, so that the material sheet is in an inclined state to drain the residual electroplating solution on it. Finally, the suction cup flip motor 5 continues to reverse its action, driving the flip suction cup 2 to rotate back to the initial station so that the rear-end material transfer mechanism can take away the material sheet for unloading.

[0038] The flipping mechanism provided in this application can adsorb and flip the sheet material in the electroplating process without manual intervention. It has high efficiency and will not contaminate the sheet material. The flipping suction cup 2 does not rigidly squeeze the sheet material. Regularly inspecting the flipping suction cup 2 to ensure that its adsorption surface is flat can ensure stable fixation of the sheet material while avoiding structural deformation and structural damage to the sheet material caused by human error, thereby improving the production yield.

[0039] When the rotating suction cup 2 is in the draining station, due to gravity, the residual electroplating liquid on the material sheet gathers towards the lowest part of the material sheet. Taking a square material sheet as an example, to improve the draining efficiency and effect, it is best to make the lowest part of the square material sheet the vertex, rather than the side. Generally, in order to make the electric field force uniform and save on the consumables of the rotating suction cup 2, a square rotating suction cup 2 is usually used. When adsorbing the material sheet, the rotating suction cup 2 corresponds to the corner of the square material sheet. To improve the draining efficiency and effect, a horizontal suction cup rotating shaft 6 can be set on the suction cup bracket 1. The suction cup rotating shaft 6 is parallel to one diagonal of the rotating suction cup 2, with one end connected to the rotating suction cup 2 and the other end connected to the suction cup rotating motor 5. When the suction cup rotating shaft 6 rotates, the other diagonal of the rotating suction cup 2 gradually becomes vertical, and the opposite diagonal of the square material sheet it attracts also gradually becomes vertical, thereby causing the residual electroplating liquid to gather and fall towards the lowest vertex of the material sheet.

[0040] Depending on the production capacity requirements, actual production may involve multiple rows and columns of electroplating tanks, where multiple sheets of material are transferred in groups and electroplated simultaneously. Therefore, an equal number of rotating suction cups 2 are needed for auxiliary operations. To improve space utilization, equipment integration, and reduce costs, an equal number of rotating suction cups 2, suction cup rotating shafts 6, and suction cup supports 1 can be arranged according to the arrangement direction of the electroplating tanks. A connecting rod 7 is set at the output end of the suction cup rotating motor 5, and a transmission component 8 with an equal number of rotating suction cups 2 is set in parallel on the connecting rod 7. Each group of transmission components 8 is connected to one rotating suction cup 2. Multiple rotating suction cups 2 can be driven by one suction cup rotating motor 5. Compared to setting a set of suction cup rotating motors 5 for each rotating suction cup 2, this solution can reduce the space occupied by the equipment, save on the manufacturing cost of the mechanism, and reduce the operating cost after the mechanism is put into production.

[0041] The specific structure of the transmission component 8 can be configured according to actual needs. This application provides some feasible technical solutions by way of example. For example, considering the drainage efficiency of square material sheets and the equipment integration of this mechanism, when the suction cup flipping shaft 6 is parallel to one diagonal of the flipping suction cup 2, the other diagonal of the flipping suction cup 2 should be collinear in the initial station and the electroplating station. That is, the electroplating tank and the flipping suction cup 2 in the initial station are obliquely offset. In order to enable the connecting rod 7 to connect each transmission component 8, the connecting rod 7 is extended along the dispersion direction of the electroplating tank. The transmission component 8 is equipped with a suction cup synchronous belt 8-1, a suction cup synchronous wheel 8-2 and a helical gear 8-3. The suction cup synchronous wheel 8-2 is provided at the top and bottom ends of the suction cup bracket 1 and is driven by the suction cup synchronous belt 8-1. The helical gear 8-3 is provided at the power input end of the suction cup synchronous wheel 8-2 and on the connecting rod 7 and is engaged for transmission. The helical gears 8-3 can be selected according to specific application requirements. One set of helical gears 8-3 is coaxially mounted on the connecting rod 7, and the other set of helical gears 8-3 is coaxially connected to the suction cup synchronous wheel 8-2. The helical gears 8-3 are used to compensate for the angular differences of each structure, so that the structures can be compactly arranged and linked in an orderly manner.

[0042] To ensure the orderly and efficient completion of the electroplating process, the suction cup flipping motor 5 in this application is constructed with a servo motor 5-1, a coupling 5-2, and a reducer 5-3 connected coaxially. The output end of the reducer 5-3 is connected to a series rod 7. By pre-programming the servo motor 5-1, the orderly conversion between the initial station, the draining station, and the electroplating station of the flipping suction cup 2 can be achieved. Furthermore, the suction cup bracket 1 can be placed on one side of the connecting rod 7, and the photoelectric sensor 9 can be placed on the other side of the connecting rod 7. The photoelectric sensor 9 is connected to the suction cup flipping motor 5. The induction disk 10 is sleeved on the connecting rod 7 and fixedly connected to the connecting rod 7. The sensing end of the photoelectric sensor 9 is correspondingly set with the induction disk 10. A sensing slot 10-1 extending radially along the connecting rod 7 is provided on the induction disk 10. The size of the induction disk 10 and the size of the sensing slot 10-1 are set according to the size and position of the sensing end of the photoelectric sensor 9, so that when the induction disk 10 rotates with the connecting rod 7, the sensing slot 10-1 can rotate to the sensing end of the photoelectric sensor 9.

[0043] In some feasible solutions, such as appendix Figure 3 Multiple limit plates 11 can be set on the basis of the equipment. A hole is drilled in the center of the limit plate 11 to pass through the connecting rod 7, which provides support and limit for the connecting rod 7. A slotted photoelectric sensor 9 is selected and installed on the limit plate 11 with the slot facing the transmission component 8. The sensing disk 10 is partially located in the slot.

[0044] Through preset programming, the suction cup flipping motor 5 is controlled to perform the following actions: When the flipping suction cup 2 is in the initial working position and adsorbs the material sheet, the induction plate 10 blocks the sensing end of the photoelectric sensor 9, generating a sensing signal to control the action of the suction cup flipping motor 5, rotating the flipping suction cup 2 to the electroplating station, and holding the flipping suction cup 2 in the electroplating station for a period of time to complete the electroplating operation of the material sheet; when the flipping suction cup 2 is in the electroplating station, the sensing slot 10-1 corresponds to the sensing end of the photoelectric sensor 9, and the photoelectric sensor 9 generates a second sensing signal. After the electroplating operation is completed, the suction cup flipping motor 5 is controlled to reverse the action, first rotating the flipping suction cup 2 to the draining station, and holding it in the draining station for a period of time to drain the residual electroplating liquid on the material sheet, and then the suction cup flipping motor 5 is controlled to continue to reverse the action, rotating the flipping suction cup 2 to the initial working position for unloading the plated material sheet.

[0045] Because the flip suction cup 2 is large and heavy, in order to improve the connection stability, a connecting claw 12 is provided on the non-adsorption surface of the flip suction cup 2 in this application. The connecting claw 12 includes a connecting arm 12-1 and several connecting fingers 12-2. One end of the connecting arm 12-1 is connected to the suction cup flipping shaft 6, and several connecting fingers 12-2 are fixed to the other end of the connecting arm 12-1, radiating outwards, and connected to the flip suction cup 2 by bolts or other structures. The multiple connecting fingers 12-2 are used to improve the connection stability and minimize the total weight of the connecting claw 12 and the flip suction cup 2, thereby reducing the wear rate of the drive equipment.

[0046] Reference Attachment Figure 4 The flip-over suction cup 2 includes a housing 2-1, a cathode conductive plate 2-2, and a suction pipe 3. The housing 2-1 is a groove-shaped structure with one open end. The cathode conductive plate 2-2 is located at the open end of the housing 2-1 and is sealed to the housing 2-1 to form a negative pressure chamber. The negative pressure chamber is connected to the outside through the suction pipe 3 and adsorption through holes 2-21 located on the cathode conductive plate 2-2. The cathode conductive plate 2-2 is made of a material insoluble in electroplating solutions. For example, graphite can be used for nickel plating and copper plating. Multiple adsorption through holes 2-21 are evenly distributed on the cathode conductive plate 2-2 to ensure adsorption stability. In use, the suction pipe 3 can be connected to a vacuum generator. When the vacuum generator evacuates, a negative pressure is formed in the negative pressure chamber, which generates an adsorption force on the material through the adsorption through holes 2-21, thereby stabilizing the adsorption of the material. When the vacuum generator breaks the vacuum, the negative pressure chamber gradually returns to normal pressure, and the adsorption force on the material is lost.

[0047] This application integrates the cathode conductive plate 2-2 onto the flip-over suction cup 2, which can increase the area of ​​the charged body, improve the uniformity of the electric field on the material sheet, and ensure the uniformity of electroplating. During electroplating, the cathode conductive plate 2-2 can be connected to the anode in the electroplating tank through an external circuit. To ensure the flatness of the cathode conductive plate 2-2, the cathode conductive plate 2-2 of the housing 2-1 can be connected by conductive bolts 2-3. The conductive bolts 2-3 extend from the housing 2-1 to the cathode conductive plate 2-2, but the ends do not penetrate the cathode conductive plate 2-2. When the non-adsorption surface of the flipping suction cup 2 is energized, the cathode conductive plate 2-2 becomes energized. This avoids the unevenness of the surface when the cathode conductive plate 2-2 is directly connected to the conductive terminals of the external circuit, which would affect the adsorption stability. A sealing gasket 2-4 is provided on the side of the housing 2-1 facing the cathode conductive plate 2-2. The sealing gasket 2-4 is located at the edge of the inner wall of the housing 2-1 and at the penetration point of the conductive bolts 2-3 to prevent air leakage in the negative pressure chamber, ensure the sealing of the negative pressure chamber, and improve the vacuum adsorption stability.

[0048] In implementation, the conductive bolt 2-3 can be directly connected to the cathode terminal of the external circuit, or the housing 2-1 can be made of a conductive material and a cathode energizing part 2-11 can be provided on the housing 2-1. The cathode energizing part 2-11 can be configured according to the shape and structure of the cathode terminal actually used, such as an internal thread groove or a slot, etc. There are no specific restrictions here. When the cathode terminal is used to energize the cathode energizing part 2-11, the housing 2-1 conducts the current to the conductive bolt 2-3, and the conductive bolt 2-3 conducts the current to the cathode conductive plate 2-2. The cathode conductive plate 2-2 is energized to carry out the electroplating process on the material sheet.

[0049] Typically, only one side of the sheet is electroplated at a time. If the non-plated side of the sheet is contaminated with electroplating solution during this electroplating process, the plating layer will also be deposited on the non-plated side of the sheet due to the sheet being charged. This will affect subsequent processes and the quality of the sheet. Even if the size of the flipping suction cup 2 is larger than the size of the sheet, it is difficult to prevent the electroplating solution from flowing into the gap between the two and spreading along the gap to the non-plated side of the sheet. This not only affects the quality of the sheet, but the plating layer in the gap may also tightly connect the sheet and the flipping suction cup 2. Even after the flipping suction cup 2 breaks the vacuum, it will be difficult to remove the sheet from the flipping suction cup 2. Therefore, this application configures the size of the flip suction cup 2 to be slightly smaller than the size of the material sheet. For example, a millimeter-level blank area is reserved on each side of the non-plated surface of the material sheet to avoid affecting the uniformity of the electric field force. An air blowing chamber 2-5 is constructed on the outer periphery of the flip suction cup 2. The air blowing port of the air blowing chamber 2-5 faces the blank area of ​​the material sheet and can be slightly inclined towards the outer edge of the material sheet. The end of the air blowing chamber 2-5 away from the material sheet is closed and equipped with an air inlet pipe 4, so that one end of the air inlet pipe 4 is connected to the interior of the air blowing chamber 2-5 and the other end is connected to the air source. During electroplating, the air source is kept open, and the air blowing port continuously blows air towards the outer edge of the material sheet to prevent the electroplating liquid from splashing or surging onto the non-plated surface of the material sheet and causing related production quality problems.

[0050] When the flip-over suction cup 2 is located at the electroplating station, the levelness of its bottom surface (i.e., the adsorption surface) affects the electroplating uniformity of the material sheet. If it is skewed, the material sheet will also be skewed, resulting in different degrees of contact between different parts of the material sheet and the electroplating solution, thus reducing the electroplating uniformity. The production and assembly precision of the flip-over suction cup 2, suction cup bracket 1, and other structures, as well as the levelness of the adsorption surface of the flip-over suction cup 2, are crucial factors. Therefore, this application provides several mounting arms 2-6 on the outer periphery of the housing 2-1, with leveling bolts 2-7 threaded through the mounting arms 2-6. The leveling bolts 2-7 can move along the thickness direction of the flip-over suction cup 2. Before formal production, the position of the leveling bolts 2-7 is adjusted so that when the leveling bolts 2-7 abut against different support structures, the flip-over suction cup 2 is stably supported and the adsorption surface is level.

[0051] Before formal production, the height of the leveling bolts 2-7 is adjusted to ensure that when the flip suction cup 2 is located at the electroplating station, the bottom end of the leveling bolts 2-7 abuts against the electroplating tank (or nearby stable equipment, etc.) below the flip suction cup 2, and the bottom surface of the flip suction cup 2 is leveled using equipment such as a level. The leveling bolts 2-7 can not only level the adsorption surface of the flip suction cup 2 before production, but also provide continuous support for the flip suction cup 2 during formal production, ensuring that the adsorption surface remains level every time the flip suction cup 2 moves to the electroplating station.

[0052] To achieve smooth material transfer between the flip-over suction cup 2 and the front-end and rear-end material transfer mechanisms, this can be achieved by controlling the size of the flip-over suction cup 2 and the spacing of the material transfer guide wheels in the front-end and rear-end material transfer mechanisms. For example, the outline size of the flip-over suction cup 2 can be configured to be smaller than the area of ​​the material sheet, and the material transfer guide wheels of the flip-over suction cup 2 can be close to the flip-over suction cup 2 to contact the parts of the material sheet that extend beyond the flip-over suction cup 2, thereby achieving rolling transfer of the material sheet. However, in this application, the cathode conductive plate 2-2 used for electroplating is located on the flip-over suction cup 2. When the cathode conductive plate 2-2 is energized, it conducts electricity to the material sheet to achieve electroplating. If the outer edge of the material sheet extends too far beyond the flip-over suction cup 2, the electric field force will decrease or disappear because the extended part does not directly contact the cathode conductive plate 2-2, affecting the electroplating uniformity of the center and edge of the surface to be plated on the material sheet and reducing the yield.

[0053] Therefore, guide wheel holes 2-8 can be set on the flip suction cup 2 to combine the initial position of the flip suction cup 2 with the front-end material transfer mechanism (or the rear-end material transfer mechanism). The material transfer guide wheel in the front-end material transfer mechanism (or the rear-end material transfer mechanism) extends into the guide wheel hole 2-8 to assist in the transfer of the material sheet. In this solution, it is not necessary to excessively reduce the size of the flip suction cup 2 in order to ensure smooth material transfer. As long as the distance between the material transfer guide wheel that passes through the guide wheel hole 2-8 and the material transfer guide wheels on both sides of the flip suction cup 2 is less than the side length of the material sheet, it is sufficient. In this way, the electric field force on the material sheet can be uniform, the electroplating uniformity can be guaranteed, and the material sheet can be transferred smoothly. However, it should be noted that: the housing 2-1 and the cathode conductive plate 2-2 are respectively provided with guide wheel holes 2-8 at corresponding positions. The side wall of the guide wheel hole 2-8 is not connected to the negative pressure chamber. That is, even if the side of the housing 2-1 facing the cathode conductive plate 2-2 is provided with guide wheel holes 2-8, the side wall of the guide wheel hole 2-8 also serves as the side wall of the groove structure of the housing 2-1, and a sealing gasket 2-4 is correspondingly constructed so that the negative pressure chamber can only be connected to the outside through the adsorption through hole 2-21 and the suction pipe 3, and no air leakage can occur at the guide wheel hole 2-8.

[0054] Compared with the prior art, the beneficial effects of this utility model are as follows: the above-mentioned flipping mechanism is used to adsorb and flip the material sheet in the electroplating process without manual intervention. It has high efficiency and will not contaminate the material sheet. The flipping suction cup 2 does not rigidly squeeze the material sheet. Regularly inspecting the flipping suction cup 2 to ensure that its adsorption surface is flat can ensure stable fixation of the material sheet while avoiding structural deformation and structural damage to the material sheet caused by human error, thereby improving the production yield.

[0055] The embodiments of this application have been described in detail above. These descriptions are merely preferred embodiments and should not be construed as limiting the scope of this application. All equivalent variations and modifications made within the scope of this application should still fall within the patent coverage of this application.

Claims

1. A blue diaphragm flipping mechanism, characterized in that, include: The suction cup bracket, the flip suction cup, and the suction cup flipping motor are provided, wherein the flip suction cup is pivotally connected to the suction cup bracket and is used to adsorb material sheets. The suction cup flipping motor is connected to the flipping suction cup and can drive the flipping suction cup to rotate to the initial station, the draining station, or the electroplating station; Wherein: at the initial station and the electroplating station, the adsorption surface of the flipping suction cup is horizontal and faces opposite directions; at the draining station, the adsorption surface of the flipping suction cup is inclined.

2. The blue diaphragm flipping mechanism according to claim 1, characterized in that, The suction cup bracket is equipped with a suction cup flipping shaft, which is parallel to a diagonal line of the flipping suction cup. One end of the shaft is connected to the flipping suction cup, and the other end is connected to the suction cup flipping motor through a transmission assembly.

3. The blue diaphragm flipping mechanism according to claim 2, characterized in that, The output end of the suction cup flipping motor is provided with a series rod, and multiple sets of the transmission components are arranged in parallel on the series rod. The transmission components include a suction cup timing belt, a suction cup timing pulley, and a helical gear. A set of suction cup timing pulleys is provided at the top and bottom ends of the suction cup bracket and is driven by the suction cup timing belt. A set of helical gears is provided at the power input end of the suction cup timing pulley and on the series rod and meshes with it for transmission.

4. The blue diaphragm flipping mechanism according to claim 3, characterized in that, The suction cup bracket and photoelectric sensor are respectively arranged on both sides of the series rod. The photoelectric sensor is connected to the suction cup flipping motor. A sensing disk is sleeved on the series rod. The sensing end of the photoelectric sensor is correspondingly arranged with the sensing disk. The sensing disk has a sensing slot extending radially along the series rod. The sensing slot can rotate with the series rod to the sensing end of the photoelectric sensor.

5. The blue diaphragm flipping mechanism according to any one of claims 2-4, characterized in that, The non-adhesive surface of the flip suction cup is provided with a connecting claw. The connecting claw includes a connecting arm and several connecting fingers. One end of the connecting arm is connected to the flip shaft of the suction cup, and several connecting fingers are fixed to the other end of the connecting arm and radiate outwards to connect to the flip suction cup.

6. The blue diaphragm flipping mechanism according to claim 5, characterized in that, The flip suction cup is provided with guide wheel holes, which penetrate the flip suction cup along the thickness direction.

7. The blue diaphragm flipping mechanism according to any one of claims 1-4, 6, characterized in that, The flipping suction cup includes a housing, a cathode conductive plate, and an air extraction pipe. The housing is a groove-shaped structure with one end open. The cathode conductive plate is located at the open end of the housing and is sealed to the housing to form a negative pressure chamber. The negative pressure chamber is connected to the outside through the air extraction pipe and an adsorption through-hole located on the cathode conductive plate.

8. The blue diaphragm flipping mechanism according to claim 7, characterized in that, The housing is connected to the cathode conductive plate by conductive bolts. Sealing gaskets are provided on the edge of the inner wall of the housing and at the penetration points of the conductive bolts. The housing is provided with a cathode energizing part, which is used to install cathode terminals.

9. The blue diaphragm flipping mechanism according to claim 7, characterized in that, The outer periphery of the housing is provided with an air blowing chamber facing the same direction as its opening. An air inlet pipe is connected to the air blowing chamber, and the air inlet pipe can supply air to the opening of the air blowing chamber.

10. The blue diaphragm flipping mechanism according to claim 7, characterized in that, The outer periphery of the housing is provided with several mounting arms, and leveling bolts are passed through the mounting arms. The leveling bolts can move along the thickness direction of the flip suction cup.

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