Loading clamp for spin uniform evaporation

By incorporating the substrate holder's rotation design and height adjustment module, combined with uniform control of the evaporation material, the problems of uneven film thickness and diffusion in traditional evaporation equipment are solved, achieving a highly uniform and stable evaporation effect, suitable for semiconductor, optical coating, and display production.

CN223481258UActive Publication Date: 2025-10-28HANGZHOU DIANZI UNIV +2
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Patent Information

Application Number
CN202422624037.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-10-28
Estimated Expiration
2034-10-30

AI Technical Summary

Technical Problem

The fixed design of the substrate holder in traditional vapor deposition equipment leads to uneven film thickness, which affects product performance and quality. Furthermore, the uneven diffusion of the evaporated material makes it difficult to meet the requirements of high-standard applications.

Method used

The substrate holder employs a rotational design combined with a revolution mechanism. Through the rotational and revolutionary drive mechanisms, along with the height adjustment module, the slender cavity of the evaporation material, and solenoid valve control, uniform deposition of the evaporation material is ensured.

Benefits of technology

It significantly improves film thickness uniformity and product quality stability, making it suitable for high-precision applications and meeting the high standards required for optical and electronic products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a loading clamp for spinning uniform evaporation, which comprises a substrate frame, a substrate table and a revolution driving mechanism for driving the substrate frame, and is characterized in that a rotation driving mechanism is arranged on the revolution driving mechanism; the autorotation driving mechanism comprises an autorotation driving motor, a rotating supporting shaft, an autonomous rotation driven gear and an autonomous rotation driving gear, the autonomous rotation driven gear is installed on the upper top face of the substrate frame, and the rotating shaft end penetrates through the substrate table and is provided with the autonomous rotation driving gear through a fastening bolt; the autonomous rotation driven gear and the substrate frame are sequentially installed below the substrate table through a rotation supporting shaft, and the autonomous rotation driving gear is meshed with the autonomous rotation driven gear. In the device, the substrate frame rotates while revolving, so that the evaporation material is more uniformly distributed on the surface of the substrate, and the overall film thickness consistency is improved.
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Description

Technical Field

[0001] This utility model relates to the field of vapor deposition equipment, specifically to a loading fixture for spin uniform vapor deposition. Background Technology

[0002] Traditional vapor deposition equipment typically employs a fixed substrate holder design, featuring only a large-scale revolution around the substrate but lacking its own rotation. This results in different rotational speeds on the inner and outer sides of the substrate holder during the deposition process. Consequently, film thickness inhomogeneity is easily generated, particularly in areas near the center of rotation and at the edges of the substrate, where significant differences in film thickness affect the performance and quality of the final product. This film thickness inhomogeneity directly impacts the overall material properties, leading to fluctuations in the optical and electronic properties of the final product, making it difficult to meet high-standard application requirements. Furthermore, in the traditional vapor deposition process, the diffusion process of the evaporated material is uncontrollable, easily resulting in uneven and unstable diffusion, thus causing uneven deposition.

[0003] Therefore, there is an urgent need for a new vapor deposition equipment design to improve film thickness uniformity and meet the requirements of high-performance applications. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and to propose a loading fixture for spin uniform vapor deposition that can improve the uniformity of film thickness.

[0005] To achieve the above objectives, the specific technical solution adopted by this utility model is as follows:

[0006] A loading fixture for spin uniform vapor deposition includes a substrate holder, a substrate stage, and a revolution drive mechanism for driving the substrate holder. The revolution drive mechanism is equipped with a spin drive mechanism, which includes a spin drive motor, a rotary support shaft, a self-rotating driven gear, and a self-rotating drive gear. The self-rotating driven gear is mounted on the top surface of the substrate holder. The end of the rotating shaft passes through the substrate stage and is mounted on the self-rotating drive gear via fastening bolts. The self-rotating driven gear and the substrate holder are sequentially mounted below the substrate stage via the rotary support shaft. The self-rotating drive gear meshes with the self-rotating driven gear.

[0007] Preferably, several substrate holders are provided, arranged in a centrally symmetrical structure at the edge below the substrate stage.

[0008] Preferably, the autonomous rotation drive gear is located at the center below the substrate stage and meshes with all autonomous rotation driven gears respectively.

[0009] Preferably, the revolution drive mechanism includes a hydraulically adjustable rotary disk and a revolution drive motor. The revolution drive motor drives the substrate stage to revolve by driving the hydraulically adjustable rotary disk, which in turn drives the substrate holder to revolve.

[0010] Preferably, a height adjustment module is provided between the revolution drive mechanism and the rotation drive mechanism.

[0011] Preferably, the height adjustment module includes a main hydraulic lifting rod and a secondary hydraulic lifting rod, used to adjust the height of the substrate holder relative to the evaporation source.

[0012] Preferably, the substrate stage is mounted below the hydraulic adjustment rotary table via a main hydraulic lifting rod and a secondary hydraulic lifting rod.

[0013] This utility model has the following features and beneficial effects:

[0014] 1) Significantly improved film thickness uniformity:

[0015] The substrate holder's rotational design allows it to rotate simultaneously with its revolution around the sun, significantly improving the uniformity of film thickness during the evaporation process. The slender evaporation conduction chamber design, combined with a solenoid valve-controlled gas release structure, ensures that the evaporation material can be deposited on the substrate at a stable rate and with a uniform distribution, thereby improving overall film thickness consistency.

[0016] 2) Flexible height adjustment:

[0017] By designing a main hydraulic lifting rod and a secondary hydraulic balance rod, this invention enables the adjustment of the substrate holder's height relative to the evaporation source, further optimizing the evaporation process and ensuring uniform film thickness and improved overall efficiency.

[0018] 3) Improved product quality stability:

[0019] This innovative design improves product quality consistency, particularly in fields like optics and electronics where high film thickness precision is required, effectively enhancing product performance and stability. Uniform film thickness not only improves optical performance but also ensures reliable electrical performance in electronic component manufacturing.

[0020] 4) Wide applicability:

[0021] This invention can be widely applied in various manufacturing industries that require high-quality thin-film materials, especially in high-precision fields such as semiconductor, optical coating, and display screen production. Its flexible design allows it to adapt to substrates of different sizes and materials, meeting diverse production needs. Attached Figure Description

[0022] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0023] Figure 1 This is a schematic diagram illustrating the application of a loading fixture for spin uniform vapor deposition according to an embodiment of the present invention;

[0024] Figure 2 This is a three-dimensional structural diagram of a loading fixture for spin uniform vapor deposition in an embodiment of the present invention.

[0025] Figure 3 for Figure 2 The front view;

[0026] Figure 4 This is a partial structural schematic diagram of an embodiment of the present utility model;

[0027] Figure 5 This is a partial structural schematic diagram of the evaporation material control module in an embodiment of this utility model;

[0028] In the diagram: 1. Evaporation chamber; 11. Revolutionary drive motor; 12. Main hydraulic lifting rod; 13. Rotation drive motor; 14. Substrate stage; 15. Rotation support shaft; 16. Self-rotating driven gear; 17. Substrate holder; 18. Fastening bolt; 19. Auxiliary hydraulic lifting rod; 110. Hydraulic adjusting rotary disc; 111. Self-rotating drive gear; 31. Molybdenum boat heat transfer rod; 32. Molybdenum boat; 33. Molybdenum boat replacement operation door; 34. Evaporation conduction chamber; 35. Solenoid valve. Detailed Implementation

[0029] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present invention can be combined with each other.

[0030] To address the problems of uneven film thickness, low deposition efficiency, and unstable product quality in existing technologies, this invention provides a loading fixture for spin-based uniform deposition. Based on the traditional revolution method, it adds a small-range rotation of the substrate holder. Specifically, as shown... Figure 1 As shown, the vapor deposition system's chamber 1 is equipped with a revolution and rotation module, including a revolution drive mechanism and a rotation drive mechanism for driving the substrate holders 17. This allows the substrate holders to not only revolve around the evaporation source over a wide range but also rotate on their own axis. For example, Figure 2 and Figure 3As shown, the revolution drive mechanism includes a hydraulically adjustable rotating disk 110 and a revolution drive motor 11. The revolution drive motor 11 drives the substrate stage 14 to revolve by driving the hydraulically adjustable rotating disk 110, which in turn drives the substrate holder 17 to revolve. The rotation drive mechanism includes a rotation drive motor 13, a rotating support shaft 15, a self-rotating driven gear 16, a hydraulically adjustable rotating disk 110, and a self-rotating driven gear 111. The self-rotating driven gear 16 is mounted on the top surface of the substrate holder 17. The shaft end passes through the substrate stage 14 and is mounted on the self-rotating driven gear 111 by fastening bolts 18. The self-rotating driven gear 16 and the substrate holder 17 are sequentially mounted below the substrate stage 14 via the rotating support shaft 15. The self-rotating driven gear 111 meshes with the self-rotating driven gear 16. When the rotation drive motor 13 rotates, it drives the self-rotating driven gear 16 to rotate through the self-rotating driven gear 111, which in turn drives the substrate holder 17 to rotate. The combination of rotation and revolution ensures that the vapor-deposited material is evenly distributed in every corner of the substrate, avoiding the phenomenon that the film thickness is thicker near the center of rotation and thinner at the edges.

[0031] Furthermore, this invention introduces a main hydraulic lifting rod and a secondary hydraulic lifting rod to adjust the height of the substrate holder relative to the evaporation source. Specifically, the substrate stage 14 is installed below the hydraulic adjustment rotary disk 110 via the main hydraulic lifting rod 12 and the secondary hydraulic lifting rod. Adjustment of the main hydraulic lifting rod 12 and the secondary hydraulic lifting rod allows for height adjustment of the substrate holder relative to the evaporation source, thereby further optimizing the evaporation process and improving overall efficiency and film thickness uniformity.

[0032] Further improvements to this invention, aimed at enhancing the uniformity of vapor deposition, include the introduction of a slender cavity in the evaporation source design. The internal pressure of this cavity is higher than that of the external chamber, allowing the evaporating material to diffuse upwards uniformly. Simultaneously, a solenoid valve-controlled opening and closing mechanism is installed at the top of the small evaporation cavity. A gas concentration detector is located within the small evaporation cavity. When the gas concentration reaches a certain level, the solenoid valve opens, allowing the vaporized gas to be released uniformly onto the substrate surface. The solenoid valve's control is synchronized with the heating process. When the powder is fully heated, it first transforms into a liquid and then into a gas. When the gas concentration reaches a certain level, the solenoid valve automatically opens to release the gas, ensuring a stable supply of evaporating material and precise control over the timing of gas release. This design results in a more uniform material distribution during vapor deposition, avoiding uneven deposition caused by premature or delayed release. By increasing the fluidity and distribution range of the evaporator, this design avoids the phenomenon of evaporating material concentrating in the central area, as seen in traditional designs. Specifically, the vapor deposition system has an evaporation material control module installed inside its chamber. This module includes a heating module, an evaporation conduction chamber 34, a gas concentration detector, a solenoid valve 35, and a microcontroller. The evaporation conduction chamber 34 has a long and narrow rectangular structure and is located above the heating module. It contains a gas concentration detector and has an opening and closing structure controlled by the solenoid valve 35 at its top. The input of the microcontroller is connected to the gas concentration detector, and the output is connected to the solenoid valve 35. When the gas concentration reaches a certain level, the solenoid valve 35 controls the opening and closing structure to open, allowing the evaporated gas to be released onto the substrate surface.

[0033] In this embodiment, a traditional heating module is used to heat the evaporation material, including a molybdenum boat 32, a molybdenum boat heat conduction rod 31, and a molybdenum boat replacement operation door 33.

[0034] When using this specific implementation, the following steps are included:

[0035] (1) Place the substrate in the substrate holder 17 and fill the material to be evaporated into the molybdenum boat 32 at the same time;

[0036] (2) Simultaneously start the revolution drive motor 11 and the rotation drive motor 13. The revolution drive motor 11 drives the hydraulic adjustment rotating disk 110 to drive the substrate stage 14 to revolve, which in turn drives the substrate holder 17 to revolve. At the same time, the rotation drive motor 13 drives the autonomous rotation drive gear 111 to drive the autonomous rotation driven gear 16 to rotate, which in turn drives the substrate holder 17 to rotate.

[0037] (3) Start the molybdenum boat 32 to fully heat the material to be evaporated. The evaporating material is first converted into liquid and then into gas, and diffuses into the evaporation conduction chamber 34. When the gas concentration in the evaporation conduction chamber 34 reaches a certain condition, the solenoid valve automatically opens to release the gas. At this time, the pressure inside the evaporation conduction chamber 34 is higher than the pressure outside the chamber, so that the evaporating material can diffuse upward evenly.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A loading fixture for spin uniform vapor deposition, comprising a substrate holder, a substrate stage, and a revolution drive mechanism for driving the substrate holder, characterized in that, The revolution drive mechanism is equipped with a rotation drive mechanism, which includes a rotation drive motor, a rotary support shaft, a self-rotating driven gear, and a self-rotating drive gear. The self-rotating driven gear is mounted on the top surface of the substrate holder. The shaft end of the rotation drive motor passes through the substrate stage and is mounted on the self-rotating drive gear by fastening bolts. The self-rotating driven gear and the substrate holder are sequentially mounted below the substrate stage via the rotary support shaft. The self-rotating drive gear meshes with the self-rotating driven gear.

2. The loading fixture for spin uniform vapor deposition as described in claim 1, characterized in that: Several substrate holders are provided, arranged in a centrally symmetrical structure at the edge below the substrate stage.

3. The loading fixture for spin uniform vapor deposition as described in claim 1, characterized in that: The autonomous rotation drive gear is located at the center below the substrate stage and meshes with all autonomous rotation driven gears respectively.

4. A loading fixture for spin uniform vapor deposition as described in claim 1, characterized in that: The revolution drive mechanism includes a hydraulically adjustable rotary disk and a revolution drive motor. The revolution drive motor drives the substrate stage to revolve by driving the hydraulically adjustable rotary disk, which in turn drives the substrate holder to revolve.

5. A loading fixture for spin uniform vapor deposition as described in claim 1, characterized in that: A height adjustment module is provided between the revolution drive mechanism and the rotation drive mechanism.

6. A loading fixture for spin uniform vapor deposition as described in claim 5, characterized in that: The height adjustment module includes a main hydraulic lifting rod and a secondary hydraulic lifting rod, used to adjust the height of the substrate holder relative to the evaporation source.

7. A loading fixture for spin uniform vapor deposition as described in claim 6, characterized in that: The substrate stage is mounted below the hydraulic adjustment rotary table via a main hydraulic lifting rod and an auxiliary hydraulic lifting rod.